CN110768014B - Integrated substrate gap waveguide via cluster feed antenna - Google Patents
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- CN110768014B CN110768014B CN201911105118.XA CN201911105118A CN110768014B CN 110768014 B CN110768014 B CN 110768014B CN 201911105118 A CN201911105118 A CN 201911105118A CN 110768014 B CN110768014 B CN 110768014B
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- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 239000002184 metal Substances 0.000 claims abstract description 74
- 230000005855 radiation Effects 0.000 claims abstract description 37
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 4
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000003989 dielectric material Substances 0.000 claims description 3
- 230000010287 polarization Effects 0.000 abstract description 11
- 238000012360 testing method Methods 0.000 description 9
- 238000004088 simulation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
Abstract
The invention discloses an integrated substrate gap waveguide via hole cluster feed antenna, which comprises a radiation structure and an integrated substrate gap waveguide structure, wherein the integrated substrate gap waveguide structure comprises an electromagnetic band gap structure for shielding electromagnetic radiation energy, a feed structure for transmitting energy, an upper dielectric plate, a lower dielectric plate and a spacing dielectric plate arranged between the upper dielectric plate and the lower dielectric plate, the radiation structure is formed on the upper surface of the upper dielectric plate, the feed structure is formed on the lower surface of the upper dielectric plate and provided with a metal via hole cluster formed by at least one first metal via hole penetrating through the upper dielectric plate, and the electromagnetic band gap structure is formed on the lower dielectric plate. The invention can realize the linear polarization antenna and the circular polarization antenna with wide bandwidth and high gain, is suitable for application in radio frequency, microwave, millimeter wave and terahertz wave, and can be used for radio frequency, microwave, millimeter wave and terahertz wave antennas, in particular 5G millimeter wave antennas, such as 5G millimeter wave antennas.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to an integrated substrate gap waveguide via cluster feed antenna.
Background
With the wide development and application of radar technology and communication technology, the microwave technology of the low frequency band cannot meet the current requirement, and the development requirement of each microwave frequency band of space transmission is higher and higher, so that antenna researchers start to develop and research space resources of higher frequency bands, which not only requires miniaturization, light weight and good concealment and maneuverability of the antenna, but also requires the antenna to have the characteristics of wide frequency band, dual polarization and multiple frequency points in order to meet the requirement of high-capacity communication, and the patch antenna is favored in the communication field due to the advantages thereof. Compared with a linear polarization antenna, the circular polarization antenna can provide more excellent channel performance, and the circular polarization electromagnetic wave has remarkable advantages in reducing channel polarization adaptation, restraining multipath interference and the like.
So far, there have been many reports of antennas operating in the millimeter wave band. These antennas can be broadly classified into microstrip antennas, metal rectangular waveguide (RectangleWaveguide, RW) antennas, and substrate integrated waveguide (Substrate Integrated Waveguide, SIW) antennas. However, in the case of millimeter wave band applications, conventional antennas have problems such as difficulty in manufacturing a pure metal structure in millimeter wave band, low shielding property of a feed network, and complex structure. In recent years, a new type of transmission line called integrated substrate gap waveguide (IntegratedSubstrate Gap Waveguide, ISGW) has been proposed, which is implemented based on a multilayer dielectric plate. The ISGW encapsulates the internal microstrip line in EBG (Electromagnetic Band Gap, electromagnetic field bandgap), greatly improving shielding of the feed network. Since the antenna can be designed inside the multilayer structure of the ISGW, rather than feeding it through external coupling, the ISGW antenna is easy to realize low profile and easy to interconnect.
However, the ISGW technology has been proposed, and the number of antennas designed by using the ISGW is very small, and the conventional antennas have disadvantages of narrow bandwidth and low gain.
Disclosure of Invention
The invention mainly solves the technical problem of providing an integrated substrate gap waveguide via cluster feed antenna, which can realize a linear polarization antenna and a circular polarization antenna with wide bandwidth and high gain.
In order to solve the technical problems, the invention adopts a technical scheme that: an integrated substrate gap waveguide via cluster feed antenna is provided, comprising a radiation structure and an integrated substrate gap waveguide structure, wherein the integrated substrate gap waveguide structure comprises an electromagnetic band gap structure for shielding electromagnetic radiation energy, a feed structure for transmitting the energy, an upper dielectric plate (1), a lower dielectric plate (3) and a spacing dielectric plate (2) arranged between the upper dielectric plate (1) and the lower dielectric plate (3), the radiation structure is formed on the upper surface of the upper dielectric plate (1), the feed structure is formed on the lower surface of the upper dielectric plate (1) and provided with a metal via cluster (15) formed by at least one first metal via penetrating through the upper dielectric plate (1), and the electromagnetic band gap structure is formed on the lower dielectric plate (3).
