CN110842961A - Mechanical arm control clamp for chip proton exchange and use method thereof - Google Patents
Mechanical arm control clamp for chip proton exchange and use method thereof Download PDFInfo
- Publication number
- CN110842961A CN110842961A CN201911193375.3A CN201911193375A CN110842961A CN 110842961 A CN110842961 A CN 110842961A CN 201911193375 A CN201911193375 A CN 201911193375A CN 110842961 A CN110842961 A CN 110842961A
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- proton exchange
- chip
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- arm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/08—Gripping heads and other end effectors having finger members
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/134—Integrated optical circuits characterised by the manufacturing method by substitution by dopant atoms
- G02B6/1345—Integrated optical circuits characterised by the manufacturing method by substitution by dopant atoms using ion exchange
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- Mechanical Engineering (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The invention discloses a mechanical arm control clamp for chip proton exchange, which is fixed at the top end and inside of a proton exchange furnace and comprises: the chip clamping device comprises a fixing module, a motor control device, a transmission device, a mechanical rotating cantilever, a mechanical displacement arm, a clamp clamping module and a chip clamp. In addition, the invention also discloses a method for controlling the clamp to perform proton exchange according to the mechanical arm. The invention can mechanically control the movement of the lithium niobate substrate, effectively reduce the manual operation in the proton exchange process and the temperature fluctuation brought to the exchange process by switching on and off the proton exchange furnace, thereby reducing the physical damage to operators and improving the stability of the lithium niobate optical waveguide manufactured by proton exchange.
Description
Technical Field
The invention relates to the technical field of integrated optics, in particular to a mechanical arm control clamp for chip proton exchange and a using method thereof.
Background
The lithium niobate material has excellent electro-optic, acousto-optic and nonlinear optical effects, and has wide application in the field of optical modulation. The refractive index increment of the proton exchange lithium niobate waveguide has anisotropy, the refractive index of the abnormal light is increased, and the refractive index of the ordinary light is slightly reduced, so that the proton exchange lithium niobate waveguide also has a polarization effect and is a single-polarization optical waveguide. The proton exchange lithium niobate waveguide integrated phase modulator integrates the functions of beam splitting, beam combining, polarization and electro-optical modulation, and has an extremely important function in the field of fiber optic gyroscopes. The high-temperature annealing proton exchange technology is the most mainstream technology for manufacturing the lithium niobate integrated optical modulator.
The method for manufacturing the lithium niobate optical waveguide by the annealing proton exchange technology mainly comprises the steps of cleaning a substrate, preparing a mask on the substrate, photoetching a waveguide pattern, proton exchange, annealing, end face polishing and the like. The proton exchange process is the core of the technology, and mainly comprises the following steps: a. respectively cleaning a quartz clamp for loading a lithium niobate substrate, a quartz pipeline for containing proton exchange liquid and the lithium niobate substrate with waveguide patterns photoetched; b. mixing a proper amount of lithium benzoate and benzoic acid crystals in a quartz pipeline by using a balance to obtain a benzoic acid mixed solution for proton exchange, mounting a thermocouple on the quartz pipeline, and putting the quartz pipeline into a heating furnace; c. starting the heating furnace, heating the proton exchange liquid in the quartz pipeline to 200 ℃, slowly heating to 240 ℃ and keeping the temperature stable; d. loading the lithium niobate substrate on a quartz clamp, preheating the lithium niobate substrate to 240 ℃ in an oven, taking the preheated quartz clamp out of the oven, and quickly putting the quartz clamp into proton exchange liquid for proton exchange. At present, the operation process of the proton exchange process is mainly completed manually.
