CN110808232A - 一种铜铝复合散热器及其加工方法 - Google Patents

一种铜铝复合散热器及其加工方法 Download PDF

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CN110808232A
CN110808232A CN201911133098.7A CN201911133098A CN110808232A CN 110808232 A CN110808232 A CN 110808232A CN 201911133098 A CN201911133098 A CN 201911133098A CN 110808232 A CN110808232 A CN 110808232A
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邱珍华
邱嘉龙
刘亚坤
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Zhejiang Tianyi Semiconductor Technology Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4878Mechanical treatment, e.g. deforming
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10Heat sinks

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Abstract

一种铜铝复合散热器,包括铝合金散热器主体,还包括一卯榫铜基板,所述的卯榫铜基板的底部带有卯榫槽,铝合金散热器主体的导热面上带有供卯榫铜基板锻压入的锻压槽,所述的锻压槽在卯榫铜基板锻压嵌入时迅速填充卯榫铜基板卯榫槽,形成卯榫结构,且锻压后卯榫铜基板的上表面与铝合金散热器主体导热面呈平整面。散热器充分利用两种材质特点,卯榫铜基板与铝合金散热器本体一体成型相互卯榫,并通过卯榫铜基板可与DBC基板直接焊接,大大增加了散热器的牢度,且由于无需中间介质导热硅脂,铜铝接合面相互卯榫锻压成型,直接接触,接触面大,牢固,散热效果非常好。

Description

一种铜铝复合散热器及其加工方法
技术领域
本发明涉及一种散热器技术领域,尤其涉及一种功率器件散热器。
背景技术
随着功率器件功率不断提高,对散热器要求越来越高。一般来说,增大散热面积可以增加散热器的散热效果,但同时也增加了散热器的体积和成本,且不符合整体器件小型化的发展趋势。在材质上,目前铝合金散热器也无法满足日益提高的散热要求。铝合金散热器无法与DBC板(中间陶瓷,两侧铜)直接焊接,必须依靠中间介质(导热硅脂)粘合后再由螺栓固定,而中间介质(导热硅脂)的导热性能较差,无法完全消除气泡,不能保证接触面充分,影响导热效率。
发明内容
本发明的目的在于针对已有技术存在的缺陷,提供一种导热性能好并能直接与DBC板焊接的铜铝复合散热器及其加工方法。
为达到上述目的,本发明采用下述技术方案:一种铜铝复合散热器,包括铝合金散热器主体,还包括一卯榫铜基板,所述的卯榫铜基板的底部带有卯榫槽,铝合金散热器主体的导热面上带有供卯榫铜基板锻压入的锻压槽,所述的锻压槽在卯榫铜基板锻压嵌入时迅速填充卯榫铜基板卯榫槽,形成卯榫结构,且锻压后卯榫铜基板的上表面与铝合金散热器主体导热面呈平整面。
作为一种改进:所述的卯榫铜基板呈方形、圆形或花形。
一种铜铝复合散热器的加工方法,包括以下工艺步骤:
1)制卯榫铜基板,模具挤压成型,使得卯榫铜基板的底部带有卯榫槽,并切割成合适大小;
2)卯榫铜基板定位,在制铝合金散热器模具下模的下顶块上顶面上开设一定位槽,并将卯榫铜基板以带卯榫槽面朝上的放入定位槽中,铝饼置入铝饼置入口并位于在卯榫铜基板上;
3)上下模合模,将带孔板的上模向下运动,与放置卯榫铜基板和铝饼的下模合模;
4)锻压成型,下顶块施压力,锻压成型后开模,锻压时,卯榫铜基板卯榫槽被快速填满,形成卯榫结构;
5)铣床加工后续处理。
本发明的有益效果:首先,本发明的复合散热器充分利用两种材质特点,即铜的导热能力快,铝的散热性能强、易加工、成本低等特点,通过铜更好的导热性能,加快热量传递,提高散热性能;再者,卯榫铜基板与铝合金散热器本体一体成型相互卯榫,并通过卯榫铜基板可与DBC基板直接焊接,大大增加了散热器的牢度,且由于无需中间介质导热硅脂,铜铝接合面相互卯榫锻压成型,直接接触,接触面大,牢固,散热效果非常好。
为了使本发明的目的、技术方案和优点更加清楚,下面将结合附图对本发明作进一步的详细描述。
附图说明
图1为本发明铜铝复合散热器的示意图。
图2为本发明铜铝复合散热器的剖视图。
图3为本发明铜铝复合散热器的加工方法中卯榫铜基板放入定位槽的上下模具示意图。
图4为放置铝块后的上下模具示意图。
图5为合模示意图。
图6为脱模后上下模示意图。
具体实施方式
如图1、图2所示,本发明铜铝复合散热器的一种实施例,包括铝散热器主体1、卯榫铜基板2,本实施例的卯榫铜基板呈方形,当然也可以为花形、圆形或其它各种形状。所述的卯榫铜基板2的底部带有卯榫槽21,铝散热器主体的导热面11上带有供卯榫铜基板2锻压入的锻压槽,所述的锻压槽在卯榫铜基板2锻压嵌入时迅速填充卯榫铜基板2卯榫槽21,形成卯榫结构,且锻压后卯榫铜基板2的上表面与铝散热器主体1导热面11呈平整面。卯榫结构既能增大接触面,又能提高结合牢度,保证结构稳定。
一种铜铝复合散热器的加工方法,包括以下工艺步骤:
1)制卯榫铜基板,模具挤压成型,使得卯榫铜基板2的底部带有卯榫槽21,并切割成合适大小;卯榫铜基板的厚度可根据需要设置,若需提高散热器效率,可加厚卯榫铜基板;
2)卯榫铜基板定位,在制铝合金散热器模具下模的下顶块上顶面上开设一定位槽,并将卯榫铜基板以带卯榫槽21面朝上的放入定位槽中,如图3所示,铝饼置入铝饼置入口并位于在卯榫铜基板上,如图4所示;
3)上下模合模,将带孔板的上模A向下运动,与放置卯榫铜基板和铝饼的下模B合模,如图5所示;
4)锻压成型,下顶块9施压力,锻压成型后开模,如图6所示,锻压时,卯榫铜基板卯榫槽被快速填满,形成卯榫结构。
5)铣床加工后续处理,经过后续CNC加工,散热器成品上表面非常平整。
该加工方法流程简单,制作方便,利于散热器的批量化生产,成本低。该加工方法相对于利于钎焊实现在铝合金散热器上形成覆铜区域或喷涂铜粉铝合金散热器表面的加工方法。钎焊铜铝接触面存在空洞,有气泡及空气,影响导热效率,钎焊表面不平整,且无法形成足够厚度。喷涂着粉率低,结合力弱,无法形成足够的厚度层,且喷涂加工容易造成环境污染,加过过程较为危险,喷涂加工浪费资源,成本很高。而本发明则完全没有上述问题。
虽然本发明已以具体实施例公开如上,然而其并非用以限定本发明,任何本领域的技术人员,在不脱离本发明的精神和范围的情况下,仍可作些许的更动与润饰,因此本发明的保护范围应当视所附的权利要求书的范围所界定者为准。