Preferably, a first copper-clad layer (11) is printed on the upper surface of the upper dielectric plate (1), and the radiation structure comprises a slit (12) formed on the first copper-clad layer (11) and a radiation patch (13) formed in the slit (12).
Preferably, the feeding structure comprises a microstrip line (14) arranged on the lower surface of the upper dielectric plate (1), and the metal via clusters (15) are respectively connected with the microstrip line (14) and the radiation patch (13).
Preferably, the slit (12) is a circle or a polygon, and the radiation patch (13) is a polygon formed by cutting corners of a circle or a rectangle.
Preferably, the metal via cluster (15) is composed of one first metal via, which is located at the end of the microstrip line (14).
Preferably, the metal via hole cluster (15) is composed of two first metal via holes, the end part of the microstrip line (14) is provided with a microstrip branch line (141) extending laterally, one first metal via hole is positioned at the end part of the microstrip line (14), and the other first metal via hole is positioned at the microstrip branch line (141).
Preferably, the electromagnetic bandgap structure comprises periodically arranged circular metal patches (31) printed on the upper surface of the lower dielectric plate (3) and a second copper-clad layer (32) on the lower surface of the lower dielectric plate (3), and each circular metal patch (31) is connected with the second copper-clad layer (32) through a second metal via (33).
Preferably, the upper dielectric plate (1), the spacing dielectric plate (2) and the lower dielectric plate (3) are bonded together.
Preferably, the radiation patch (13) has two cut corners, and the two cut corner positions are positioned at opposite corners of the rectangle.
Preferably, when the metal via cluster (15) is composed of one first metal via, the first metal via is located at the geometric center of the radiation patch (13).
Preferably, the width of the microstrip line (14) is in a step transition.
Preferably, the circular metal patches (31) located in a predetermined range right below the radiation patch (13) are not aligned with the circular metal patches (31) of the remaining portion.
Preferably, the circular metal patches (31) form an 8×6 array, and the arrangement periods of the circular metal patches (31) of the first three rows of the 4 th column and the 5 th column and the circular metal patches (31) of the last three rows of the 4 th column and the 5 th column are respectively shifted to the outside, and the arrangement periods of the circular metal patches (31) of the third rows of the 3 rd column and the 4 th column are respectively shifted to the inside.
Preferably, the upper dielectric plate (1), the spacing dielectric plate (2) and the lower dielectric plate (3) are made of dielectric materials with dielectric constants of 2.2 and loss tangents of 0.0009, and the external dimensions of the upper dielectric plate (1), the spacing dielectric plate (2) and the lower dielectric plate (3) are 30mm multiplied by 20mm multiplied by 1.549mm.
Unlike the prior art, the invention has the beneficial effects that:
1. by integrating the substrate gap waveguide structure, the energy transmission characteristic of the millimeter wave frequency band is improved;
2. the integrated substrate gap waveguide structure is integrated on the dielectric plate, so that the thickness of the antenna is greatly reduced, the gain of the antenna is improved, and the broadband of the antenna is improved;
3. the wide bandwidth and high gain can be realized, the advantages of easy processing, easy integration, high radiation efficiency and the like are achieved, the wide bandwidth and high gain can be applied to the application of radio frequency, microwave, millimeter wave and terahertz wave, and the wide bandwidth and high gain can be applied to the antennas of radio frequency, microwave, millimeter wave and terahertz wave, such as 5G millimeter wave antennas.
Drawings
Fig. 1 is a schematic diagram of the structure of an integrated substrate gap waveguide via cluster feed antenna according to a first embodiment of the present invention.
Fig. 2 is a schematic top view of an upper dielectric plate of the integrated substrate gap waveguide via cluster feed antenna shown in fig. 1.
Fig. 3 is a bottom schematic view of an upper dielectric plate of the integrated substrate gap waveguide via cluster feed antenna shown in fig. 1.
Fig. 4 is a schematic top view of the underlying dielectric plate of the integrated substrate gap waveguide via cluster feed antenna shown in fig. 1.
Fig. 5 is a bottom schematic view of the lower dielectric plate of the integrated substrate gap waveguide via cluster feed antenna shown in fig. 1.
Fig. 6 is a schematic diagram of the structure of an integrated substrate gap waveguide via cluster feed antenna in accordance with a second embodiment of the present invention.
