CN110842766A - Chip loading mechanism and chip grinding and polishing system - Google Patents
Chip loading mechanism and chip grinding and polishing system Download PDFInfo
- Publication number
- CN110842766A CN110842766A CN201911171194.0A CN201911171194A CN110842766A CN 110842766 A CN110842766 A CN 110842766A CN 201911171194 A CN201911171194 A CN 201911171194A CN 110842766 A CN110842766 A CN 110842766A
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- loading
- chip
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- loading mechanism
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a chip loading mechanism and a chip grinding and polishing system, and relates to the technical field of chip grinding and polishing. The chip loading mechanism comprises a loading part and a magnetic part, wherein a plurality of positioning holes for accommodating chips are concavely arranged on one side of the loading part, the magnetic part is selectively contacted with one side of the loading part, which is far away from the positioning holes, so as to bear the loading part, and the magnetic part is used for selectively absorbing the loading part. The chip loading mechanism provided by the invention can simplify the loading process of chips in batches, save the cost and does not influence the chip polishing precision.
Description
Technical Field
The invention relates to the technical field of chip grinding and polishing, in particular to a chip loading mechanism and a chip grinding and polishing system.
Background
Before the batch of chips are ground and polished, the batch of chips need to be loaded. At present, the common chip loading modes include vacuum adsorption, wax sticking, glue coating and the like. The vacuum adsorption difficulty is high, the cost is high, the uniformity of wax sticking and gluing is difficult to control, the polishing precision is difficult to guarantee, and the problem of difficulty in unloading exists.
Disclosure of Invention
The invention aims to provide a chip loading mechanism which can simplify the process of loading chips in batches, save the cost and ensure the polishing precision.
Another object of the present invention is to provide a chip polishing system, which can simplify the loading process of chips in batch, save the cost, and ensure the polishing precision.
The invention provides a technical scheme that:
a chip loading mechanism comprises a loading part and a magnetic part,
a plurality of positioning holes for accommodating the chips are concavely arranged on one side of the loading piece;
the magnetic part is selectively contacted with one side of the loading part, which is far away from the positioning hole, so as to bear the loading part, and the magnetic part is used for selectively adsorbing the loading part.
Further, be provided with change over switch on the piece is inhaled to magnetism, be provided with the electro-magnet in the piece is inhaled to magnetism, change over switch with the electro-magnet electricity is connected for control the break-make of the circuit of electro-magnet.
Furthermore, the magnetic attraction piece comprises a base and a bearing table, one end of the bearing table is connected with the base, the bearing table and the base enclose an accommodating cavity, the electromagnet is accommodated in the accommodating cavity, the change-over switch is arranged on the side wall of the bearing table, and one end of the bearing table, which is far away from the base, is used for bearing the loading piece.
Furthermore, the bearing table and the base are coaxially arranged, and the vertical projection of the bearing table on the base is located in an area defined by the outer edge of the base.
Further, the plummer all is cylindrical with the base.
Furthermore, the chip loading mechanism further comprises a positioning part, wherein the positioning part is connected with the magnetic part and used for fixing the loading part when the magnetic part bears the loading part.
Furthermore, a bayonet is arranged on the positioning piece, a convex handle is arranged on the outer edge of the loading piece in a radial protruding mode, and the bayonet is used for clamping the convex handle to prevent the loading piece from rotating on the magnetic suction piece.
Furthermore, the setting element includes linkage segment, interlude and cooperation section, the both ends of interlude respectively with the linkage segment reaches the respective one end of cooperation section is the contained angle and connects, the linkage segment with the piece is inhaled to magnetism is connected, the bayonet socket set up in on the cooperation section.
Furthermore, the positioning hole comprises a conical guide section, a first accommodating section and a second accommodating section which are coaxially arranged from the surface of the loading part to the interior of the loading part in sequence, and the diameter of the first accommodating section is larger than that of the second accommodating section.