According to the above steps of the proton exchange process, the quartz tube containing the proton exchange liquid in step c and the oven for preheating the jig in step d are separated. The temperature of the quartz clamp is firstly reduced and then increased in the process of taking the quartz clamp out of the oven and then putting the quartz clamp into the proton exchange liquid, and the operation is traditionally completed manually. The manual operation is difficult to avoid the gas volatilization of the proton exchange liquid, which causes certain harm to the body of an operator. And the operation of opening the furnace also causes temperature fluctuations within the proton exchange furnace, which causes uncontrollable uncertainties in the proton exchange.
Disclosure of Invention
Therefore, the invention aims to provide a mechanical arm control clamp for chip proton exchange and a using method thereof, which are used for solving the problem of manually operating chip movement in the proton exchange process, and the specific technical scheme is as follows:
in one aspect, the present invention provides a mechanical arm control clamp for proton exchange of a chip, which is fixed at the top end and inside a proton exchange furnace, and comprises:
the fixed module comprises a fixed base and a temperature isolation mechanism which are connected with each other, and the fixed base is arranged at the top end of the proton exchange furnace;
the motor control device is arranged in the temperature isolation mechanism and provided with a displacement control button;
the transmission device is arranged on the temperature isolation mechanism and is electrically connected with the motor control device;
the mechanical rotating cantilever is rotationally connected with the transmission device; the transmission device is provided with a rocker arm structure capable of operating the mechanical rotating cantilever to move up and down, and the rocker arm structure is controlled by the motor control device;
the end part of the mechanical rotating cantilever, which is far away from the transmission device, is fixedly connected with one end of the mechanical displacement arm, and the other end of the mechanical displacement arm extends into the mechanical displacement arm sliding groove and can realize relative sliding with the mechanical displacement arm sliding groove; the transmission device is also provided with a telescopic structure which can control the mechanical displacement arm to realize horizontal movement, and the telescopic structure is controlled by the motor control device;
the end part of the mechanical displacement arm sliding groove far away from the mechanical displacement arm is vertically and fixedly connected with one end of the clamp clamping module;
the chip clamp comprises a clamp rod and a chip placing groove, the other end of the clamp clamping module is connected with the clamp rod, and the end, far away from the clamp clamping module, of the clamp rod is connected with the chip placing groove; the chip placing groove is a glass vessel for fixing the lithium niobate substrate;
the transmission device, the mechanical rotating cantilever, the mechanical displacement arm, the clamp clamping module and the chip clamp are all positioned in the proton exchange furnace.
The mechanical arm control clamp for chip proton exchange provided by the invention can mechanically control the movement of the lithium niobate substrate, effectively reduce the manual operation in the proton exchange process and the temperature fluctuation brought to the exchange process by switching on and off the proton exchange furnace, thereby reducing the physical damage to operators and improving the stability of the lithium niobate optical waveguide manufactured by proton exchange.
On the basis of the technical scheme, the invention can be improved as follows:
preferably, the displacement control button comprises displacement control in four directions of up, down, left and right, so as to realize the movement control of the chip clamp in four dimensions.
Preferably, the fixture clamping module is fixed with the fixture rod in an inserting manner; the fixture clamping module is provided with a hollow groove matched with the outer diameter of the fixture rod in the inner part of one end connected with the fixture rod.
Preferably, the clamp holding module is made of a polymer material.
Preferably, the clamp rod and the chip placing groove are of an integrally formed structure.
Preferably, the clamp rod and the chip placing groove are made of silicon dioxide materials.
The silica material does not react with the benzoic acid melt and can therefore participate in the proton exchange throughout. After proton exchange is finished, the catalyst can be cleaned and dried by alcohol, can be repeatedly used and has high repeated utilization rate.
Preferably, the chip placing groove is a glass dish with a diameter of 15-25cm, a hollow bottom and a chip groove partition plate.
