CN110743805B - Semiconductor production detection device - Google Patents
Semiconductor production detection device Download PDFInfo
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- CN110743805B CN110743805B CN201911003408.3A CN201911003408A CN110743805B CN 110743805 B CN110743805 B CN 110743805B CN 201911003408 A CN201911003408 A CN 201911003408A CN 110743805 B CN110743805 B CN 110743805B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a semiconductor production detection device which comprises a bottom plate, a fixing frame, a supporting plate, a first electric push rod, a connecting plate, a detection head, a toothed bar, a transmission gear, a rack, a rotating plate, a fixing plate, a first spring, a pushing plate, a guide plate, a first motor, a toothed plate, a sliding block, a second motor, an output gear, a second electric push rod, a cross bar, a clamping plate, a second spring, a connecting rod, a limiting block, a blanking plate and a connecting shaft. The semiconductor detection device is simple in structure and convenient to operate, the semiconductor can be conveniently placed through the design of the supporting plate, conveying is facilitated, and continuous detection of a plurality of semiconductors can be conveniently carried out through the plurality of detection heads arranged at the bottom of the connecting plate; after unqualified products are detected, the sliding block drives the clamping plate to move, so that the products are conveniently positioned, and the unqualified products can be taken out; the semiconductor after detection is conveniently taken out through the movement and the rotation of the clamping plate, and the unqualified product to be detected is conveniently discharged through the design of the discharging plate.
Description
Technical Field
The invention relates to a detection device, in particular to a semiconductor production detection device, and belongs to the technical field of semiconductor application.
Background
The semiconductor refers to a material with a conductive property between a conductor and an insulator at normal temperature, and is widely applied in the fields of consumer electronics, communication systems, medical instruments and the like, for example, a diode is a device made of a semiconductor, the importance of the semiconductor is very great from the viewpoint of technology or economic development, most of electronic products today, such as computers, mobile phones or digital recorders, have a very close relationship with the semiconductor in core units, common semiconductor materials include silicon, germanium, gallium arsenide and the like, and silicon is the most influential one of various semiconductor materials in commercial application.
The current semiconductor is a material with conductivity between a conductor and an insulator at normal temperature, but for a semiconductor production detection device, because detection is needed during semiconductor production, operation is inconvenient, and simultaneous detection of a plurality of semiconductors is not facilitated; the detection is not beneficial to the conveying of semiconductors, and the detection is not beneficial to the taking out of unqualified products, and the classification is not beneficial; and when the product is unqualified at the detection position, the positioning of the taking-out structure is not facilitated, the operation is not facilitated, and the operation efficiency is influenced. Therefore, a semiconductor production inspection apparatus is proposed to address the above problems.
Disclosure of Invention
The present invention is directed to solving the above problems and to providing a semiconductor manufacturing inspection apparatus.
The invention achieves the aim through the following technical scheme, and the semiconductor production detection device comprises a fixed frame, a detection mechanism, a moving mechanism and a discharging mechanism, wherein the fixed frame is arranged at the top of a bottom plate;
the detection mechanism comprises a first electric push rod, a connecting plate, a detection head, a toothed bar and a transmission gear, the bottom of the fixing frame is fixedly connected with the first electric push rod, the bottom end of the first electric push rod is fixedly connected with the connecting plate, the bottom of the connecting plate is fixedly connected with the detection head, the bottom surface of the connecting plate is rotatably connected with the toothed bar, the toothed bar is meshed with the transmission gear, the transmission gear is meshed with a rack, the rack is fixedly connected with the bottom of the supporting plate, the side wall of the fixing frame is rotatably connected with the rotating plate, and the top surface of the bottom plate is fixedly connected with the guide plate;
the moving mechanism comprises a first motor toothed plate and a sliding block, the outer wall of the fixed frame is fixedly connected with a first motor, the output end of the first motor is fixedly connected with the toothed plate, the toothed plate is connected with the inner part of the sliding block in a penetrating manner, the top surface of the sliding block is fixedly connected with a second motor, the output end of the second motor is fixedly connected with the output gear, and the bottom surface of the sliding block is fixedly connected with a second electric push rod;
unloading mechanism includes horizontal pole and splint, second electric putter bottom and horizontal pole fixed connection, the horizontal pole tip rotates with splint to be connected, and passes through second spring fixed connection between the splint, splint middle part and connecting rod sliding connection, and connecting rod tip and stopper fixed connection, mount lateral wall and unloading board fixed connection.
