CN110834088A - Method for manufacturing frame structure frame of electronic equipment - Google Patents

Method for manufacturing frame structure frame of electronic equipment Download PDF

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Publication number
CN110834088A
CN110834088A CN201810932503.0A CN201810932503A CN110834088A CN 110834088 A CN110834088 A CN 110834088A CN 201810932503 A CN201810932503 A CN 201810932503A CN 110834088 A CN110834088 A CN 110834088A
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CN
China
Prior art keywords
polishing
manufacturing
total mass
frame structure
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810932503.0A
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Chinese (zh)
Inventor
唐爱军
何志
田民
夏爽
兰翻
谢春旭
黄德军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Futaihong Precision Industry Co Ltd
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Shenzhen Futaihong Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Futaihong Precision Industry Co Ltd filed Critical Shenzhen Futaihong Precision Industry Co Ltd
Priority to CN201810932503.0A priority Critical patent/CN110834088A/en
Publication of CN110834088A publication Critical patent/CN110834088A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/1003—Use of special medium during sintering, e.g. sintering aid
    • B22F3/1007—Atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
    • B22F3/225—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/04—Ferrous alloys, e.g. steel alloys containing manganese
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
    • C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
    • C22C38/42—Ferrous alloys, e.g. steel alloys containing chromium with nickel with copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys
    • C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
    • C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
    • C22C38/48—Ferrous alloys, e.g. steel alloys containing chromium with nickel with niobium or tantalum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F2003/245—Making recesses, grooves etc on the surface by removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F2003/247—Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

Abstract

The invention provides a method for manufacturing a frame structure frame in electronic equipment, which adopts a metal injection molding mode and comprises the steps of mixing, injection molding, degreasing, sintering and the like, wherein a hollow structure is additionally arranged on an injection mold, so that a reinforcing rib structure is additionally arranged at a corresponding position of an intermediate body, and the structure reduces structural deformation caused by shrinkage; in the polishing procedure, the method processes the polishing surface into a curved surface, thereby enhancing the final appearance effect.