The invention also provides a chip grinding and polishing system, which comprises a grinding and polishing device and the chip loading mechanism, wherein the chip loading mechanism comprises a loading part and a magnetic part, and a plurality of positioning holes for accommodating chips are concavely arranged on one side of the loading part; the magnetic part is selectively contacted with one side of the loading part, which is far away from the positioning hole, so as to bear the loading part, and the magnetic part is used for selectively adsorbing the loading part. The grinding and polishing device is used for grinding and polishing the chip accommodated in the positioning hole.
Compared with the prior art, the chip loading mechanism provided by the invention has the advantages that one side of the loading part is concavely provided with the plurality of positioning holes for accommodating the chips, and one side of the loading part, which is far away from the positioning holes, is loaded and selectively adsorbed by the magnetic part. In practical application, the batch chips are accommodated in the positioning holes, then the loading piece is placed on the magnetic suction piece, and the magnetic suction piece is started to control the magnetic suction piece to suck the loading piece, so that the batch chips are loaded. The magnetic attraction piece is controlled to stop attracting the loading piece, so that the loading piece can be moved away, and unloading of the chips in batches is completed. The chip loading mechanism is simple in structure, the loading and unloading processes are convenient and quick, and factors influencing the chip polishing precision do not exist. Therefore, the chip loading mechanism provided by the invention has the beneficial effects that: the loading process of chips in batches can be simplified, the cost is saved, and the chip polishing precision is not influenced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below. It is appreciated that the following drawings depict only certain embodiments of the invention and are therefore not to be considered limiting of its scope. For a person skilled in the art, it is possible to derive other relevant figures from these figures without inventive effort.
Fig. 1 is a schematic structural diagram of a chip loading mechanism according to a first embodiment of the present invention;
FIG. 2 is a schematic view of the structure of the loading member of FIG. 1;
FIG. 3 is a cross-sectional view of the alignment hole and chip mating structure of FIG. 2;
FIG. 4 is a schematic view of the magnetic member shown in FIG. 1;
fig. 5 is a schematic structural view of the positioning member in fig. 1.
Icon: 100-a chip loading mechanism; 110-a load member; 111-locating holes; 1111-a conical guide section; 1113-a first accommodating section; 1115-a second tapered guide section; 1117-second accommodating section; 113-a convex handle; 130-a magnetic element; 131-a base; 132-a housing chamber; 133-a carrier stage; 1331-a diverter switch; 150-a positioning element; 151-connecting segment; 153-middle section; 155-a mating segment; 1551-bayonet.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "inside", "outside", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention are conventionally placed in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, and are used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is also to be noted that, unless otherwise explicitly stated or limited, the terms "disposed" and "connected" are to be interpreted broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The following detailed description of embodiments of the invention refers to the accompanying drawings.
First embodiment
Referring to fig. 1, a chip loading mechanism 100 according to the present embodiment is used for batch polishing of chips. The chip loading mechanism 100 is simple to operate, can simplify the loading process of chips in batches, saves cost, and does not influence the chip polishing precision.
The chip loading mechanism 100 provided in this embodiment includes a loading member 110, a magnetic attraction member 130 and a positioning member 150, wherein the loading member 110 is used for fixing a batch of chips, the magnetic attraction member 130 is used for attracting the loading member 110 to load the batch of chips, and the positioning member 150 is connected to the magnetic attraction member 130 and is used for fixing the position of the loading member 110 when the loading member 110 is attracted by the magnetic attraction member 130.
Referring to fig. 1 and 2, the carrier 110 is respectively provided with a plurality of positioning holes 111 and a protruding handle 113, the positioning holes 111 are concavely formed on one side of the carrier 110, and the positioning holes 111 are used for accommodating and fixing the chip to prevent the chip from slipping or jumping during the grinding process. The other side of the loading part 110 opposite to the side where the positioning hole 111 is recessed is used for contacting with the magnetic attraction part 130. The protruding handle 113 is used to cooperate with the positioning member 150 to fix the loading member 110 relative to the magnetic member 130.
