CN110808258B - 固态摄像装置和电子设备 - Google Patents

固态摄像装置和电子设备 Download PDF

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Publication number
CN110808258B
CN110808258B CN201910982601.XA CN201910982601A CN110808258B CN 110808258 B CN110808258 B CN 110808258B CN 201910982601 A CN201910982601 A CN 201910982601A CN 110808258 B CN110808258 B CN 110808258B
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China
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pixel
phase difference
pixels
light
photoelectric conversion
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Expired - Fee Related
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CN201910982601.XA
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Chinese (zh)
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CN110808258A (zh
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伊东恭佑
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Sony Corp
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Sony Corp
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/67—Focus control based on electronic image sensor signals
    • H04N23/672—Focus control based on electronic image sensor signals based on the phase difference signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/133—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements including elements passing panchromatic light, e.g. filters passing white light
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/17—Colour separation based on photon absorption depth, e.g. full colour resolution obtained simultaneously at each pixel location
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
    • H04N25/704—Pixels specially adapted for focusing, e.g. phase difference pixel sets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8067—Reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/807—Pixel isolation structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/11—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Focusing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Automatic Focus Adjustment (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Color Television Image Signal Generators (AREA)
  • Studio Devices (AREA)
CN201910982601.XA 2013-07-11 2014-07-04 固态摄像装置和电子设备 Expired - Fee Related CN110808258B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910982601.XA CN110808258B (zh) 2013-07-11 2014-07-04 固态摄像装置和电子设备

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-145817 2013-07-11
JP2013145817A JP6295526B2 (ja) 2013-07-11 2013-07-11 固体撮像装置および電子機器
CN201410319147.7A CN104284106B (zh) 2013-07-11 2014-07-04 固态摄像装置和电子设备
CN201910982601.XA CN110808258B (zh) 2013-07-11 2014-07-04 固态摄像装置和电子设备

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CN201410319147.7A Division CN104284106B (zh) 2013-07-11 2014-07-04 固态摄像装置和电子设备

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CN110808258A CN110808258A (zh) 2020-02-18
CN110808258B true CN110808258B (zh) 2023-05-12

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CN201910982547.9A Expired - Fee Related CN110808257B (zh) 2013-07-11 2014-07-04 固态摄像装置和电子设备
CN201410319147.7A Expired - Fee Related CN104284106B (zh) 2013-07-11 2014-07-04 固态摄像装置和电子设备

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CN201410319147.7A Expired - Fee Related CN104284106B (zh) 2013-07-11 2014-07-04 固态摄像装置和电子设备

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US (2) US9620541B2 (enExample)
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CN (3) CN110808258B (enExample)

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JP5778873B2 (ja) * 2012-12-07 2015-09-16 富士フイルム株式会社 画像処理装置、画像処理方法及びプログラム、並びに記録媒体
WO2014087804A1 (ja) * 2012-12-07 2014-06-12 富士フイルム株式会社 撮像装置、画像処理方法及びプログラム
JP5865555B2 (ja) * 2013-05-13 2016-02-17 富士フイルム株式会社 混色率算出装置及び方法並びに撮像装置
JP2016127389A (ja) * 2014-12-26 2016-07-11 キヤノン株式会社 画像処理装置およびその制御方法
US10033949B2 (en) * 2016-06-16 2018-07-24 Semiconductor Components Industries, Llc Imaging systems with high dynamic range and phase detection pixels
JP2019012968A (ja) * 2017-06-30 2019-01-24 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、及び電子機器
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WO2019075750A1 (zh) * 2017-10-20 2019-04-25 深圳市汇顶科技股份有限公司 像素传感模块及图像撷取装置
CN110164898A (zh) * 2019-06-20 2019-08-23 德淮半导体有限公司 彩色滤光片阵列和图像传感器
CN110634899B (zh) * 2019-09-26 2022-02-01 上海华力集成电路制造有限公司 背照式图像传感器光电子隔离层网栅的辅助图形结构
WO2021131318A1 (ja) * 2019-12-24 2021-07-01 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器
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CN111464733B (zh) * 2020-05-22 2021-10-01 Oppo广东移动通信有限公司 控制方法、摄像头组件和移动终端
KR102801630B1 (ko) * 2020-06-18 2025-04-29 에스케이하이닉스 주식회사 이미지 센싱 장치
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Also Published As

Publication number Publication date
JP6295526B2 (ja) 2018-03-20
CN104284106A (zh) 2015-01-14
CN110808257B (zh) 2023-11-14
CN110808258A (zh) 2020-02-18
CN104284106B (zh) 2019-10-22
CN110808257A (zh) 2020-02-18
US20170148828A1 (en) 2017-05-25
US9620541B2 (en) 2017-04-11
US20150015749A1 (en) 2015-01-15
JP2015018969A (ja) 2015-01-29
US9818783B2 (en) 2017-11-14

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