CN212932854U

CN212932854U - Packaging detection equipment suitable for multi-specification semiconductors

Info

Publication number: CN212932854U
Application number: CN202021701945.3U
Authority: CN
Inventors: 胡蓓; 张万娟
Original assignee: Chongqing Xinyiyuan Intelligent Technology Co Ltd
Current assignee: Guangzhou Heshi Cultural Activity Planning Co ltd
Priority date: 2020-08-17
Filing date: 2020-08-17
Publication date: 2021-04-09
Anticipated expiration: 2030-08-17

Abstract

The invention discloses packaging detection equipment suitable for multi-specification semiconductors, which comprises a support, a first support plate and a pushing device, wherein a first tooth column is installed on the inner surface of the left side of the support, a rocker is installed on the surface of a transmission gear, a second tooth column is installed on the side surface of the transmission gear, a detection table is installed on the bottom of a touch rod in a deviating manner, a first rotating rod is installed at the top of a sliding rod, a fixed rod is installed at the bottom of the sliding rod, a first transmission rod is installed on the surface of a conveyor belt, a first push rod is installed on the top of a bearing plate in a deviating manner, an engagement rod is installed on the inner side of a material rack, a sponge pad is installed on the side surface of the material rack, and when a packaged product is conveyed to the bearing plate, the packaged product stays in place due to the action of the first spring and then under the action of the first push, the packaging product is pushed to the material rack, and ordered transportation of materials can be achieved.

Description

Packaging detection equipment suitable for multi-specification semiconductors

Technical Field

The invention relates to the technical field of semiconductor packaging detection, in particular to packaging detection equipment suitable for semiconductors of multiple specifications.

Background

The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, most electronic products, such as computers, mobile phones or digital recorders, have close relationship with the semiconductor, and because of the importance of the semiconductor, the semiconductor can be packaged and detected when being delivered from a factory.

The existing semiconductor package detection equipment can accurately detect the defects of the semiconductor, but many semiconductor package detection equipment can only detect the semiconductor with the same specification, and if the semiconductor with another specification needs to be detected, equipment needs to be replaced, which brings great troubles, so that the package detection equipment suitable for the semiconductors with multiple specifications is provided.

Disclosure of Invention

The invention aims to provide a packaging detection device suitable for semiconductors of multiple specifications, and aims to solve the problems that many semiconductor packaging detection devices in the background technology can only detect semiconductors of the same specification, and if semiconductors of another specification need to be detected, the devices need to be replaced, so that the problems are troublesome.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a encapsulation check out test set suitable for multi-specification semiconductor, includes support, first backup pad and pusher, the left side internally surface mounting of support has first tooth post, and the side-mounting of first tooth post has drive gear, drive gear's surface mounting has the rocker, drive gear's side-mounting has the second tooth post, and the bottom of second tooth post installs the touch pole, the bottom skew of touch pole is installed and is detected the platform, and the side skew of detecting the platform installs the slide bar, first rotary rod is installed at the top of slide bar, the bottom of slide bar is installed the dead lever, and the side-mounting of dead lever has the nut, the skew of first backup pad is installed in the side of touch pole, and the skew conveyer belt of surface mounting of first backup pad has first transmission pole, and the side-mounting of first transmission pole has the conveying pole, the utility model discloses a material conveying device, including conveyer bar, conveyer belt, bearing plate, first spring, first push rod, hydraulic stem, pusher, connecting rod, movable rod, conveyer belt side-mounting has the movable rod, and the side-mounting of inclined plane board has the bearing plate, first spring is installed to the bottom of bearing plate, the top skew of bearing plate installs first push rod, and the top of first push rod installs the hydraulic stem, pusher is skew to be installed in the bottom of bearing plate, and pusher's side skew installs material feeding unit, and material feeding unit's side skew installs the material frame, the connecting rod is installed to the inboard of material frame, and the surface mounting who connects the rod has the.

Preferably, the first tooth column is in sliding connection with the bracket, and the second tooth column and the first tooth column form a relative movement structure through the transmission gear.

Preferably, the first rotating rod is connected with the sliding rod through a shaft, the sliding rod and the fixing rod are installed in a fitting mode, and the first rotating rod drives the contact rod to stretch and retract through the second toothed column to form a rotating structure.

