CN107398687A - The processing method and electronic equipment bonnet of electronic equipment bonnet - Google Patents
The processing method and electronic equipment bonnet of electronic equipment bonnet Download PDFInfo
- Publication number
- CN107398687A CN107398687A CN201710720538.3A CN201710720538A CN107398687A CN 107398687 A CN107398687 A CN 107398687A CN 201710720538 A CN201710720538 A CN 201710720538A CN 107398687 A CN107398687 A CN 107398687A
- Authority
- CN
- China
- Prior art keywords
- electronic equipment
- bonnet
- finished product
- equipment bonnet
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Forging (AREA)
Abstract
The invention discloses the processing method of electronic equipment bonnet, electronic equipment bonnet and electronic equipment.The processing method comprises the following steps：Materials flitch, forging embryo is formed through forging and pressing, stretching, the forging embryo includes bottom plate and the frame located at bottom plate week portion；Processing groove is opened up in the corner location of the frame, the opening of the processing groove is directed away from the direction of the bottom plate, and the distance between the bottom land of the processing groove and the bottom plate are more than or equal to the height of the frame of electronic equipment bonnet finished product；Architectural feature and external appearance characteristic are processed on the forging embryo, the part that the frame of the electronic equipment bonnet finished product will be higher by process removes, and obtains electronic equipment bonnet finished product；Electronic equipment bonnet is made of the above method；Electronic equipment includes above-mentioned electronic equipment bonnet.The processing method of electronic equipment bonnet of the present invention, the internal stress on forging embryo, the deformation that process is processed after reduction, so as to be effectively improved the flatness of product can be discharged in advance.
Description
Technical field
The present invention relates to electronic equipment casing processing technique field, and in particular to the processing method of electronic equipment bonnet and
Electronic equipment bonnet.
Background technology
Electronic equipment bonnet generally comprises bottom plate and frame, and frame surrounds the electronic component at inner chamber.It is processed at its
Be usually in journey material is forged and pressed, stretch after form forging embryo, the part such as hole that forging embryo needs by polishing, CNC processing again,
Then injection forms finished product.In process, because by forging and stamping, stretching, the stress forged on embryo is relatively concentrated, through later in advance
During continuous CNC processing, the internal stress forged on embryo can be discharged progressively, and the progressively release of internal stress can cause product to be processed in CNC
During deform, so as to cause flatness bad, cause yields to decline.
The content of the invention
Based on this, the processing method that the present invention provides a kind of electronic equipment bonnet, the planted agent on forging embryo can be discharged in advance
Power, the deformation that process is processed after reduction, so as to be effectively improved the flatness of product.
Invention additionally discloses a kind of electronic equipment bonnet.
In order to realize the purpose of the present invention, the present invention uses following technical scheme：
The processing method of a kind of electronic equipment bonnet, comprises the following steps：
Materials flitch, forging embryo is formed through forging and pressing, stretching, the forging embryo includes bottom plate and located at the side in bottom plate week portion
Frame；
Processing groove is opened up in the corner location of the frame, the opening of the processing groove is directed away from the side of the bottom plate
To the distance between the bottom land of the processing groove and the bottom plate are more than or equal to the height of the frame of electronic equipment bonnet finished product
Degree；
Process architectural feature and external appearance characteristic on the forging embryo, will be higher by process the electronic equipment bonnet into
The part of the frame of product removes, and obtains electronic equipment bonnet finished product.
The processing method of above electronic equipment bonnet, in plate of material after forging and pressing, stretching and to form forging embryo, in the frame of forging embryo
Corner location open up processing groove, can so discharge in advance forging embryo on internal stress, after reduction process process deformation, so as to
It is effectively improved the flatness of product.
In wherein some embodiments, four corner locations of frame of the forging embryo open up a processing groove.
In some of embodiments, the processing well width is 6mm-8mm, and depth is 3.0mm ± 0.1mm.
In wherein some embodiments, the electronic equipment bonnet is cell phone rear cover.
In wherein some embodiments, it is described processed on the forging embryo architectural feature and the step of external appearance characteristic it is specific
It is：
The locating and machining standard on the forging embryo；
Earpiece holes, USB holes and antenna slot are processed on the forging embryo；
The forging embryo is molded, forms electronic equipment bonnet semi-finished product；
Handled in the inner chamber of the electronic equipment bonnet semi-finished product and process TP faces, and the electronic equipment will be higher by
The part of the frame of bonnet finished product is removed by way of CNC；
The surface of the forging embryo is polished；
Processing shooting head bore, obtains electronic equipment bonnet finished product on the electronic equipment bonnet semi-finished product.
