CN221025506U - Semiconductor protection device - Google Patents
Semiconductor protection device Download PDFInfo
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- CN221025506U CN221025506U CN202323057370.2U CN202323057370U CN221025506U CN 221025506 U CN221025506 U CN 221025506U CN 202323057370 U CN202323057370 U CN 202323057370U CN 221025506 U CN221025506 U CN 221025506U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 95
- 230000001012 protector Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Abstract
The utility model relates to a semiconductor protection device, which comprises a box body, a cover plate hinged on the box body, a supporting plate for supporting a semiconductor, a clamping plate for clamping the semiconductor and a protection device for preventing the clamping force of the clamping plate from being excessive; the box body is provided with a containing groove; the accommodating groove is provided with a first sliding groove; the clamping plate slides in the first sliding groove; the protection device is arranged in the first sliding groove; the protection device drives the clamping plate to move; the supporting plate is arranged in the accommodating groove; the supporting plate is provided with a second sliding groove; the clamping plate slides in the second sliding groove. The problem is solved that when the screw is rotated and the clamping plate is perceived to be in contact with the semiconductor element, the clamping plate can exert strong force on the semiconductor element, and the semiconductor element is easily damaged.
Description
Technical Field
The present disclosure relates to semiconductor devices, and particularly to a semiconductor protection device.
Background
The semiconductor refers to a material with conductivity between that of the semiconductor at normal temperature, and the semiconductor has application in the fields of consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion and the like, for example, a device manufactured by the semiconductor is required to be specially stored and aligned to provide good protection for the semiconductor after the semiconductor is manufactured.
Through searching, the semiconductor protection device with the patent publication number of CN215795409U is characterized in that when a semiconductor is placed, the semiconductor can be fixed between the clamping plate and the baffle after the adjusting screw is rotated through the connecting cylinder, the clamping plate and the adjusting screw, and the position of the clamping plate can be adjusted, so that the semiconductors with different sizes can be placed at the position according to the requirements, the application range of the device is wider, the semiconductor is fixed, and the semiconductor is prevented from being knocked during the semiconductor transferring process; through the mutual cooperation of the anti-static PVC plate, the conductive heat dissipation plate and the metal wires, static electricity and electric arcs can be effectively blocked, static electricity can be effectively drained, and damage to semiconductors caused by the static electricity is prevented.
The technical characteristics have the following defects: when the semiconductor element is stored and protected, the clamping plates can move simultaneously after the adjusting screw is rotated, and the moving distances are the same, so that two semiconductor elements with different sizes cannot be fixed, the limitation is high, and the semiconductor element is easily damaged when the screw is rotated and the clamping plates are perceived to be in contact with the semiconductor element because the protection performance of the semiconductor element is insufficient.
Disclosure of utility model
The embodiment of the application solves the problem that the clamping plate can exert strong force on the semiconductor element and easily damage the semiconductor element when the screw is rotated and the clamping plate is perceived to be in contact with the semiconductor element in the prior art by providing the semiconductor protection device.
The technical scheme adopted by the embodiment of the application is as follows.
A semiconductor protection device comprises a box body, a cover plate hinged on the box body, a supporting plate for supporting a semiconductor, a clamping plate for clamping the semiconductor and a protection device for preventing the clamping force of the clamping plate from being excessive; the box body is provided with a containing groove; the accommodating groove is provided with a first sliding groove; the clamping plate slides in the first sliding groove; the protection device is arranged in the first sliding groove; the protection device drives the clamping plate to move; the supporting plate is arranged in the accommodating groove; the supporting plate is provided with a second sliding groove; the clamping plate slides in the second sliding groove.
The further technical scheme is as follows: the clamping plate is provided with a connecting piece; a third sliding groove is formed in the connecting piece; the guard slides within the third slide channel.
The further technical scheme is as follows: the rotary rods are rotationally connected with the protection devices in a synchronous rotation mode; a handle is arranged on one side of the rotary rod; a clamping groove is formed in the side wall of the box body; the handle is placed in the clamping groove.
The further technical scheme is as follows: the protection device comprises a moving part arranged on the rotating rod, a first buckling part arranged on the moving part, a rotating part arranged on the rotating rod, a second buckling part sliding on the rotating part and an elastic part for always pushing the second buckling part to move towards the first buckling part; one end of the elastic piece abuts against the second clamping piece; the other end of the elastic piece abuts against the rotating piece; the moving piece is positioned in the third sliding groove to slide; the moving part is provided with a spiral groove; a first clamping block is arranged in the third sliding groove; the first clamping block is clamped into the spiral groove; a support plate is arranged in the first sliding groove; the moving piece rotates on the support plate.