In this embodiment, the number of the protruding handles 113 is two, and the two protruding handles 113 are respectively protruded from the outer edges of two opposite sides of the loading member 110 in the radial direction. In other embodiments, other numbers of lugs 113 may be provided on the carrier 110 depending on the application.
Referring to fig. 2 and fig. 3, in the present embodiment, the positioning hole 111 includes a first tapered guiding section 1111, a first accommodating section 1113, a second tapered guiding section 1115, and a second accommodating section 1117 coaxially disposed in sequence from the surface of the carrier 110 to the inside thereof.
The bottom end of the first conical guiding section 1111, which has a relatively larger diameter, is disposed on the surface of the carrier 110, the top end of the first conical guiding section 1111, which has a relatively smaller diameter, extends to the inside of the carrier 110 to be connected to one end of the first accommodating section 1113, and the diameter of the top end of the first conical guiding section 1111 is equal to the diameter of the first accommodating section 1113. The bottom end of the second conical guiding section 1115, which has a relatively large diameter, is disposed at one end of the first accommodating section 1113, which is far away from the first conical guiding section 1111, and the diameter of the bottom end is smaller than that of the first accommodating section 1113, and the top end of the second conical guiding section 1115 is connected with the second accommodating section 1117 and is equal to that of the second accommodating section 1117.
As shown in fig. 3, when the chip is inserted into the positioning hole 111, the second accommodating section 1117 can be easily inserted under the guidance of the first tapered guiding section 1111 and the second tapered guiding section 1115, and the raised ring wall on the side of the chip is accommodated in the first accommodating section 1113. When the chip is ground and polished, the top of the chip receives shearing force, the chip is under the limiting action of the second accommodating section 1117, and the raised ring wall on the side edge of the chip is limited by the first accommodating section 1113, so that the chip can jump or move under the action of the shearing force, errors are avoided, and the grinding and polishing accuracy is ensured.
Referring to fig. 1 and 4, the magnetic member 130 includes a base 131 and a supporting platform 133, in this embodiment, the base 131 and the supporting platform 133 are both cylindrical, one end of the supporting platform 133 is coaxially connected to one end of the base 131, and the diameter of the supporting platform 133 is smaller than that of the base 131, that is, the vertical projection of the supporting platform 133 on the base 131 is located in the area surrounded by the outer edge of the base 131, and one end of the supporting platform 133 away from the base 131 is used for supporting the loading member 110.
In this embodiment, an electromagnet adsorption manner is adopted, the bearing table 133 and the base 131 enclose the accommodating cavity 132, the electromagnet is arranged in the accommodating cavity 132, the circuit of the electromagnet is electrically connected with the switch 1331, the switch 1331 is arranged on the side wall of the bearing table 133, and an operator can control the switch 1331 to switch on and off the circuit of the electromagnet, so that the magnetic field is generated to adsorb the carrier 110, the batch chips are loaded, or the magnetic field is cancelled, and the adsorption of the carrier 110 is stopped, so that the batch chips are unloaded.
In other embodiments, the electromagnet may be disposed at other relative positions and structures with respect to the magnetic element 130, such as the electromagnet is embedded at an end of the supporting platform 133 away from the base 131.
Referring to fig. 1 and fig. 5, the positioning element 150 includes a connecting section 151, an intermediate section 153 and a matching section 155, two ends of the intermediate section 153 are respectively connected to one end of the connecting section 151 and one end of the matching section 155 at an included angle, and in this embodiment, the connecting section 151 and the matching section 155 are perpendicular to the intermediate section 153. The connecting section 151 is connected to the magnetic member 130, and the engaging section 155 is engaged with the protruding handle 113 protruding from the loading member 110.
In this embodiment, the connecting section 151 is connected to the magnetic attraction element 130, the extending direction of the middle section 153 is the same as the protruding direction of the supporting platform 133, the matching section 155 is laid on the end surface of the supporting platform 133 at the end far from the base 131, and the matching section 155 is provided with a bayonet 1551, the bayonet 1551 is used for clamping the protruding handle 113, so as to position the loading element 110, and prevent the loading element 110 from displacing relative to the magnetic attraction element 130 in the polishing process.
