CN113659325B - Integrated substrate gap waveguide array antenna - Google Patents
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- CN113659325B CN113659325B CN202110885559.7A CN202110885559A CN113659325B CN 113659325 B CN113659325 B CN 113659325B CN 202110885559 A CN202110885559 A CN 202110885559A CN 113659325 B CN113659325 B CN 113659325B
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- 229910052782 aluminium Inorganic materials 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/02—Details
- H01Q19/021—Means for reducing undesirable effects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0075—Stripline fed arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
Abstract
The application provides an integrated substrate gap waveguide array antenna which is used for solving the technical problem of high manufacturing cost of the array antenna in the prior art. Wherein, an integrated substrate gap waveguide array antenna includes: the feed network is used for receiving the excitation current, forming an electromagnetic field and generating electromagnetic waves; the waveguide structure is connected with the feed network and is used for limiting electromagnetic waves to radiate outwards and directionally transmitting the electromagnetic waves; and the radiation patches are connected with the waveguide structure and are used for radiating electromagnetic waves to the outside. According to the invention, the waveguide structure is arranged, so that electromagnetic waves are directionally propagated to the plurality of radiation patches connected with the waveguide structure, and the electromagnetic waves are limited to radiate outwards in the directional propagation process, so that the electromagnetic waves can be less interfered in the propagation process, and the radiation efficiency is high. The integrated substrate gap waveguide array antenna can realize high-gain radiation with fewer radiation patches and a simpler feed network, thereby reducing the manufacturing cost.
Description
Technical Field
The application relates to the technical field of antennas, in particular to an integrated substrate gap waveguide array antenna.
Background
Recently, with the rapid development of wireless communication network technology, the entire wireless communication system is developed toward miniaturization, light weight, high reliability, versatility, and low cost. The microwave and millimeter wave technology with low cost, high performance and high yield is very critical for developing a commercialized low-cost microwave and millimeter wave broadband system.
In implementing the prior art, the inventors found that:
in order to improve the radiation gain, the array antenna in the prior art needs to be provided with a plurality of radiation arrays. And more radiating arrays, the arrangement of the radiating patches in the radiating arrays is also more complicated. Meanwhile, in order to equally feed electromagnetic waves into the respective radiation patches, the feed network is also designed to be complicated. The complicated radiating array and feed network result in excessive processing cost and material cost of the planar antenna.
Therefore, it is necessary to provide an integrated substrate gap waveguide array antenna for solving the technical problem of high manufacturing cost of the array antenna in the prior art.
Disclosure of Invention
The embodiment of the application provides an integrated substrate gap waveguide array antenna, which is used for solving the technical problem of high manufacturing cost of the array antenna in the prior art.
Specifically, an integrated substrate gap waveguide array antenna includes:
the feed network is used for receiving the excitation current, forming an electromagnetic field and generating electromagnetic waves;
the waveguide structure is connected with the feed network and is used for limiting electromagnetic waves to radiate outwards and directionally transmitting the electromagnetic waves;
a plurality of radiation patches connected with the waveguide structure and used for radiating electromagnetic waves to the outside;
wherein the waveguide structure comprises:
a first metal plate for limiting outward radiation of electromagnetic waves;
a first insulating substrate disposed between the first metal plate and the feed network for separating the first metal plate and the feed network;
a plurality of metal bump structures disposed on the first insulating substrate for limiting outward radiation of electromagnetic waves;
a second metal plate for limiting outward radiation of electromagnetic waves;
the second insulating substrate is arranged between the metal protruding structure and the second metal plate and is used for separating the metal protruding structure from the second metal plate;
the second metal plate includes:
a first metal layer adjacent to the second insulating substrate;
a second metal layer remote from the second insulating substrate;
an insulating layer disposed between the first metal layer and the second metal layer;
a plurality of metal through holes penetrating the first metal layer, the insulating layer and the second metal layer for directionally transmitting electromagnetic waves;
the plurality of radiation patches are arranged on the second metal layer and used for radiating electromagnetic waves from the plurality of metal through holes to the outside.
Further, the first metal layer is further provided with a plurality of coupling patches for expanding the bandwidth of electromagnetic waves;
the metal through holes are also used for directionally propagating the electromagnetic waves with the expanded bandwidth.