It is described to be handled in the inner chamber of the electronic equipment bonnet semi-finished product and process TP in wherein some embodiments
Face, and the step of the part for the frame for being higher by the electronic equipment bonnet finished product is removed by way of CNC after, also have
Following steps：Side opening is processed on the electronic equipment bonnet semi-finished product.
It is described that the electronic equipment bonnet semi-finished product are processed into high light video camera head hole and sun in wherein some embodiments
Also there are following steps before the conductive bit of pole：The electronic equipment bonnet semi-finished product are subjected to blasting treatment.
In wherein some embodiments, it is described by the electronic equipment bonnet semi-finished product carry out blasting treatment the step of it
Also there are following steps afterwards：The electronic equipment bonnet semi-finished product are subjected to anodic oxidation.
In wherein some embodiments, high light video camera head hole is processed on the electronic equipment bonnet semi-finished product described
Also there are following steps after step：In the embedded SMA actuators anode conducting position of the electronic equipment bonnet semi-finished product.
The present invention also adopts the following technical scheme that：
A kind of electronic equipment bonnet, it is made up of the processing method of described electronic equipment bonnet.
The present invention also adopts the following technical scheme that：
Brief description of the drawings
Fig. 1 is the structural representation that embryo is forged in the processing method of electronic equipment bonnet described in a preferred embodiment of the present invention；
Fig. 2 is the structural representation of electronic equipment bonnet described in a preferred embodiment of the present invention；
Fig. 3 is the enlarged drawing at A in Fig. 1；
Fig. 4 is the flow chart of the processing method of electronic equipment bonnet described in a preferred embodiment of the present invention.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give presently preferred embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more thorough
Comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
Embodiment
The processing method of electronic equipment bonnet of the present invention, electronic equipment therein include mobile phone, tablet personal computer, the back of the body
Press from both sides charger etc..
Fig. 1 to Fig. 4 is refer to, above-mentioned processing method includes the steps：
Materials flitch, forging embryo 10 is formed through forging and pressing, stretching.Plate of material therein can be the materials such as plastic cement, metal, ceramics
It is made.Internal stress can be produced by forging after the stretch in embryo.Forging embryo 10 includes bottom plate 11 and the frame 12 located at 11 weeks portions of bottom plate.Bottom
Plate 11 is formed in one with frame 12, and now the height of frame 12 is higher than the bezel height of finished product, facilitates CNC processing earpiece holes etc.
Part, the frame of a part can be removed during post-production.Planarity requirements in the step are≤0.1.
Processing groove 13 is opened up in the corner location of frame 12, the opening of processing groove 13 is directed away from the direction of bottom plate 11, i.e.,
Processing groove 13 is to be opened in the top of frame 12.The distance between bottom land and bottom plate 11 of processing groove 13 are more than or equal to electronics
The height of the frame of equipment bonnet finished product；So ensure that the frame of finished product is complete.In a wherein embodiment, processing groove 13
Bottom land and the distance between bottom plate 11 be 6.3mm.The method that opens up of processing groove 13 can be processed by CNC, or other
Processing mode.In a wherein embodiment, because follow-up process uses CNC processing modes, therefore directly set in CNC
A standby upper plus station, CNC go out above-mentioned processing groove 13.
In a wherein embodiment, 12 4 corner locations of frame of forging embryo 10 open up a processing groove 13, such stress
Can more uniformly it discharge.In other examples, above-mentioned processing groove 13 can also open up more, such as can be with
Processing groove 13 is opened up in the middle part of frame.As cell phone rear cover, the width of processing groove 13 is 6mm-8mm, depth be 3.0mm ±
0.1mm.The width of processing groove 13 is specially 7mm, can farthest discharge internal stress, does not interfere with follow-up processing work again
Sequence.
Architectural feature and external appearance characteristic are processed on forging embryo 10, the side of electronic equipment bonnet finished product will be higher by process
The part of frame 12 removes, and obtains electronic equipment bonnet finished product 20.The processing method of above electronic equipment bonnet, in plate of material through forging
After pressure, stretching form forging embryo, processing groove is opened up in the corner location of the frame of forging embryo, can so be discharged in advance interior on forging embryo
Stress, the deformation that process is processed after reduction, so as to be effectively improved the flatness of product.The eventually mill off of processing groove 13, Bu Huiying
Ring the outward appearance of cell phone rear cover.