In this embodiment, the number and the position of the protruding handles 113 of the loading unit 110 correspond to that of the two positioning units 150, the two positioning units 150 are arranged on the base 131 in a central symmetry manner, the matching sections 155 of the two positioning units 150 are located on two opposite sides of the end surface of the end of the plummer 133 far away from the base 131, and the bayonets 1551 of the two positioning units are opposite to each other.
In practical application, after the batch of chips are inserted into the positioning holes 111 on the carrier 110, the carrier 110 is placed on the supporting platform 133, and during placement, the two protruding handles 113 are respectively clamped into the respective bayonets 1551 of the two positioning members 150, and then the switch 1331 is operated to make the magnetic attraction member 130 have magnetism, so that the carrier 110 is attracted, that is, the loading of the batch of chips is completed, and the subsequent polishing process can be performed. After polishing, the switch 1331 is operated to make the magnetic attraction element 130 no longer have magnetism, and at this time, the loading element 110 is moved away from the carrier 133 along the axial direction, i.e., the batch of chips is unloaded.
Therefore, the chip loading mechanism 100 provided by the embodiment can simplify the chip loading process in batch, save the cost, and does not affect the chip polishing precision.
Second embodiment
The present embodiment provides a chip polishing system, which includes a polishing apparatus and the chip loading mechanism 100 provided in the first embodiment, wherein the polishing apparatus is configured to polish and polish the chip accommodated in the positioning hole 111.
In practical application, after the batch of chips are inserted into the positioning hole 111 on the carrier 110, the carrier 110 is placed on the supporting platform 133, when placing, the two protruding handles 113 are respectively clamped into the respective bayonets 1551 of the two positioning members 150, then the switch 1331 is operated to make the magnetic attraction member 130 have magnetism, the carrier 110 is attracted, that is, the loading of the batch of chips is completed, and then the chip polishing device performs polishing processing on the chips. After polishing, the switch 1331 is operated to make the magnetic attraction element 130 no longer have magnetism, and at this time, the loading element 110 is moved away from the carrier 133 along the axial direction, i.e., the batch of chips is unloaded.
Therefore, the chip polishing system provided by the embodiment can simplify the loading process of the chips in batches, save the cost and does not influence the chip polishing precision.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A chip loading mechanism is characterized by comprising a loading part and a magnetic part,
a plurality of positioning holes for accommodating the chips are concavely arranged on one side of the loading piece;
the magnetic part is selectively contacted with one side of the loading part, which is far away from the positioning hole, so as to bear the loading part, and the magnetic part is used for selectively adsorbing the loading part.
2. The chip loading mechanism according to claim 1, wherein a switch is disposed on the magnetic member, and an electromagnet is disposed in the magnetic member, and the switch is electrically connected to the electromagnet for controlling on/off of a circuit of the electromagnet.
3. The chip loading mechanism according to claim 2, wherein the magnetic member comprises a base and a supporting platform, one end of the supporting platform is connected to the base, the supporting platform and the base form an accommodating cavity, the electromagnet is accommodated in the accommodating cavity, the switch is disposed on a sidewall of the supporting platform, and one end of the supporting platform, which is away from the base, is used for supporting the loading member.
4. The chip loading mechanism according to claim 3, wherein the carrier is disposed coaxially with the base, and a vertical projection of the carrier on the base is located in an area surrounded by an outer edge of the base.
5. The chip loading mechanism according to claim 4, wherein the susceptor and the base are cylindrical.
6. The chip loading mechanism according to claim 1, further comprising a positioning member connected to the magnetically attracting member for fixing the loading member when the magnetically attracting member carries the loading member.