Further, the feed network consists of a plurality of three-port power dividers and a plurality of microstrip lines;
the three-port power divider comprises an input end and two output ends, and is used for distributing the transmitting power to each radiation patch;
the microstrip line is used for receiving excitation current and generating electromagnetic waves;
and two output ends of the three-port power divider are respectively connected with two microstrip lines.
Further, the radiation patches and the three-port power divider form an included angle of 45 degrees.
Further, the metal bump structure includes:
a metal column having one end connected to the first insulating substrate;
and a patch connected with the other end of the metal column.
Further, the feeding network, the plurality of metal bump structures, the first metal layer, the second metal layer, the plurality of metal through holes and the plurality of radiation patches are all printed by adopting a printed circuit PCB technology.
Further, the integrated substrate gap waveguide array antenna further includes:
and the third insulating substrate is used for protecting the plurality of radiation patches.
Further, the plurality of radiation patches are arranged in 8 rows by 8 columns;
the center-to-center spacing between two adjacent radiating patches in the same row is 0.6λ;
the center-to-center spacing between two adjacent radiating patches in the same column is 0.6λ;
where λ=c/f, c is the wave velocity, c=3×108m/s, and f is the central working frequency of the integrated substrate gap waveguide array antenna.
Further, the metal through holes are distributed according to 4 rows and 8 columns;
the center-to-center spacing between two adjacent metal through holes in the same row is 0.6lambda;
the center-to-center spacing between two adjacent metal through holes in the same column is 1.2lambda;
where λ=c/f, c is the wave velocity, c=3×108m/s, and f is the central working frequency of the integrated substrate gap waveguide array antenna.
Further, the plurality of coupling patches are arranged according to 4 rows by 8 columns;
the center-to-center spacing between two adjacent metal through holes in the same row is 0.6lambda;
the center-to-center spacing between two adjacent metal through holes in the same column is 1.2lambda;
wherein λ=c/f, c is the wave velocity, c=3×108m/s, and f is the central operating frequency of the integrated substrate gap waveguide array antenna;
and two adjacent coupling patches are symmetrically distributed along the center of the metal through hole.
The technical scheme provided by the embodiment of the application has at least the following beneficial effects:
according to the invention, the waveguide structure is arranged, so that electromagnetic waves are directionally propagated to the plurality of radiation patches connected with the waveguide structure, and the electromagnetic waves are limited to radiate outwards in the directional propagation process, so that the electromagnetic waves can be less interfered in the propagation process, and the radiation efficiency is high. So that the integrated substrate gap waveguide array antenna can realize high-gain radiation with fewer radiation patches and a simpler feed network. Fewer radiating patches and a simpler feed network result in a low manufacturing cost for the integrated substrate gap waveguide array antenna. The radiation patch is rotated for 45 degrees, so that the electric field direction of the integrated substrate gap waveguide array antenna is rotated for 45 degrees, the radiation of the integrated substrate gap waveguide array antenna on the E face and the H face is optimized, and low side lobes are realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
fig. 1 is a schematic structural diagram of an integrated substrate gap waveguide array antenna according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a feeding network according to an embodiment of the present application.
100. Integrated substrate gap waveguide array antenna
11. Feed network
12. Waveguide structure
121. A first metal plate
122. First insulating substrate
123. Second metal plate
124. Second insulating substrate
125. Metal through hole
126. Third insulating substrate
13. Radiation patch
Detailed Description
For the purposes, technical solutions and advantages of the present application, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1, the present application discloses an integrated substrate gap waveguide array antenna 100, comprising:
a feed network 11 for receiving the excitation current, forming an electromagnetic field, and generating electromagnetic waves;
a waveguide structure 12 connected to the feed network 11, for confining electromagnetic waves to radiate outwards and propagating the electromagnetic waves directionally;
and a plurality of radiation patches 13 connected with the waveguide structure 12 for radiating electromagnetic waves to the outside.
It will be appreciated that the feed network 11 is a microwave circuit network that feeds high frequency signals to the antenna elements in a certain amplitude, phase distribution. The feed network 11 is mainly composed of a power divider and a microstrip line. In an ideal case, the power divider and the microstrip line perform only power division and generation of electromagnetic waves, without participating in radiation. In practical cases, however, there is some stray radiation from the power divider and microstrip line. When the feed network 11 is complex in structure and large in size, the radiation performance of the antenna is seriously affected.