In a wherein embodiment, above-mentioned processing architectural feature and external appearance characteristic, it is specifically：
Forging embryo 10 the back side by way of CNC locating and machining standard, in order in the mistake in each hole of post-production
Positioned in journey.The references are the keepers such as positioning hole, locating slot.Planarity requirements in the step for≤
0.12。
Processing before being molded by the inner chamber of above-mentioned references simultaneously processes positioning hole, in order to which the later stage enters
Row positioning processing.
Then earpiece holes, USB holes and antenna are processed on embryo 10 is forged by way of CNC using above-mentioned keeper
Groove, the processing sequence of earpiece holes, USB holes and antenna slot are disregarded successively.Planarity requirements in the step are≤0.15.
Forging embryo 10 is molded, forms electronic equipment bonnet semi-finished product.Injection for electronic equipment is this area
Common knowledge, its injection parameters will not be repeated here.Planarity requirements in the step are≤0.18.
External form is processed to electronic equipment bonnet semi-finished product, i.e., its surface polished, the operation such as CNC so that its surface
Closer to finished product, and it is easy to be molded；Planarity requirements in the step are≤0.2.
The inner chamber of electronic equipment bonnet semi-finished product after injection is processed further, and processes TP faces, is passed through simultaneously
The mode of CNC Milling Machinings mills the part for the frame for being higher by electronic equipment bonnet finished product, so that the size of frame 12 with into
The size of product frame is consistent.Positive planarity requirements in the step are≤0.15, and the planarity requirements at the back side are≤0.2.
To processing side opening on the frame 12 of electronic equipment bonnet semi-finished product by way of CNC, side opening include volume keyhole,
Keyhole etc. is switched, is processed according to the species of mobile phone is corresponding.Such as iphone mobile phones side opening include two volume keyholes, one it is Jing Yin
Keyhole and a switch keyhole.
Smart polishing is carried out to the surface for forging embryo 10 so that surface is more smooth, and it is unnecessary to remove some burrs, salient point etc.
Material.Essence polishing successively can be polished using the milling tools of different accuracy, so polish come it is finer.
Electronic equipment bonnet semi-finished product are subjected to blasting treatment so that its surface has granular sensation, after rising smoothly
Lid, its feel is more preferable, can prevent mobile phone from dropping to a certain extent.
Electronic equipment bonnet semi-finished product are subjected to anodic oxidation, layer oxide film is formed on its surface so that its wearability,
Corrosion resistance is more preferable.
Shooting head bore is processed by way of CNC on electronic equipment bonnet semi-finished product, and in embedded SMA actuators anode conducting
Position, obtains electronic equipment bonnet finished product.
Fig. 2 is refer to, the present invention also protects a kind of electronic equipment bonnet 20, and it is made up of above-mentioned method, including bottom plate
11st, frame 12 and the moulding 21 at the inner chamber that bottom plate 11 and frame 12 surround.Due to being provided with processing groove during processing
13, the flatness of its finished product is higher, and yield is higher, can save over discarded this departmental cost of finished product.One is real wherein
Apply in example, the distance between top of frame 12 to bottom plate 11 is 5.9mm.
The present invention also protects a kind of electronic equipment, and it includes above-mentioned electronic equipment bonnet 20.The electronic equipment includes hand
Machine, tablet personal computer, back splint charger etc..
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. the processing method of a kind of electronic equipment bonnet, it is characterised in that comprise the following steps：
Materials flitch, forging embryo is formed through forging and pressing, stretching, the forging embryo includes bottom plate and the frame located at bottom plate week portion；
Processing groove is opened up in the corner location of the frame, the opening of the processing groove is directed away from the direction of the bottom plate, institute
State the height of the distance between the bottom land of processing groove and described bottom plate more than or equal to the frame of electronic equipment bonnet finished product；
Architectural feature and external appearance characteristic are processed on the forging embryo, the electronic equipment bonnet finished product will be higher by process
The part of frame removes, and obtains electronic equipment bonnet finished product.
2. the processing method of electronic equipment bonnet according to claim 1, it is characterised in that：Four, the frame of the forging embryo
Corner location opens up a processing groove.
3. the processing method of electronic equipment bonnet according to claim 1 or 2, it is characterised in that：The processing well width
For 6mm-8mm, depth is 3.0mm ± 0.1mm.
