CN110856288A - 石墨烯发热体 - Google Patents
石墨烯发热体 Download PDFInfo
- Publication number
- CN110856288A CN110856288A CN201911291759.9A CN201911291759A CN110856288A CN 110856288 A CN110856288 A CN 110856288A CN 201911291759 A CN201911291759 A CN 201911291759A CN 110856288 A CN110856288 A CN 110856288A
- Authority
- CN
- China
- Prior art keywords
- graphene heating
- box body
- graphene
- chip
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 61
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 55
- 238000005187 foaming Methods 0.000 claims abstract description 24
- 239000012774 insulation material Substances 0.000 claims abstract description 14
- 239000011810 insulating material Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 13
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011496 polyurethane foam Substances 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 4
- -1 phenolic aldehyde Chemical class 0.000 description 14
- 229910002804 graphite Inorganic materials 0.000 description 12
- 239000010439 graphite Substances 0.000 description 12
- 238000004321 preservation Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011083 cement mortar Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
- F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/24—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor being self-supporting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/025—Heaters specially adapted for glass melting or glass treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/04—Heating means manufactured by using nanotechnology
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Resistance Heating (AREA)
Abstract
本发明公开了一种石墨烯发热体,包括盒体,设置于所述盒体上的盖体,设置于所述盒体内的石墨烯发热芯片;保温材料注入所述盒体内发泡使石墨烯发热芯片与盖体、盒体粘结为整体。保温材料在所述石墨烯发热芯片的四周及下方发泡,使石墨烯发热芯片与盖体之间、石墨烯发热芯片与盒体底部之间粘合。本发明的石墨烯发热体,既避免了石墨烯发热芯片在运输或铺设地暖时被损坏,大幅提高石墨烯发热模块的安全性,同时也避免了层层粘结的繁杂工序。
Description
技术领域
本发明涉及一种发热体,尤其涉及一种石墨烯发热体。
背景技术
地暖是地板辐射采暖的简称,从热媒介上分为水地暖和电地暖两大类,石墨烯电热地暖是电地暖的一种。
目前现有的电热地板通常是在大理石或者瓷砖地板下面直接放置发热芯片,通过发热芯片通电释放能量,对室内进行升温,采用这种方式的发热地板存在一些问题:在运输或者在施工过程中,发热芯片的上表面容易被施工人员踩坏,底面被坚硬的沙粒刺破,从而造成发热芯片的损坏,通电后发热芯片与地面导通而漏电,导致漏电开关跳闸,使地暖无法正常工作。
发明内容