The integrated substrate gap waveguide array antenna 100 disclosed herein employs electromagnetic coupling feeding. The electromagnetic coupling feeding mode means that the feeding microstrip line is not directly contacted with the radiation patch, but is spaced a certain distance. Specifically, the integrated substrate gap waveguide array antenna 100 disclosed herein employs a proximity coupled feed structure for electromagnetic coupling feed. The adjacent coupled feed structure is to set the feed microstrip line and the radiation patch on different medium substrates. The structure is convenient for controlling the coupling strength between the feed microstrip line and the radiation patch, and is beneficial to increasing the impedance bandwidth.
Referring to fig. 2, in a specific embodiment provided in the present application, the feed network 11 is composed of a plurality of three-port power splitters and a plurality of microstrip lines;
the three-port power divider comprises an input end and two output ends, and is used for distributing the transmitting power to each radiation patch;
the microstrip line is used for receiving excitation current and generating electromagnetic waves;
and two output ends of the three-port power divider are respectively connected with two microstrip lines.
Considering that the integrated substrate gap waveguide array antenna 100 disclosed in the present application belongs to an array antenna, it is necessary to equally feed electromagnetic waves into each radiation patch. Thus, the feed network 11 comprises a number of three-port power splitters and a number of microstrip lines. The microstrip line can transmit electromagnetic waves, and the power divider can divide the electromagnetic waves into two parts with equal amplitude and same direction. In a specific application scenario, the three-port power divider can be expressed as a Y-shaped microstrip power divider, and the Y-shaped microstrip power divider divides electromagnetic waves into two parts with equal amplitude and same direction. The microstrip line may appear as a T-match microstrip. The two output ends of the Y-shaped microstrip power divider are respectively connected with the input ends of the two T-shaped matching microstrips, and the two output ends of the T-shaped matching microstrips are respectively connected with the input ends of the two Y-shaped microstrip power dividers, so that the feed network 11 is formed. The feed network 11 is configured such that each radiating patch receives a feed of electromagnetic waves of equal amplitude and in the same direction. Through experiments, the feed network 11 disclosed by the application has a better coupling effect and has the function of expanding bandwidth.
Further, in the array antenna in the prior art, a plurality of radiating arrays are required to be provided in order to improve the radiation gain. And more radiating arrays, the arrangement of the radiating patches in the radiating arrays is also more complicated. Meanwhile, in order to equally feed electromagnetic waves into the respective radiation patches, the feed network is also designed to be complicated. The complicated radiating array and feed network result in excessive processing cost and material cost of the planar antenna. In order to solve the technical problem of high manufacturing cost of the array antenna in the prior art, the inventor designs the waveguide structure 12 to make the electromagnetic wave directionally propagate in the process of feeding the radiation patch, so that the electromagnetic wave can be less interfered in the propagation process, and the radiation gain is improved. In other words, the integrated substrate gap waveguide array antenna 100 can achieve high gain radiation with fewer radiating patches 13 and a simpler feed network 11. Fewer radiating patches 13 and simpler feed network 11 result in a low manufacturing cost for the integrated substrate gap waveguide array antenna 100. Specifically, in one embodiment provided herein, the waveguide structure 12 includes:
a first metal plate 121 for restricting electromagnetic waves from radiating outwards;
a first insulating substrate 122 disposed between the first metal plate 121 and the feed network 11, for separating the first metal plate 121 from the feed network 11;
a plurality of metal bump structures disposed on the first insulating substrate 122 for limiting outward radiation of electromagnetic waves;
a second metal plate 123 for restricting electromagnetic waves from radiating outwards;
and a second insulating substrate 124 disposed between the metal bump structure and the second metal plate 123 for separating the metal bump structure and the second metal plate 123.