Preferably, the mount is the U-shaped structure, mount bottom inside is equipped with two electric putter, and the connecting plate of first electric putter bottom is equipped with a plurality of and detects the head.
Preferably, bottom plate top surface and fixed plate fixed connection, the fixed plate lateral wall is through first spring and push pedal fixed connection, push pedal and bottom plate top surface sliding connection, and the push pedal contact has the commentaries on classics board bottom.
Preferably, the number of the guide plates is two, two sliding grooves with parallel bottom surfaces and arc-shaped top surfaces are formed in the guide plates, and the inner parts of the sliding grooves formed in the guide plates are connected with connecting shafts fixedly connected with the middle parts of the toothed bars in a sliding mode.
Preferably, the number of the rotating plates is two, each rotating plate is located between the pushing plate and the toothed bar, the rotating plates are of an inclined mechanism, and the rotating plates are in contact with the toothed bar.
Preferably, the top surface of the supporting plate is provided with a plurality of grooves for placing semiconductors, two inclined structure openings are respectively arranged on two sides of each groove, and each row of grooves are provided with a detection head correspondingly.
Preferably, the sliding block is of a square hollow structure, the sliding block is in sliding connection with the toothed plate, and the toothed plate is in meshed connection with the output gear.
Preferably, the two sides of the bottom end of the cross rod are respectively rotatably connected with the two clamping plates, the bottom ends of the two clamping plates are in contact with opening side walls formed in the supporting plate, and the two clamping plate side walls are respectively in sliding connection with the two limiting blocks.
Preferably, the blanking plate is of an F-shaped structure, and the bottom end of the blanking plate is respectively contacted with two ends of the connecting rod.
Preferably, the toothed plate is rotatably connected with the middle of the fixing frame, the toothed plate is slidably connected with the sliding block, and a through hole for rotating the output gear is formed in the top of the sliding block.
The invention has the beneficial effects that:
1. the semiconductor detection device is simple in structure and convenient to operate, the semiconductor can be conveniently placed through the design of the supporting plate, conveying is facilitated, continuous detection of a plurality of semiconductors is conveniently carried out through the plurality of detection heads arranged at the bottom of the connecting plate, and the detection efficiency is improved;
2. after unqualified products are detected, the sliding block drives the clamping plate to move, so that the products are conveniently positioned, the unqualified products can be conveniently taken out, effective separation is convenient, and classification after semiconductor detection is facilitated;
3. according to the invention, the detected semiconductor can be conveniently taken out through the movement and rotation of the clamping plate, and the unqualified product to be detected can be conveniently discharged through the design of the discharging plate, so that the operation efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic overall perspective view of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a schematic side view of the present invention;
FIG. 4 is a schematic diagram of a side view of the guide plate of the present invention.