Preferably, first transfer line and conveyer belt formula structure as an organic whole, every node of movable rod is swivelling joint, and just first transfer line passes through the conveyer belt rotation and drives the conveying pole and constitute sliding structure.

Preferably, the included angle between the first spring and the bearing plate is 90 degrees, the first push rod and the bearing plate are of a parallel structure, and the first push rod forms a telescopic structure through a hydraulic rod.

Preferably, pusher includes second transfer line, atress pole, second push rod, shell, second spring and telescopic link, the second transfer line is skew to be installed in the bottom of bearing plate, and the surface mounting of second transfer line has the atress pole, the side-mounting of second transfer line has the second push rod, the bottom of second transfer line is skew to be installed the shell, and the internally mounted of shell has the second spring, the side-mounting of second spring has the telescopic link, the second push rod runs through in the top of shell and contacts with the telescopic link, the design of second spring and shell formula as an organic whole, the telescopic link is installed for laminating with the shell.

Preferably, material feeding unit includes second backup pad, second rotary rod, slider, motor, spacing ring, limiting plate and third push rod, the skew side-mounting in pusher of second backup pad has the limiting plate, the surface mounting of second backup pad has the second rotary rod, the side-mounting of second rotary rod has the slider, and the top skew of slider installs the third rotary rod, the motor is installed at the top of second rotary rod, the skew side-mounting of second rotary rod has the spacing ring, and the side-mounting of spacing ring has the third push rod, the spacing ring is sliding connection with the second backup pad, the second rotary rod drives the slider and constitutes sliding structure in the spacing ring inboard with motor electric connection, and the spacing ring drives the third push rod through the slider and constitutes extending structure.

Preferably, the third rotary rod is provided with the group altogether, and every group all designs about second rotary rod central point symmetry, third rotary rod and stress bar are the design of staggering each other, the stress bar drives the rotatory revolution mechanic that constitutes of third rotary rod through the second rotary rod, and the second push rod drives the second transfer line rotation through the stress bar and makes the telescopic link constitute extending structure.

Preferably, the measuring unit of the graduated scale is cm, and the material rack is in sliding connection with the connecting rod.

Compared with the prior art, the invention has the beneficial effects that:

1. this encapsulation check out test set suitable for many specifications semiconductor through the setting of conveyer belt and movable rod, when the conveyer belt is rotatory, can drive first transfer line and rotate, because every node of movable rod is swing joint, so when first transfer line drives the movable rod motion, the touching pole can carry out reciprocating type rotation through movable rod and first transfer line, transports the material above the material frame forward automatically.

2. This encapsulation check out test set suitable for many specifications semiconductor, through material feeding unit's setting, when the material transmits the material frame upper surface, because the material just contacts the regional conveying pole of material frame and can't touch, drive the second rotary rod when rotatory at the motor this moment, the slider can slide in the spacing ring, because the spacing ring is the semicircle design, when the slider slides the vertical region of spacing ring, can drive the third push rod through the spacing ring and slide forward, with the material propelling movement to the region that the conveying pole can touch.

3. This encapsulation check out test set suitable for many specifications semiconductor, because the material frame is adjustable design, adjust the standard size and dimension of this specification semiconductor through the scale in advance before detecting, when the material that the size is greater than standard size reachs the material frame, can be because inside the too big unable material frame that enters into of volume, setting through pusher, when the third rotary rod passes through the second rotary rod rotatory, can drive the second rotary rod rotatory, the second rotary rod can consequently drive the second push rod rotatory through the second transfer line, when the telescopic link is touched to the second push rod, can be with the telescopic link propelling movement forward, leave the material frame with the too big semiconductor propelling movement of size.

4. This encapsulation check out test set suitable for semiconductor of many specifications, through the setting of bearing plate and first spring, when the semiconductor transported on the bearing plate, can be because the effect of first spring stops in situ, on the effect of first push rod afterwards, with semiconductor propelling movement to material frame, can realize the orderly transportation of material.

5. This encapsulation check out test set suitable for semiconductor of many specifications can carry out the detection of size of a dimension and thickness to the semiconductor of different specifications, through the width of adjustment material frame and the height of slide bar, can make the semiconductor of different specifications obtain different testing results during the detection.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a pushing apparatus according to the present invention;

FIG. 3 is a schematic front view of a pushing device according to the present invention;

FIG. 4 is a schematic view of a feeding device according to the present invention;

FIG. 5 is a schematic view of a load bearing plate according to the present invention.