It is to be understood that the first metal plate 121, the plurality of metal bump structures, and the second metal plate 123 are all used to limit the electromagnetic waves from radiating outwards, so the first metal plate 121, the plurality of metal bump structures, and the second metal plate 123 are all made of non-ferromagnetic materials. The non-ferromagnetic material is understood to be a non-magnetically conductive metal or alloy, such as a metal of gold, silver, copper, aluminum, etc. In order to make the integrated substrate gap waveguide array antenna 100 described in the present application suitable for mass production, the materials of the first metal plate 121, the plurality of metal bump structures, and the second metal plate 123 are preferably copper or aluminum, so as to reduce manufacturing costs.
The first metal plate 121 may be understood as a ground plate. The first metal plate 121 serving as a ground plate is used to cooperate with the feed network 11 on the one hand so that an excitation current flows, forming an electromagnetic field, and generating electromagnetic waves. On the other hand, the first metal plate 121 is not magnetically conductive, so that electromagnetic waves are not radiated to the outside in the direction of the first metal plate 121.
The first insulating substrate 122 is made of an insulating material, and provides a mounting position for the feeding network 11. The first insulating substrate 122 has one side provided with the feeding network 11, and the other side connected with the first metal plate 121, so as to separate the first metal plate 121 from the feeding network 11. It will be appreciated that electromagnetic waves may pass through insulating materials such as glass, ceramic, plastic, etc., without consuming energy. Since the first insulating substrate 122 is made of an insulating material, the first insulating substrate 122 does not affect radiation of electromagnetic waves.
It should be further noted that the first insulating substrate 122 is further provided with a plurality of metal bump structures on a surface on which the feeding network 11 is provided. The metal bump structure limits the electromagnetic wave radiation range so that the electromagnetic wave is not radiated outward. Considering that the first metal plate 121 and the plurality of metal bump structures together limit the electromagnetic wave radiation range, the electromagnetic wave can only radiate in a direction away from the first metal plate 121.
Electromagnetic waves radiate in a direction away from the first metal plate 121 until contacting the second metal plate 123. In order to avoid the second metal plate 123 from directly contacting the metal bump structure, a second insulating substrate 124 is further disposed between the second metal plate 123 and the metal bump structure. The second insulating substrate 124 is made of an insulating material, and does not limit electromagnetic wave radiation. Accordingly, in the case where electromagnetic waves radiate in a direction away from the first metal plate 121, the electromagnetic waves may pass through the second insulating substrate 124 until contacting the second metal plate 123.
Specifically, the second metal plate 123 includes:
a first metal layer adjacent to the second insulating substrate 124;
a second metal layer remote from the second insulating substrate 124;
an insulating layer disposed between the first metal layer and the second metal layer;
a plurality of metal through holes 125 penetrating the first metal layer, the insulating layer, and the second metal layer for directional propagation of electromagnetic waves;
the plurality of radiation patches 13 are disposed on the second metal layer, and are configured to radiate electromagnetic waves from the plurality of metal through holes 125 to the outside.
It is understood that the first metal layer and the second metal layer of the second metal plate 123 limit electromagnetic waves from radiating to the outside. The second metal plate 123 is provided with slits, i.e. a plurality of metal through holes 125. The plurality of metal vias 125 are used to directionally propagate electromagnetic waves and excite the plurality of radiating patches 13 disposed on the second metal layer, thereby allowing for the introduction of more flexible matching characteristics and a wider operating band.
After the electromagnetic waves excite the radiation patches 13 through the metal vias 125, the radiation patches 13 radiate the electromagnetic waves into free space.
Further, in a specific embodiment provided in the present application, the first metal layer is further provided with a plurality of coupling patches, which are used for expanding the bandwidth of electromagnetic waves;
the plurality of metal vias 125 are also used to directionally propagate bandwidth-expanding electromagnetic waves.
It should be emphasized that, through experiments by the inventor, it is found that when the integrated substrate gap waveguide array antenna 100 disclosed in the present application performs electromagnetic coupling feeding only by adopting a feeding structure of adjacent coupling, the standing wave ratio of electromagnetic waves is poor. In order to solve the technical problem of poor standing-wave ratio characteristics of electromagnetic waves, the inventor sets a plurality of coupling patches on the first metal layer. It is understood that the plurality of coupling patches are used for realizing impedance matching, so that no reflection is generated when electromagnetic waves radiate to the first metal layer, and radiation interference is reduced. Meanwhile, the plurality of coupling patches also enable the capacitance generated by coupling to be cancelled with the inductance of the feeder line, so that resonance points can be increased near the original resonance points, the bandwidth is widened, and the transmission capacity of the integrated substrate gap waveguide array antenna 100 is improved.