Description

Method for manufacturing frame structure frame of electronic equipment
Technical Field
The invention relates to a method for manufacturing a frame structure frame in electronic equipment.
Background
For a long time in the past, the manufacturing process of mobile phone shells represented by machine processing/anodization of aluminum alloys has been the dominant issue, however, with the development of smart phones, aluminum alloys have not been able to meet the increasingly more stringent aesthetic requirements of consumers.
Metal Injection Molding (MIM) is a new process in which Metal powder (stainless steel, such as BASF 17-4PH) is used as a material, and a desired structure is obtained through Injection Molding, degreasing, sintering, grinding/magnetic polishing, dimension inspection, full inspection, and the like. The MIM has the outstanding characteristics of strength and hardness of stainless steel, and can be made into various structures, so that the machining time of a stainless steel plate machine tool is saved.
As is well known, the MIM has a molding shrinkage of up to 16%, which has a fatal effect on post-processing positioning; meanwhile, due to the problem of material, the polishing of MIM is not as bright as that of stainless steel section, and a plurality of sand holes appear, which is a difficult problem in the industry.
Disclosure of Invention
In view of the above, there is a need to develop a method for manufacturing a frame structure frame of an electronic device, so that structural instability caused by shrinkage is reduced during a molding process and a polishing process is improved, so that the frame structure frame has a good polishing effect.
A method of manufacturing a frame structure in an electronic device, comprising:
mixing a metal powder with a binder to obtain a mixture, wherein the metal powder comprises the following components: the metal powder is composed of C of not more than 0.07% of total mass, Cr of 15.0-17.5% of total mass, Ni of 3-5% of total mass, Cu of 3-5% of total mass, Nb of 0.15-0.45% of total mass, Mn of not more than 1.05% of total mass, Si of not more than 1.05% of total mass and Fe of 21.2-79.98% of total mass, a binder comprises ethylene vinyl acetate of 20% of weight and paraffin of 80% of weight, and the volume ratio of the binder to the metal powder is 1: 3-1: 1.
Performing injection molding on the mixture through a mold to obtain a blank, wherein the mold temperature is 95-110 ℃, the material temperature is 185-10 ℃, and the injection pressure is 0.7-0.9 Bar; the mold is provided with a plurality of hollow structures, so that a plurality of reinforcing ribs are formed at corresponding positions on the intermediate body, and the reinforcing ribs are used for reducing structural deformation caused by shrinkage in the injection molding.
Degreasing to remove organic substances in the green body, wherein the degreasing temperature is 130 ℃, and the degreasing protective atmosphere is NH3Degreasing time was 4 hours.
And sintering the degreased blank, wherein the sintering protective atmosphere is argon, the sintering temperature is 1300-1500 ℃, and the sintering time is 21-27 h.
Further, the metal powder and the binder were weighed according to the volume ratio, and the metal powder and the binder were mixed in a bow-knife mixer at a temperature of 130 to 160 ℃ for 2 hours.
Further, the method also comprises the step of carrying out intermediate machine tool machining and surface treatment on the sintered blank, wherein the machine tool machining comprises the following steps: processing an antenna seam/positioning hole, blanking, and milling a side hole and an appearance; wherein the surface treatment comprises: electrochemical treatment, polishing treatment and physical vapor deposition treatment.
Further, cleaning is carried out between the processing of the antenna seam/positioning hole and the electrochemical treatment, between the milling of the side hole and the appearance and the polishing treatment and between the polishing treatment and the physical vapor deposition treatment, wherein the cleaning comprises carrying out alkali washing and/or acid washing and/or acetone cleaning on the intermediate body in sequence; and sand blasting is further included between the antenna seam/positioning hole machining and the electrochemical treatment, and the sand blasting is used for removing burrs of the blank.
Further, the cutter used by the machine tool is a ball cutter and is used for machining two end faces, oppositely arranged, of the blank into a curved surface.
Further, the polishing process includes rough polishing, middle polishing, finish polishing, and mirror polishing.
Further, the manufacturing method further comprises film pasting, laser engraving and assembling.
The invention adopts a metal injection molding mode, comprises the steps of mixing, injection molding, degreasing, sintering and the like, and adds a hollow structure on an injection mold, so that a reinforcing rib structure is added at a corresponding position of an intermediate body, and the structure reduces structural deformation caused by shrinkage; in the polishing procedure, the method processes the polishing surface into a curved surface, thereby enhancing the final appearance effect.
Drawings
Fig. 1 is a schematic view of a method for manufacturing a frame structure of a mobile phone according to an embodiment of the present invention.
Fig. 2 is a schematic view of an improved end portion of an intermediate body of a frame structure in a mobile phone according to an embodiment of the present invention.
Fig. 3 is a schematic polished end view of a frame structure of a mobile phone according to an embodiment of the present invention.
Fig. 4 is a schematic view illustrating polishing of a frame structure in a mobile phone according to an embodiment of the present invention.
Description of the main elements
End of intermediate body 10