In the figure: 1. a support; 2. a first tooth post; 3. a transmission gear; 4. a rocker; 5. a second tooth post; 6. a touch lever; 7. a detection table; 8. a slide bar; 9. a first rotating rod; 10. fixing the rod; 11. a nut; 12. a first support plate; 13. a first drive lever; 14. a conveying rod; 15. a movable rod; 16. an inclined plane plate; 17. a bearing plate; 18. a first spring; 19. a first push rod; 20. a hydraulic lever; 21. a pushing device; 2101. a second transmission rod; 2102. a stress beam; 2103. a second push rod; 2104. a housing; 2105. a second spring; 2106. a telescopic rod; 22. a feeding device; 2201. a second support plate; 2202. a second rotating rod; 2203. a slider; 2204. a motor; 2205. a limiting ring; 2206. a limiting plate; 2207. a third push rod; 2208. a third rotating rod; 23. a material rack; 24. a sponge cushion; 25. a connecting rod; 26. a graduated scale; 27. and (4) a conveyor belt.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a packaging detection device suitable for multi-specification semiconductors comprises a support 1, a first support plate 12 and a pushing device 21, wherein a first tooth post 2 is installed on the inner surface of the left side of the support 1, a transmission gear 3 is installed on the side surface of the first tooth post 2, a rocker 4 is installed on the surface of the transmission gear 3, a second tooth post 5 is installed on the side surface of the transmission gear 3, the first tooth post 2 is in sliding connection with the support 1, the second tooth post 5 and the first tooth post 2 form a relative motion structure through the transmission gear 3, a touch rod 6 is installed at the bottom of the second tooth post 5, a detection table 7 is installed at the bottom of the touch rod 6 in a deviating mode, a sliding rod 8 is installed at the side surface of the detection table 7 in a deviating mode, a first rotating rod 9 is installed at the top of the sliding rod 8, the first rotating rod 9 is in shaft connection with the sliding rod 8, the sliding rod 8 and the fixing rod 10 are installed in a fitting mode, and the first rotating rod 9, the bottom of the sliding rod 8 is provided with the fixed rod 10, the side surface of the fixed rod 10 is provided with the nut 11, the first support plate 12 is eccentrically arranged on the side surface of the touch rod 6, the bottom of the surface of the first support plate 12 is eccentrically provided with the conveyor belt 27, through the arrangement of the conveyor belt 27 and the movable rod 15, when the conveyor belt 27 rotates, the first drive rod 13 can be driven to rotate, because each node of the movable rod 15 is movably connected, when the first drive rod 13 drives the movable rod 15 to move, the conveying rod 14 can perform reciprocating rotation with the first drive rod 13 through the movable rod 15, materials on the material frame 23 are automatically conveyed forwards, the surface of the conveyor belt 27 is provided with the first drive rod 13, the first drive rod 13 and the conveyor belt 27 are of an integral structure, each node of the movable rod 15 is rotatably connected, and the first drive rod 13 drives the conveying rod 14 to form a sliding structure through the rotation of, the conveying rod 14 is installed on the side face of the first transmission rod 13, the movable rod 15 is installed on the side face of the conveying rod 14, the inclined plane plate 16 is installed on the side face of the conveying belt 27, the bearing plate 17 is installed on the side face of the inclined plane plate 16, the first spring 18 is installed at the bottom of the bearing plate 17, the first push rod 19 is installed at the top of the bearing plate 17 in a deviating mode, through the arrangement of the bearing plate 17 and the first spring 18, when a semiconductor is conveyed to the bearing plate 17, the semiconductor stays in place under the action of the first spring 18, then the semiconductor is pushed to the material frame 23 under the action of the first push rod 19, ordered conveying of the material can be achieved, the included angle between the first spring 18 and the bearing plate 17 is 90 degrees, the first push rod 19 and the bearing plate 17 are in a parallel structure, the first push rod 19 forms a telescopic structure through the hydraulic rod 20, the hydraulic rod 20 is installed at the top of the first push rod 19, the, the pushing device 21 comprises a second transmission rod 2101, a force bearing rod 2102, a second push rod 2103, a housing 2104, a second spring 2105 and a telescopic rod 2106, the second transmission rod 2101 is installed at the bottom of a bearing plate 17 in a deviating mode, the