In another aspect, the present invention further provides a method for proton exchange by using the above robot arm control clamp, including the following steps:
s1: putting the lithium niobate substrate into the chip placing groove;
s2: controlling the mechanical rotating cantilever and the mechanical displacement arm through the displacement control button so as to slowly place the chip placing groove above proton exchange liquid in a quartz pipeline in the proton exchange furnace for preheating;
s3: after the temperature displayed on the control interface of the proton exchange furnace is stable, the chip placing groove is placed to the bottom of a quartz pipeline in the proton exchange furnace through the displacement control button to carry out proton exchange;
s4: and after the proton exchange is finished, the chip placing groove is controlled to move out of the proton exchange furnace through the displacement control button, and a control program of the proton exchange furnace is closed.
Preferably, the stay time of the chip placing groove in the proton exchange liquid is controlled within the range of 3min-6 min.
Preferably, before the method is performed, a quartz tube containing a proton exchange liquid is placed into the proton exchange furnace, then the proton exchange furnace is started to heat the proton exchange liquid in the quartz tube to 200 ℃, and then the temperature is slowly raised to 240 ℃ and kept stable; and then, loading the lithium niobate substrate on a lithium niobate substrate clamp, preheating the lithium niobate substrate to 240 ℃ in an oven, and then placing the lithium niobate substrate in the chip placing groove.
By adopting the technical scheme, the invention has the advantages that:
the invention relates to a mechanical arm control clamp for chip proton exchange, which controls the movement of a chip clamp by driving a transmission device and an execution device (a mechanical rotating cantilever, a mechanical displacement arm and a mechanical displacement arm sliding groove), so that a chip placing groove filled with a lithium niobate substrate is suspended above a proton exchange liquid surface or is immersed in a proton exchange liquid according to a proton exchange process. The mechanically controlled chip clamp consists of a four-freedom-degree execution device and a chip clamp, and the chip clamp can be controlled to move up and down and back and forth through a motor control device. The liquid used for exchanging the proton of the chip is an organic matter which is volatile at the proton exchange temperature and harmful to a human body, the proton exchange is carried out by using the chip clamp controlled by a machine, the manual operation in the proton exchange process can be avoided, the harm to the human body caused by the volatilization of the gas of the proton exchange liquid in the proton exchange process is reduced, and therefore the safety and the controllability of the proton exchange process can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a mechanical arm control clamp for exchanging protons on a chip according to the present invention.
Fig. 2 is a schematic view of the mechanical displacement arm of fig. 1 sliding relative to the mechanical displacement arm sliding groove.
Fig. 3 is a schematic view of the mechanical rotating arm of fig. 1 rotating relative to the transmission.
FIG. 4 is a schematic structural diagram of a chip holder according to the present invention.
FIG. 5 is a schematic view of a connection structure of the chip clamping module and the chip clamp according to the present invention.
Fig. 6 is a schematic view of a connection structure of a mechanical rotating cantilever and a transmission device provided by the invention.
Fig. 7 is a schematic view of a connection structure of the mechanical displacement arm and the sliding groove of the mechanical displacement arm according to the present invention.
Fig. 8 is a schematic flow chart of a method for exchanging protons according to a robot arm control clamp provided by the invention.
Wherein, in the figure,
1-fixed base, 2-temperature isolation mechanism, 3-motor control device, 4-displacement control button, 5-transmission device, 6-mechanical rotating cantilever, 7-mechanical displacement arm, 8-mechanical displacement arm sliding groove, 9-clamp clamping module, 10-clamp rod, 11-chip placing groove and 12-fixing screw.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Example (b):
a robotic arm control fixture for chip proton exchange and method of use thereof according to embodiments of the present invention are described in detail below with reference to fig. 1-8.
The embodiment of the invention discloses a mechanical arm control clamp for proton exchange of a chip, which is mainly used for moving and controlling the chip clamp in the proton exchange process of manufacturing a lithium niobate substrate, and particularly controls the chip clamp to move up, down, left and right by driving a transmission device 5 and an execution device. As shown in fig. 1, 2, and 3, the robot arm control jig includes: the chip clamping device comprises a fixing module, a motor control device 3, a transmission device 5, a mechanical rotating cantilever 6, a mechanical displacement arm 7, a mechanical displacement arm sliding groove 8, a clamp clamping module 9 and a chip clamp.
