CN113659325A - Integrated substrate gap waveguide array antenna - Google Patents

Integrated substrate gap waveguide array antenna Download PDF

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Publication number
CN113659325A
CN113659325A CN202110885559.7A CN202110885559A CN113659325A CN 113659325 A CN113659325 A CN 113659325A CN 202110885559 A CN202110885559 A CN 202110885559A CN 113659325 A CN113659325 A CN 113659325A
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China
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metal
array antenna
electromagnetic waves
waveguide array
patches
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CN202110885559.7A
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CN113659325B (en
Inventor
张玲
陆云龙
黄季甫
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Super Communications Co ltd
Ningbo University
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Super Communications Co ltd
Ningbo University
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Priority to CN202110885559.7A priority Critical patent/CN113659325B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/02Details
    • H01Q19/021Means for reducing undesirable effects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/0006Particular feeding systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/0006Particular feeding systems
    • H01Q21/0075Stripline fed arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061Two dimensional planar arrays
    • H01Q21/065Patch antenna array

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Abstract

The application provides an integrated substrate gap waveguide array antenna which is used for solving the technical problem that the manufacturing cost of the array antenna is high in the prior art. Wherein, an integrated substrate gap waveguide array antenna comprises: the feed network is used for receiving the excitation current, forming an electromagnetic field and generating electromagnetic waves; the waveguide structure is connected with the feed network and used for limiting the outward radiation of the electromagnetic waves and directionally propagating the electromagnetic waves; and the plurality of radiation patches are connected with the waveguide structure and used for radiating electromagnetic waves to the outside. According to the invention, the waveguide structure is arranged, electromagnetic waves are directionally propagated to the plurality of radiation patches connected with the waveguide structure, and the outward radiation of the electromagnetic waves in the directional propagation process is limited, so that the electromagnetic waves can be less interfered in the propagation process, and the radiation efficiency is high. Therefore, the integrated substrate gap waveguide array antenna can realize high-gain radiation by using fewer radiating patches and a simpler feed network, and further reduces the manufacturing cost.

Description

Integrated substrate gap waveguide array antenna
Technical Field
The application relates to the technical field of antennas, in particular to an integrated substrate gap waveguide array antenna.
Background
Recently, with the rapid development of wireless communication network technology, the entire wireless communication system is developed toward miniaturization, light weight, high reliability, versatility, and low cost. Low cost, high performance, high yield microwave and millimeter wave technology is critical to developing commercial low cost microwave and millimeter wave broadband systems.
In the process of realizing the prior art, the inventor finds that:
in order to improve radiation gain, the array antenna in the prior art needs to be provided with a plurality of radiation arrays. And the arrangement of the radiation patches in the radiation array is also more complicated due to the more radiation arrays. Meanwhile, in order to equally feed electromagnetic waves into each radiation patch, the feed network is also designed to be complicated. The complicated radiating array and feed network result in high processing cost and material cost of the planar antenna.
Therefore, it is desirable to provide an integrated substrate gap waveguide array antenna for solving the technical problem of high manufacturing cost of the array antenna in the prior art.
Disclosure of Invention
The embodiment of the application provides an integrated substrate gap waveguide array antenna, which is used for solving the technical problem that the manufacturing cost of the array antenna in the prior art is high.
Specifically, an integrated substrate gap waveguide array antenna includes:
the feed network is used for receiving the excitation current, forming an electromagnetic field and generating electromagnetic waves;
the waveguide structure is connected with the feed network and used for limiting the outward radiation of the electromagnetic waves and directionally propagating the electromagnetic waves;
the plurality of radiation patches are connected with the waveguide structure and used for radiating electromagnetic waves to the outside;
wherein the waveguide structure comprises:
a first metal plate for limiting electromagnetic waves from being radiated outward;
the first insulating substrate is arranged between the first metal plate and the feed network and used for separating the first metal plate from the feed network;
the metal protruding structures are arranged on the first insulating substrate and used for limiting electromagnetic waves from radiating outwards;
a second metal plate for limiting electromagnetic waves from being radiated outward;
the second insulating substrate is arranged between the metal bump structure and the second metal plate and used for separating the metal bump structure and the second metal plate;
the second metal plate includes:
a first metal layer adjacent to the second insulating substrate;
a second metal layer remote from the second insulating substrate;
an insulating layer disposed between the first metal layer and the second metal layer;
the metal through holes penetrate through the first metal layer, the insulating layer and the second metal layer and are used for directionally propagating electromagnetic waves;
the radiating patches are arranged on the second metal layer and used for radiating electromagnetic waves from the metal through holes to the outside.