force bearing rod 2102 is installed on the surface of the second transmission rod 2101, the second push rod 2103 is installed on the side surface of the second transmission rod 2101, the housing 2104 is installed at the bottom of the second transmission rod 2101 in a deviating mode, the second spring 2105 is installed inside the housing 2104, the telescopic rod 2106 is installed on the side surface of the second spring 2105, the second push rod 2103 penetrates through the top of the housing 2104 to be in contact with the telescopic rod 2106, the second spring 2105 and the housing are designed in an integrated mode, the telescopic rod 2106 and the housing 2104 are installed in a fitting mode, the feeding device 22 is installed at the side surface of the pushing device 21 in a deviating mode, the feeding device 22 comprises a second supporting plate 2201, a second rotary rod 2202, a sliding block 2203, a motor, the second support plate 2201 is eccentrically installed on the side surface of the pushing device 21, a limit plate 2206 is installed on the side surface of the second support plate 2201, a second rotating rod 2202 is installed on the surface of the second support plate 2201, a sliding block 2203 is installed on the side surface of the second rotating rod 2202, a third rotating rod 2208 is installed on the top portion of the sliding block 2203 in an offsetting manner, a motor 2204 is installed on the top portion of the second rotating rod 2202, a limit ring 2205 is installed on the side surface of the second rotating rod 2202 in an offsetting manner, a third push rod 2207 is installed on the side surface of the limit ring 2205, the limit ring 2205 is in sliding connection with the second support plate 2201, through the arrangement of the feeding device 22, when the material is conveyed to the upper side of the material rack 23, because the material just contacts the area conveying rod 14 of the material rack 23 and cannot be contacted, at the moment, when the motor 2204 drives the second rotating rod 2202 to rotate, the sliding block 2203 can slide in the limit ring 2205, because the, the third push rod 2207 is driven to slide forwards by the limit ring 2205, the material is pushed to the area which can be touched by the conveying rod 14, the second rotating rod 2202 is electrically connected with the motor 2204 to drive the sliding block 2203 to form a sliding structure at the inner side of the limit ring 2205, the limit ring 2205 drives the third push rod 2207 by the sliding block 2203 to form a telescopic structure, 6 groups of the third rotating rods 2208 are arranged, each group is symmetrically designed about the center point of the second rotating rod 2202, the third rotating rod 2208 and the stress rod 2102 are designed in a mutually staggered manner, the stress rod 2102 drives the third rotating rod 2208 to rotate by the second rotating rod 2202 to form a rotating structure, the second push rod 2103 drives the second driving rod 2101 to rotate by the stress rod 2102 to enable the telescopic rod 2106 to form the telescopic structure, because the material rack 23 is designed to be adjustable, the standard size of the semiconductor in the specification is adjusted by the graduated scale 26 before detection, when the material with the size larger than the standard size reaches the material rack 23, the volume of the material rack 23 is too large and the material rack 23 cannot enter the material rack, through the arrangement of the pushing device 21, when the third rotating rod 2208 rotates through the second rotating rod 2202, the second rotating rod 2202 can be driven to rotate, the second rotating rod 2202 can drive the second push rod 2103 to rotate through the second transmission rod 2101, when the second push rod 2103 touches the telescopic rod 2106, the telescopic rod 2106 can be pushed forwards, the oversize semiconductor is pushed away from the material rack 23, the material rack 23 is installed on the side surface of the feeding device 22 in a deviating way, the inner side of the material rack 23 is provided with the connecting rod 25, the surface of the connecting rod 25 is provided with the graduated scale 26, the side surface of the material rack 23 is provided with the sponge cushion 24, the measuring unit of the graduated scale 26 is cm, the material rack 23 is in sliding connection with the connecting rod 25, the equipment can detect the size and the thickness of the semiconductors of different specifications, and the width of the material rack 23 and the height of the sliding rod 8, different detection results can be obtained when semiconductors of different specifications are detected.