The further technical scheme is as follows: a plurality of groups of second clamping blocks are arranged on the first clamping pieces; the second clamping block is triangular; a plurality of groups of third clamping blocks are arranged on the second clamping pieces; the third clamping block is triangular; the third clamping block corresponds to a gap between the two groups of second clamping blocks; when the first clamping piece rotates, the second clamping piece and the first clamping piece synchronously rotate, and at the moment, the clamping plate moves in a direction away from the semiconductor; when the first clamping piece rotates reversely, the second clamping piece and the first clamping piece rotate synchronously, at the moment, the clamping plate moves towards the direction close to the semiconductor until the clamping plate compresses the semiconductor, the third clamping block is separated from a gap between the second clamping blocks, and meanwhile the third clamping block is clamped into a gap between the next group of second clamping blocks through the elastic piece.
One or more technical solutions provided in the embodiments of the present application at least have the following technical effects or advantages:
1. Because the box body is cuboid, the holding tank has been seted up in the box body, the top of holding tank is the opening, first sliding tray has been seted up to the bottom of holding tank, first sliding tray is offered about, be provided with the layer board that bears the weight of the semiconductor in the holding tank, the second sliding tray has been offered on the layer board, the clamping plate slides in the second sliding tray, first sliding tray swivelling joint has the rotary rod, be provided with protector on the rotary rod, sliding connection has the clamping plate in the first sliding tray, be provided with the connecting piece on the clamping plate, the connecting piece is cylindric, third sliding tray has been offered on the connecting piece, protector slides in the third sliding tray, one side of rotary rod is provided with the handle, handle swivelling joint is in on the rotary rod, the draw-in groove has been offered on the lateral wall of box body orientation handle, the handle is located the draw-in groove, when rotatory rotary rod, drive protector is rotatory, thereby drive the clamping plate and move towards or keep away from the direction of semiconductor, clamping force is in initial state after clamping semiconductor, no matter how rotatory can not exert unnecessary force to semiconductor, and then realize placing semiconductor and clamp and use the semiconductor greatly.
2. Because the rotating rod is provided with the moving part which is cylindrical, the moving part is provided with the spiral groove, the moving part is inserted into the third sliding groove, the third sliding groove is internally provided with the first clamping block, the first clamping block is clamped into the spiral groove, when the moving part rotates, the clamping plate is driven to move left and right, the moving part is provided with the first clamping piece, the rotating rod is provided with the rotating part, the rotating part is cylindrical, one end of the rotating part is slidably connected with the second clamping piece, an elastic part is arranged between the second clamping piece and the rotating part, the elastic part is sleeved on the rotating part, the first sliding groove is internally provided with the support plate, the moving part is rotatably connected onto the support plate, the rotating rod is penetrated into the moving part, the second clamping piece corresponds to the first clamping piece, the first clamping piece is provided with a plurality of groups of second clamping blocks, the second clamping piece is provided with a plurality of third clamping blocks, the second clamping block and the third clamping block are triangular, the third clamping block corresponds to the gap between two adjacent groups of second clamping blocks, when the third clamping block moves towards the right angle surface of the second clamping block, the clamping plate is driven to move away from the semiconductor, when the third clamping block moves towards the inclined surface of the second clamping block, the clamping plate is driven to move towards the semiconductor until the clamping plate clamps the semiconductor, then the rotary rod is continuously rotated, so that the third clamping block moves in a square shape with the inclined surface of the second clamping block, the elastic piece is compressed until the third clamping block moves out of the gap between the two groups of second clamping blocks, the third clamping block is pushed into the gap between the next two groups of second clamping blocks through the elastic piece, the rotary force is prevented from being excessively extruded through the elastic piece, the semiconductor is prevented from continuously increasing force after the semiconductor is clamped, thereby avoiding overexposure of the semiconductor.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor protection device in the present utility model.
Fig. 2 is a cross-sectional view of a semiconductor shield apparatus in accordance with the present utility model.
Fig. 3 is a partial enlarged view of a in fig. 2.
In the figure: 1. a case body; 11. a receiving groove; 12. a first sliding groove; 13. a rotating rod; 14. a handle; 15. a clamping groove; 16. a support plate; 2. a cover plate; 3. a supporting plate; 31. a second sliding groove; 4. a clamping plate; 41. a connecting piece; 42. a third sliding groove; 421. a first clamping block; 5. a protective device; 51. a moving member; 511. a spiral groove; 52. a first clamping piece; 521. a second clamping block; 53. a rotating member; 54. a second clamping piece; 541. a third clamping block; 55. an elastic member.
