CN110797686A - Integrated device - Google Patents

Abstract

The invention provides an integrated device which comprises at least two circuit boards which are detachably connected, wherein a flexible connector is detachably connected between any two adjacent circuit boards. Compared with the traditional integrated device adopting welding and bonding, the integrated device can realize repeated disassembly and assembly, is convenient for the maintenance of the circuit boards, has lower manufacturing cost, can realize accurate contraposition connection of the two circuit boards, and has higher assembly precision; on the other hand, the protruding part arranged on the conductor can increase the contact area between the conductor and the bonding pad, so that the contact between the conductor and the bonding pad is more sufficient, and the problems of circuit interruption or signal distortion and the like of the integrated device can be avoided; meanwhile, the bulge part can also increase the friction force between the electric conductor and the bonding pad, so that the electric conductor and the bonding pad are not easy to dislocate in the assembling process of the integrated device, and the reliability of electric connection between the two circuit boards is ensured.

Description

Integrated device

Technical Field

The invention relates to the technical field of circuit connection, in particular to an integrated device.

Background

In the electronics industry, electronic components such as chips and circuit boards are often connected by solder joints (BGA) or conductive adhesives. Although welding has the advantage of reliable connection, the welding also has the defect that the welding cannot be repeatedly disassembled and assembled, and if the welding process has misoperation or the problems of poor conduction and the like after welding, the welded electronic element only consumes more resources for reworking or is directly scrapped, so that the material waste and the cost are caused; although the conductive adhesive connection is easier to implement and convenient for rework and maintenance compared with soldering, the conductive performance of the conductive adhesive is not stable enough due to some problems of the conductive adhesive itself and the influence of external factors such as weather, aging, stress strain and the like, so that the problem of circuit interruption or signal distortion is easy to occur between electronic elements connected by the conductive adhesive.

Disclosure of Invention

In order to solve the technical problems, the invention provides an integrated device which has the advantages of repeated disassembly and assembly, good conductivity and the like.

Based on the above, the invention provides an integrated device, which comprises at least two detachably connected circuit boards, wherein a flexible connector is detachably connected between any two adjacent circuit boards;

the flexible connector comprises an insulator, wherein a plurality of first conductors are arranged on the surface of one side of the insulator, a plurality of second conductors are arranged on the surface of the other side of the insulator, the circuit board on the side where the first conductors are located is marked as a first circuit board, the circuit board on the side where the second conductors are located is marked as a second circuit board, first pads with the same number as the first conductors are arranged on the surface of the first circuit board facing the flexible connector, the first pads are in one-to-one correspondence with and connected with the first conductors, second pads with the same number as the second conductors are arranged on the surface of the second circuit board facing the flexible connector, and the second pads are in one-to-one correspondence with and connected with the second conductors;

the insulator is provided with a conductive medium for connecting the first conductor and the second conductor, and a convex part is arranged on the surface of the first conductor connected with the first pad or/and the surface of the second conductor connected with the second pad.

Preferably, the surfaces of the first circuit board and/or the second circuit board facing the flexible connector are provided with components, and the insulator is provided with a containing hole or a containing groove for containing the components.

Preferably, the convex part is in a regular or irregular solid geometry.

Preferably, the shape of the convex part is sharp angle shape, inverted cone shape, particle shape, dendritic shape, column shape or block shape.

Preferably, the height of the protrusion is in the range of 1 to 30 μm.

Preferably, the surface of the convex part is a regular or irregular arc-shaped surface.

Preferably, two or more of the protrusions are provided on the surface of the first conductor or/and the second conductor, the shape of each of the protrusions is the same or different, the size of each of the protrusions is the same or different, and the two or more of the protrusions are continuously or discontinuously distributed on the surface of the first conductor or/and the second conductor.

Preferably, the surface of the first conductor or/and the second conductor is a rough surface or a flat surface.

Preferably, the material of the protrusion is one or a combination of more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

Preferably, an adhesive film layer is arranged on at least one side surface of the insulator or/and the protruding part, and the protruding part is hidden in the adhesive film layer or penetrates through the adhesive film layer and is exposed.