In the figure: 1. the bottom plate, 2, the mount, 3, the layer board, 4, first electric putter, 5, the connecting plate, 6, detect the head, 7, the ratch, 8, drive gear, 9, the rack, 10, the commentaries on classics board, 11, the fixed plate, 12, first spring, 13, the push pedal, 14, the baffle, 15, first motor, 16, the pinion rack, 17, the slider, 18, the second motor, 19, the output gear, 20, second electric putter, 21, the horizontal pole, 22, splint, 23, the second spring, 24, the connecting rod, 25, the stopper, 26, the lower feed plate, 27, the connecting axle.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to fig. 1-4, a semiconductor production inspection apparatus includes a fixing frame 2 installed on the top of a base plate 1, an inspection mechanism, a moving mechanism and a blanking mechanism;
the detection mechanism comprises a first electric push rod 4, a connecting plate 5, a detection head 6, a toothed bar 7 and a transmission gear 8, the bottom of the fixing frame 2 is fixedly connected with the first electric push rod 4, the bottom end of the first electric push rod 4 is fixedly connected with the connecting plate 5 and used for driving the detection head 6 to move, the bottom of the connecting plate 5 is fixedly connected with the detection head 6, the bottom surface of the connecting plate 5 is rotatably connected with the toothed bar 7, the toothed bar 7 is meshed with the transmission gear 8, the transmission gear 8 is meshed with a rack 9, the rack 9 is fixedly connected with the bottom of the supporting plate 3, the side wall of the fixing frame 2 is rotatably connected with a rotating plate 10, and the top surface of the bottom plate 1 is fixedly connected with a guide plate 14;
the moving mechanism comprises a toothed plate 16 and a sliding block 17 of a first motor 15, the outer wall of the fixed frame 2 is fixedly connected with the first motor 15, the output end of the first motor 15 is fixedly connected with the toothed plate 16, the toothed plate 16 is in penetrating connection with the inside of the sliding block 17, the top surface of the sliding block 17 is fixedly connected with a second motor 18, the output end of the second motor 18 is fixedly connected with an output gear 19, and the bottom surface of the sliding block 17 is fixedly connected with a second electric push rod 20 and used for moving a clamping plate 22;
unloading mechanism includes horizontal pole 21 and splint 22, 20 bottom and the horizontal pole 21 fixed connection of second electric putter, 21 tip of horizontal pole rotates with splint 22 to be connected, and through second spring 23 fixed connection between the splint 22, splint 22 middle part and connecting rod 24 sliding connection, and connecting rod 24 tip and stopper 25 fixed connection, 2 lateral walls of mount and unloading board 26 fixed connection for the unloading of unqualified semiconductor.
The fixing frame 2 is of a U-shaped structure, two first electric push rods 4 are arranged inside the bottom end of the fixing frame 2, and a plurality of detection heads 6 are arranged on a connecting plate 5 at the bottom end of each first electric push rod 4, so that the connecting plate 5 can move conveniently, and the detection heads 6 can be driven to move conveniently; the top surface of the bottom plate 1 is fixedly connected with a fixed plate 11, the side wall of the fixed plate 11 is fixedly connected with a push plate 13 through a first spring 12, the push plate 13 is slidably connected with the top surface of the bottom plate 1, and the push plate 13 is in contact with the bottom of the rotating plate 10, so that the push plate 13 can move conveniently and the rotating plate 10 can be pushed to rotate conveniently; the number of the guide plates 14 is two, sliding grooves with parallel bottom surfaces and arc-shaped top surfaces are formed in the two guide plates 14, and the inner parts of the sliding grooves formed in the guide plates 14 are connected with a connecting shaft 27 fixedly connected with the middle part of the toothed bar 7 in a sliding manner; the number of the rotating plates 10 is two, each rotating plate 10 is located between the push plate 13 and the toothed bar 7, the rotating plates 10 are of an inclined mechanism, and the rotating plates 10 are in contact with the toothed bar 7, so that the toothed bar 7 is conveniently pushed to rotate, and the toothed bar 7 is conveniently separated from the transmission gear 8; the top surface of the supporting plate 3 is provided with a plurality of grooves for placing semiconductors, two sides of each groove are respectively provided with two inclined structure openings, and each row of grooves are provided with a detection head 6 correspondingly, so that the placement of the semiconductors is facilitated, and the detection is facilitated; the sliding block 17 is of a square hollow structure, the sliding block 17 is in sliding connection with the toothed plate 16, and the toothed plate 16 is in meshed connection with the output gear 19, so that the sliding block 17 can move conveniently, and the clamping plate 22 can be driven to move conveniently; the two sides of the bottom end of the cross rod 21 are respectively rotatably connected with the two clamping plates 22, the bottom ends of the two clamping plates 22 are in contact with the side wall of the opening formed in the supporting plate 3, and the side walls of the two clamping plates 22 are respectively in sliding connection with the two limiting blocks 25, so that the clamping plates 22 can rotate conveniently, and the semiconductor can be clamped conveniently; the blanking plate 26 is in an F-shaped structure, and the bottom end of the blanking plate 26 is respectively contacted with two ends of the connecting rod 24, so that the connecting rod 24 can be conveniently pushed to move, and the semiconductor can be conveniently blanked; the toothed plate 16 is rotatably connected with the middle part of the fixing frame 2, the toothed plate 16 is slidably connected with the sliding block 17, and the top of the sliding block 17 is provided with a through hole for rotating the output gear 19, so that the toothed plate 16 can rotate conveniently, and the clamping plate 22 can be driven to rotate conveniently.