Detailed Description
The embodiment of the application solves the problem that the clamping plate can exert strong force on the semiconductor element and easily damage the semiconductor element when the screw is rotated and the clamping plate is perceived to be in contact with the semiconductor element in the prior art by providing the semiconductor protection device.
In order to solve the problems, the technical scheme in the embodiment of the application has the following general ideas
In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
A semiconductor protection device comprises a box body 1, a cover plate 2 hinged on the box body 1, a supporting plate 3 for supporting a semiconductor, a clamping plate 4 for clamping the semiconductor and a protection device 5 for preventing the clamping force of the clamping plate 4 from being excessive; the box body 1 is provided with a containing groove 11; the accommodating groove 11 is provided with a first sliding groove 12; the clamping plate 4 slides in the first sliding groove 12; the guard 5 is arranged in the first sliding groove 12; the protection device 5 drives the clamping plate 4 to move; the supporting plate 3 is arranged in the accommodating groove 11; the supporting plate 3 is provided with a second sliding groove 31; the clamping plate 4 slides in the second slide groove 31.
The clamping plate 4 is provided with a connecting piece 41; the connecting piece 41 is provided with a third sliding groove 42; the guard 5 slides in the third slide groove 42.
A rotary rod 13 which synchronously rotates all the protection devices 5 is rotatably connected with the first sliding groove 12; a handle 14 is arranged on one side of the rotary rod 13; the side wall of the box body 1 is provided with a clamping groove 15; the handle 14 is placed in the clamping groove 15.
The box body 1 is the cuboid form, the holding tank 11 has been seted up in the box body 1, the top of holding tank 11 is the opening, first sliding tray 12 has been seted up to the bottom of holding tank 11, first sliding tray 12 is left and right sides and is seted up, be provided with the layer board 3 that bears the weight of the semiconductor in the holding tank 11, second sliding tray 31 has been seted up on the layer board 3, clamping plate 4 slides in second sliding tray 31, rotary rod 13 has been connected with in the rotation of first sliding tray 12, be provided with protector 5 on rotary rod 13, sliding connection has clamping plate 4 in first sliding tray 12, be provided with connecting piece 41 on the clamping plate 4, connecting piece 41 is cylindric, third sliding tray 42 has been seted up on the connecting piece 41, protector 5 slides in third sliding tray 42, one side of rotary rod 13 is provided with handle 14, handle 14 swivelling joint is in on rotary rod 13, clamping groove 15 has been seted up on the lateral wall of box body 1 towards handle 14, when rotatory rotary rod 13, drive device 5 is rotatory, thereby drive clamping plate 4 towards or keep away from the direction of semiconductor, after the semiconductor is in the rotatory state no matter how the semiconductor is in the rotatory clamping force.
Because the box body 1 is cuboid, the holding tank 11 has been seted up in the box body 1, the top of holding tank 11 is the opening, first sliding tank 12 has been seted up to the bottom of holding tank 11, set up about the first sliding tank 12, be provided with the layer board 3 that bears the semiconductor in the holding tank 11, set up the second sliding tank 31 on the layer board 3, clamping plate 4 slides in second sliding tank 31, rotary rod 13 has been connected with in the rotation of first sliding tank 12, be provided with protector 5 on the rotary rod 13, sliding connection has clamping plate 4 in the first sliding tank 12, be provided with connecting piece 41 on the clamping plate 4, connecting piece 41 is cylindric, third sliding tank 42 has been seted up on the connecting piece 41, protector 5 slides in third sliding tank 42, one side of rotary rod 13 is provided with handle 14, handle 14 swivelling joint is in on the rotary rod 13, the clamping groove 15 has been seted up on the lateral wall of box body 1 towards handle 14, handle 14 is located clamping groove 15, when rotatory 13, drive protector 5 rotates, thereby drive clamping plate 4 towards or keep away from semiconductor removal direction, no matter how the semiconductor is in the semiconductor is placed to the semiconductor after the clamping force is in the semiconductor is not used to the clamp, and no matter the semiconductor is placed to the semiconductor is damaged greatly.
The protection device 5 comprises a moving part 51 arranged on the rotary rod 13, a first clamping part 52 arranged on the moving part 51, a rotary part 53 arranged on the rotary rod 13, a second clamping part 54 sliding on the rotary part 53 and an elastic part 55 which always pushes the second clamping part 54 to move towards the first clamping part 52; one end of the elastic member 55 abuts against the second fastening member 54; the other end of the elastic member 55 abuts against the rotary member 53; the moving member 51 slides in the third sliding groove 42; the moving member 51 is provided with a spiral groove 511; the third sliding groove 42 is provided with a first clamping block 421; the first clamping block 421 is clamped into the spiral groove 511; a support plate 16 is arranged in the first sliding groove 12; the moving member 51 rotates on the support plate 16.