Reinforcing rib 20
End face 30
End face 40
Polishing wheel 50
Detailed Description
The technical solution of the present invention will be clearly and completely described with reference to the accompanying fig. 1-4 of the specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1, a method for manufacturing a frame structure of an electronic device, wherein the electronic product may be a mobile phone, a tablet computer, a personal digital assistant, or the like. The electronic product is a mobile phone in this embodiment, and the manufacturing method of the frame structure frame in the electronic device is a manufacturing method of the frame structure frame in the mobile phone, and the manufacturing method includes:
and S1, mixing the metal powder with the adhesive to obtain a mixture.
The metal powder comprises the following components: not more than 0.07% by total mass of C, 15.0-17.5% by total mass of Cr, 3-5% by total mass of Ni, 3-5% by total mass of Cu, 0.15-0.45% by total mass of Nb, not more than 1.05% by total mass of Mn, not more than 1.05% by total mass of Si, and 21.2-79.98% by total mass of Fe.
The adhesive comprises 20% by weight of Ethylene Vinyl Acetate (EVA) and 80% by weight of paraffin wax.
The mixing process of the metal powder and the binder comprises the following steps: the alloy powder and the binder were weighed in a predetermined ratio, and mixed with the binder in a sigma blade mixer (sigma blade mixer) at a temperature of 130 to 160 ℃ for 2 hours. The volume ratio of the adhesive to the metal powder is 1: 3-1: 1.
And S2, performing injection molding, degreasing and sintering on the mixture through a mold to obtain an intermediate.
Wherein injection molding the mixture through a mold comprises:
and S20, injecting the mixture into a blank body on an injection molding machine by using a mold, wherein the mold temperature is 95-110 ℃, the material temperature is 185-210 ℃, and the injection pressure is 0.7-0.9 Bar.
Referring to fig. 2, the mold (not shown) is provided with a plurality of hollows, so that a plurality of ribs 20 for reducing structural deformation caused by shrinkage during the injection molding are formed at corresponding positions on the intermediate body end portion 10.
S21, degreasing the blank at a high temperature under the protection of atmosphere to remove organic substances in the blank, wherein the degreasing temperature is 130 ℃, and the degreasing protection atmosphere is NH3Degreasing time is 4 h.
And S22, using a common intermittent vacuum sintering furnace, wherein the sintering protective atmosphere is argon, the sintering maximum temperature is 1300-1500 ℃, and the whole sintering period is 21-27 h to obtain an intermediate.
S3 intermediate processing, as depicted in FIG. 2, comprising: machine tool machining S30 and surface treatment S31, wherein machine tool machining S30 includes: processing an antenna seam/positioning hole S301, blanking S302, and milling a side hole and an appearance S303; wherein the surface treatment S31 includes: electrochemical processing (EC) S311, polishing processing S312, Physical Vapor Deposition (PVD) processing S313.
In the present embodiment, step S301 is used for etching the antenna and the positioning hole. Step S301 may further include cleaning, where the cleaning includes performing alkali cleaning and/or acid cleaning and/or acetone cleaning on the intermediate, and performing electrochemical treatment S311 on the intermediate after the cleaning, where the electrochemical treatment S311 is used to erode nano holes on the surface of the intermediate, so that the subsequent plastic film is tightly bonded to the surface of the intermediate.
And blanking S302, namely cutting redundant parts in the intermediate body by using a machine tool, further modifying the shape and milling side holes by using the machine tool after removing the redundant parts, and then cleaning, wherein the cleaning comprises alkali cleaning and/or acid cleaning and/or acetone cleaning of the intermediate body.
Preferably, as shown in fig. 3, in the machining step of the machine tool, the antenna seam/positioning hole S301, the blanking S302, and the side hole and shape milling S303 are all machined by using a ball cutter, so that the end surface 30 and the end surface 40 which are oppositely arranged in the frame structure frame of the electronic device are milled into a curved surface.
As shown in fig. 4, after the side holes and the shape S303 are milled, the end faces 30 and 40 are polished by using a polishing wheel 50, wherein the polishing includes four polishing processes of rough polishing, middle polishing, finish polishing and mirror polishing.
The polishing is followed by a Physical Vapor Deposition (PVD) process S313, the PVD process being used to deposit a layer of plastic film.
Further, the electrochemical treatment S311 is preceded by a sand blasting deburring treatment for removing burrs on the surface of the electrochemically treated intermediate.
S4: and D, pasting, laser engraving and assembling the electronic equipment middle frame structure processed in the step S3.
The manufacturing method of the mobile phone middle frame structure frame adopts a metal injection molding mode, comprises the steps of mixing, injection molding, degreasing, sintering and the like, and adds the hollowed structure on the injection mold, so that the reinforcing rib structure is added at the corresponding position of the intermediate body, and the structure reduces the structural deformation caused by shrinkage; in the polishing procedure, the method processes the polishing surface into a curved surface, thereby enhancing the final appearance effect.
In addition, those skilled in the art should recognize that the foregoing embodiments are illustrative only, and not limiting, and that appropriate changes and modifications can be made without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (7)