Fig. 7 is a bottom schematic view of an upper dielectric plate of the integrated substrate gap waveguide via cluster feed antenna shown in fig. 6.
Fig. 8 is a bottom schematic view of an upper dielectric plate of the integrated substrate gap waveguide via cluster feed antenna shown in fig. 6.
Fig. 9 is a schematic structural diagram of an integrated substrate gap waveguide via cluster feed antenna in accordance with a third embodiment of the present invention.
Fig. 10 is a bottom schematic view of an upper dielectric plate of the integrated substrate gap waveguide via cluster feed antenna shown in fig. 9.
Fig. 11 is a bottom schematic view of an upper dielectric plate of the integrated substrate gap waveguide via cluster feed antenna shown in fig. 9.
Fig. 12 is a graph of test simulation results of return loss and gain for the integrated substrate gap waveguide via cluster feed antenna shown in fig. 1.
Fig. 13 is a graph of test simulation results of return loss and gain for the integrated substrate gap waveguide via cluster feed antenna shown in fig. 6.
Fig. 14 is a graph of test simulation results of return loss and gain for the integrated substrate gap waveguide via cluster feed antenna shown in fig. 9.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, a first embodiment of an integrated substrate gap waveguide via cluster feed antenna of the present invention is shown. In a first embodiment of the present invention, an integrated substrate gap waveguide via cluster feed antenna includes a radiation structure and an integrated substrate gap waveguide structure, the integrated substrate gap waveguide structure including an electromagnetic bandgap structure for shielding electromagnetic radiation energy, a feed structure for transmitting energy, an upper dielectric plate 1, a lower dielectric plate 3, and a spacing dielectric plate 2 disposed between the upper dielectric plate 1 and the lower dielectric plate 3, the radiation structure being formed on an upper surface of the upper dielectric plate 1, the feed structure being formed on a lower surface of the upper dielectric plate 1 and having a metal via cluster 15 composed of at least one first metal via penetrating the upper dielectric plate 1, the electromagnetic bandgap structure being formed on the lower dielectric plate 3.
Specifically, the upper surface of the upper dielectric plate 1 is printed with a first copper-clad layer 11, and the radiation structure includes a slit 12 formed on the first copper-clad layer 11 and a radiation patch 13 formed in the slit 12, and the slit 12 may be circular or polygonal, for example, circular in this embodiment. The feed structure comprises a microstrip line 14 arranged on the lower surface of the upper dielectric plate 1, and metal via clusters 15 are respectively connected with the microstrip line 14 and the radiation patch 13. The radiation patch 13 may be a polygon formed by cutting corners of a circle or a rectangle, for example, a polygon formed by cutting corners of a rectangle in this embodiment.
In this embodiment, the metal via cluster 15 is composed of a first metal via, which is located at the end of the microstrip line 14. In actual arrangement, the first metal via is located at the geometric center of the radiation patch 13, and the width of the microstrip line 14 is in a step transition, as shown in fig. 3, at the middle position of the microstrip line 14, the width is in a step transition.
In one particular application, the radiating patch 13 has two cut corners located diagonally to the rectangle, e.g., two cut corners located at the upper left and lower right corners of the rectangle.
The electromagnetic bandgap structure includes periodically arranged circular metal patches 31 printed on the upper surface of the lower dielectric plate 3 and a second copper-clad layer 32 on the lower surface of the lower dielectric plate 3, each circular metal patch 31 being connected to the second copper-clad layer 32 by a second metal via 33. Wherein each circular metal patch 31 forms a mushroom-type EBG structure together with the second metal via holes 33 thereon, such that a periodically arranged mushroom-type EBG structure is formed on the lower dielectric plate 3.
The spacer dielectric plate 2 is used for separating the upper dielectric plate 1 and the lower dielectric plate 3, so that a gap is formed between the upper dielectric plate 1 and the lower dielectric plate 3. In the present embodiment, the upper dielectric plate 1, the lower dielectric plate 3, and the spacer dielectric plate 2 may be bonded together or fixed together by screws.
The integrated substrate gap waveguide via cluster feed antenna of this embodiment forms a circularly polarized antenna, the first copper-clad layer 11 on the upper surface of the upper dielectric plate 1 corresponds to an ideal electrical conductor (PEC), the lower dielectric plate 3 corresponds to an ideal magnetic conductor (PMC), the microstrip line 14 is located between the PEC and the PMC, the microstrip line 14 is encapsulated therein and is not interfered by the outside, and one end of the microstrip line 14 is connected with the radiation patch 13 through the first metal via 15 to perform probe feed for the radiation patch 13.