Claims (3)

1.一种铜铝复合散热器,包括铝合金散热器主体(1),其特征在于:还包括一卯榫铜基板(2),所述的卯榫铜基板(2)的底部带有卯榫槽(21),铝合金散热器主体的导热面(11)上带有供卯榫铜基板(2)锻压入的锻压槽,所述的锻压槽在卯榫铜基板(2)锻压嵌入时迅速填充卯榫铜基板(2)卯榫槽(21),形成卯榫结构,且锻压后卯榫铜基板(2)的上表面与铝合金散热器主体导热面(11)呈平整面。
2.根据权利要求1所述的一种铜铝复合散热器,其特征在于:所述的卯榫铜基板呈方形、圆形或花形。
3.一种铜铝复合散热器的加工方法,其特征在于:包括以下工艺步骤:
1)制卯榫铜基板,模具挤压成型,使得卯榫铜基板的底部带有卯榫槽,并切割成合适大小;
2)卯榫铜基板定位,在制铝合金散热器模具下模的下顶块上顶面上开设一定位槽,并将卯榫铜基板以带卯榫槽(21)面朝上的放入定位槽中,铝饼置入铝饼置入口并位于在卯榫铜基板上;
3)上下模合模,将带孔板的上模向下运动,与放置卯榫铜基板和铝饼的下模合模;
4)锻压成型,下顶块施压力,锻压成型后开模,锻压时,卯榫铜基板卯榫槽被快速填满,形成卯榫结构;
5)铣床加工后续处理。
CN201911133098.7A 2019-11-19 2019-11-19 一种铜铝复合散热器及其加工方法 Pending CN110808232A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023175122A1 (en) * 2022-03-16 2023-09-21 Danfoss Silicon Power Gmbh Multi-metal cooler and method for forming a multi-metal cooler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023175122A1 (en) * 2022-03-16 2023-09-21 Danfoss Silicon Power Gmbh Multi-metal cooler and method for forming a multi-metal cooler

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