In specific implementation, in the mechanical arm control fixture provided by the embodiment of the invention, as shown in fig. 1, the whole fixture is fixed on the proton exchange furnace through the fixing module, and the fixing module comprises the fixing base 1 and the temperature isolation mechanism 2, and plays roles of fixing the fixture structure and the temperature isolation protection motor control device 3.
The motor control device 3 is arranged in the temperature isolation mechanism 2 and provided with a displacement control button 4, and the displacement control button 4 comprises displacement control in four directions of up, down, left and right so as to realize the movement control of four dimensions of the chip clamp.
The transmission device 5 is installed on the temperature isolation mechanism 2 and electrically connected with the motor control device 3, that is, the transmission device 5 is controlled by the motor control device 3.
The mechanical rotating cantilever 6 is rotatably connected with the transmission device 5, specifically, as shown in fig. 6, the mechanical rotating cantilever 6 is connected with the transmission device 5 through a rotating shaft or a rotating knob; the transmission device 5 is provided with a rocker arm structure which can control the mechanical rotating cantilever 6 to move up and down, and the rocker arm structure is controlled by the motor control device 3 and a corresponding motor. Further, the rocker arm structure can precisely control the vertical displacement of the mechanical rotating cantilever 6 (i.e., the chip clamp).
The end of the mechanical rotating cantilever 6 far from the transmission device 5 is fixedly connected with one end of a mechanical displacement arm 7, as shown in fig. 7, the other end of the mechanical displacement arm 7 extends into a mechanical displacement arm sliding groove 8 and can realize relative sliding with the mechanical displacement arm sliding groove 8; the transmission device 5 is also provided with a telescopic structure which can control the mechanical displacement arm 7 to realize horizontal movement, and the telescopic structure is controlled by the motor control device 3 and a corresponding motor. Further, the telescopic structure can precisely control the horizontal displacement of the mechanical displacement arm 7 (i.e., the chip gripper).
The clamp holding module 9 is made of polymer material, as shown in fig. 1, the end of the mechanical displacement arm sliding groove 8 far from the mechanical displacement arm 7 is vertically and fixedly connected with one end of the clamp holding module 9 through a fixing screw 12.
As shown in fig. 4 and 5, the chip clamp includes a clamp rod 10 and a chip placement groove 11, the other end of the clamp clamping module 9 is fixed to the clamp rod 10 by inserting, and specifically, a hollow groove matched with the outer diameter of the clamp rod 10 is formed inside the end of the clamp clamping module 9 connected to the clamp rod 10; one end of the clamp rod 10 away from the clamp chucking module 9 is connected to the chip placement groove 11. As shown in fig. 4, the clamp rod 10 and the chip placement groove 11 are integrally formed, and both are made of silicon dioxide.
The clamp rod 10 is 40cm long and 3cm in diameter, and the chip placing groove 11 at the lower part is a glass dish with a diameter of 15-25cm, a hollow bottom and a chip groove clapboard, and is used for fixing the lithium niobate substrate.
The transmission device 5, the mechanical rotating cantilever 6, the mechanical displacement arm 7, the clamp clamping module 9 and the chip clamp are all positioned in the proton exchange furnace.
According to the mechanical arm control clamp for chip proton exchange provided by the embodiment of the invention, the mechanical rotating cantilever 6 and the mechanical displacement arm 7 are used for controlling the chip clamp to move in four directions, so that the mechanization of chip control in the proton exchange process is realized, the manual operation in the proton exchange process and the temperature fluctuation brought to the exchange process by switching on and off the proton exchange furnace can be effectively reduced, the physical damage to operators can be reduced, and the stability of preparing the lithium niobate optical waveguide by proton exchange is improved.
