CN110856288A - 石墨烯发热体 - Google Patents

石墨烯发热体 Download PDF

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CN110856288A
CN110856288A CN201911291759.9A CN201911291759A CN110856288A CN 110856288 A CN110856288 A CN 110856288A CN 201911291759 A CN201911291759 A CN 201911291759A CN 110856288 A CN110856288 A CN 110856288A
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graphene heating
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graphene
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杨倩倩
张春政
史志洁
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Huanuan Wuxi Technology Co Ltd
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Huanuan Wuxi Technology Co Ltd
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Priority to US16/991,719 priority patent/US20200370762A1/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24DDOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D13/00Electric heating systems
    • F24D13/02Electric heating systems solely using resistance heating, e.g. underfloor heating
    • F24D13/022Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
    • F24D13/024Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/02Details
    • H05B3/03Electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/145Carbon only, e.g. carbon black, graphite
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/24Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor being self-supporting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/025Heaters specially adapted for glass melting or glass treatment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2214/00Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
    • H05B2214/04Heating means manufactured by using nanotechnology
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Resistance Heating (AREA)

Abstract

本发明公开了一种石墨烯发热体,包括盒体,设置于所述盒体上的盖体,设置于所述盒体内的石墨烯发热芯片;保温材料注入所述盒体内发泡使石墨烯发热芯片与盖体、盒体粘结为整体。保温材料在所述石墨烯发热芯片的四周及下方发泡,使石墨烯发热芯片与盖体之间、石墨烯发热芯片与盒体底部之间粘合。本发明的石墨烯发热体,既避免了石墨烯发热芯片在运输或铺设地暖时被损坏,大幅提高石墨烯发热模块的安全性,同时也避免了层层粘结的繁杂工序。

Description

石墨烯发热体
技术领域
本发明涉及一种发热体,尤其涉及一种石墨烯发热体。
背景技术
地暖是地板辐射采暖的简称,从热媒介上分为水地暖和电地暖两大类,石墨烯电热地暖是电地暖的一种。
目前现有的电热地板通常是在大理石或者瓷砖地板下面直接放置发热芯片,通过发热芯片通电释放能量,对室内进行升温,采用这种方式的发热地板存在一些问题:在运输或者在施工过程中,发热芯片的上表面容易被施工人员踩坏,底面被坚硬的沙粒刺破,从而造成发热芯片的损坏,通电后发热芯片与地面导通而漏电,导致漏电开关跳闸,使地暖无法正常工作。
发明内容
发明目的:本发明的目的是提供一种石墨烯发热芯片与外部保护机构一体粘结成型的石墨烯发热体,既避免了石墨烯发热芯片在运输或铺设地暖时被损坏,又避免了层层粘结的繁杂工序。
技术方案:本发明的石墨烯发热体,包括盒体,设置于所述盒体上的盖体,设置于所述盒体内的石墨烯发热芯片;保温材料注入所述盒体内发泡形成保温层并使石墨烯发热芯片与盖体、盒体粘结为整体。
优选地,保温材料注入所述盒体内在所述石墨烯发热芯片的四周及下方发泡,分别使石墨烯发热芯片与盖体、石墨烯发热芯片与盒体底部之间粘合。
优选地,所述盒体内设置有支撑石墨烯发热芯片的支撑体,使石墨烯发热芯片与盖体之间贴合。
优选地,所述盒体上设置有保温材料的注入口。
为了增大盒体内的石墨烯发热芯片通过盖体向外的热传递,所述盖体为导热材料。
优选地,所述盒体为硬质材料。
优选地,所述石墨烯发热芯片上设有正、负电极,所述正、负电极上焊接有插座。
优选地,所述盒体上设置有所述插座的插座口。
优选地,所述保温材料包括聚氨酯、聚苯乙烯、酚醛、橡塑、无机发泡材料中的至少一种。更优选地,所述保温材料包括聚氨酯发泡材料。
有益效果:与现有技术相比,本发明具有以下有益效果:1、利用发泡保温材料现场发泡将石墨烯发热芯片与外部盒体结构一体粘结,既保护了石墨烯发热芯片在运输或铺设地暖时不被损坏,同时也避免了层层粘结的繁杂工序;2、由于发泡保温材料在整个盒体内发泡成型,避免了单独对焊接点做绝缘处理;3、使用发泡保温材料替代现有的胶黏剂等粘结材料的粘结,有利于环保。4、盖体使用导热材料,在保障了石墨烯发热芯片的产热传热性能的同时,使石墨烯发热体的安全性大幅提高。
附图说明
图1为本发明的整体结构示意图;
图2为本发明的内部结构示意图;
图3为本发明的整体结构剖面示意图。
具体实施方式
下面结合说明书附图和具体实施例对本发明技术方案做进一步说明。
如图1~3所示,其中,1、盖体,2、石墨烯发热芯片,3、插座,4、保温材料、5、盒体,6、注入口,7、插座口。本发明的石墨烯发热体,包括盒体5及盒体5上的盖体1,盒体5及盖体1优选为硬质材料,盖体1为导热材料制成,更便于将盒体5内部的石墨烯发热芯片2的热量传递给外部;盒体5可根据需要设计成多种形状,本实施例为方形,且为了避免搬运、安装过程磕角,本实施例的盒体5四角都为圆角结构。
如图2所示,石墨烯发热芯片2放置于盒体5内,石墨烯发热芯片2是整个石墨烯发热模块的核心结构,用于发热;为了使石墨烯发热芯片2与盖体1之间贴合且与盒体5底部之间留有空隙,在盒体5内放置有支撑石墨烯发热芯片2的支架(图中未示出),还可以设置有其他能够支撑石墨烯发热芯片2的支撑体,只要能够使石墨烯发热芯片2与盖体1之间贴合即可。石墨烯发热芯片2上设有正、负电极,插座3焊接在石墨烯发热芯片2的正、负电极上用于插接电源线;在盒体5的侧边设置有与插座3对应的预留插座口7,以便于向外连接导线。
为便于向盒体5内注入发泡保温材料,盒体5的两个侧边上分别设有两个注入口6,本实施例的保温材料4为聚氨酯发泡材料,发泡保温材料4还可以是聚苯乙烯、酚醛、橡塑、无机发泡材料或者其组合;发泡保温材料4通过注入口6注入到盒体5内在盒体5内现场发泡,由于石墨烯发热芯片2与盖体1之间贴合而与盒体5底部之间留有空隙,注入的发泡保温材料4在石墨烯发热芯片2的四周及下方发泡,石墨烯发热芯片2通过其侧边上的发泡保温材料以及下方的发泡保温材料与盖体1、盒体5粘结为整体。发泡保温材料4在整个盒体5内部发泡也使得石墨烯发热芯片2上的焊接处填充有发泡保温材料4,起到了绝缘的效果,无需再对其进行绝缘保护。有本实施例的石墨烯发热芯片2与盖体1之间没有发泡保温材料4,石墨烯发热芯片2可以更好地通过盖体1向外传递热量,而其余空间均被发泡保温材料填充形成保温层,如图3所示,其中斜线部分为发泡保温材料4填充区域,圆圈内为部分区域放大图。该保温层一方面起到了保温效果,另一方避免了现有技术中石墨烯发热芯片2需分别与其他构件层层粘结的繁杂工序,并且也避免使用胶黏剂粘结,有利于环保;同时也避免了单独对插座3的焊接点做绝缘保护处理。本发明的石墨烯发热体是将石墨烯发热芯片密封的整体,因此,可有效地与水泥砂浆隔离,避免水泥碱性对芯片的侵蚀,使石墨烯发热模块安全性大幅提高。