Furthermore, the first metal layer is also provided with a plurality of coupling patches for expanding the bandwidth of the electromagnetic waves;
the metal through holes are also used for directionally transmitting the electromagnetic waves with expanded bandwidth.
Furthermore, the feed network consists of a plurality of three-port power dividers and a plurality of microstrip lines;
the three-port power divider comprises an input end and two output ends and is used for distributing transmitting power to each radiating patch;
the microstrip line is used for receiving the excitation current and generating electromagnetic waves;
and two output ends of the three-port power divider are respectively connected with the two microstrip lines.
Furthermore, the plurality of radiation patches and the three-port power divider form an included angle of 45 degrees.
Further, the metal bump structure includes:
a metal post having one end connected to the first insulating substrate;
and the patch is connected with the other end of the metal column.
Furthermore, the feed network, the plurality of metal protruding structures, the first metal layer, the second metal layer, the plurality of metal through holes and the plurality of radiation patches are printed by adopting a Printed Circuit Board (PCB) technology.
Further, the integrated substrate gap waveguide array antenna further includes:
and the third insulating substrate covers the plurality of radiation patches and is used for protecting the plurality of radiation patches.
Further, the plurality of radiation patches are arranged in 8 rows by 8 columns;
the center distance between two adjacent radiation patches in the same row is 0.6 lambda;
the center distance between two adjacent radiation patches in the same column is 0.6 lambda;
wherein λ c/f, c is the wave speed, c 3 x 108m/s, and f is the central operating frequency of the integrated substrate gap waveguide array antenna.
Furthermore, the metal through holes are arranged in 4 rows by 8 columns;
the center distance between two adjacent metal through holes in the same row is 0.6 lambda;
the center distance between two adjacent metal through holes in the same row is 1.2 lambda;
wherein λ c/f, c is the wave speed, c 3 x 108m/s, and f is the central operating frequency of the integrated substrate gap waveguide array antenna.
Further, the coupling patches are arranged according to 4 rows by 8 columns;
the center distance between two adjacent metal through holes in the same row is 0.6 lambda;
the center distance between two adjacent metal through holes in the same row is 1.2 lambda;
wherein λ c/f, c is the wave speed, c 3 x 108m/s, and f is the central operating frequency of the integrated substrate gap waveguide array antenna;
and two adjacent coupling patches are symmetrically distributed along the center of the metal through hole.
The technical scheme provided by the embodiment of the application at least has the following beneficial effects:
according to the invention, the waveguide structure is arranged, electromagnetic waves are directionally propagated to the plurality of radiation patches connected with the waveguide structure, and the outward radiation of the electromagnetic waves in the directional propagation process is limited, so that the electromagnetic waves can be less interfered in the propagation process, and the radiation efficiency is high. So that the integrated substrate gap waveguide array antenna can realize high-gain radiation by using fewer radiating patches and a simpler feed network. The fewer radiating patches and simpler feed network make the integrated substrate gap waveguide array antenna less expensive to manufacture. In addition, the radiation patch is rotated by 45 degrees, so that the electric field direction of the integrated substrate gap waveguide array antenna is rotated by 45 degrees, the radiation of the integrated substrate gap waveguide array antenna on the E surface and the H surface is optimized, and the low side lobe is realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic structural diagram of an integrated substrate gap waveguide array antenna according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a feed network provided in an embodiment of the present application.
100 integrated substrate gap waveguide array antenna
11 feed network
12 waveguide structure
121 first metal plate
122 first insulating substrate
123 second metal plate
124 second insulating substrate
125 metal via
126 third insulating substrate
13 radiation patch
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, the present application discloses an integrated substrate gap waveguide array antenna 100, comprising:
the feed network 11 is used for receiving the excitation current, forming an electromagnetic field and generating electromagnetic waves;
the waveguide structure 12 is connected with the feed network 11 and used for limiting the outward radiation of the electromagnetic waves and directionally propagating the electromagnetic waves;
and a plurality of radiation patches 13 connected to the waveguide structure 12 for radiating electromagnetic waves to the outside.