The embodiment of the invention also discloses a method for performing proton exchange according to the mechanical arm control clamp, which comprises the following steps as shown in FIG. 8:
s1: putting the lithium niobate substrate into the chip placing groove 11;
s2: the mechanical rotating cantilever 6 and the mechanical displacement arm 7 are controlled by the displacement control button 4, so that the chip placing groove 11 is slowly placed above proton exchange liquid in a quartz pipeline in the proton exchange furnace for preheating;
s3: after the temperature displayed on the control interface of the proton exchange furnace is stable, the chip placing groove 11 is placed to the bottom of a quartz pipeline in the proton exchange furnace through the displacement control button 4 for proton exchange;
s4: after the proton exchange is finished, the chip placing groove 11 is controlled by the displacement control button 4 to move out of the proton exchange furnace, and the control program of the proton exchange furnace is closed.
In the above step S3, the residence time of the chip placement groove 11 in the proton exchange solution is controlled within the range of 3min to 6min, and the preferable duration is 5 min.
Before the method is executed, a quartz pipeline filled with proton exchange liquid is put into a proton exchange furnace, then the proton exchange furnace is started to heat the proton exchange liquid in the quartz pipeline to 200 ℃, and then the temperature is slowly raised to 240 ℃ and kept stable; then, the lithium niobate substrate is loaded on the lithium niobate substrate clamp, preheated to 240 ℃ in the oven, and then placed in the chip placing groove 11.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a mechanical arm control anchor clamps for chip proton exchange, is fixed in the top and the inside of proton exchange furnace, its characterized in that includes:
the fixed module comprises a fixed base and a temperature isolation mechanism which are connected with each other, and the fixed base is arranged at the top end of the proton exchange furnace;
the motor control device is arranged in the temperature isolation mechanism and provided with a displacement control button;
the transmission device is arranged on the temperature isolation mechanism and is electrically connected with the motor control device;
the mechanical rotating cantilever is rotationally connected with the transmission device; the transmission device is provided with a rocker arm structure capable of operating the mechanical rotating cantilever to move up and down, and the rocker arm structure is controlled by the motor control device;
the end part of the mechanical rotating cantilever, which is far away from the transmission device, is fixedly connected with one end of the mechanical displacement arm, and the other end of the mechanical displacement arm extends into the mechanical displacement arm sliding groove and can realize relative sliding with the mechanical displacement arm sliding groove; the transmission device is also provided with a telescopic structure which can control the mechanical displacement arm to realize horizontal movement, and the telescopic structure is controlled by the motor control device;
the end part of the mechanical displacement arm sliding groove far away from the mechanical displacement arm is vertically and fixedly connected with one end of the clamp clamping module;
the chip clamp comprises a clamp rod and a chip placing groove, the other end of the clamp clamping module is connected with the clamp rod, and the end, far away from the clamp clamping module, of the clamp rod is connected with the chip placing groove; the chip placing groove is a glass vessel for fixing the lithium niobate substrate;
the transmission device, the mechanical rotating cantilever, the mechanical displacement arm, the clamp clamping module and the chip clamp are all positioned in the proton exchange furnace.
2. The robotic arm control gripper for chip proton exchange as claimed in claim 1, wherein said displacement control buttons comprise four directional displacement controls of "up", "down", "left" and "right" to achieve four dimensional movement control of said chip gripper.
3. The mechanical arm control clamp for chip proton exchange as claimed in claim 1, wherein the clamp holding module is fixed with the clamp rod in a plugging manner; the fixture clamping module is provided with a hollow groove matched with the outer diameter of the fixture rod in the inner part of one end connected with the fixture rod.
4. The robotic arm control gripper for chip proton exchange as claimed in claim 1, wherein said gripper holding module is made of polymer material.
5. The robotic arm control gripper for proton exchange of chips as claimed in claim 1, wherein said gripper bar is integrally formed with said chip placement slot.