7. The chip loading mechanism according to claim 6, wherein a bayonet is disposed on the positioning member, a protruding handle is protruded radially from an outer edge of the loading member, and the bayonet is used for holding the protruding handle to prevent the loading member from rotating on the magnetic member.
8. The chip loading mechanism according to claim 7, wherein the positioning member comprises a connection section, a middle section and a fitting section, two ends of the middle section are respectively connected to one end of the connection section and one end of the fitting section at an included angle, the connection section is connected to the magnetic member, and the bayonet is disposed on the fitting section.
9. The chip loading mechanism according to claim 1, wherein the positioning hole comprises a first tapered guiding section, a first accommodating section, a second tapered guiding section and a second accommodating section coaxially arranged in sequence from the surface of the loading member to the inside thereof, and the first accommodating section is larger than the second accommodating section in diameter.
10. A chip polishing system comprising a polishing device and a chip loading mechanism as claimed in any one of claims 1 to 9, wherein the polishing device is configured to polish the chip received in the positioning hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911171194.0A CN110842766B (en) | 2019-11-26 | 2019-11-26 | Chip loading mechanism and chip grinding and polishing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911171194.0A CN110842766B (en) | 2019-11-26 | 2019-11-26 | Chip loading mechanism and chip grinding and polishing system |
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| Publication Number | Publication Date |
|---|---|
| CN110842766A true CN110842766A (en) | 2020-02-28 |
| CN110842766B CN110842766B (en) | 2022-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911171194.0A Active CN110842766B (en) | 2019-11-26 | 2019-11-26 | Chip loading mechanism and chip grinding and polishing system |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001105303A (en) * | 1999-10-04 | 2001-04-17 | U T K Syst:Kk | Double side polishing carrier |
| CN1332060A (en) * | 2000-07-10 | 2002-01-23 | 住友电木株式会社 | Abrading substances holding material and manufacturing method thereof |
| US6716093B2 (en) * | 2001-12-07 | 2004-04-06 | Lam Research Corporation | Low friction gimbaled substrate holder for CMP apparatus |
| CN201336496Y (en) * | 2008-07-02 | 2009-10-28 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN102848306A (en) * | 2012-08-29 | 2013-01-02 | 苏州市意可机电有限公司 | Double-face grinding tool for locating washer |
| CN105108638A (en) * | 2015-09-16 | 2015-12-02 | 苏州天孚光通信股份有限公司 | Grinding clamp and jig thereof |
| CN106965077A (en) * | 2015-10-16 | 2017-07-21 | 应用材料公司 | Outside clamp ring for chemically-mechanicapolish polishing carrier head |
| CN207736100U (en) * | 2018-01-16 | 2018-08-17 | 万莉萍 | A kind of novel metallographic grinding device |
-
2019
- 2019-11-26 CN CN201911171194.0A patent/CN110842766B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001105303A (en) * | 1999-10-04 | 2001-04-17 | U T K Syst:Kk | Double side polishing carrier |
| CN1332060A (en) * | 2000-07-10 | 2002-01-23 | 住友电木株式会社 | Abrading substances holding material and manufacturing method thereof |
| US6716093B2 (en) * | 2001-12-07 | 2004-04-06 | Lam Research Corporation | Low friction gimbaled substrate holder for CMP apparatus |
| CN201336496Y (en) * | 2008-07-02 | 2009-10-28 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN102848306A (en) * | 2012-08-29 | 2013-01-02 | 苏州市意可机电有限公司 | Double-face grinding tool for locating washer |
| CN105108638A (en) * | 2015-09-16 | 2015-12-02 | 苏州天孚光通信股份有限公司 | Grinding clamp and jig thereof |
| CN106965077A (en) * | 2015-10-16 | 2017-07-21 | 应用材料公司 | Outside clamp ring for chemically-mechanicapolish polishing carrier head |
| CN207736100U (en) * | 2018-01-16 | 2018-08-17 | 万莉萍 | A kind of novel metallographic grinding device |
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| Publication number | Publication date |
|---|---|
| CN110842766B (en) | 2022-07-12 |
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