Further, in a specific embodiment provided in the present application, the plurality of radiation patches and the three-port power divider form an included angle of 45 °.
It will be appreciated that the integrated substrate gap waveguide array antenna 100 will form two portions of radiated energy during operation. Wherein, a part of the radiation energy comes from the main beam direction of the integrated substrate gap waveguide array antenna 100, and another part of the radiation energy comes from the side lobe direction of the integrated substrate gap waveguide array antenna 100. When an excessive interference signal enters an antenna side lobe, the signal identification is seriously affected. For this reason, lowering the antenna side lobe can improve the antenna radiation efficiency.
In order to solve the technical problem of low radiation efficiency of the integrated substrate gap waveguide array antenna 100, the inventor reduces side lobes by forming an included angle of 45 degrees between a plurality of radiation patches and the three-port power divider. Specifically, the inventor finds that, compared with the traditional radiation patch setting direction, the invention rotates a plurality of radiation patches by 45 degrees, and can rotate the electric field polarization direction of the integrated substrate gap waveguide array antenna 100 by 45 degrees, thereby optimizing the radiation of the integrated substrate gap waveguide array antenna 100 on the E plane and the H plane, and further realizing low side lobes. The E plane refers to a direction plane parallel to the electric field vector direction in the antenna radiation direction, and the H plane refers to a direction plane parallel to the magnetic field vector direction in the antenna radiation direction. When the radiation patches of the integrated substrate gap waveguide array antenna 100 form an included angle of 45 degrees with the three-port power divider, the implementation of the low side lobe enables the radiation efficiency of the integrated substrate gap waveguide array antenna 100 to be remarkably improved.
It should be further noted that, in one embodiment provided in the present application, to protect the plurality of radiation patches 13 from being damaged, the integrated substrate gap waveguide array antenna 100 provided in the present application further includes:
a third insulating substrate 126 covering the plurality of radiation patches 13 for protecting the plurality of radiation patches 13.
It is understood that the third insulating substrate 126 is made of an insulating material, and does not limit electromagnetic wave radiation. Accordingly, in the case where the radiation patch 13 radiates electromagnetic waves to the outside, the electromagnetic waves may pass through the third insulating substrate 126. Meanwhile, the third insulating substrate 126 also protects the plurality of radiation patches 13 from deformation caused by external pressure, and prolongs the service life of the integrated substrate gap waveguide array antenna 100.
Further, in a specific embodiment provided in the present application, the feeding network, the plurality of metal bump structures, the first metal layer, the second metal layer, the plurality of metal vias, and the plurality of radiating patches are all printed using a printed circuit PCB technology.
It is appreciated that array antennas are widely used in the field of communication devices such as airborne radar, satellite communications, mobile communications, and satellite television systems. With the development of technology, the form of the communication device is also becoming smaller, and thus new requirements are also being placed on the size of the array antenna. To further reduce the size of the integrated substrate gap waveguide array antenna 100, the inventors have proposed a printed circuit PCB (Printed Circuit Board) technique to print the feed network 11, the number of metal bump structures, the first metal layer, the second metal layer, the number of metal vias 125, the number of radiating patches 13, the number of coupling patches from a manufacturing perspective. It will be appreciated that printed circuit PCB technology has good product consistency, can be applied to standardized designs, and is conducive to mechanization and automation in the production process. The weight of the antenna can be effectively reduced by adopting the printed circuit PCB technology while the manufacturing cost is effectively reduced.
The following describes a specific implementation procedure of the integrated substrate gap waveguide array antenna 100 provided in the present application:
the integrated substrate gap waveguide array antenna 100 comprises, from bottom to top: a first metal plate 121 for functioning as a ground plate; a first insulating substrate 122 connected to the first metal plate; the feed network 11 and the metal protrusion structures are arranged on the first insulating substrate 122; a second insulating substrate 124 connected to the first insulating substrate 122; a second metal plate 123 connected to the second insulating substrate 124; a plurality of coupling patches disposed on one side of the second metal plate 123; a plurality of radiation patches 13 arranged on the other surface of the second metal plate 123; and a third insulating substrate 126 connected to the second metal plate 123.