When the device is used, firstly, an electric element in the device is externally connected with a power supply and a control switch, a semiconductor is placed in a groove on the top surface of a supporting plate 3, the supporting plate 3 is placed on a bottom plate 1, after a rack 9 at the bottom of the supporting plate 3 is contacted with a transmission gear 8, a first electric push rod 4 at the top of a fixing frame 2 drives a connecting plate 5 to vertically move, the connecting plate 5 drives a detection head 6 to simultaneously move and then align with the semiconductor placed on the supporting plate 3 for detection, meanwhile, the connecting plate 5 drives a rack bar 7 to simultaneously move, at the moment, a first spring 12 on a fixing plate 11 pushes a push plate 13 to move, the push plate 13 pushes a rotating plate 10 to rotate around the top of the rotating plate, so that the rotating plate 10 abuts against the rack bar 7, the rack bar 7 is positioned between the rotating plate 10 and a guide plate 14, the rack bar 7 is in a vertical state at the moment, the transmission gear 8 is driven to rotate during movement, and further the rack bar 9 is driven to simultaneously move, the supporting plate 3 is driven to move and then the next row of semiconductors is detected, when the toothed bar 7 drives the connecting shaft 27 to move to the lowest end, the connecting shaft 27 is enabled to move to the bottom of a sliding groove formed in the guide plate 14, the rotary plate 10 pushes the toothed bar 7 to rotate through the elasticity of the first spring 12, the connecting shaft 27 on the toothed bar 7 is enabled to move to the inside of the connecting shaft 27, the toothed bar 7 is enabled to be separated from the transmission gear 8, when the first electric push rod 4 is shortened, the connecting shaft 27 is enabled to vertically move in the sliding groove in the guide plate 14, when the first electric push rod 4 drives the connecting plate 5 to move to the top, the connecting shaft 27 moves to the outside of the guide plate 14, the supporting plate 3 is driven to gradually move through the back-and-forth expansion of the first electric push;
when unqualified products exist at the detection position, the second motor 18 drives the output gear 19 to rotate, the output gear 19 is meshed with the toothed plate 16, and then the second motor 18 and the sliding block 17 are driven to move transversely on the toothed plate 16, so that the detected unqualified products are conveniently positioned;
after the positioning is completed, the extension of the second electric push rod 20 at the bottom end of the sliding block 17 drives the cross rod 21 to vertically move, the cross rod 21 drives the two clamp plates 22 to move to the two sides of the unqualified semiconductor, so that the two ends of the clamp plates 22 contact with the inclined plane of the opening formed on the supporting plate 3, and further the two clamp plates 22 are pushed to mutually rotate, so that the two clamp plates 22 in the vertical state rotate to the inclined state, after the spring is compressed, the connecting rod 24 slides between the clamp plates 22 under the self gravity, the limiting block 25 is driven to move and then contact with the side wall of the clamp plate 22, and further the semiconductor is clamped, the shortening of the second electric push rod 20 drives the clamp plates 22 and the unqualified semiconductor clamped between the clamp plates to move out of the supporting plate 3, the reverse rotation of the second motor 18 drives the sliding block 17 to move to the original position, the first motor 15 drives the toothed plate 16 to rotate, and further drives the sliding block 17, the second electric push rod 20 and the clamp plates 22 to rotate, make splint 22 rotate when tending to horizontal position, the connecting rod 24 of two of splint 22 contacts the lateral wall of lower feed plate 26, promotes connecting rod 24 and removes the top to splint 22 for stopper 25 and splint 22 lateral wall separation, make the second spring 23 that is compression state promote splint 22 and rotate to the original place after, make splint 22 and semiconductor separation, and then take out the back unloading with unqualified product inside the collecting box of placing specially, conveniently operate.