1. A method of manufacturing a frame structure in an electronic device, comprising:
mixing a metal powder with a binder to obtain a mixture, wherein the metal powder comprises the following components: the alloy comprises C with the total mass not greater than 0.07%, Cr with the total mass being 15.0-17.5%, Ni with the total mass being 3-5%, Cu with the total mass being 3-5%, Nb with the total mass being 0.15-0.45%, Mn with the total mass not greater than 1.05%, Si with the total mass not greater than 1.05% and Fe with the total mass being 21.2-79.98%, a binder comprises ethylene vinyl acetate with the weight percentage being 20% and paraffin with the weight percentage being 80%, and the volume ratio of the binder to metal powder is 1: 3-1: 1;
performing injection molding on the mixture through a mold to obtain a blank, wherein the mold temperature is 95-110 ℃, the material temperature is 185-10 ℃, and the injection pressure is 0.7-0.9 Bar; the mold is provided with a plurality of hollow structures, so that a plurality of reinforcing ribs are formed at corresponding positions on the intermediate body, and the reinforcing ribs are used for reducing structural deformation caused by shrinkage in the injection molding;
degreasing to remove organic substances in the green body, wherein the degreasing temperature is 130 ℃, and the degreasing protective atmosphere is NH3Degreasing for 4 hours;
and sintering the degreased blank, wherein the sintering protective atmosphere is argon, the sintering temperature is 1300-1500 ℃, and the sintering time is 21-27 h.
2. The method for manufacturing a frame structure in an electronic device according to claim 1, wherein the metal powder and the binder are weighed according to the volume ratio, and the metal powder and the binder are mixed in a bow-knife mixer at a temperature of 130 ℃ to 160 ℃ for 2 hours.
3. The method of manufacturing a frame structure in an electronic device according to claim 1, further comprising intermediate machine processing and surface treatment of the sintered green body, wherein the machine processing comprises: processing an antenna seam/positioning hole, blanking, and milling a side hole and an appearance; wherein the surface treatment comprises: electrochemical treatment, polishing treatment and physical vapor deposition treatment.
4. A method for manufacturing a frame structure in an electronic device according to claim 3, wherein between said processing of the antenna seam/locating hole and said electrochemical treatment, between said milling of the side hole and profile and said polishing treatment, and between said polishing treatment and said physical vapor deposition treatment, comprises cleaning, said cleaning comprising subjecting said intermediate body to alkali washing and/or acid washing and/or acetone washing in sequence; and sand blasting is further included between the antenna seam/positioning hole machining and the electrochemical treatment, and the sand blasting is used for removing burrs of the blank.
5. A method for manufacturing a frame structure in an electronic device according to claim 3, wherein the tool used for the machine tool is a ball cutter for machining both end surfaces of the green body disposed opposite to each other into a curved surface.
6. A method for manufacturing a frame structure in an electronic device according to claim 3, wherein said polishing process comprises rough polishing, middle polishing, finish polishing and mirror polishing.
7. The method for manufacturing a frame structure in an electronic device according to any one of claims 1 to 6, wherein the manufacturing method further comprises film pasting, laser engraving and assembling.
CN201810932503.0A 2018-08-15 2018-08-15 Method for manufacturing frame structure frame of electronic equipment Pending CN110834088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810932503.0A CN110834088A (en) 2018-08-15 2018-08-15 Method for manufacturing frame structure frame of electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810932503.0A CN110834088A (en) 2018-08-15 2018-08-15 Method for manufacturing frame structure frame of electronic equipment

Publications (1)

Publication Number Publication Date
CN110834088A true CN110834088A (en) 2020-02-25

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207280A (en) * 2020-09-19 2021-01-12 上海富驰高科技股份有限公司 Manufacturing method of engine rocker arm and profiling clamping support for sintering

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207280A (en) * 2020-09-19 2021-01-12 上海富驰高科技股份有限公司 Manufacturing method of engine rocker arm and profiling clamping support for sintering
CN112207280B (en) * 2020-09-19 2022-08-09 上海富驰高科技股份有限公司 Manufacturing method of engine rocker arm and profiling clamping support for sintering process

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Application publication date: 20200225