Preferably, the insulator is provided with a connection hole for connecting the first conductor and the second conductor, and the conductive medium is provided in the connection hole.

Preferably, the conductive medium fills the connection hole, or the conductive medium is attached to a hole wall of the connection hole to form a conductive hole.

Preferably, the first pads and the first conductors are two or more, the first pads are independent of each other, and the first conductors are independent of each other;

the second bonding pads and the second conductors are two or more, the second bonding pads are mutually independent, and the second conductors are mutually independent.

Preferably, the number of the first conductors is equal to that of the second conductors, and each of the first conductors is connected to each of the second conductors in a one-to-one correspondence via the conductive medium in the different connecting holes.

Preferably, the number of the first conductors is greater than that of the second conductors, at least two of the first conductors are connected to the same second conductor through the conductive media in different connecting holes, and the rest of the first conductors are connected to the rest of the second conductors in a one-to-one correspondence manner through the conductive media in different connecting holes.

Preferably, the number of the first conductors is less than that of the second conductors, at least two of the second conductors are connected to the same first conductor through the conductive media in different connecting holes, and the rest of the second conductors are connected to the rest of the first conductors in a one-to-one correspondence manner through the conductive media in different connecting holes.

Preferably, at least two of the first conductors are connected to the same second conductor through the conductive media in different connecting holes, and at least two of the second conductors are connected to the same first conductor through the conductive media in different connecting holes.

Preferably, at least two of the first conductors are connected to the same second conductor through the conductive media in different connecting holes, at least two of the second conductors are connected to the same first conductor through the conductive media in different connecting holes, and the rest of the first conductors are connected to the rest of the second conductors in a one-to-one correspondence manner through the conductive media in different connecting holes.

Preferably, two or more connection holes are provided between the first conductor and the second conductor connected thereto.

Preferably, the material of the insulator is one or a combination of more of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyphenylene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, and polyoxamide.

The embodiment of the invention has the following beneficial effects:

the integrated device provided by the embodiment of the invention realizes the circuit conduction between the two circuit boards by clamping the flexible connector between the two adjacent circuit boards and respectively connecting the electric conductors on the two sides of the flexible connector with the bonding pads on the two circuit boards through the convex parts arranged on the surfaces of the electric conductors, so that compared with the traditional integrated device adopting welding and bonding, the integrated device provided by the embodiment of the invention can realize repeated disassembly and assembly, is convenient for the maintenance of the circuit boards, has lower manufacturing cost, can also realize the accurate contraposition connection of the two circuit boards, and has higher assembly precision; on the other hand, the protruding part arranged on the conductor can increase the contact area between the conductor and the bonding pad, so that the contact between the conductor and the bonding pad is more sufficient, and the problems of circuit interruption or signal distortion and the like of the integrated device can be avoided; meanwhile, the bulge part can also increase the friction force between the electric conductor and the bonding pad, so that the electric conductor and the bonding pad are not easy to dislocate in the assembling process of the integrated device, and the reliability of electric connection between the two circuit boards is ensured.

Drawings

Fig. 1 is an exploded schematic view of an integrated device according to a first embodiment of the present invention;

fig. 2 is a schematic cross-sectional structure diagram of an integrated device according to a first embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of a flexible connector according to a first embodiment of the present invention;

FIG. 4 is an enlarged view of area I of FIG. 3;

FIG. 5 is a partial view of a first electrical conductor having a planar surface according to a first embodiment of the present invention;