发明目的:本发明的目的是提供一种石墨烯发热芯片与外部保护机构一体粘结成型的石墨烯发热体,既避免了石墨烯发热芯片在运输或铺设地暖时被损坏,又避免了层层粘结的繁杂工序。
技术方案:本发明的石墨烯发热体,包括盒体,设置于所述盒体上的盖体,设置于所述盒体内的石墨烯发热芯片;保温材料注入所述盒体内发泡形成保温层并使石墨烯发热芯片与盖体、盒体粘结为整体。
优选地,保温材料注入所述盒体内在所述石墨烯发热芯片的四周及下方发泡,分别使石墨烯发热芯片与盖体、石墨烯发热芯片与盒体底部之间粘合。
优选地,所述盒体内设置有支撑石墨烯发热芯片的支撑体,使石墨烯发热芯片与盖体之间贴合。
优选地,所述盒体上设置有保温材料的注入口。
为了增大盒体内的石墨烯发热芯片通过盖体向外的热传递,所述盖体为导热材料。
优选地,所述盒体为硬质材料。
优选地,所述石墨烯发热芯片上设有正、负电极,所述正、负电极上焊接有插座。
优选地,所述盒体上设置有所述插座的插座口。
优选地,所述保温材料包括聚氨酯、聚苯乙烯、酚醛、橡塑、无机发泡材料中的至少一种。更优选地,所述保温材料包括聚氨酯发泡材料。
有益效果:与现有技术相比,本发明具有以下有益效果:1、利用发泡保温材料现场发泡将石墨烯发热芯片与外部盒体结构一体粘结,既保护了石墨烯发热芯片在运输或铺设地暖时不被损坏,同时也避免了层层粘结的繁杂工序;2、由于发泡保温材料在整个盒体内发泡成型,避免了单独对焊接点做绝缘处理;3、使用发泡保温材料替代现有的胶黏剂等粘结材料的粘结,有利于环保。4、盖体使用导热材料,在保障了石墨烯发热芯片的产热传热性能的同时,使石墨烯发热体的安全性大幅提高。
附图说明
图1为本发明的整体结构示意图;
图2为本发明的内部结构示意图;
图3为本发明的整体结构剖面示意图。
具体实施方式
下面结合说明书附图和具体实施例对本发明技术方案做进一步说明。
如图1~3所示,其中,1、盖体,2、石墨烯发热芯片,3、插座,4、保温材料、5、盒体,6、注入口,7、插座口。本发明的石墨烯发热体,包括盒体5及盒体5上的盖体1,盒体5及盖体1优选为硬质材料,盖体1为导热材料制成,更便于将盒体5内部的石墨烯发热芯片2的热量传递给外部;盒体5可根据需要设计成多种形状,本实施例为方形,且为了避免搬运、安装过程磕角,本实施例的盒体5四角都为圆角结构。
如图2所示,石墨烯发热芯片2放置于盒体5内,石墨烯发热芯片2是整个石墨烯发热模块的核心结构,用于发热;为了使石墨烯发热芯片2与盖体1之间贴合且与盒体5底部之间留有空隙,在盒体5内放置有支撑石墨烯发热芯片2的支架(图中未示出),还可以设置有其他能够支撑石墨烯发热芯片2的支撑体,只要能够使石墨烯发热芯片2与盖体1之间贴合即可。石墨烯发热芯片2上设有正、负电极,插座3焊接在石墨烯发热芯片2的正、负电极上用于插接电源线;在盒体5的侧边设置有与插座3对应的预留插座口7,以便于向外连接导线。
为便于向盒体5内注入发泡保温材料,盒体5的两个侧边上分别设有两个注入口6,本实施例的保温材料4为聚氨酯发泡材料,发泡保温材料4还可以是聚苯乙烯、酚醛、橡塑、无机发泡材料或者其组合;发泡保温材料4通过注入口6注入到盒体5内在盒体5内现场发泡,由于石墨烯发热芯片2与盖体1之间贴合而与盒体5底部之间留有空隙,注入的发泡保温材料4在石墨烯发热芯片2的四周及下方发泡,石墨烯发热芯片2通过其侧边上的发泡保温材料以及下方的发泡保温材料与盖体1、盒体5粘结为整体。发泡保温材料4在整个盒体5内部发泡也使得石墨烯发热芯片2上的焊接处填充有发泡保温材料4,起到了绝缘的效果,无需再对其进行绝缘保护。有本实施例的石墨烯发热芯片2与盖体1之间没有发泡保温材料4,石墨烯发热芯片2可以更好地通过盖体1向外传递热量,而其余空间均被发泡保温材料填充形成保温层,如图3所示,其中斜线部分为发泡保温材料4填充区域,圆圈内为部分区域放大图。该保温层一方面起到了保温效果,另一方避免了现有技术中石墨烯发热芯片2需分别与其他构件层层粘结的繁杂工序,并且也避免使用胶黏剂粘结,有利于环保;同时也避免了单独对插座3的焊接点做绝缘保护处理。本发明的石墨烯发热体是将石墨烯发热芯片密封的整体,因此,可有效地与水泥砂浆隔离,避免水泥碱性对芯片的侵蚀,使石墨烯发热模块安全性大幅提高。
Claims (10)
1.一种石墨烯发热体,其特征在于,包括盒体(5),设置于所述盒体(5)上的盖体(1),设置于所述盒体(5)内的石墨烯发热芯片(2);保温材料(4)注入所述盒体(5)内发泡使石墨烯发热芯片(2)与盖体(1)、盒体(5)粘结为整体。
2.根据权利要求1所述的石墨烯发热体,其特征在于,所述保温材料(4)注入所述盒体(5)内在所述石墨烯发热芯片(2)的四周及下方发泡。
3.根据权利要求1所述的石墨烯发热体,其特征在于,所述盒体(5)内设置有支撑石墨烯发热芯片(2)的支撑体,用于使石墨烯发热芯片(2)与盖体(1)之间贴合。
4.根据权利要求1所述的石墨烯发热体,其特征在于,所述盒体(5)上设置有保温材料(4)的注入口(6)。
5.根据权利要求1所述的石墨烯发热体,其特征在于,所述盖体(1)为导热材料。