The working principle is as follows: when the packaging detection equipment suitable for the multi-specification semiconductors is used, firstly, a packaging product to be detected is prevented from falling on the conveyor belt 27, the packaging product is conveyed to the inclined plane plate 16 through the conveyor belt 27 and slides onto the bearing plate 17 through the inclined plane plate 16, the packaging product cannot fall immediately under the action of the first spring 18, then the hydraulic rod 20 drives the first push rod 19 to move downwards to push the packaging product into the material rack 23, at the moment, the motor 2204 drives the second rotary rod 2202 to rotate, the second rotary rod 2202 drives the sliding block 2203 to slide in the limit ring 2205, due to the shape characteristics of the limit ring 2205, the 220sliding block 3 drives the third push rod 2207 to move forwards through the limit ring 2205 to push the packaging product which just falls on the material rack 23 forwards, the width of the material rack 23 can be adjusted according to the sizes of different packaging products, and if the size of the packaging product is too large, will block at the top of the material shelf 23, at this moment, the third rotating lever 2208 is rotating through the second rotating lever 2202, the third rotating lever 2208 will drive the force-bearing rod 2102 to rotate, the second driving lever 2101 will drive the second push rod 2103 to rotate through the force-bearing rod 2102, when the second push rod 2103 touches the telescopic rod 2106, will push it forward, the package blocked at the top of the material shelf 23 will be pushed away from the material shelf 23, when the qualified package is pushed to the area where the conveying lever 14 is located, because the first driving lever 13 and the conveying belt 27 are designed as an organic whole, the first driving lever 13 will be in the rotating state all the time, because the movable lever 15 is adjustable, when the first driving lever 13 drives the movable lever 15 to move, the conveying lever 14 will thus make reciprocating motion, the package is transported forward orderly, then the package will be placed on the detecting platform 7 manually, wave rocker 4 and make second tooth post 5 drive contact rod 6 decline, when the thickness of encapsulation article exceeds standard, contact rod 6 can not contact first rotary rod 9, when the thickness of encapsulation article does not reach standard, contact rod 6 can contact first rotary rod 9 and drive its rotation, first rotary rod 9 can extrude foam-rubber cushion 24, the thickness that explains this encapsulation article is not up to standard when there is the indentation on foam-rubber cushion 24, because slide bar 8 and dead lever 10 are the laminating installation, detect in the encapsulation article thickness that faces different specifications, the height of accessible nut 11 adjustment slide bar 8, the condition distance that first rotary rod 9 touched foam-rubber cushion 24 can consequently change, the realization carries out thickness detection to the encapsulation article of different specifications.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a encapsulation check out test set suitable for multi-specification semiconductor, includes support (1), first backup pad (12) and pusher (21), its characterized in that: the left side of support (1) internally surface mounting have first tooth post (2), and the side-mounting of first tooth post (2) has drive gear (3), the surface mounting of drive gear (3) has rocker (4), the side-mounting of drive gear (3) has second tooth post (5), and the bottom of second tooth post (5) installs touch pole (6), the bottom skew of touch pole (6) is installed and is detected platform (7), and detects the side skew of platform (7) and install slide bar (8), first rotary rod (9) is installed at the top of slide bar (8), dead lever (10) is installed to the bottom of slide bar (8), and the side-mounting of dead lever (10) has nut (11), the skew of first backup pad (12) is installed in the side of touch pole (6), and the skew of the surperficial bottom of first backup pad (12) installs conveyer belt (27), the conveying belt (27) is provided with a first transmission rod (13) on the surface, a conveying rod (14) is arranged on the side surface of the first transmission rod (13), a movable rod (15) is arranged on the side surface of the conveying rod (14), an inclined plate (16) is arranged on the side surface of the conveying belt (27), a bearing plate (17) is arranged on the side surface of the inclined plate (16), a first spring (18) is arranged at the bottom of the bearing plate (17), a first push rod (19) is arranged at the top of the bearing plate (17) in a deviating mode, a hydraulic rod (20) is arranged at the top of the first push rod (19), a pushing device (21) is arranged at the bottom of the bearing plate (17) in a deviating mode, a feeding device (22) is arranged at the side surface of the pushing device (21) in a deviating mode, a material frame (23) is arranged at the side surface of the feeding device (22) in a deviating, and the surface of the connecting rod (25) is provided with a graduated scale (26), and the side surface of the material frame (23) is provided with a spongy cushion (24).