4. the processing method of electronic equipment bonnet according to claim 3, it is characterised in that：The electronic equipment bonnet is
Cell phone rear cover.
5. the processing method of electronic equipment bonnet according to claim 1, it is characterised in that：It is described to add on the forging embryo
The step of work architectural feature and external appearance characteristic is specifically：
The locating and machining standard on the forging embryo；
Earpiece holes, USB holes and antenna slot are processed on the forging embryo；
The forging embryo is molded, forms electronic equipment bonnet semi-finished product；
Handled in the inner chamber of the electronic equipment bonnet semi-finished product and process TP faces, and the electronic equipment bonnet will be higher by
The part of the frame of finished product is removed by way of CNC；
The surface of the forging embryo is polished；
Processing shooting head bore, obtains electronic equipment bonnet finished product on the electronic equipment bonnet semi-finished product.
6. the processing method of electronic equipment bonnet according to claim 5, it is characterised in that：It is described in the electronic equipment
The inner chamber of bonnet semi-finished product is handled and processes TP faces, and the part for the frame for being higher by the electronic equipment bonnet finished product is led to
After crossing the step of CNC mode removes, also with following steps：Side opening is processed on the electronic equipment bonnet semi-finished product.
7. the processing method of electronic equipment bonnet according to claim 6, it is characterised in that：It is described by the electronic equipment
Bonnet semi-finished product also have following steps before processing high light video camera head hole and anode conducting position：By the electronic equipment bonnet
Semi-finished product carry out blasting treatment.
8. the processing method of electronic equipment bonnet according to claim 7, it is characterised in that：The electronics is set described
Also there are following steps after the step of standby bonnet semi-finished product carry out blasting treatment：The electronic equipment bonnet semi-finished product are carried out
Anodic oxidation.
9. the processing method of electronic equipment bonnet according to claim 6, it is characterised in that：Set described in the electronics
Also there are following steps after the step of processing high light video camera head hole on standby bonnet semi-finished product：The electronic equipment bonnet half into
The embedded SMA actuators anode conducting position of product.
10. a kind of electronic equipment bonnet, it is characterised in that：As adding for the electronic equipment bonnet described in claim any one of 1-9
Work method is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710720538.3A CN107398687A (en) | 2017-08-21 | 2017-08-21 | The processing method and electronic equipment bonnet of electronic equipment bonnet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710720538.3A CN107398687A (en) | 2017-08-21 | 2017-08-21 | The processing method and electronic equipment bonnet of electronic equipment bonnet |
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| CN107398687A true CN107398687A (en) | 2017-11-28 |
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| CN201710720538.3A Pending CN107398687A (en) | 2017-08-21 | 2017-08-21 | The processing method and electronic equipment bonnet of electronic equipment bonnet |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019140764A1 (en) * | 2018-01-17 | 2019-07-25 | 广东长盈精密技术有限公司 | Metal middle frame machining process |
| CN110394600A (en) * | 2019-07-10 | 2019-11-01 | 广东长盈精密技术有限公司 | Production method, metal shell and the mobile power source of metal shell |
| CN110524788A (en) * | 2019-08-05 | 2019-12-03 | 广东长盈精密技术有限公司 | Production method, center and the electronic equipment of center |
| CN110674541A (en) * | 2019-08-27 | 2020-01-10 | 广东长盈精密技术有限公司 | Middle frame manufacturing method, middle frame and electronic equipment |
| CN112427586A (en) * | 2020-12-22 | 2021-03-02 | 惠州威博精密科技有限公司 | Method for improving flatness of forged shell blank |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2500406Y (en) * | 2001-07-23 | 2002-07-17 | 联想(北京)有限公司 | Stress releasing hole of metallic stamping pieces |