In order to obtain the required operating frequency band, the stop band of the EBG structure can be adapted to the electromagnetic wave frequency band propagated by the ISGW by selecting a suitable arrangement period for the mushroom-shaped EBG structure and a suitable size for the circular metal patch 31 and the second metal via 33. In order to obtain a better matching effect, in the present embodiment, the arrangement period of the circular metal patches 31 located in a predetermined range just below the radiation patch 13 is not uniform with the circular metal patches 31 of the remaining portion, so that the energy fed by the microstrip line 14 can be prevented from being coupled to the mushroom-type EBG structure array, and the characteristic impedance can be effectively improved. For example, as shown in fig. 4, the circular metal patches 31 form an 8×6 array, that is, the mushroom-shaped EBG structure also forms an 8×6 array, and the arrangement periods of the circular metal patches 31 of the first three rows of the 4 th column and the 5 th column and the circular metal patches 31 of the third rows of the 4 th column and the 5 th column are respectively shifted to the outside, and the arrangement periods of the circular metal patches 31 of the third rows of the 3 rd column and the 4 th column are shifted to the inside.
The integrated substrate gap waveguide via cluster feed antenna of the embodiment has the following characteristics in practical application:
the size of the radiating patch 13 and the size of the chamfer are changed to adjust the axial ratio bandwidth and the resonance depth of the resonance frequency point, but the size of the radiating patch 13 and the size of the chamfer have less influence on the-10 dB bandwidth. Specifically, the phase difference can be adjusted by changing the cut angle of the radiation patch 13, which affects the circularly polarized radiation; changing the radius of the slot 12 can adjust the axial ratio bandwidth, affecting the antenna matching.
In one specific application, the upper dielectric plate 1, the spacer dielectric plate 2 and the lower dielectric plate 3 are made of Rogers5880 dielectric materials with a dielectric constant of 2.2 and a loss tangent of 0.0009, and the outer dimensions of the upper dielectric plate 1, the spacer dielectric plate 2 and the lower dielectric plate 3 are 30mm×20mm×1.549mm. The test results obtained by simulation and test of the integrated substrate gap waveguide via cluster feed antenna of the present embodiment, as shown in fig. 12, show that the antenna has an impedance bandwidth (|s) from 22.3 to 27.3GHz (20%) 11 I is lower than-10 dB), has an axial ratio bandwidth of 26.4 to 28.3GHz (7%), and an in-band gain of 7.2 to 8.4dBi.
Referring to fig. 6-8, a second embodiment of an integrated substrate gap waveguide via cluster feed antenna of the present invention is shown. The integrated substrate gap waveguide via cluster feed antenna of the second embodiment has the same technical features as the integrated substrate gap waveguide via cluster feed antenna of the first embodiment, except that the slot 12 is circular and the radiation patch 13 is circular. That is, the radiating patch 13 and the slot 12 are both circular, the integrated substrate gap waveguide via cluster feed antenna also constitutes a circularly polarized antenna, and the metal via cluster 15 is also composed of one first metal via. In this embodiment, the slit 12 has a diameter twice that of the radiating patch 13.
The integrated substrate gap waveguide via cluster feed antenna of the embodiment has the following characteristics in practical application:
the frequency point is adjusted by changing the diameter of the first metal via hole, wherein the larger the diameter of the first metal via hole is, the higher the frequency of the first resonance point is, the more the resonance depth is changed, the frequency position of the second resonance point is basically unchanged, and the resonance depth is different. Specifically, increasing the diameter of the first metal via increases the resonant frequency, while affecting the resonant depth; varying the diameter of the slit 12 allows for adjustment of gain and matching, which in one specific application is better when the diameter of the slit 12 is twice that of the circular radiating patch 13.
The test result is obtained by simulating and testing the integrated substrate gap waveguide via cluster feed antenna of the embodiment, and as shown in fig. 13, the simulation result shows that the working frequency band of the antenna with the return loss smaller than-10 dB is 21.5-26.3 GHz, and the in-band gain is 6-9.4 dBi.