It will be understood that the feed network 11 is a microwave circuit network that feeds high frequency signals to the elements of the antenna with a certain amplitude and phase distribution. The feed network 11 mainly consists of a power divider and a microstrip line. Under the ideal condition, the power divider and the microstrip line only carry out power distribution and generation of electromagnetic waves, but do not participate in radiation. However, in practical situations, the power divider and the microstrip line have a certain amount of stray radiation. When the feed network 11 is complex in structure and large in size, the radiation performance of the antenna is seriously affected.
The integrated substrate gap waveguide array antenna 100 disclosed in the present application employs an electromagnetic coupling feeding method. The feed mode of electromagnetic coupling means that the feed microstrip line is not directly contacted with the radiation patch, but is separated by a certain distance. Specifically, the integrated substrate gap waveguide array antenna 100 disclosed herein employs a proximity-coupled feed structure for electromagnetic coupling feeding. The feeding structure of the adjacent coupling is that the feeding microstrip line and the radiation patch are respectively arranged on different medium substrates. The structure is convenient for controlling the coupling strength between the feed microstrip line and the radiation patch, and is beneficial to increasing the impedance bandwidth.
Referring to fig. 2, in an embodiment provided in the present application, the feeding network 11 is composed of a plurality of three-port power dividers and a plurality of microstrip lines;
the three-port power divider comprises an input end and two output ends and is used for distributing transmitting power to each radiating patch;
the microstrip line is used for receiving the excitation current and generating electromagnetic waves;
and two output ends of the three-port power divider are respectively connected with the two microstrip lines.
Considering that the integrated substrate gap waveguide array antenna 100 disclosed in the present application belongs to an array antenna, it is necessary to equally feed electromagnetic waves into each radiating patch. Therefore, the feeding network 11 includes several three-port power splitters and several microstrip lines. The microstrip line can transmit electromagnetic waves, and the power divider can divide the electromagnetic waves into two parts with equal amplitude and the same direction. In a specific application scenario, the three-port power divider may be represented as a Y-type microstrip power divider, and the Y-type microstrip power divider divides electromagnetic waves into two parts with equal amplitude and the same direction. The microstrip line may be embodied as a T-type matching microstrip. Two output ends of the Y-shaped microstrip power divider are respectively connected with input ends of two T-shaped matching microstrips, and two output ends of the T-shaped matching microstrips are respectively connected with input ends of two Y-shaped microstrip power dividers, thereby forming the feed network 11. The structure of the feed network 11 enables each radiation patch to receive the feed of electromagnetic waves with equal amplitude and same direction. Experiments prove that the feed network 11 disclosed by the application has a better coupling effect and has a function of expanding bandwidth.
Further, in order to improve radiation gain, the array antenna in the prior art needs to provide a plurality of radiation arrays. And the arrangement of the radiation patches in the radiation array is also more complicated due to the more radiation arrays. Meanwhile, in order to equally feed electromagnetic waves into each radiation patch, the feed network is also designed to be complicated. The complicated radiating array and feed network result in high processing cost and material cost of the planar antenna. In order to solve the technical problem of high manufacturing cost of the array antenna in the prior art, the inventor designs the waveguide structure 12 to make the electromagnetic wave directionally propagate in the process of feeding the radiation patch, so that the electromagnetic wave can be subjected to less interference in the propagation process, and the radiation gain is improved. In other words, the integrated substrate gap waveguide array antenna 100 can realize high-gain radiation with fewer radiating patches 13 and a simpler feed network 11. The fewer radiating patches 13 and simpler feed network 11 results in a low cost of manufacture of the integrated substrate gap waveguide array antenna 100. Specifically, in one embodiment provided herein, the waveguide structure 12 includes:
a first metal plate 121 for limiting electromagnetic waves from being radiated outward;
a first insulating substrate 122 disposed between the first metal plate 121 and the feeding network 11, for separating the first metal plate 121 and the feeding network 11;
a plurality of metal bump structures disposed on the first insulating substrate 122 for limiting electromagnetic waves from radiating outwards;
a second metal plate 123 for limiting electromagnetic waves from being radiated outward;
and a second insulating substrate 124 disposed between the metal bump structure and the second metal plate 123 for separating the metal bump structure and the second metal plate 123.