Wherein the second metal plate 123 includes: a first metal layer connected to the second insulating substrate 124 and provided with a plurality of coupling patches; a second metal layer connected to the third insulating substrate 126 and provided with a plurality of radiation patches 13; an insulating layer disposed between the first metal layer and the second metal layer; a plurality of metal vias 125 extending through the first metal layer, the insulating layer, and the second metal layer.
Specifically, the feed network 11 is composed of a plurality of three-port power splitters and a plurality of microstrip lines. The three-port power divider comprises an input end and two output ends, and the two output ends of the three-port power divider are respectively connected with the two microstrip lines.
The metal bump structure is represented by a metal column with one end connected with the first insulating substrate and a patch connected with the other end of the metal column.
The radiation patches 13 are arranged in 8 rows by 8 columns. The center-to-center spacing between two adjacent radiating patches in the same row is 0.6λ, and the center-to-center spacing between two adjacent radiating patches in the same column is 0.6λ. Where λ=c/f, c is wave velocity, c=3×10 8 m/s, f is the center operating frequency of the integrated substrate gap waveguide array antenna 100. And the radiation patch 13 forms an included angle of 45 degrees with the three-port power divider. The front side wall of the radiation patch 13 and the front side wall of the second metal plate 123 are parallel.
The plurality of metal vias 125 are arranged in 4 rows by 8 columns. The center-to-center spacing between two adjacent metal vias in the same row is 0.6λ, and the center-to-center spacing between two adjacent metal vias in the same column is 1.2λ. Where λ=c/f, c is wave velocity, c=3×10 8 m/s, f is the center operating frequency of the integrated substrate gap waveguide array antenna 100.
The plurality of coupling patches are arranged in 4 rows by 8 columns. The center-to-center spacing between two adjacent metal vias in the same row is 0.6λ, and the center-to-center spacing between two adjacent metal vias in the same column is 1.2λ. Where λ=c/f, c is the wave velocity, c=3×108m/s, and f is the central operating frequency of the integrated substrate gap waveguide array antenna 100. And two adjacent coupling patches are symmetrically distributed along the center of the metal through hole.
When an excitation current passes through the feeding network 11 and the first metal plate 121, an electromagnetic field is formed, generating electromagnetic waves. The electromagnetic wave is limited by the first metal plate 121 and the metal bump structures, and can be radiated only in the opposite direction to the first metal plate 121. And the feed network 11 and the coupling patches realize impedance matching, electromagnetic coupling feed is carried out, and the bandwidth of electromagnetic waves is expanded. The electromagnetic wave then propagates directionally through the plurality of metal vias 125 to the plurality of radiating patches 13. A plurality of radiation patches 13 radiate the electromagnetic waves to the outside.
The integrated substrate gap waveguide array antenna 100 provided by the application is provided with the waveguide structure 12, so that electromagnetic waves are directionally propagated to the plurality of radiation patches 13 connected with the waveguide structure 12, and the electromagnetic waves are limited to radiate outwards in the directional propagation process, so that the electromagnetic waves can be less interfered in the propagation process, and the radiation efficiency is high. So that the integrated substrate gap waveguide array antenna 100 can achieve high gain radiation with fewer radiation patches 13 and a simpler feed network 11. Fewer radiating patches 13 and simpler feed network 11 result in a low manufacturing cost for the integrated substrate gap waveguide array antenna 100. And the radiation patch 13 is rotated by 45 degrees, so that the electric field direction of the integrated substrate gap waveguide array antenna 100 is rotated by 45 degrees, thereby optimizing the radiation of the integrated substrate gap waveguide array antenna 100 on the E face and the H face, and further realizing low side lobes.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the statement "comprises" or "comprising" an element defined by … … does not exclude the presence of other identical elements in a process, method, article or apparatus that comprises the element.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. which are within the spirit and principles of the present application are intended to be included within the scope of the claims of the present application.