Referring to fig. 9-11, a third embodiment of an integrated substrate gap waveguide via cluster feed antenna of the present invention is shown. The circularly polarized antenna of the third embodiment has the same technical features as the circularly polarized antenna of the first embodiment, and the slot 12 is circular, and the radiating patch 13 is a polygon formed by cutting a corner of a rectangle, except that the metal via cluster 15 is composed of two first metal vias, the end of the microstrip line 14 is provided with a microstrip branch line 141 extending laterally, one first metal via is located at the end of the microstrip line 14, and the other first metal via is located at the microstrip branch line 141. Thus, the integrated substrate gap waveguide via cluster feed antenna of the present embodiment also constitutes a circularly polarized antenna.
The integrated substrate gap waveguide via cluster feed antenna of the embodiment has the following characteristics in practical application:
adjusting the degree of separation of two degenerate modes of circular polarization by changing the size of the chamfer, wherein the larger the chamfer is, the larger the axial ratio bandwidth is; the axial ratio bandwidth is adjusted by changing the feeding position of the first metal via hole from the center position of the slot 12, wherein when the feeding position of the first metal via hole is at a predetermined distance from the center position of the slot 12, the axial ratio bandwidth is highest, is smaller than or larger than the predetermined distance, and is reduced. The phase difference can be adjusted by changing the cutting angle of the radiation patch 13, and the circular polarization radiation is influenced; changing the radius of the slot 12 can adjust the axial ratio bandwidth, affecting the antenna matching.
The test results obtained by simulation and test of the integrated substrate gap waveguide via cluster feed antenna of the present embodiment, as shown in fig. 14, show that the antenna has an impedance bandwidth (|s) from 24.2 to 27.7GHz (13.4%) 11 I is lower than-10 dB), has an axial ratio bandwidth of 24.7 to 28.6GHz (14.7%), and an in-band gain of 6.5-8 dBi.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (6)
1. An integrated substrate gap waveguide via cluster feed antenna, characterized by comprising a radiation structure and an integrated substrate gap waveguide structure, wherein the integrated substrate gap waveguide structure comprises an electromagnetic band gap structure for shielding electromagnetic radiation energy, a feed structure for transmitting energy, an upper dielectric plate (1), a lower dielectric plate (3) and a spacing dielectric plate (2) arranged between the upper dielectric plate (1) and the lower dielectric plate (3), the radiation structure is formed on the upper surface of the upper dielectric plate (1), the feed structure is formed on the lower surface of the upper dielectric plate (1) and is provided with a metal via cluster (15) formed by at least one first metal via penetrating the upper dielectric plate (1), the electromagnetic band gap structure is formed on the lower dielectric plate (3), the upper surface of the upper dielectric plate (1) is printed with a first copper-clad layer (11), the radiation structure comprises a circular gap (12) formed on the first copper-clad layer (11) and a radiation patch (13) with a radiation bandwidth which is changed by changing the tangential angle of the radiation patch by cutting the angle of the circular gap (12) and the rectangular gap (13) and the radiation patch with a smaller tangential angle than the tangential angle of the radiation patch (13) is changed by changing the tangential angle; the electromagnetic band gap structure comprises circular metal patches (31) which are printed on the upper surface of the lower dielectric plate (3) and are arranged periodically and a second copper-clad layer (32) on the lower surface of the lower dielectric plate (3), and each circular metal patch (31) is connected with the second copper-clad layer (32) through a second metal via hole (33); the arrangement period of the circular metal patches (31) in a preset range under the radiation patches (13) is inconsistent with the arrangement period of the circular metal patches (31) in the rest part, the circular metal patches (31) form an 8 multiplied by 6 array, the arrangement periods of the circular metal patches (31) in the first three rows of the 4 th column and the 5 th column and the circular metal patches (31) in the last three rows of the 4 th column and the 5 th column are respectively offset outwards, and the arrangement periods of the circular metal patches (31) in the third rows of the 3 rd column and the 4 th column are offset inwards.
2. The integrated substrate gap waveguide via cluster feed antenna according to claim 1, wherein the feed structure comprises a microstrip line (14) arranged on the lower surface of the upper dielectric plate (1), and the metal via cluster (15) is connected with the microstrip line (14) and the radiation patch (13) respectively.
3. The integrated substrate gap waveguide via cluster feed antenna of claim 2, wherein the radiating patch (13) is a circular radiating patch, the diameter of the circular slot (12) being twice the diameter of the circular radiating patch.
4. The integrated substrate gap waveguide via cluster feed antenna of claim 2, wherein the metal via cluster (15) consists of one first metal via located at an end of the microstrip line (14).
5. The integrated substrate gap waveguide via cluster feed antenna of claim 4, wherein the metal via cluster (15) is composed of two first metal vias, the end of the microstrip line (14) is provided with a laterally extending microstrip branch line (141), one first metal via is located at the end of the microstrip line (14), and the other first metal via is located at the microstrip branch line (141).