| CN102074163A (en) * | 2009-11-17 | 2011-05-25 | 三星移动显示器株式会社 | Container member, method of manufacturing the same, and display device having the same |
| US20110228458A1 (en) * | 2010-03-17 | 2011-09-22 | Otter Products, Llc | Multi-material protective case for sliding/articulating/rotating handheld electronic devices |
| CN104148896A (en) * | 2014-08-04 | 2014-11-19 | 贵州航宇科技发展股份有限公司 | Manufacturing method of GH4169 high-temperature alloy semi-ring |
| CN204082301U (en) * | 2014-08-27 | 2015-01-07 | 沈阳华铁汽车散热器有限公司 | Main leaf structure that heat radiator of internal-combustion engine is unstressed |
| CN104811513A (en) * | 2015-04-22 | 2015-07-29 | 奥捷五金(江苏)有限公司 | Metal rear cover of mobile electronic product and manufacturing technology thereof |
| CN104850188A (en) * | 2015-06-04 | 2015-08-19 | 上海华勤通讯技术有限公司 | Metal middle frame and manufacturing method thereof, handheld terminal and manufacturing method thereof |
| CN105345102A (en) * | 2015-11-30 | 2016-02-24 | 沈阳飞机工业（集团）有限公司 | Method for controlling rough machining deformation of sheet titanium alloy |
| CN206060962U (en) * | 2016-08-18 | 2017-03-29 | 马鞍山众翌科技有限公司 | TV aluminum frame |
| CN106790812A (en) * | 2016-12-28 | 2017-05-31 | 东莞长盈精密技术有限公司 | Mobile terminal center flitch |
| CN106862456A (en) * | 2017-02-17 | 2017-06-20 | 苏州鑫捷顺五金机电有限公司 | Aluminum alloy mobile phone shell cold-heading stretch forming process |
-
2017
- 2017-08-21 CN CN201710720538.3A patent/CN107398687A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2500406Y (en) * | 2001-07-23 | 2002-07-17 | 联想(北京)有限公司 | Stress releasing hole of metallic stamping pieces |
| CN102074163A (en) * | 2009-11-17 | 2011-05-25 | 三星移动显示器株式会社 | Container member, method of manufacturing the same, and display device having the same |
| US20110228458A1 (en) * | 2010-03-17 | 2011-09-22 | Otter Products, Llc | Multi-material protective case for sliding/articulating/rotating handheld electronic devices |
| CN104148896A (en) * | 2014-08-04 | 2014-11-19 | 贵州航宇科技发展股份有限公司 | Manufacturing method of GH4169 high-temperature alloy semi-ring |
| CN204082301U (en) * | 2014-08-27 | 2015-01-07 | 沈阳华铁汽车散热器有限公司 | Main leaf structure that heat radiator of internal-combustion engine is unstressed |
| CN104811513A (en) * | 2015-04-22 | 2015-07-29 | 奥捷五金(江苏)有限公司 | Metal rear cover of mobile electronic product and manufacturing technology thereof |
| CN104850188A (en) * | 2015-06-04 | 2015-08-19 | 上海华勤通讯技术有限公司 | Metal middle frame and manufacturing method thereof, handheld terminal and manufacturing method thereof |
| CN105345102A (en) * | 2015-11-30 | 2016-02-24 | 沈阳飞机工业（集团）有限公司 | Method for controlling rough machining deformation of sheet titanium alloy |
| CN206060962U (en) * | 2016-08-18 | 2017-03-29 | 马鞍山众翌科技有限公司 | TV aluminum frame |
| CN106790812A (en) * | 2016-12-28 | 2017-05-31 | 东莞长盈精密技术有限公司 | Mobile terminal center flitch |
| CN106862456A (en) * | 2017-02-17 | 2017-06-20 | 苏州鑫捷顺五金机电有限公司 | Aluminum alloy mobile phone shell cold-heading stretch forming process |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019140764A1 (en) * | 2018-01-17 | 2019-07-25 | 广东长盈精密技术有限公司 | Metal middle frame machining process |
| US11192169B2 (en) | 2018-01-17 | 2021-12-07 | Guangdong Everwin Precision Technology Co., Ltd. | Metal middle frame machining process |
| CN110394600A (en) * | 2019-07-10 | 2019-11-01 | 广东长盈精密技术有限公司 | Production method, metal shell and the mobile power source of metal shell |
| CN110394600B (en) * | 2019-07-10 | 2021-03-12 | 广东长盈精密技术有限公司 | Manufacturing method of metal shell, metal shell and mobile power supply |
| CN110524788A (en) * | 2019-08-05 | 2019-12-03 | 广东长盈精密技术有限公司 | Production method, center and the electronic equipment of center |
| CN110674541A (en) * | 2019-08-27 | 2020-01-10 | 广东长盈精密技术有限公司 | Middle frame manufacturing method, middle frame and electronic equipment |
| CN112427586A (en) * | 2020-12-22 | 2021-03-02 | 惠州威博精密科技有限公司 | Method for improving flatness of forged shell blank |
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Application publication date: 20171128 |
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