It is well within the skill of those in the art to implement and protect the present invention without undue experimentation and without undue experimentation that the present invention is directed to software and process improvements.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A semiconductor production detection device is characterized in that: comprises a fixed frame (2) arranged at the top of a bottom plate (1), a detection mechanism, a moving mechanism and a blanking mechanism;
the detection mechanism comprises a first electric push rod (4), a connecting plate (5), a detection head (6), a rack bar (7) and a transmission gear (8), the bottom of the fixing frame (2) is fixedly connected with the first electric push rod (4), the bottom end of the first electric push rod (4) is fixedly connected with the connecting plate (5), the bottom of the connecting plate (5) is fixedly connected with the detection head (6), the bottom surface of the connecting plate (5) is rotatably connected with the rack bar (7), the rack bar (7) is meshed with the transmission gear (8), the transmission gear (8) is meshed with a rack (9), the rack (9) is fixedly connected with the bottom of the supporting plate (3), the side wall of the fixing frame (2) is rotatably connected with the rotating plate (10), and the top surface of the bottom plate (1) is fixedly connected with the guide plate (14);
the moving mechanism comprises a first motor (15), a toothed plate (16) and a sliding block (17), the outer wall of the fixed frame (2) is fixedly connected with the first motor (15), the output end of the first motor (15) is fixedly connected with the toothed plate (16), the toothed plate (16) is in penetrating connection with the inside of the sliding block (17), the top surface of the sliding block (17) is fixedly connected with a second motor (18), the output end of the second motor (18) is fixedly connected with an output gear (19), and the bottom surface of the sliding block (17) is fixedly connected with a second electric push rod (20);
unloading mechanism includes horizontal pole (21) and splint (22), second electric putter (20) bottom and horizontal pole (21) fixed connection, horizontal pole (21) tip rotates with splint (22) to be connected, and through second spring (23) fixed connection between splint (22), splint (22) middle part and connecting rod (24) sliding connection, and connecting rod (24) tip and stopper (25) fixed connection, mount (2) lateral wall and flitch (26) fixed connection down.
2. The semiconductor production inspection device of claim 1, wherein: the fixing frame (2) is of a U-shaped structure, two first electric push rods (4) are arranged inside the bottom end of the fixing frame (2), and a plurality of detection heads (6) are arranged on a connecting plate (5) at the bottom end of each first electric push rod (4).
3. The semiconductor production inspection device of claim 1, wherein: bottom plate (1) top surface and fixed plate (11) fixed connection, fixed plate (11) lateral wall is through first spring (12) and push pedal (13) fixed connection, push pedal (13) and bottom plate (1) top surface sliding connection, and push pedal (13) contact has commentaries on classics board (10) bottom.
4. The semiconductor production inspection device of claim 1, wherein: the number of the guide plates (14) is two, sliding grooves with parallel bottom surfaces and arc-shaped top surfaces are formed in the two guide plates (14), and the inner parts of the sliding grooves formed in the guide plates (14) are connected with a connecting shaft (27) fixedly connected with the middle of the toothed bar (7) in a sliding mode.
5. The semiconductor production inspection device of claim 1, wherein: the number of the rotating plates (10) is two, each rotating plate (10) is located between the pushing plate (13) and the toothed bar (7), the rotating plates (10) are inclined mechanisms, and the rotating plates (10) are in contact with the toothed bars (7).