6.根据权利要求1所述的石墨烯发热体,其特征在于,所述盒体(5)为硬质材料。
7.根据权利要求1所述的石墨烯发热体,其特征在于,所述石墨烯发热芯片(2)上设有正、负电极,所述正、负电极上焊接有插座(3)。
8.根据权利要求7所述的石墨烯发热体,其特征在于,所述盒体(5)上预留有所述插座(3)的插座口(7)。
9.根据权利要求1所述的石墨烯发热体,其特征在于,所述保温材料(4)包括聚氨酯、聚苯乙烯、酚醛、橡塑、无机发泡材料中的至少一种。
10.根据权利要求9所述的石墨烯发热体,其特征在于,所述保温材料(4)为聚氨酯发泡材料。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911291759.9A CN110856288A (zh) | 2019-12-16 | 2019-12-16 | 石墨烯发热体 |
US16/991,719 US20200370762A1 (en) | 2019-12-16 | 2020-08-12 | Graphene heating element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911291759.9A CN110856288A (zh) | 2019-12-16 | 2019-12-16 | 石墨烯发热体 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110856288A true CN110856288A (zh) | 2020-02-28 |
Family
ID=69609237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911291759.9A Pending CN110856288A (zh) | 2019-12-16 | 2019-12-16 | 石墨烯发热体 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20200370762A1 (zh) |
CN (1) | CN110856288A (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD920026S1 (en) * | 2019-04-08 | 2021-05-25 | Samsung Electronics Co., Ltd. | Induction range |
CN114016697A (zh) * | 2021-10-25 | 2022-02-08 | 东莞市唯美陶瓷工业园有限公司 | 一种发热瓷砖及其制作方法 |
CN116658965B (zh) * | 2023-05-30 | 2024-04-16 | 山东省六竣装饰材料有限公司 | 一种复合石墨烯取暖墙板及其加工方法 |
CN117979475B (zh) * | 2024-03-28 | 2024-06-11 | 常州早稻电器有限公司 | 一种可折叠的石墨烯加热装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040080390A (ko) * | 2004-07-23 | 2004-09-18 | 이건국 | 발열 기능을 갖는 발열 작용 체 및 구조 체의 구성 방법및 그 제조 방법 |
CN101215922A (zh) * | 2007-01-05 | 2008-07-09 | 造丰科技有限公司 | 采暖用高架地板 |
CN208011845U (zh) * | 2018-03-01 | 2018-10-26 | 保定市融博新能源科技有限公司 | 一种石墨烯材质的地暖 |
CN208763360U (zh) * | 2018-08-03 | 2019-04-19 | 江苏尚珩达科技有限公司 | 一种石墨烯自发热pvc地板 |
CN209011484U (zh) * | 2018-10-19 | 2019-06-21 | 江苏长青艾德利装饰材料有限公司 | 一种地暖发热模块 |
CN110405910A (zh) * | 2019-07-26 | 2019-11-05 | 西安红元节能材料有限公司 | 一种远红外线养生保健环保节能型集成墙面的制备方法 |
CN209593784U (zh) * | 2018-11-05 | 2019-11-05 | 苏州汉纳材料科技有限公司 | 一种安全电热板 |
CN211630412U (zh) * | 2019-12-16 | 2020-10-02 | 华暖(无锡)技术有限公司 | 一种石墨烯发热体 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109403582A (zh) * | 2018-12-07 | 2019-03-01 | 英瑞克自动化有限公司 | 一种方便拆卸的复合地板 |