6. The robotic arm control gripper for proton exchange of chips as claimed in claim 1, wherein said gripper bar and said chip placement slot are made of silicon dioxide material.
7. The mechanical arm control clamp for proton exchange of chips of claim 1, wherein the chip placement groove is a hollow-bottom glass dish with a diameter of 15-25cm and a chip groove clapboard.
8. A method for proton exchange by a manipulator arm controlled clamp according to any one of claims 1 to 7, comprising the steps of:
s1: putting the lithium niobate substrate into the chip placing groove;
s2: controlling the mechanical rotating cantilever and the mechanical displacement arm through the displacement control button so as to slowly place the chip placing groove above proton exchange liquid in a quartz pipeline in the proton exchange furnace for preheating;
s3: after the temperature displayed on the control interface of the proton exchange furnace is stable, the chip placing groove is placed to the bottom of a quartz pipeline in the proton exchange furnace through the displacement control button to carry out proton exchange;
s4: and after the proton exchange is finished, the chip placing groove is controlled to move out of the proton exchange furnace through the displacement control button, and a control program of the proton exchange furnace is closed.
9. The method for proton exchange according to the robot arm control jig of claim 8, wherein a time period for which the chip placement tank stays in the proton exchange solution is controlled to be in a range of 3min to 6 min.
10. The method of claim 8, wherein the proton exchange is performed by placing a quartz tube containing a proton exchange solution into the proton exchange furnace, and then starting the proton exchange furnace to heat the proton exchange solution in the quartz tube to 200 ℃, slowly raising the temperature to 240 ℃ and keeping the temperature stable; and then, loading the lithium niobate substrate on a lithium niobate substrate clamp, preheating the lithium niobate substrate to 240 ℃ in an oven, and then placing the lithium niobate substrate in the chip placing groove.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911193375.3A CN110842961A (en) | 2019-11-28 | 2019-11-28 | Mechanical arm control clamp for chip proton exchange and use method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911193375.3A CN110842961A (en) | 2019-11-28 | 2019-11-28 | Mechanical arm control clamp for chip proton exchange and use method thereof |
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| CN110842961A true CN110842961A (en) | 2020-02-28 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4563567A (en) * | 1982-06-08 | 1986-01-07 | Commissariat A L'energie Atomique | Apparatus for transmitting a laser beam |
| CN1417621A (en) * | 2001-11-11 | 2003-05-14 | 华为技术有限公司 | Proton exchange method and equipment for producing lithium niobate light waveguide |
| CN106363665A (en) * | 2016-11-30 | 2017-02-01 | 广西大学 | Clamping gripper with water cooling function |
| CN109610005A (en) * | 2018-12-11 | 2019-04-12 | 武汉光谷信息光电子创新中心有限公司 | A kind of proton exchange furnace and its application method |
| CN209440142U (en) * | 2018-12-22 | 2019-09-27 | 山东科技大学 | A kind of multiple degrees of freedom automatic transporting machine people |
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2019
- 2019-11-28 CN CN201911193375.3A patent/CN110842961A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4563567A (en) * | 1982-06-08 | 1986-01-07 | Commissariat A L'energie Atomique | Apparatus for transmitting a laser beam |
| CN1417621A (en) * | 2001-11-11 | 2003-05-14 | 华为技术有限公司 | Proton exchange method and equipment for producing lithium niobate light waveguide |
| CN106363665A (en) * | 2016-11-30 | 2017-02-01 | 广西大学 | Clamping gripper with water cooling function |
| CN109610005A (en) * | 2018-12-11 | 2019-04-12 | 武汉光谷信息光电子创新中心有限公司 | A kind of proton exchange furnace and its application method |
| CN209440142U (en) * | 2018-12-22 | 2019-09-27 | 山东科技大学 | A kind of multiple degrees of freedom automatic transporting machine people |
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Application publication date: 20200228 |