The first clamping piece 52 is provided with a plurality of groups of second clamping blocks 521; the second clamping block 521 is triangular; the second clamping piece 54 is provided with a plurality of groups of third clamping blocks 541; the third clamping block 541 is triangular; the third clamping block 541 corresponds to a gap between the two sets of second clamping blocks 521; when the first fastening piece 52 rotates, the second fastening piece 54 rotates synchronously with the first fastening piece 52, and at this time, the clamping plate 4 moves in a direction away from the semiconductor; when the first fastening member 52 rotates reversely, the second fastening member 54 rotates synchronously with the first fastening member 52, and the clamping plate 4 moves in a direction approaching the semiconductor until the clamping plate 4 presses the semiconductor, the third clamping block 541 breaks away from the gap between the second clamping blocks 521, and the third clamping block 541 is clamped between the gaps between the next group of second clamping blocks 521 by the elastic member 55.
The rotary rod 13 is provided with a moving part 51, the moving part 51 is cylindrical, the moving part 51 is provided with a spiral groove 511, the moving part 51 is inserted into the third sliding groove 42, the third sliding groove 42 is internally provided with a first clamping block 421, the first clamping block 421 is clamped into the spiral groove 511, when the moving part 51 rotates, the clamping plate 4 is driven to move left and right, the moving part 51 is provided with a first clamping piece 52, the rotary rod 13 is provided with a rotating part 53, the rotating part 53 is cylindrical, one end of the rotating part 53 is slidingly connected with a second clamping piece 54, an elastic part 55 is arranged between the second clamping piece 54 and the rotating part 53, the elastic part 55 is sleeved on the rotating part 53, a support plate 16 is arranged in the first sliding groove 12, the moving part 51 is rotationally connected on the support plate 16, the rotary rod 13 is penetrated on the moving part 51, the second clamping piece 54 corresponds to the first clamping piece 52, the first clamping piece 52 is provided with a plurality of groups of second clamping blocks 521, the second clamping piece 54 is provided with a plurality of third clamping blocks 541, the second clamping blocks 521 and the third clamping blocks 541 are triangular, the third clamping blocks 541 correspond to gaps between two groups of adjacent second clamping blocks 521, when the third clamping blocks 541 move towards the right angle surface of the second clamping blocks 521, the clamping plate 4 is driven to move away from the semiconductor, when the third clamping blocks 541 move towards the inclined surface of the second clamping blocks 521, the clamping plate 4 is driven to move towards the semiconductor until the clamping plate 4 clamps the semiconductor, then the rotary rod 13 is continuously rotated, so that the third clamping blocks 541 move in a square shape with the inclined surface of the second clamping blocks 521, the elastic piece 55 is compressed until the third clamping blocks 541 are pushed into the gaps between the two groups of second clamping blocks 521 by the elastic force of the elastic piece 55 after moving out of the gaps between the two groups of second clamping blocks 521, thereby preventing the semiconductor from being excessively pressed by the rotation force through the elastic member 55.
Because the rotating rod 13 is provided with the moving part 51, the moving part 51 is cylindrical, the moving part 51 is provided with the spiral groove 511, the moving part 51 is inserted into the third sliding groove 42, the third sliding groove 42 is internally provided with the first clamping block 421, the first clamping block 421 is clamped into the spiral groove 511, when the moving part 51 rotates, the clamping plate 4 is driven to move left and right, the moving part 51 is provided with the first clamping block 52, the rotating rod 13 is provided with the rotating part 53, the rotating part 53 is cylindrical, one end of the rotating part 53 is slidingly connected with the second clamping block 54, an elastic part 55 is arranged between the second clamping block 54 and the rotating part 53, the elastic part 55 is sleeved on the rotating part 53, the first sliding groove 12 is internally provided with the support plate 16, the moving part 51 is rotationally connected on the support plate 16, the rotating rod 13 is penetrated on the moving part 51, the second clamping block 54 corresponds to the first clamping block 52, the first clamping block 52 is provided with a plurality of groups of second clamping blocks 521, the second clamping piece 54 is provided with a plurality of third clamping blocks 541, the second clamping blocks 521 and the third clamping blocks 541 are triangular, the third clamping blocks 541 correspond to gaps between two groups of adjacent second clamping blocks 521, when the third clamping blocks 541 move towards the right angle surface of the second clamping blocks 521, the clamping plate 4 is driven to move away from the semiconductor, when the third clamping blocks 541 move towards the inclined surface of the second clamping blocks 521, the clamping plate 4 is driven to move towards the semiconductor until the clamping plate 4 clamps the semiconductor, then the rotary rod 13 is continuously rotated, so that the third clamping blocks 541 move in a square shape with the inclined surface of the second clamping blocks 521, the elastic piece 55 is compressed until the third clamping blocks 541 are pushed into the gaps between the two groups of second clamping blocks 521 by the elastic force of the elastic piece 55 after moving out of the gaps between the two groups of second clamping blocks 521, the rotation force is thus prevented from being excessively pressed by the elastic member 55, thereby realizing the prevention of the continuous increase of force of the semiconductor after the semiconductor is clamped, thereby avoiding the excessive pressing of the semiconductor.