Claims (8)
1. An integrated substrate gap waveguide array antenna, comprising:
the feed network is used for receiving the excitation current, forming an electromagnetic field and generating electromagnetic waves;
the waveguide structure is connected with the feed network and is used for limiting electromagnetic waves to radiate outwards and directionally transmitting the electromagnetic waves;
a plurality of radiation patches connected with the waveguide structure and used for radiating electromagnetic waves to the outside;
wherein the waveguide structure comprises:
a first metal plate for limiting outward radiation of electromagnetic waves;
a first insulating substrate disposed between the first metal plate and the feed network for separating the first metal plate and the feed network;
a plurality of metal bump structures disposed on the first insulating substrate for limiting outward radiation of electromagnetic waves;
a second metal plate for limiting outward radiation of electromagnetic waves;
the second insulating substrate is arranged between the metal protruding structure and the second metal plate and is used for separating the metal protruding structure from the second metal plate;
the second metal plate includes:
a first metal layer adjacent to the second insulating substrate;
a second metal layer remote from the second insulating substrate;
an insulating layer disposed between the first metal layer and the second metal layer;
a plurality of metal through holes penetrating the first metal layer, the insulating layer and the second metal layer for directionally transmitting electromagnetic waves;
the plurality of radiation patches are arranged on the second metal layer and used for radiating electromagnetic waves from the plurality of metal through holes to the outside;
the first metal layer is also provided with a plurality of coupling patches for expanding the bandwidth of electromagnetic waves;
the metal through holes are also used for directionally transmitting electromagnetic waves with expanded bandwidth;
the feed network consists of a plurality of three-port power dividers and a plurality of microstrip lines;
the three-port power divider comprises an input end and two output ends, and is used for distributing the transmitting power to each radiation patch;
the microstrip line is used for receiving excitation current and generating electromagnetic waves;
and two output ends of the three-port power divider are respectively connected with two microstrip lines.
2. The integrated substrate gap waveguide array antenna of claim 1, wherein the plurality of radiating patches form an angle of 45 ° with the three-port power divider.
3. The integrated substrate gap waveguide array antenna of claim 1, wherein the metal bump structure comprises:
a metal column having one end connected to the first insulating substrate;
and a patch connected with the other end of the metal column.
4. The integrated substrate gap waveguide array antenna of claim 1, wherein the feed network, the plurality of metal bump structures, the first metal layer, the second metal layer, the plurality of metal vias, and the plurality of radiating patches are all printed using printed circuit PCB technology.
5. The integrated substrate gap waveguide array antenna of claim 1, further comprising:
and the third insulating substrate is used for protecting the plurality of radiation patches.
6. The integrated substrate gap waveguide array antenna of claim 1, wherein the plurality of radiating patches are arranged in 8 rows by 8 columns;
the center-to-center spacing between two adjacent radiating patches in the same row is 0.6λ;
the center-to-center spacing between two adjacent radiating patches in the same column is 0.6λ;
where λ=c/f, c is wave velocity, c=3×10 8 And m/s, and f is the central working frequency of the integrated substrate gap waveguide array antenna.
7. The integrated substrate gap waveguide array antenna of claim 1, wherein the plurality of metal vias are arranged in 4 rows by 8 columns;
the center-to-center spacing between two adjacent metal through holes in the same row is 0.6lambda;
the center-to-center spacing between two adjacent metal through holes in the same column is 1.2lambda;
where λ=c/f, c is wave velocity, c=3×10 8 And m/s, and f is the central working frequency of the integrated substrate gap waveguide array antenna.
8. The integrated substrate gap waveguide array antenna of claim 1, wherein the plurality of coupling patches are arranged in 4 rows by 8 columns;
the center-to-center spacing between two adjacent metal through holes in the same row is 0.6lambda;
the center-to-center spacing between two adjacent metal through holes in the same column is 1.2lambda;
where λ=c/f, c is wave velocity, c=3×10 8 m/s, f is the central working frequency of the integrated substrate gap waveguide array antenna;
and two adjacent coupling patches are symmetrically distributed along the center of the metal through hole.
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| TWI765755B (en) * | 2021-06-25 | 2022-05-21 | 啟碁科技股份有限公司 | Antenna module and wireless transceiver device |
| CN115411479B (en) * | 2022-08-16 | 2023-04-07 | 厦门大学 | Double-gap waveguide device based on glass substrate and manufacturing method |
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