FIG. 6 is a sectional view (one) of a portion of a flexible connector according to a first embodiment of the present invention at a magnification of 400 times under a metallographic microscope;

fig. 7 is a sectional view of a part of the flexible connector according to the first embodiment of the present invention at a magnification of 400 times under a metallographic microscope;

fig. 8 is a sectional view (three) of a part of the flexible connector according to the first embodiment of the present invention at a magnification of 400 times under a metallographic microscope;

fig. 9 is a sectional view (four) of a part of the flexible connector according to the first embodiment of the present invention at a magnification of 400 times under a metallographic microscope;

fig. 10 is a sectional view (five) of a part of the flexible connector according to the first embodiment of the present invention at a magnification of 400 times under a metallographic microscope;

fig. 11 is a sectional view (six) of a part of the flexible connector according to the first embodiment of the present invention at a microscopic magnification of 100 times;

fig. 12 is a schematic cross-sectional view illustrating a connection hole filled with a conductive medium according to a first embodiment of the present invention;

FIG. 13 is a schematic cross-sectional view of a first electrical conductor and a second electrical conductor in a second electrical connection in accordance with an embodiment of the present invention;

FIG. 14 is a schematic cross-sectional view of a third electrical connection between a first electrical conductor and a second electrical conductor in accordance with one embodiment of the invention;

FIG. 15 is a schematic cross-sectional view of a fourth electrical connection between the first electrical conductor and the second electrical conductor in accordance with one embodiment of the invention;

FIG. 16 is a schematic cross-sectional view of a fifth electrical connection between the first electrical conductor and the second electrical conductor in accordance with one embodiment of the invention;

FIG. 17 is a schematic cross-sectional view of a flexible connector according to a second embodiment of the present invention;

FIG. 18 is an enlarged view of area II of FIG. 17;

fig. 19 is a partial view of a second embodiment of the present invention where the surface of the first conductor is roughened;

FIG. 20 is a schematic cross-sectional view of a flexible connector (with a boss having a solid geometry) according to a third embodiment of the present invention;

fig. 21 is a schematic cross-sectional view of a flexible connector (the surface of the boss is an arc-shaped surface) according to a third embodiment of the present invention.

Description of reference numerals:

1. the flexible printed circuit board comprises a first circuit board 11, a first bonding pad 2, a second circuit board 21, a second bonding pad 3, a flexible connector 31, an insulator 311, a containing hole 32, a first conductor 33, a second conductor 34, a conducting medium 35, a bulge 36, a conducting hole 37 and an adhesive film layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

As shown in fig. 1 to 2, an embodiment of the present invention provides an integrated device, which includes at least two circuit boards detachably connected, and a flexible connector 3 is detachably connected between any two adjacent circuit boards; when assembling the integrated device, an operator first mounts the flexible connector 3 on one of the circuit boards, and then fastens and connects the circuit board to the other circuit board, so as to clamp the flexible connector 3 between the two circuit boards. It should be noted that the detachable connection described herein includes a bolt connection, a snap connection, and the like, and of course, the connection manner between the two circuit boards may be the same or different compared to the connection manner between the flexible connector 3 and the circuit board.

Further, as shown in fig. 1 to 2, the flexible connector 3 includes an insulator 31, a plurality of first conductors 32 are disposed on one side surface of the insulator 31, a plurality of second conductors 33 are disposed on the other side surface of the insulator 31, and a conductive medium 34 for connecting the first conductors 32 and the second conductors 33 is further disposed on the insulator 31; marking the circuit board on the side of the first conductor 32 as a first circuit board 1, wherein the surface of the first circuit board 1 facing the flexible connector 3 is provided with first pads 11 with the same number as the first conductors 32, each first pad 11 is connected with each first conductor 32 in a one-to-one correspondence manner, and the surface of the first conductor 32 connected with the first pad 11 is provided with a convex part 35; the circuit board on the side of the second conductors 33 is referred to as a second circuit board 2, the surface of the second circuit board 2 facing the flexible connector 3 is provided with the same number of second pads 21 as the second conductors 33, the second pads 21 are connected to the second conductors 33 in a one-to-one correspondence, and the surface of the second conductors 33 connected to the second pads 21 is also provided with protrusions 35. In practical use, therefore, each first conductor 32 is electrically connected to each first land 11 on the first circuit board 1 via the protrusion 35 provided on the surface thereof, and similarly, each second conductor 33 is electrically connected to each second land 21 on the second circuit board 2 via the protrusion 35 provided on the surface thereof.

Based on the structure, the integrated device clamps the flexible connector 3 between the two circuit boards, and the electric conductors on the two sides of the flexible connector 3 are respectively connected with the bonding pads on the two circuit boards through the convex parts 35 arranged on the surfaces of the electric conductors, so that the circuit conduction between the two circuit boards is realized, and therefore, compared with the traditional integrated device adopting welding and bonding, the integrated device provided by the embodiment of the invention can realize repeated disassembly and assembly, is convenient for the maintenance of the circuit boards, has lower manufacturing cost, can also realize accurate contraposition connection of the two circuit boards, and has higher assembly precision; on the other hand, the convex parts 35 arranged on the first conductor 32 and the second conductor 33 can increase the contact area between the first pad 11 and the first conductor 32 and between the second pad 21 and the second conductor 33, so that the flexible connector 3 is more fully contacted with the circuit board, and the problems of circuit interruption, signal distortion and the like of the integrated device can be avoided; meanwhile, the protruding portion 35 can also increase the friction force between the first pad 11 and the first conductor 32 and between the second pad 21 and the second conductor 33, so that in the assembling process of the integrated device, the first pad 11 and the first conductor 32 and the second pad 21 and the second conductor 33 are not easy to be dislocated, and the reliability of the electrical connection between the two circuit boards is ensured.

Specifically, as shown in fig. 3 to 11, the convex portion 35 has a regular or irregular solid geometry, such as a pointed shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, a block shape, and the like, and, in any shape, the height h of the convex portion 35 itself has a value ranging from 1 to 30 μm, with 2.5 to 15 μm being the most preferable range. On the basis, the surfaces of the first conductor 32 and the second conductor 33 are provided with two or more protrusions 35, the shape of each protrusion 35 may be the same or different, and the size of each protrusion 35 may also be the same or different, that is, the shape of the two or more protrusions 35 may be one or more of a sharp angle shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape and a block shape, and the size of the two or more protrusions 35 of the same shape may be different. In addition, two or more protrusions 35 are continuously or discontinuously distributed on the surfaces of the first conductor 32 and the second conductor 33, for example, when the two or more protrusions 35 are in a sharp-angled shape and are continuously distributed, a regular and periodic three-dimensional pattern with insection or an irregular and disordered three-dimensional pattern with insection may be formed.

Alternatively, as shown in fig. 3 to 5, the surfaces of the first conductor 32 and the second conductor 33 may be flat surfaces or rough surfaces. The flat surface and the rough surface referred to herein mean surfaces of the first conductor 32 and the second conductor 33 where the protrusion 35 is located, that is, a reference surface where the protrusion 35 is located, and are not a plane composed of two or more protrusions 35. When the surfaces of the first conductor 32 and the second conductor 33 are rough surfaces, they include concave portions and convex portions, the convex portions 35 are distributed over both the concave portions and the convex portions, and the sum of the height H of any one of the convex portions and the height H of the convex portion 35 itself on the convex portion is also 1 to 30 μm. Of course, the height H of the convex portion 35 provided on the convex portion may be 1 to 30 μm, and then, the sum of the height H of the convex portion and the height H of the convex portion 35 provided on the convex portion is greater than 1 to 30 μm, so that the electrical connection performance of the flexible connector 3 and the integrated device can be further enhanced.

Optionally, the material of the protruding portion 35 is one or a combination of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold, and silver. Specifically, the bump 35 may be composed of a single component, that is, one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver, or may be composed of one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver as a main component, and then one or more of metals other than the main component may be formed on the surface of the main component by one or more of electroplating, electroless plating, physical vapor deposition, and chemical vapor deposition, thereby forming the bump 35 of a composite material. In the present embodiment, the projection 35 is preferably made of a composite material mainly made of copper, and one or more metals selected from nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver are formed on the surface of copper, because the projection 35 made of copper alone is easily oxidized or worn, and the nickel, tin, gold, and silver formed on the surface of copper can improve the corrosion resistance and wear resistance of the projection 35, and further improve the electrical conductivity of the flexible connector, thereby prolonging the service life of the flexible connector.

As shown in fig. 3, the insulator 31 is provided with a connection hole for connecting the first conductor 32 and the second conductor 33, the conductive medium 34 is attached to the wall of the connection hole to form a conductive hole 36, and the conductive hole 36 may be a through hole, a buried hole, or a blind hole. Of course, as shown in fig. 12, during the forming process of the conductive medium 34, an operator may also choose to fill the entire connection hole with the conductive medium 34, that is, not form the conductive hole 36, so as to prevent the etching solution from entering the conductive hole 36 and protect the conductive medium 34 from being etched.

In the embodiment of the present invention, the first pads 11 and the first conductors 32 are two or more, and each first pad 11 is independent of each other, and each first conductor 32 is independent of each other; similarly, the second pads 21 and the second conductors 33 are provided in two or more numbers, and the second pads 21 are independent of each other, and the second conductors 33 are independent of each other. Wherein, the following connection forms exist between the first conductor 32 and the second conductor 33:

first, as shown in fig. 3, the number of the second conductors 33 is equal to that of the first conductors 32, and each of the first conductors 32 is connected to each of the second conductors 33 through the conductive medium 34 in a different connecting hole in a one-to-one correspondence. In this connection, the signal lines on the first circuit board 1 and the signal lines on the second circuit board 2 are conducted in a one-to-one correspondence.

Secondly, as shown in fig. 13, the number of the first conductors 32 is greater than that of the second conductors 33, at least two first conductors 32 are connected to the same second conductor 33 through the conductive mediums 34 in different connecting holes, and the rest first conductors 32 are connected to the rest second conductors 33 through the conductive mediums 34 in different connecting holes in a one-to-one correspondence manner. In this connection mode, a part of the signal lines on the first circuit board 1 are conducted with the ground lines on the second circuit board 2, and the rest signal lines on the first circuit board 1 are conducted with the signal lines on the second circuit board 2 in a one-to-one correspondence manner.

Thirdly, as shown in fig. 14, the number of the first conductors 32 is less than that of the second conductors 33, at least two second conductors 33 are respectively connected with the same first conductor 32 through the conductive mediums 34 in different connecting holes, and the other second conductors 33 are respectively connected with the other first conductors 32 through the conductive mediums 34 in different connecting holes in a one-to-one correspondence manner. In this connection mode, a part of the signal lines on the second circuit board 2 are conducted with the ground lines on the first circuit board 1, and the rest signal lines on the second circuit board 2 are conducted with the signal lines on the first circuit board 1 in a one-to-one correspondence manner.

Fourth, as shown in fig. 15, at least two first conductors 32 are connected to the same second conductor 33 through conductive media 34 in different connecting holes, respectively, and at least two second conductors 33 are connected to the same first conductor 32 through conductive media 34 in different connecting holes, respectively. In this connection mode, part of the signal lines on the first circuit board 1 are conducted with the ground lines on the second circuit board 2, and part of the signal lines on the second circuit board 2 are conducted with the ground lines on the first circuit board 1.

Fifth, as shown in fig. 16, at least two first conductors 32 are connected to the same second conductor 33 through the conductive mediums 34 in different connecting holes, at least two second conductors 33 are connected to the same first conductor 32 through the conductive mediums 34 in different connecting holes, and the rest first conductors 32 are connected to the rest second conductors 33 through the conductive mediums 34 in different connecting holes in a one-to-one correspondence manner. In this connection form, a part of the signal lines on the first circuit board 1 are conducted with the ground lines on the second circuit board 2, a part of the signal lines on the second circuit board 2 are conducted with the ground lines on the first circuit board 1, and the rest of the signal lines on the first circuit board 1 are conducted with the rest of the signal lines on the second circuit board 2 in a one-to-one correspondence manner.

Optionally, no matter which form of electrical connection is adopted between the first conductor 32 and the second conductor 33, two or more connection holes may be provided between the first conductor 32 and the second conductor 33 connected thereto, and a conductive medium 34 is provided in each connection hole to further improve the conductive performance of the flexible connector 3 and the integrated device.

Optionally, the surfaces of the first circuit board 1 and/or the second circuit board 2 facing the flexible connector 3 are provided with components (not shown), and the insulator 31 is provided with a receiving hole 311 for receiving the components, so as to avoid damaging the components, and further improve the integration degree of the integrated device, of course, the receiving hole 311 may be a receiving groove or other similar structures.

Optionally, the material of the insulator 31 in the embodiment of the present invention is one or more of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyphenylene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, and polyoxamide. Specifically, the insulator 31 may be a single component, i.e., one of the above-described various insulating materials, or may be a composite of any of the above-described plural insulating materials. Because of this, the insulator 31 has a certain amount of deformation, when the flexible connector 3 is clamped between two circuit boards, the protruding portion 35 that first contacts the pad is compressed backward, so that the relatively lower protruding portion 35 can also contact the pad to ensure a reliable electrical connection between the first and second electrical conductors 32 and 33 and the pad.

Optionally, the conductive medium 34 in the embodiment of the present invention is preferably copper, but other materials with good conductive performance may also be selected, for example, tin, silver, gold, graphite, copper paste, silver paste, tin paste, carbon nanotube, etc.

In order to make the features and advantages of the integrated device provided by the present invention more comprehensible, an integrated device with a simple structure will be further described in detail with reference to the accompanying drawings.

As shown in fig. 1, the integrated device includes a first circuit board 1, a second circuit board 2, and a flexible connector 3 interposed therebetween, and the first circuit board 1, the second circuit board 2, and the flexible connector 3 are connected by a bolt.

Further, as shown in fig. 2 to 3, the flexible connector 3 includes an insulator 31, a surface of the insulator 31 facing the first circuit board 1 is provided with n mutually independent first conductors 32, a surface facing the second circuit board 2 is provided with n mutually independent second conductors 33, and both the surface of the first conductor 32 and the surface of the second conductor 33 are provided with a protrusion 35; in addition, the insulator 31 is further provided with a number of connecting holes equal to the number of the first conductors 32 and the second conductors 33, and a conductive medium 34 is attached to the hole wall of each connecting hole, so that n conductive holes 36 are provided in the insulator 31, and each conductive hole 36 is correspondingly connected with one first conductor 32 and one second conductor 33.

Still further, as shown in fig. 2, n first pads 11 are disposed on the surface of the first circuit board 1 facing the flexible connector 3, and each first conductor 32 is connected to each first pad 11 through a protrusion 35 disposed on the surface thereof; similarly, the surface of the second circuit board 2 facing the flexible connector 3 is provided with n second pads 21, and the second conductors 33 are connected to the second pads 21 in a one-to-one correspondence manner through the protrusions 35 provided on the surface of each second conductor. Accordingly, the electrical signals transmitted by the signal lines on the first circuit board 1 pass through the first pad 11, the protrusion 35 on the first conductor 32, the conductive medium 34, the second conductor 33, the protrusion 35 on the second conductor 33, and the second pad 21 in sequence, and are transmitted to the signal lines on the second circuit board 2, so that signal conduction between the first circuit board 1 and the second circuit board 2 is realized.

Finally, it should be noted that, according to different practical applications, the flexible connector 3 in the embodiment of the present invention may also be provided with the protruding portion 35 only on the surface of the first conductor 32 or the second conductor 33, that is, the first conductor 32 is connected to the first pad 11 through the protruding portion 35, and the second conductor 33 is directly attached to the second pad 21, or the first conductor 32 is directly attached to the first pad 11, and the second conductor 33 is connected to the second pad 21 through the protruding portion 35, and the integrated device also has the technical effects as described above, and therefore, the description is omitted here.

Example two

As shown in fig. 17 to 19, the integrated device according to the embodiment of the present invention is different from the integrated device according to the first embodiment in that the surface of the protrusion 35 provided on the first conductor 32 or/and the second conductor 33 is a regular or irregular arc-shaped surface. Specifically, two or more projections 35 are provided, the shape of each projection 35 may be the same or different, and the size of each projection 35 may be the same or different, that is, the curvature, height, edge profile shape, and the like of each projection 35 are different. In addition, the two or more protrusions 35 are continuously or discontinuously distributed on the surface of the first conductor 32 or/and the second conductor 33, and when continuously distributed, the two or more protrusions 35 form a regular, periodic, or an irregular, disordered, corrugated pattern. Of course, only one of them is listed here, and other combinations of similar shapes are also within the scope of protection of the present application, and are not listed here.

Except for the differences, other specific structures of the embodiment of the present invention are the same as those of the first embodiment, and the corresponding principles and technical effects are also the same, which are not described herein again.

EXAMPLE III

As shown in fig. 20 to 21, the integrated device according to the embodiment of the present invention is different from the integrated devices according to the first and second embodiments in that the detachable connection between the flexible connector 3 and the circuit board is an adhesive. Specifically, the protruding portions 35 of the flexible connector 3 are provided with the adhesive film layer 37, and for each protruding portion 35, when the flexible connector 3 is not clamped between two circuit boards, it is hidden in the adhesive film layer 37 or penetrates through the adhesive film layer 37 and is exposed. Based on this, during the assembly process of the integrated device, since the adhesive film layer 37 has fluidity, the protrusions 35 which have not penetrated the adhesive film layer 37 before all or individually penetrate the adhesive film layer 37 and contact the first pads 11 or/and the second pads 21 together with the protrusions 35 which have penetrated the adhesive film layer 37 before, so that the flexible connector 3 and the two circuit boards form a reliable electrical connection, and the integrated device is ensured to have good conductivity after the adhesive film layer 37 is added; at the same time, thanks to the adhesive capacity of the adhesive film layer 37, the connection of the integrated device is more stable and is not easy to loosen and disengage. Of course, in order to simplify the process, the adhesive film layer 37 in the embodiment of the present invention is directly formed on the entire surface of the flexible connector 3, and therefore, the adhesive film layer 37 is formed on the surface of the insulator 31 on which the first conductor 32 or/and the second conductor 33 provided with the protrusion 35 is/are located, in addition to the protrusion 35.

Preferably, in the embodiment of the present invention, the adhesive film layer 37 is preferably a pressure sensitive adhesive or a thermoplastic adhesive, but the adhesive film layer 37 may also be a thermosetting adhesive or the like according to the actual application. Except for the differences, other specific structures of the embodiment of the present invention are the same as those of the first embodiment, and the corresponding principles and technical effects are also the same, which are not described herein again.

In summary, the present invention provides an integrated device, which includes at least two detachably connected circuit boards, and a flexible connector 3 is detachably connected between any two adjacent circuit boards. Compared with the prior art, the integrated device has the advantages of good conductivity, high reliability, low manufacturing cost and repeated disassembly and assembly.

It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, which are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.

The foregoing is directed to the preferred embodiment of the present invention, and it is understood that various changes and modifications may be made by one skilled in the art without departing from the spirit of the invention, and it is intended that such changes and modifications be considered as within the scope of the invention.

Claims (20)

1. An integrated device is characterized by comprising at least two circuit boards which are detachably connected, wherein a flexible connector is detachably connected between any two adjacent circuit boards;

the flexible connector comprises an insulator, wherein a plurality of first conductors are arranged on the surface of one side of the insulator, a plurality of second conductors are arranged on the surface of the other side of the insulator, the circuit board on the side where the first conductors are located is marked as a first circuit board, the circuit board on the side where the second conductors are located is marked as a second circuit board, first pads with the same number as the first conductors are arranged on the surface of the first circuit board facing the flexible connector, the first pads are in one-to-one correspondence with and connected with the first conductors, second pads with the same number as the second conductors are arranged on the surface of the second circuit board facing the flexible connector, and the second pads are in one-to-one correspondence with and connected with the second conductors;

the insulator is provided with a conductive medium for connecting the first conductor and the second conductor, and a convex part is arranged on the surface of the first conductor connected with the first pad or/and the surface of the second conductor connected with the second pad.