It can be understood that, in the present application, the first metal plate 121, the plurality of metal protruding structures, and the second metal plate 123 are all used to limit electromagnetic waves from radiating outwards, and therefore, the first metal plate 121, the plurality of metal protruding structures, and the second metal plate 123 are all made of non-ferromagnetic materials. The non-ferromagnetic material is understood to be a non-magnetically conductive metal or alloy, such as a metal of gold, silver, copper, aluminum, etc. In order to make the integrated substrate gap waveguide array antenna 100 described herein suitable for mass production, the material of the first metal plate 121, the plurality of metal protruding structures, and the second metal plate 123 is preferably copper or aluminum, thereby reducing the manufacturing cost.
The first metal plate 121 may be understood as a ground plate. The first metal plate 121, which is a ground plate, is on the one hand used to cooperate with the feeding network 11, so that the exciting current flows, forming an electromagnetic field, generating electromagnetic waves. On the other hand, the first metal plate 121 is not magnetically permeable, so that the electromagnetic wave is not radiated to the outside in the direction of the first metal plate 121.
The first insulating substrate 122 is made of an insulating material and provides a mounting position for the feeding network 11. The first insulating substrate 122 has a feeding network 11 disposed on one surface thereof, and a first metal plate 121 connected to the other surface thereof, so as to separate the first metal plate 121 and the feeding network 11. It is understood that electromagnetic waves can pass through insulating materials such as glass, ceramic, plastic, etc. without consuming energy. Since the first insulating substrate 122 is made of an insulating material, the first insulating substrate 122 does not affect the radiation of the electromagnetic wave.
It should be further noted that a plurality of metal bump structures are further disposed on one surface of the first insulating substrate 122, where the feeding network 11 is disposed. The metal bump structure limits the radiation range of electromagnetic waves, so that the electromagnetic waves are not radiated outwards. Considering that the first metal plate 121 and the plurality of metal protruding structures together limit the radiation range of the electromagnetic wave, the electromagnetic wave can only radiate in a direction away from the first metal plate 121.
The electromagnetic wave is radiated in a direction away from the first metal plate 121 until contacting the second metal plate 123. In order to avoid direct contact between the second metal plate 123 and the metal bump structure, a second insulating substrate 124 is further disposed between the second metal plate 123 and the metal bump structure. The second insulating substrate 124 is made of an insulating material and does not limit electromagnetic wave radiation. Therefore, in the case where electromagnetic waves are radiated in a direction away from the first metal plate 121, they can pass through the second insulating substrate 124 until they contact the second metal plate 123.
Specifically, the second metal plate 123 includes:
a first metal layer adjacent to the second insulating substrate 124;
a second metal layer remote from the second insulating substrate 124;
an insulating layer disposed between the first metal layer and the second metal layer;
a plurality of metal vias 125 penetrating through the first metal layer, the insulating layer, and the second metal layer for directionally propagating electromagnetic waves;
the plurality of radiation patches 13 are disposed on the second metal layer, and are configured to radiate electromagnetic waves from the plurality of metal vias 125 to the outside.
It is understood that the first metal layer and the second metal layer of the second metal plate 123 limit the radiation of the electromagnetic waves to the outside. The second metal plate 123 is provided with a plurality of slits, i.e., a plurality of metal through holes 125. The metal vias 125 are used to directionally propagate electromagnetic waves and excite the radiation patches 13 disposed on the second metal layer, so that more flexible matching characteristics and a wider operating frequency band can be introduced.
When the electromagnetic wave excites the plurality of radiation patches 13 through the plurality of metal through holes 125, the plurality of radiation patches 13 radiate the electromagnetic wave to a free space.
Further, in a specific embodiment provided by the present application, the first metal layer is further provided with a plurality of coupling patches for expanding a bandwidth of the electromagnetic wave;
the metal vias 125 are also used to directionally propagate the electromagnetic waves with extended bandwidth.