6. The semiconductor production inspection device of claim 1, wherein: the top surface of the supporting plate (3) is provided with a plurality of grooves for placing semiconductors, two inclined structure openings are respectively arranged on two sides of each groove, and each row of grooves are provided with a detection head (6) correspondingly.
7. The semiconductor production inspection device of claim 1, wherein: slider (17) are square hollow structure, slider (17) and pinion rack (16) sliding connection, and pinion rack (16) are connected with output gear (19) meshing.
8. The semiconductor production inspection device of claim 1, wherein: the two sides of the bottom end of the cross rod (21) are respectively rotatably connected with the two clamping plates (22), the bottom ends of the two clamping plates (22) are in contact with opening side walls formed in the supporting plate (3), and the side walls of the two clamping plates (22) are respectively in sliding connection with the two limiting blocks (25).
9. The semiconductor production inspection device of claim 1, wherein: the blanking plate (26) is of an F-shaped structure, and the bottom end of the blanking plate (26) is respectively contacted with two ends of the connecting rod (24).
10. The semiconductor production inspection device of claim 1, wherein: the toothed plate (16) is rotatably connected with the middle of the fixing frame (2), the toothed plate (16) is slidably connected with the sliding block (17), and a through hole for rotating the output gear (19) is formed in the top of the sliding block (17).
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| CN201911003408.3A CN110743805B (en) | 2019-10-22 | 2019-10-22 | Semiconductor production detection device |
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| CN201911003408.3A CN110743805B (en) | 2019-10-22 | 2019-10-22 | Semiconductor production detection device |
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| CN113351516B (en) * | 2021-02-05 | 2024-02-09 | 安徽力幕新材料科技有限公司 | Testing device and method for cast-rolled blank of aluminum foil for power battery |
| CN112730989B (en) * | 2021-03-05 | 2023-01-17 | 国网浙江宁波市鄞州区供电有限公司 | Semiconductor resistor detection system and detection method thereof |
| CN114226270B (en) * | 2021-10-29 | 2023-08-22 | 成都科海数控科技有限责任公司 | Transmission mechanism of mica sheet selecting machine with stable transmission |
| CN114441728A (en) * | 2022-01-29 | 2022-05-06 | 烟台市海洋经济研究院(烟台市渔业技术推广站、烟台市海洋捕捞增殖管理站) | Portable marine organism pollution detector |
| CN115254622B (en) * | 2022-07-08 | 2023-03-14 | 青岛宝佳智能装备股份有限公司 | Carbon-point length fixing machine |
| CN115979559B (en) * | 2023-01-20 | 2023-09-12 | 宜宾卓邦科技有限公司 | Semiconductor multi-endpoint path test equipment |
| CN117347829B (en) * | 2023-10-16 | 2024-02-27 | 青岛舒元日佳电子科技有限公司 | Integrated circuit board power supply path detection device |
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| JPS58224910A (en) * | 1982-06-24 | 1983-12-27 | Nec Home Electronics Ltd | Pellet supplier |
| TW200745572A (en) * | 2006-06-09 | 2007-12-16 | Visera Technologies Co Ltd | Manufacturing method of wafer-level testing circuit board, and the structure thereof |
| CN203459290U (en) * | 2013-08-17 | 2014-03-05 | 镭射沃激光科技(深圳)有限公司 | Automatic loading/unloading and sorting mechanism based on automatic production line |
| CN208466535U (en) * | 2018-04-24 | 2019-02-05 | 珠海光宇电池有限公司 | Lithium ion battery open-circuit voltage test equipment |
| CN208853284U (en) * | 2018-05-30 | 2019-05-14 | 深圳卓斌电子有限公司 | A kind of detection device of chip |
| CN208810594U (en) * | 2018-09-04 | 2019-05-03 | 深圳市圳佳光电科技有限公司 | LED daylight lamp detects automatically and defective products excludes mechanism |
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