6. The integrated substrate gap waveguide via cluster feed antenna according to claim 1, wherein the upper dielectric plate (1), the spacing dielectric plate (2) and the lower dielectric plate (3) are made of dielectric materials with a dielectric constant of 2.2 and a loss tangent of 0.0009, and the external dimensions of the upper dielectric plate (1), the spacing dielectric plate (2) and the lower dielectric plate (3) are 30mm×20mm×1.549mm.
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| CN201910396843 | 2019-05-14 | ||
| CN2019103968430 | 2019-05-14 | ||
| CN2019103982207 | 2019-05-14 | ||
| CN2019103968479 | 2019-05-14 | ||
| CN201910398220 | 2019-05-14 | ||
| CN201910396847 | 2019-05-14 |
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| CN110768014B true CN110768014B (en) | 2024-01-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114336001A (en) * | 2020-09-28 | 2022-04-12 | 中兴通讯股份有限公司 | Antenna unit, array, device and terminal |
| CN113659325B (en) * | 2021-08-03 | 2024-01-09 | 超讯通信股份有限公司 | Integrated substrate gap waveguide array antenna |
| CN113612029B (en) * | 2021-08-06 | 2022-06-07 | 北京邮电大学 | Multi-layer waveguide feed low-cost millimeter wave high-gain slot antenna array |
| CN113964535B (en) * | 2021-10-22 | 2023-12-05 | 云南大学 | Circularly polarized filter antenna based on integrated substrate gap waveguide |
| CN113964512B (en) * | 2021-10-22 | 2022-08-26 | 云南大学 | Three-frequency integrated substrate gap waveguide cavity filtering antenna |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008283381A (en) * | 2007-05-09 | 2008-11-20 | Univ Of Fukui | Antenna device |
| CN104112903A (en) * | 2014-06-26 | 2014-10-22 | 西安空间无线电技术研究所 | Microstrip antenna using parasitical feed metal columns |
| CN107146951A (en) * | 2017-05-23 | 2017-09-08 | 宇龙计算机通信科技(深圳)有限公司 | A kind of terminal enclosure and terminal based on EBG structures |
| WO2017167987A1 (en) * | 2016-04-01 | 2017-10-05 | Sony Corporation | Microwave antenna apparatus, packing and manufacturing method |
| CN107946752A (en) * | 2017-10-13 | 2018-04-20 | 云南大学 | A kind of substrate integrates gap waveguide electromagnetic dipole antenna |
| CN210668693U (en) * | 2019-11-13 | 2020-06-02 | 云南大学 | Novel ISGW via hole cluster feed antenna |
-
2019
- 2019-11-13 CN CN201911105118.XA patent/CN110768014B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008283381A (en) * | 2007-05-09 | 2008-11-20 | Univ Of Fukui | Antenna device |
| CN104112903A (en) * | 2014-06-26 | 2014-10-22 | 西安空间无线电技术研究所 | Microstrip antenna using parasitical feed metal columns |
| WO2017167987A1 (en) * | 2016-04-01 | 2017-10-05 | Sony Corporation | Microwave antenna apparatus, packing and manufacturing method |
| CN107146951A (en) * | 2017-05-23 | 2017-09-08 | 宇龙计算机通信科技(深圳)有限公司 | A kind of terminal enclosure and terminal based on EBG structures |
| CN107946752A (en) * | 2017-10-13 | 2018-04-20 | 云南大学 | A kind of substrate integrates gap waveguide electromagnetic dipole antenna |
| CN210668693U (en) * | 2019-11-13 | 2020-06-02 | 云南大学 | Novel ISGW via hole cluster feed antenna |
Non-Patent Citations (4)
| Title |
|---|
| 60 GHz slot antenna array based on ridge gap waveguide technology enhanced with dielectric superstrate;Hussein Attia等;《2015 9th European Conference on Antennas and Propagation (EuCAP)》;全文 * |
| 基于基片集成脊波导的缝隙阵列天线的仿真与实验研究;林澍;赵志华;王也;田雨;陆加;李贝贝;张卯瑞;;科学技术与工程(第27期);全文 * |
| 无线通信设备中微带滤波器的结构和性能研究;喇东升;《中国博士学位论文全文数据库 信息科技辑》;全文 * |
| 郑会利等.《天线工程设计基础》.西安电子科技大学出版社,2018,195-196. * |
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| CN110768014A (en) | 2020-02-07 |
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