It should be emphasized that, through the experiments of the inventor, when the integrated substrate gap waveguide array antenna 100 disclosed in the present application performs the electromagnetic coupling feeding only by using the proximity coupling feeding structure, the standing wave ratio characteristic of the electromagnetic wave is poor. In order to solve the technical problem of poor standing-wave ratio characteristics of electromagnetic waves, the inventor arranges a plurality of coupling patches on the first metal layer. It can be understood that the coupling patches are used for realizing impedance matching, so that when electromagnetic waves are radiated to the first metal layer, no reflection is generated, and radiation interference is reduced. Meanwhile, the plurality of coupling patches also cancel the capacitance generated by coupling with the inductance of the feeder line, so that a resonance point can be added near the original resonance point, thereby widening the bandwidth and improving the transmission capability of the integrated substrate gap waveguide array antenna 100.
Further, in one embodiment provided herein, the plurality of radiation patches and the three-port power divider form an included angle of 45 °.
It will be appreciated that the integrated substrate gap waveguide array antenna 100 will develop two portions of radiated energy during operation. Wherein, a part of the radiation energy comes from the main beam direction of the integrated substrate gap waveguide array antenna 100, and the other part of the radiation energy comes from the side lobe direction of the integrated substrate gap waveguide array antenna 100. When an excessive interference signal enters an antenna side lobe, the signal identification is seriously affected. Therefore, the antenna radiation efficiency can be improved by reducing the antenna side lobe.
In order to solve the technical problem of low radiation efficiency of the integrated substrate gap waveguide array antenna 100, the inventor reduces the side lobe by forming an included angle of 45 degrees between a plurality of radiation patches and the three-port power divider. Specifically, the inventor finds that compared with the traditional radiation patch arrangement direction, the rotation of the plurality of radiation patches by 45 degrees in the invention can rotate the electric field polarization direction of the integrated substrate gap waveguide array antenna 100 by 45 degrees, so that the radiation of the integrated substrate gap waveguide array antenna 100 on the E plane and the H plane is optimized, and further, the low side lobe is realized. The E surface is a direction plane parallel to the electric field vector direction in the antenna radiation direction, and the H surface is a direction plane parallel to the magnetic field vector direction in the antenna radiation direction. When the plurality of radiating patches of the integrated substrate gap waveguide array antenna 100 and the three-port power divider form an included angle of 45 degrees, the realization of the low side lobe enables the radiation efficiency of the integrated substrate gap waveguide array antenna 100 to be remarkably improved.
It should be further noted that, in an embodiment provided by the present application, in order to protect the plurality of radiating patches 13 from being damaged, the integrated substrate gap waveguide array antenna 100 further includes:
a third insulating substrate 126 covering the plurality of radiation patches 13 for protecting the plurality of radiation patches 13.
It is understood that the third insulating substrate 126 is made of an insulating material, and does not limit electromagnetic wave radiation. Therefore, in the case where the radiation patch 13 radiates electromagnetic waves to the outside, the electromagnetic waves may pass through the third insulating substrate 126. Meanwhile, the third insulating substrate 126 also protects the plurality of radiating patches 13 from deformation caused by external pressure, and prolongs the service life of the integrated substrate gap waveguide array antenna 100.
Further, in a specific embodiment provided in the present application, the feed network, the plurality of metal bump structures, the first metal layer, the second metal layer, the plurality of metal vias, and the plurality of radiation patches are all printed by using a Printed Circuit Board (PCB) technology.
It can be understood that the array antenna is widely applied to the field of communication equipment such as airborne radar, satellite communication, mobile communication, satellite television system and the like. As technology develops, the form of communication equipment becomes smaller and smaller, and therefore new requirements for the size of the array antenna are also made. To further reduce the size of the integrated substrate gap waveguide array antenna 100, the inventor proposes, from a manufacturing perspective, a printed Circuit board (pcb) technology to print the feeding network 11, the metal bump structures, the first metal layer, the second metal layer, the metal vias 125, the radiation patches 13, and the coupling patches. It can be appreciated that printed circuit PCB technology has good product consistency, can be applied to standardized designs, and facilitates mechanization and automation in the production process. The manufacturing cost is effectively reduced, and meanwhile, the weight of the antenna can be effectively reduced by adopting the printed circuit PCB technology.