While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (5)
1. The semiconductor protection device is characterized by comprising a box body (1), a cover plate (2) hinged on the box body (1), a supporting plate (3) for supporting a semiconductor, a clamping plate (4) for clamping the semiconductor and a protection device (5) for preventing the clamping force of the clamping plate (4) from being excessive; the box body (1) is provided with a containing groove (11); the accommodating groove (11) is provided with a first sliding groove (12); the clamping plate (4) slides in the first sliding groove (12); the protection device (5) is arranged in the first sliding groove (12); the protection device (5) drives the clamping plate (4) to move; the supporting plate (3) is arranged in the accommodating groove (11); a second sliding groove (31) is formed in the supporting plate (3); the clamping plate (4) slides in the second sliding groove (31).
2. The semiconductor protection device according to claim 1, characterized in that the clamping plate (4) is provided with a connection piece (41); a third sliding groove (42) is formed in the connecting piece (41); the guard (5) slides in the third sliding groove (42).
3. The semiconductor protection device according to claim 2, characterized in that a rotary lever (13) for synchronously rotating all the protection devices (5) is rotatably connected to the first sliding groove (12); a handle (14) is arranged on one side of the rotary rod (13); a clamping groove (15) is formed in the side wall of the box body (1); the handle (14) is placed in the clamping groove (15).
4. A semiconductor protection device according to claim 3, characterized in that the protection device (5) comprises a moving member (51) provided on the rotating lever (13), a first catch member (52) provided on the moving member (51), a rotating member (53) provided on the rotating lever (13), a second catch member (54) sliding on the rotating member (53), and an elastic member (55) that always pushes the second catch member (54) to move toward the first catch member (52); one end of the elastic piece (55) abuts against the second clamping piece (54); the other end of the elastic piece (55) is abutted against the rotating piece (53); the moving piece (51) is positioned in the third sliding groove (42) to slide; the moving part (51) is provided with a spiral groove (511); a first clamping block (421) is arranged in the third sliding groove (42); the first clamping block (421) is clamped into the spiral groove (511); a support plate (16) is arranged in the first sliding groove (12); the moving member (51) rotates on the support plate (16).
5. The semiconductor protection device according to claim 4, wherein the first fastening member (52) is provided with a plurality of groups of second fastening blocks (521); the second clamping block (521) is triangular; a plurality of groups of third clamping blocks (541) are arranged on the second clamping piece (54); the third clamping block (541) is triangular; the third clamping block (541) corresponds to a gap between two groups of second clamping blocks (521); when the first clamping piece (52) rotates, the second clamping piece (54) and the first clamping piece (52) synchronously rotate, and at the moment, the clamping plate (4) moves in a direction away from the semiconductor; when the first clamping piece (52) reversely rotates, the second clamping piece (54) and the first clamping piece (52) synchronously rotate, at the moment, the clamping plate (4) moves towards the direction close to the semiconductor until the clamping plate (4) presses the semiconductor, the third clamping block (541) is separated from a gap between the second clamping blocks (521), and meanwhile the third clamping block (541) is clamped into the gap between the next group of second clamping blocks (521) through the elastic piece (55).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323057370.2U CN221025506U (en) | 2023-11-13 | 2023-11-13 | Semiconductor protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323057370.2U CN221025506U (en) | 2023-11-13 | 2023-11-13 | Semiconductor protection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221025506U true CN221025506U (en) | 2024-05-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323057370.2U Active CN221025506U (en) | 2023-11-13 | 2023-11-13 | Semiconductor protection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221025506U (en) |
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2023
- 2023-11-13 CN CN202323057370.2U patent/CN221025506U/en active Active
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