2. The package inspection apparatus for a multi-specification semiconductor as claimed in claim 1, wherein: the first toothed column (2) is in sliding connection with the support (1), and the second toothed column (5) and the first toothed column (2) form a relative movement structure through the transmission gear (3).

3. The package inspection apparatus for a multi-specification semiconductor as claimed in claim 1, wherein: the first rotating rod (9) is connected with the sliding rod (8) through a shaft, the sliding rod (8) and the fixing rod (10) are installed in a fitting mode, and the first rotating rod (9) drives the contact rod (6) to stretch through the second toothed column (5) to form a rotating structure.

4. The package inspection apparatus for a multi-specification semiconductor as claimed in claim 1, wherein: first transfer line (13) and conveyer belt (27) formula structure as an organic whole, every node of movable rod (15) is swivelling joint, and just first transfer line (13) are through conveyer belt (27) rotatory drive carry pole (14) to constitute sliding construction.

5. The package inspection apparatus for a multi-specification semiconductor as claimed in claim 1, wherein: the included angle between the first spring (18) and the bearing plate (17) is 90 degrees, the first push rod (19) and the bearing plate (17) are of a parallel structure, and the first push rod (19) forms a telescopic structure through the hydraulic rod (20).

6. The package inspection apparatus for a multi-specification semiconductor as claimed in claim 1, wherein: the pushing device (21) comprises a second transmission rod (2101), a stress rod (2102), a second push rod (2103), a housing (2104), a second spring (2105) and a telescopic rod (2106), wherein the second transmission rod (2101) is installed at the bottom of the bearing plate (17) in a deviating mode, and a stress rod (2102) is arranged on the surface of the second transmission rod (2101), a second push rod (2103) is arranged on the side surface of the second transmission rod (2101), the bottom of the second transmission rod (2101) is eccentrically provided with a shell (2104), a second spring (2105) is arranged in the shell (2104), a telescopic rod (2106) is arranged on the side surface of the second spring (2105), the second push rod (2103) penetrates through the top of the shell (2104) to be in contact with the telescopic rod (2106), the second spring (2105) and the shell (2104) design as an organic whole, telescopic link (2106) and shell (2104) are for laminating the installation.

7. The package inspection apparatus for a multi-specification semiconductor as claimed in claim 1, wherein: the feeding device (22) comprises a second supporting plate (2201), a second rotating rod (2202), a sliding block (2203), a motor (2204), a limiting ring (2205), a limiting plate (2206) and a third push rod (2207), wherein the second supporting plate (2201) is installed on the side surface of the pushing device (21) in a deviating manner, the limiting plate (2206) is installed on the side surface of the second supporting plate (2201), a second rotating rod (2202) is installed on the surface of the second supporting plate (2201), the sliding block (2203) is installed on the side surface of the second rotating rod (2202), the third rotating rod (2208) is installed on the top portion of the sliding block (2203) in a deviating manner, the motor (2204) is installed on the top portion of the second rotating rod (2202), the limiting ring (2205) is installed on the side surface of the second rotating rod (2202) in a deviating manner, the third push rod (2207) is installed on the side surface of the limiting ring (2205), and the limiting ring (2205), the second rotating rod (2202) is electrically connected with the motor (2204) to drive the sliding block (2203) to form a sliding structure at the inner side of the limit ring (2205), and the limit ring (2205) drives the third push rod (2207) to form a telescopic structure through the sliding block (2203).

8. The package inspection apparatus for a multi-specification semiconductor as claimed in claim 7, wherein: the third rotary rod (2208) is provided with 6 groups altogether, and every group all designs about second rotary rod (2202) central point symmetry, third rotary rod (2208) and atress pole (2102) are the design of staggering each other, atress pole (2102) drive third rotary rod (2208) through second rotary rod (2202) and rotate and constitute revolution mechanic, and second push rod (2103) drive second transfer line (2101) through atress pole (2102) and rotate and make telescopic link (2106) constitute extending structure.

9. The package inspection apparatus for a multi-specification semiconductor as claimed in claim 1, wherein: the measuring unit of the graduated scale (26) is cm, and the material rack (23) is in sliding connection with the connecting rod (25).