The following describes a specific implementation process of the integrated substrate gap waveguide array antenna 100 provided in the present application:
an integrated substrate-gap waveguide array antenna 100, comprising from bottom to top: a first metal plate 121 for serving as a ground plate; a first insulating substrate 122 connected to the first metal plate; the feed network 11 and the plurality of metal bump structures are arranged on the first insulating substrate 122; a second insulating substrate 124 connected to the first insulating substrate 122; a second metal plate 123 connected to the second insulating substrate 124; a plurality of coupling patches arranged on one side of the second metal plate 123; a plurality of radiation patches 13 disposed on the other surface of the second metal plate 123; and a third insulating substrate 126 connected to the second metal plate 123.
Wherein the second metal plate 123 includes: a first metal layer connected to the second insulating substrate 124 and provided with a plurality of coupling patches; a second metal layer connected to the third insulating substrate 126 and provided with a plurality of radiation patches 13; an insulating layer disposed between the first metal layer and the second metal layer; a plurality of metal vias 125 penetrating the first metal layer, the insulating layer, and the second metal layer.
Specifically, the feed network 11 is composed of a plurality of three-port power dividers and a plurality of microstrip lines. The three-port power divider comprises an input end and two output ends, and the two output ends of the three-port power divider are respectively connected with the two microstrip lines.
The metal protruding structure is represented by a metal column with one end connected with the first insulating substrate and a patch connected with the other end of the metal column.
The plurality of radiation patches 13 are arranged in 8 rows by 8 columns. The center distance between two adjacent radiation patches in the same row is 0.6 lambda, and the center distance between two adjacent radiation patches in the same column is 0.6 lambda. Wherein λ c/f, c is wave speed, c 3 108m/s, f is the central operating frequency of the integrated substrate gap waveguide array antenna 100. And the radiation patch 13 and the three-port power divider form an included angle of 45 degrees. The front side wall of the radiation patch 13 and the front side wall of the second metal plate 123 are parallel.
The metal vias 125 are arranged in 4 rows by 8 columns. The center distance between two adjacent metal through holes in the same row is 0.6 lambda, and the center distance between two adjacent metal through holes in the same column is 1.2 lambda. Wherein λ c/f, c is wave speed, c 3 108m/s, f is the central operating frequency of the integrated substrate gap waveguide array antenna 100.
The coupling patches are arranged according to 4 rows by 8 columns. The center distance between two adjacent metal through holes in the same row is 0.6 lambda, and the center distance between two adjacent metal through holes in the same column is 1.2 lambda. Where λ c/f, c is the wave velocity, c 3 x 108m/s, and f is the central operating frequency of the integrated substrate gap waveguide array antenna 100. And two adjacent coupling patches are symmetrically distributed along the center of the metal through hole.
When an excitation current passes through the feeding network 11 and the first metal plate 121, an electromagnetic field is formed, and an electromagnetic wave is generated. The electromagnetic wave is limited by the first metal plate 121 and the plurality of metal protrusion structures, and can only radiate in the direction opposite to the first metal plate 121. And the feed network 11 and a plurality of coupling patches realize impedance matching, perform electromagnetic coupling feed, and expand the bandwidth of electromagnetic waves. The electromagnetic waves then propagate directionally to the plurality of radiating patches 13 through the plurality of metal vias 125. The plurality of radiation patches 13 radiate the electromagnetic waves to the outside.