CN110056163A (zh) * | 2019-05-29 | 2019-07-26 | 上海热丽科技集团有限公司 | 一种自发热陶瓷瓷砖、制备工艺及其铺装方法 |
KR20210122058A (ko) * | 2020-03-31 | 2021-10-08 | 임춘만 | 스마트 시티의 주택과 도로 |
CN212777517U (zh) * | 2020-09-03 | 2021-03-23 | 杨佩君 | 一种环保型家用电加热装置 |
-
2019
- 2019-12-16 CN CN201911291759.9A patent/CN110856288A/zh active Pending
-
2020
- 2020-08-12 US US16/991,719 patent/US20200370762A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040080390A (ko) * | 2004-07-23 | 2004-09-18 | 이건국 | 발열 기능을 갖는 발열 작용 체 및 구조 체의 구성 방법및 그 제조 방법 |
CN101215922A (zh) * | 2007-01-05 | 2008-07-09 | 造丰科技有限公司 | 采暖用高架地板 |
CN208011845U (zh) * | 2018-03-01 | 2018-10-26 | 保定市融博新能源科技有限公司 | 一种石墨烯材质的地暖 |
CN208763360U (zh) * | 2018-08-03 | 2019-04-19 | 江苏尚珩达科技有限公司 | 一种石墨烯自发热pvc地板 |
CN209011484U (zh) * | 2018-10-19 | 2019-06-21 | 江苏长青艾德利装饰材料有限公司 | 一种地暖发热模块 |
CN209593784U (zh) * | 2018-11-05 | 2019-11-05 | 苏州汉纳材料科技有限公司 | 一种安全电热板 |
CN110405910A (zh) * | 2019-07-26 | 2019-11-05 | 西安红元节能材料有限公司 | 一种远红外线养生保健环保节能型集成墙面的制备方法 |
CN211630412U (zh) * | 2019-12-16 | 2020-10-02 | 华暖(无锡)技术有限公司 | 一种石墨烯发热体 |
Also Published As
Publication number | Publication date |
---|---|
US20200370762A1 (en) | 2020-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110856288A (zh) | 石墨烯发热体 | |
CN211630412U (zh) | 一种石墨烯发热体 | |
WO2014117541A1 (zh) | 一种建筑光伏构件模块 | |
CN209893516U (zh) | 一种防漏电的石墨烯电热膜 | |
CN205654030U (zh) | 一种纳米远红外发热瓷砖 | |
CN203145016U (zh) | 一种调节混凝土内外温差的装置 | |
CN204678474U (zh) | 一种基于导热膜的地暖结构 | |
CN105696757A (zh) | 一种保温装饰防辐射一体板 | |
CN101936042B (zh) | 小框体复合保温隔热体系防水构造 | |
CN200989052Y (zh) | 平面蓄热保温型拼装式电热地板 | |
CN204728634U (zh) | 一种干式地暖导热模块 | |
CN206090923U (zh) | 一种主动能源式保温外墙 | |
KR20100000401U (ko) | 발열 거푸집 패널 | |
CN205296696U (zh) | 一种供暖保暖地板 | |
CN104154659A (zh) | 热水器、热水器的复合板和热水器的制备方法 | |
CN204876117U (zh) | 一种带外框的保温板 | |
CN206941930U (zh) | 一种装配式坡屋面板 | |
CN204098426U (zh) | 一种发热石板砖 | |
CN214301854U (zh) | 一种抗冻水表井 | |
CN204662690U (zh) | 一种建筑保温泡沫板的卡扣结构防护装置 | |
CN205657243U (zh) | 智能电网专用连接器 | |
CN211523917U (zh) | 一种复合保温型木地板 | |
CN204513542U (zh) | 发热线制热器 | |
CN207069505U (zh) | 一种油纸电容式穿墙套管 | |
CN220823308U (zh) | 一种高强发热模块 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |