CN110769615B - Ceramic copper-clad plate conductive micropore and preparation method thereof - Google Patents
Ceramic copper-clad plate conductive micropore and preparation method thereof Download PDFInfo
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- CN110769615B CN110769615B CN201910876368.7A CN201910876368A CN110769615B CN 110769615 B CN110769615 B CN 110769615B CN 201910876368 A CN201910876368 A CN 201910876368A CN 110769615 B CN110769615 B CN 110769615B
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- ceramic copper
- active solder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Abstract
The invention discloses a ceramic copper-clad plate conductive micropore and a preparation method thereof, wherein the preparation method comprises the following steps: punching holes at the designated position of the ceramic copper-clad plate; injecting active solder into the hole, wherein the thickness of the active solder exceeds that of the ceramic plate; and carrying out laser irradiation on the active solder, and carrying out metallurgical bonding on the active solder and the ceramic plate in the hole to prepare the conductive micropore of the ceramic copper-clad plate. According to the invention, the active solder and the ceramic plate in the hole are metallurgically bonded by utilizing the irradiation of the laser, the connection strength between the active solder and the ceramic plate is high, the prepared ceramic copper-clad plate has good conductivity of the conductive micropore, the thermal cycle resistance is strong, meanwhile, the uniform thickness of the metal on the hole wall is ensured, and the reliability and the stability of the product are improved.
Description
Technical Field
The invention relates to the field of manufacturing of ceramic copper-clad plates, in particular to a conductive micropore of a ceramic copper-clad plate and a preparation method thereof.
Background
In the field of manufacturing of ceramic copper clad laminates, in order to realize signal conduction of upper and lower layers of the ceramic copper clad laminate, a through hole is usually required to be formed on a substrate, and the through hole is metallized. At present, the common preparation method of the conductive micropores of the ceramic copper-clad plate adopts a copper electroplating mode, through-holes are metallized through an electroplating hole filling process, however, the copper electroplating mode easily causes holes in the through-holes, electroplating liquid medicine is easily stored in the holes, and the prepared ceramic copper-clad plate with the conductive micropores bites the holes in the use process, so that the resistance in the through-holes is abnormal, the reliability of the product is low, and a great risk exists in the use process.
Accordingly, there is a need for improvements and developments in the art.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a conductive micropore of a ceramic copper-clad plate and a preparation method thereof, and aims to solve the problems that the resistance in a through hole is easy to be abnormal when the conductive micropore is prepared on the ceramic copper-clad plate in the prior art, so that the ceramic copper-clad plate has a large risk in the use process and the reliability is reduced.
The technical scheme of the invention is as follows:
a preparation method of a ceramic copper-clad plate conductive micropore comprises the following steps:
punching holes at the designated position of the ceramic copper-clad plate;
injecting active solder exceeding the thickness of the ceramic plate into the hole;
and carrying out laser irradiation on the active welding flux, and carrying out metallurgical bonding on the active welding flux and the ceramic plate in the hole to prepare the conductive micropore of the ceramic copper-clad plate.
The preparation method of the conductive micropore of the ceramic copper clad laminate comprises the following steps of carrying out laser irradiation on the active solder to enable the active solder to be combined on a ceramic plate in the micropore, and preparing the conductive micropore of the ceramic copper clad laminate:
performing first laser irradiation on the active solder by adopting laser with first radiation power to melt the active solder;
and after the active welding flux is solidified, carrying out secondary laser irradiation on the active welding flux by adopting laser with second radiation power to prepare the conductive micropore of the ceramic copper-clad plate, wherein the second radiation power is smaller than the first radiation power.
The preparation method of the conductive micropore of the ceramic copper-clad plate is characterized in that the diameter of a light spot irradiated by the first laser is larger than that of a light spot irradiated by the second laser.
The preparation method of the conductive micropore of the ceramic copper clad laminate is characterized in that the diameter of a light spot of the first laser irradiation is 0.7-0.9 times of the aperture of the micropore.
The preparation method of the conductive micropore of the ceramic copper-clad plate is characterized in that the diameter of a light spot irradiated by the second laser is 0.4-0.6 times of the diameter of the micropore.
The preparation method of the conductive micropore of the ceramic copper-clad plate comprises the step of preparing the conductive micropore of the ceramic copper-clad plate, wherein the first radiation power is 100-120W.
The preparation method of the conductive micropore of the ceramic copper clad laminate is characterized in that the second radiation power is 80-90W.
The preparation method of the conductive micropore of the ceramic copper clad laminate comprises the following steps of:
and coating a solder resist around the hole opening in the area of the surface of the ceramic copper-clad plate close to the hole opening.
The preparation method of the conductive micropore of the ceramic copper clad laminate comprises the following steps of:
monitoring the temperature of the active solder in real time by adopting a temperature detector;
and controlling the laser irradiation power and the irradiation time in real time according to the real-time monitored active solder temperature, and performing laser irradiation on the active solder under the protection of inert atmosphere.
The invention relates to a conductive micropore of a ceramic copper-clad plate, which is prepared by adopting the preparation method.
Has the beneficial effects that: the invention provides a preparation method of a ceramic copper-clad plate conductive micropore, which utilizes laser irradiation to enable active solder to realize metallurgical bonding with a ceramic plate in a hole, the connection strength between the active solder and the ceramic plate is high, the prepared ceramic copper-clad plate conductive micropore has good conductivity and strong heat cycle resistance, and meanwhile, the laser irradiation ensures that the metal thickness of the hole wall is uniform, and the reliability and the stability of a product are improved; furthermore, the preparation method of the conductive micropores of the ceramic copper-clad plate provided by the invention also has the advantages of simple operation, low material cost, short production period and high production efficiency.
Drawings
FIG. 1 is a flow chart of a preferred embodiment of the preparation method of the conductive micropores of the ceramic copper clad laminate of the present invention.
FIG. 2 is an operation diagram of a preferred embodiment of the preparation method of the conductive micropores of the ceramic copper clad laminate of the present invention.
Detailed Description
The invention provides a ceramic copper-clad plate conductive micropore and a preparation method thereof, and the invention is further explained in detail below in order to make the purpose, technical scheme and effect of the invention clearer and more clear and definite. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The existing preparation of the conductive micropore of the ceramic copper-clad plate adopts an electroplating copper method, and the through hole is metallized by adopting an electroplating hole filling process, however, the mode easily causes the through hole to have a hole, electroplating liquid medicine is easily stored in the hole, and the prepared ceramic copper-clad plate with the conductive micropore can bite the hole in the use process, so that the resistance in the through hole is abnormal, the thermal cycling capability is reduced, and finally, the product has a large risk in the use process and the reliability is reduced.
Based on the problems of the existing preparation method of the conductive micropores of the ceramic copper clad laminate, the embodiment of the invention provides a preparation method of the conductive micropores of the ceramic copper clad laminate, as shown in figure 1, the preparation method comprises the following steps:
s100, punching holes at the designated position of the ceramic copper-clad plate;
s200, injecting active solder with the thickness exceeding that of the ceramic plate into the hole;
s300, carrying out laser irradiation on the active solder to enable the active solder to be metallurgically bonded with the ceramic plate in the hole, and thus obtaining the conductive micropore of the ceramic copper clad laminate.
In the embodiment, the active solder and the ceramic plate in the hole are metallurgically bonded by laser irradiation, the connection strength between the active solder and the ceramic plate is high, the prepared ceramic copper-clad plate has good conductivity and strong thermal cycle resistance, and meanwhile, the laser irradiation ensures that the metal thickness of the hole wall is uniform, so that the reliability and the stability of the product are improved; furthermore, the preparation method of the conductive micropore of the ceramic copper clad laminate provided by the invention also has the advantages of simple operation, low material cost, short production period and high production efficiency.
In some embodiments, holes are punched at the designated positions on the ceramic copper-clad plate by using laser, and the hole diameter (hole diameter) is 0.1-0.3 mm.
In some embodiments, in order to ensure that the ceramic copper-clad plate is not polluted by active solder in the preparation process of the conductive micropores of the ceramic copper-clad plate, after laser drilling, solder resist is coated on the surface of the ceramic copper-clad plate in a region close to the hole opening and surrounds the hole opening. The embodiment avoids the pollution of the ceramic copper-clad plate caused by the adhesion of the active solder dropping on the orifice area on the copper plate in the process of injecting the active solder into the hole.
In some embodiments, active solder is injected into the hole from two sides of the ceramic copper-clad plate, and in order to ensure that the ceramic plate in the hole can be metallurgically bonded with the active solder, the thickness of the active solder is larger than that of the ceramic plate in the ceramic copper-clad plate.
In some embodiments, the step of laser irradiating the active solder comprises:
monitoring the temperature of the active solder in real time by adopting a temperature detector;
and controlling the laser irradiation power and the irradiation time in real time according to the real-time monitored active solder temperature, and performing laser irradiation on the active solder under the protection of inert atmosphere.
As shown in fig. 2, it is right the active solder carries out the in-process of laser irradiation, still is provided with thermodetector above the ceramic copper-clad plate, thermodetector is used for downthehole the temperature of active solder carries out real-time supervision, through right the temperature of active solder carries out real-time supervision, can in time adjust the power and the irradiation time of laser instrument according to the production situation at any time to obtain the ceramic copper-clad plate electrically conductive micropore of stable quality, avoided the laser irradiation in-process, if the active solder temperature is too high, lead to the active solder receives the action of gravity fast downslide after the rapid melting and stays bottom of the hole, thereby cause the wet time of ceramic plate short, or if the active solder temperature is crossed lowly and is led to the melting process of active solder slow, thereby reduce production efficiency. In the present embodiment, in order to prevent the active solder from being oxidized during the laser irradiation, the active solder is irradiated with laser under an inert atmosphere.
In some embodiments, the step of irradiating the active solder with laser to bond the active solder on the ceramic plate in the hole to obtain the conductive micropore of the ceramic copper clad laminate comprises:
performing first laser irradiation on the active solder by adopting laser with first radiation power to melt the active solder;
and after the active welding flux is solidified, carrying out secondary laser irradiation on the active welding flux by adopting laser with second radiation power to prepare the conductive micropore of the ceramic copper-clad plate, wherein the second radiation power is smaller than the first radiation power.
In the embodiment, the laser irradiation on the active solder is carried out in two steps, wherein in the first step, the laser with the first radiation power is adopted to carry out the first laser irradiation on the active solder, so that the active solder is melted and fully wets the ceramic plate, the metallurgical bonding between the active solder and the ceramic plate is realized, and the redundant metal is accumulated at the bottom of the hole after being cooled; and secondly, after the active solder is solidified, performing secondary laser irradiation by adopting laser with second radiation power, so that the redundant metal accumulated at the bottom of the hole is melted by the laser irradiation and is cleaned under the action of the impact force of the laser, and meanwhile, forming a metal layer with uniform thickness on the hole wall through the secondary laser irradiation, wherein the second radiation power is smaller than the first radiation power. In the embodiment, the laser irradiation is carried out on the active solder in two steps, so that the reliability and good conductivity of the prepared conductive micropore of the ceramic copper-clad plate are ensured, and in addition, the operation is simple, and the industrial mass production is facilitated.
In some embodiments, the first laser shot has a larger spot diameter than the second laser shot. In this embodiment, when the active solder is subjected to the first laser irradiation, the active solder needs to be melted to wet the ceramic plate, and further, metallurgical bonding between the active solder and the ceramic plate is achieved, and when the active solder is subjected to the second laser irradiation, only the redundant metal accumulated at the bottom of the hole needs to be melted, so that if the diameter of the light spot of the second laser irradiation is equal to or larger than that of the light spot of the first laser irradiation, the metal layer with a certain thickness on the hole wall is melted, and the conductivity of the conductive micropore of the prepared ceramic copper-clad plate is affected.
In some embodiments, the first laser irradiation has a spot diameter of 0.7 to 0.9 times the aperture diameter of the hole. In this embodiment, the melting process of the active solder is mainly affected by the laser power, the energy density and the irradiation time, when the laser irradiation with the spot diameter of 0.7 to 0.9 times of the aperture of the hole is adopted, on one hand, the active solder can be melted and wetted by controlling the laser power, the energy density and the irradiation time, so that the metallurgical bonding of the ceramic plate and the active solder is realized, and on the other hand, the active solder is irradiated by the laser with the spot diameter of 0.7 to 0.9 times of the aperture of the hole, so that the active solder is heated more uniformly, which is also beneficial to the melting process.
In some embodiments, the second laser irradiation has a spot diameter of 0.4 to 0.6 times the aperture diameter of the pores. In this embodiment, in order to ensure that the metal layer with a certain thickness on the hole wall is not affected, and simultaneously, the removal of the redundant metal is realized, the spot diameter is adopted to irradiate the laser of 0.4-0.6 times of the hole diameter, when the adopted spot diameter is smaller than 0.4 times of the hole diameter, the irradiation area is too small, the time consumed for removing the redundant metal is too long, the production efficiency is low, the industrial production is not facilitated, when the adopted spot diameter is larger than 0.6 times of the hole diameter, the area of the laser irradiation for the first time is too close, the metal layer with a certain thickness on the hole wall is easily melted, and the quality of the conductive micropore for preparing the ceramic copper-clad plate is unstable.
In some embodiments, the first radiation power is 100-. In the embodiment, the first radiation power is set to be 100-120W according to the spot diameter of radiation, the irradiation time, the thickness of the ceramic plate in the ceramic copper-clad plate and the aperture size, if the first radiation power is too small, the irradiation time is prolonged, the preparation efficiency is low, and the industrial production is not facilitated.
In some embodiments, the second radiation power is 80-90W. In this embodiment, according to the spot diameter of the radiation, the irradiation time, the thickness and the pore size of the ceramic plate in the ceramic copper clad laminate, and in combination with the range of the first radiation power, the second radiation power is set to 80-90W, if the second radiation power is too small, the irradiation time is lengthened, the preparation efficiency is low, and the industrial production is not facilitated, and if the second radiation power is too large, the metal layer with a certain thickness on the pore wall is also partially melted, so that the quality of the finally prepared conductive micropore of the ceramic copper clad laminate is affected.
In some embodiments, the invention also provides a conductive micropore of a ceramic copper clad laminate, which is prepared by the preparation method of the conductive micropore of the ceramic copper clad laminate.
The preparation method of the conductive micropore of the ceramic copper clad laminate of the invention is further explained by the following specific embodiment:
example 1
The ceramic copper-clad plate is perforated in advance by laser, the aperture is 0.1mm, and then a layer of solder resist is coated near the aperture area of the upper and lower surfaces of the ceramic copper-clad plate.
And respectively injecting Ag-Cu-Ti active solder into the holes from the upper surface and the lower surface of the ceramic copper-clad plate to ensure that the thickness of the active solder layer exceeds that of the ceramic plate.
Under the protection of argon, irradiating the active solder by adopting laser with the power of 100W and the spot diameter of 70um, measuring the temperature of the active solder in real time, controlling the power and time of laser irradiation in real time according to the temperature of the active solder, ensuring that the active solder is fully melted and wets the ceramic plate, and stopping laser irradiation; after the active solder is solidified, the active solder is irradiated by laser with the power of 80W and the spot diameter of 50um for the second time, so that the solder near the hole wall is uniform, and redundant active solder is cleaned.
Example 2:
the ceramic copper-clad plate is perforated in advance by laser, the aperture is 0.2mm, and then a layer of solder resist is coated near the aperture areas of the upper and lower surfaces of the ceramic copper-clad plate.
And respectively injecting Ag-Cu-Ti active solder into the holes from the upper surface and the lower surface of the ceramic copper-clad plate to ensure that the thickness of the active solder layer exceeds that of the ceramic plate.
Under the protection of argon gas, irradiating the active solder by adopting laser with the power of 110W and the spot diameter of 140um, measuring the temperature of the active solder in real time, controlling the power and time of laser irradiation in real time according to the temperature of the active solder, ensuring that the active solder is fully melted and wets the ceramic plate, and stopping laser irradiation; after the active solder is solidified, the active solder is irradiated by laser with the power of 80W and the spot diameter of 100um for the second time, so that the solder near the hole wall is uniform, and redundant active solder is cleaned.
In conclusion, the invention designs a preparation method of the conductive micropore of the ceramic copper clad laminate, which utilizes the irradiation of laser to enable the active solder to react with the ceramic to realize metallurgical bonding, the connection strength between the active solder and the ceramic plate is high, the prepared conductive micropore of the ceramic copper clad laminate has good conductivity and strong thermal cycle resistance, meanwhile, the laser irradiation ensures the uniform thickness of metal on the hole wall, and the reliability and the stability of the product are improved.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (8)
1. A preparation method of a ceramic copper-clad plate conductive micropore is characterized by comprising the following steps:
punching holes at the designated position of the ceramic copper-clad plate;
injecting active solder into the hole, wherein the thickness of the active solder exceeds that of the ceramic plate;
monitoring the temperature of the active solder in real time by adopting a temperature detector;
controlling laser irradiation power and irradiation time in real time according to the active solder temperature monitored in real time, carrying out laser irradiation on the active solder under the protection of inert atmosphere, and carrying out primary laser irradiation on the active solder by adopting laser with first irradiation power so as to melt the active solder;
and after the active welding flux is solidified, carrying out secondary laser irradiation on the active welding flux by adopting laser with second radiation power to prepare the conductive micropore of the ceramic copper-clad plate, wherein the second radiation power is smaller than the first radiation power.
2. The method for preparing the conductive micropores of the ceramic copper-clad plate according to claim 1, wherein the spot diameter of the first laser irradiation is larger than the spot diameter of the second laser irradiation.
3. The method for preparing the conductive micropore of the ceramic copper clad laminate according to claim 2, wherein the diameter of the spot of the first laser irradiation is 0.7 to 0.9 times the diameter of the pore.
4. The method for preparing the conductive micropores of the ceramic copper clad laminate according to claim 2, wherein the diameter of the light spot of the second laser irradiation is 0.4-0.6 times of the diameter of the pores.
5. The method for preparing the conductive micropores of the ceramic copper-clad plate according to claim 1, wherein the first radiation power is 100-120W.
6. The method for preparing the conductive micropores of the ceramic copper clad laminate according to claim 1, wherein the second radiation power is 80-90W.
7. The method for preparing the conductive micropores of the ceramic copper-clad plate according to claim 1, wherein before the active solder exceeding the thickness of the ceramic plate is injected into the pores, the method further comprises the following steps:
and coating a solder resist around the hole opening in the area of the surface of the ceramic copper-clad plate close to the hole opening.
8. A ceramic copper clad laminate conductive micropore is characterized in that the micropore is prepared by the preparation method of any one of claims 1 to 7.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6437484A (en) * | 1987-08-04 | 1989-02-08 | Nippon Steel Corp | Metallizing of ceramic by active metal |
| JP2013153051A (en) * | 2012-01-25 | 2013-08-08 | Tokuyama Corp | Metallized ceramic via substrate and manufacturing method thereof |
| CN103753022B (en) * | 2014-01-17 | 2016-05-25 | 江苏中科大港激光科技有限公司 | Adopt twin-laser metal material to be implemented to the method for laser weld |
| CN107598371A (en) * | 2017-09-21 | 2018-01-19 | 中国科学院长春光学精密机械与物理研究所 | A kind of welding method of coppersmith part |
| CN108516871B (en) * | 2018-04-23 | 2020-12-22 | 哈尔滨工业大学（威海） | Surface metallization method of porous silicon nitride ceramic |
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