Claims (10)

1.一种石墨烯发热体,其特征在于,包括盒体(5),设置于所述盒体(5)上的盖体(1),设置于所述盒体(5)内的石墨烯发热芯片(2);保温材料(4)注入所述盒体(5)内发泡使石墨烯发热芯片(2)与盖体(1)、盒体(5)粘结为整体。
2.根据权利要求1所述的石墨烯发热体,其特征在于,所述保温材料(4)注入所述盒体(5)内在所述石墨烯发热芯片(2)的四周及下方发泡。
3.根据权利要求1所述的石墨烯发热体,其特征在于,所述盒体(5)内设置有支撑石墨烯发热芯片(2)的支撑体,用于使石墨烯发热芯片(2)与盖体(1)之间贴合。
4.根据权利要求1所述的石墨烯发热体,其特征在于,所述盒体(5)上设置有保温材料(4)的注入口(6)。
5.根据权利要求1所述的石墨烯发热体,其特征在于,所述盖体(1)为导热材料。
6.根据权利要求1所述的石墨烯发热体,其特征在于,所述盒体(5)为硬质材料。
7.根据权利要求1所述的石墨烯发热体,其特征在于,所述石墨烯发热芯片(2)上设有正、负电极,所述正、负电极上焊接有插座(3)。
8.根据权利要求7所述的石墨烯发热体,其特征在于,所述盒体(5)上预留有所述插座(3)的插座口(7)。
9.根据权利要求1所述的石墨烯发热体,其特征在于,所述保温材料(4)包括聚氨酯、聚苯乙烯、酚醛、橡塑、无机发泡材料中的至少一种。
10.根据权利要求9所述的石墨烯发热体,其特征在于,所述保温材料(4)为聚氨酯发泡材料。
CN201911291759.9A 2019-12-16 2019-12-16 石墨烯发热体 Pending CN110856288A (zh)

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