2. The integrated device according to claim 1, wherein a surface of the first circuit board or/and the second circuit board facing the flexible connector is provided with a component, and the insulator is provided with a receiving hole or a receiving groove for receiving the component.

3. The integrated device of claim 1, wherein the protrusions have a regular or irregular solid geometry.

4. The integrated device according to claim 3, wherein the shape of the protrusion is a sharp corner, an inverted corner, a granular shape, a dendritic shape, a columnar shape, or a block shape.

5. The integrated device of claim 3, wherein the height of the protrusion is in a range of 1 to 30 μm.

6. The integrated device according to claim 1, wherein the surface of the protrusion is a regular or irregular arc-shaped surface.

7. The integrated device according to claim 1, wherein the surface of the first conductor or/and the second conductor is provided with two or more protrusions, the shape of each protrusion is the same or different, the size of each protrusion is the same or different, and the two or more protrusions are continuously or discontinuously distributed on the surface of the first conductor or/and the second conductor.

8. The integrated device according to claim 1, wherein a surface of the first conductor or/and the second conductor is a rough surface or a flat surface.

9. The integrated device of claim 1, wherein the material of the protruding portion is one or more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

10. The integrated device according to claim 1, wherein an adhesive film layer is disposed on at least one side surface of the insulator or/and the protrusion, and the protrusion is hidden in the adhesive film layer or penetrates through the adhesive film layer and is exposed.

11. The integrated device according to claim 1, wherein a connection hole for connecting the first conductor and the second conductor is provided in the insulator, and the conductive medium is provided in the connection hole.

12. The integrated device of claim 11, wherein the conductive medium fills the contact hole, or adheres to a wall of the contact hole and forms a conductive hole.

13. The integrated device according to claim 11, wherein the first pads and the first conductors are provided in two or more numbers, and each of the first pads is independent of each other, and each of the first conductors is independent of each other;

the second bonding pads and the second conductors are two or more, the second bonding pads are mutually independent, and the second conductors are mutually independent.

14. The integrated device according to claim 13, wherein the number of the first conductors is equal to the number of the second conductors, and each of the first conductors is connected to each of the second conductors in a one-to-one correspondence via the conductive medium in the different connection holes.

15. The integrated device according to claim 13, wherein the number of the first conductors is greater than the number of the second conductors, at least two of the first conductors are connected to the same second conductor through the conductive media in different ones of the connection holes, and the remaining first conductors are connected to the remaining second conductors in a one-to-one correspondence through the conductive media in different ones of the connection holes.

16. The integrated device according to claim 13, wherein the number of the first conductors is smaller than the number of the second conductors, at least two of the second conductors are connected to the same first conductor through the conductive media in different ones of the connection holes, and the remaining second conductors are connected to the remaining first conductors in a one-to-one correspondence through the conductive media in different ones of the connection holes.

17. The integrated device according to claim 13, wherein at least two of the first conductors are connected to the same second conductor through the conductive media in different ones of the connection holes, and at least two of the second conductors are connected to the same first conductor through the conductive media in different ones of the connection holes.

18. The integrated device according to claim 13, wherein at least two of the first conductors are connected to the same second conductor through the conductive media in different ones of the connection holes, at least two of the second conductors are connected to the same first conductor through the conductive media in different ones of the connection holes, and the remaining first conductors are connected to the remaining second conductors in a one-to-one correspondence through the conductive media in different ones of the connection holes.

19. The integrated device according to claim 11, wherein two or more of the connection holes are provided between the first conductor and the second conductor connected thereto.

20. The integrated device of claim 1, wherein the insulator is made of one or more of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, and polyoxamide.

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