The integrated substrate gap waveguide array antenna 100 provided by the application directionally propagates electromagnetic waves to the plurality of radiation patches 13 connected with the waveguide structure 12 by arranging the waveguide structure 12, and limits the electromagnetic waves from radiating outwards in the directional propagation process, so that the electromagnetic waves can be subjected to less interference in the propagation process, and the radiation efficiency is high. Resulting in an integrated substrate gap waveguide array antenna 100 capable of high gain radiation with fewer radiating patches 13, and a simpler feed network 11. The fewer radiating patches 13 and simpler feed network 11 results in a low cost of manufacture of the integrated substrate gap waveguide array antenna 100. In addition, the radiation patch 13 is rotated by 45 degrees, so that the electric field direction of the integrated substrate gap waveguide array antenna 100 is rotated by 45 degrees, the radiation of the integrated substrate gap waveguide array antenna 100 on the E surface and the H surface is optimized, and the low side lobe is realized.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the statement that there is an element defined as "comprising" … … does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims (10)

1. An integrated substrate-gap waveguide array antenna, comprising:
the feed network is used for receiving the excitation current, forming an electromagnetic field and generating electromagnetic waves;
the waveguide structure is connected with the feed network and used for limiting the outward radiation of the electromagnetic waves and directionally propagating the electromagnetic waves;
the plurality of radiation patches are connected with the waveguide structure and used for radiating electromagnetic waves to the outside;
wherein the waveguide structure comprises:
a first metal plate for limiting electromagnetic waves from being radiated outward;
the first insulating substrate is arranged between the first metal plate and the feed network and used for separating the first metal plate from the feed network;
the metal protruding structures are arranged on the first insulating substrate and used for limiting electromagnetic waves from radiating outwards;
a second metal plate for limiting electromagnetic waves from being radiated outward;
the second insulating substrate is arranged between the metal bump structure and the second metal plate and used for separating the metal bump structure and the second metal plate;
the second metal plate includes:
a first metal layer adjacent to the second insulating substrate;
a second metal layer remote from the second insulating substrate;
an insulating layer disposed between the first metal layer and the second metal layer;
the metal through holes penetrate through the first metal layer, the insulating layer and the second metal layer and are used for directionally propagating electromagnetic waves;
the radiating patches are arranged on the second metal layer and used for radiating electromagnetic waves from the metal through holes to the outside.
2. The integrated substrate gap waveguide array antenna according to claim 1, wherein the first metal layer is further provided with a plurality of coupling patches for expanding the bandwidth of electromagnetic waves;
the metal through holes are also used for directionally transmitting the electromagnetic waves with expanded bandwidth.
3. The integrated substrate gap waveguide array antenna of claim 1, wherein the feed network is comprised of a number of three-port power splitters and a number of microstrip lines;
the three-port power divider comprises an input end and two output ends and is used for distributing transmitting power to each radiating patch;
the microstrip line is used for receiving the excitation current and generating electromagnetic waves;
and two output ends of the three-port power divider are respectively connected with the two microstrip lines.
4. The integrated substrate gap waveguide array antenna of claim 3, wherein the plurality of radiating patches are at a 45 ° angle to the three-port power splitter.
5. The integrated substrate-gap waveguide array antenna of claim 1, wherein the metal bump structure comprises:
a metal post having one end connected to the first insulating substrate;
and the patch is connected with the other end of the metal column.
6. The integrated substrate gap waveguide array antenna of claim 1, wherein the feed network, the plurality of metal bump structures, the first metal layer, the second metal layer, the plurality of metal vias, and the plurality of radiating patches are printed using printed circuit PCB technology.
7. The integrated substrate-gap waveguide array antenna of claim 1, wherein the integrated substrate-gap waveguide array antenna further comprises:
and the third insulating substrate covers the plurality of radiation patches and is used for protecting the plurality of radiation patches.
8. The integrated substrate-gap waveguide array antenna of claim 1, wherein the plurality of radiating patches are arranged in 8 rows by 8 columns;
the center distance between two adjacent radiation patches in the same row is 0.6 lambda;
the center distance between two adjacent radiation patches in the same column is 0.6 lambda;
wherein λ c/f, c is wave speed, c 3 108And m/s and f are the central working frequency of the integrated substrate gap waveguide array antenna.
9. The integrated substrate-gap waveguide array antenna of claim 1, wherein the plurality of metal vias are arranged in 4 rows by 8 columns;
the center distance between two adjacent metal through holes in the same row is 0.6 lambda;
the center distance between two adjacent metal through holes in the same row is 1.2 lambda;
wherein λ c/f, c is wave speed, c 3 108And m/s and f are the central working frequency of the integrated substrate gap waveguide array antenna.
10. The integrated substrate-gap waveguide array antenna of claim 2, wherein the plurality of coupling patches are arranged in 4 rows by 8 columns;
the center distance between two adjacent metal through holes in the same row is 0.6 lambda;
the center distance between two adjacent metal through holes in the same row is 1.2 lambda;
wherein λ c/f, c is wave speed, c 3 108m/s, f is the central working frequency of the integrated substrate gap waveguide array antenna;
and two adjacent coupling patches are symmetrically distributed along the center of the metal through hole.
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