CN110739359A - α相GeTe宽光谱红外探测器及其制备方法 - Google Patents
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Abstract
α相GeTe宽光谱红外探测器及其制备方法,属于光电子技术领域,尤其是一种薄膜宽光谱红外探测器。本发明α相GeTe宽光谱红外光电探测器,从下往上分别是基底、α相GeTe光敏层和金属电极层,制备过程包括基底清洗、α相GeTe薄膜溅射、GeTe退火、电极蒸镀过程。本发明具有工艺简单,成本低,响应度高,探测率高等优点,且可以在室温下工作,在红外探测领域具有重要的应用前景。同时,GeTe作为相变材料,已成为下一代存储和计算的关键材料。
Description
技术领域
本发明属于光电子技术领域,尤其是一种薄膜宽光谱红外探测器。
背景技术
红外探测器在军事、电力、工业等领域有极为广泛的应用。目前,常用于制备红外探测器的光敏材料主要有碲镉汞、碲化铟、非晶硅、氧化钒等。但由于探测器光敏材料与其后端读出电路晶格不匹配,现有的红外探测器和后端的集成电路通常分别生产后,采用铟柱倒装互联的方式进行集成,这种生产和集成方式,生产成本过高,导致红外热像仪价格居高不下。
发明内容
本发明的目的在于提供一种低成本、高探测率的红外光电探测器。
本发明α相GeTe宽光谱红外探测器及其制备方法,其特征在于所述探测器从下往上分别是基底、α相GeTe光敏层和金属电极层。
其中,基底为不导电介质,如普通玻璃、石英玻璃或SiO2。
所述α相GeTe薄膜层,厚度为20-60nm。
所述金属电极层为Al、Au或ITO,厚度为50-150nm。
所述的α相GeTe宽光谱红外探测器,其制备步骤如下:
S1,基底清洗吹干,以彻底清除基底表面吸附的杂质;
S2,α相GeTe薄膜层溅射:在磁控溅射机中,10-5Pa真空环境下,充Ar气,使腔体气压保持在3-5Pa,使用GeTe靶材溅射60-200s,使得厚度达到20-60nm;
S3,退火:将溅射好GeTe薄膜的基底取出,并在260-300℃范围退火10-20min;
S4,电极蒸镀:将退火后的器件放入真空蒸镀室中,真空度小于10-5Pa后,蒸镀电极30-90s,使得厚度达到50-150nm。
本发明具有工艺简单,成本低,响应度高,探测率高等优点,且可以在室温下工作,在红外探测领域具有重要的应用前景。同时,GeTe作为相变材料,已成为下一代存储和计算的关键材料。本发明利用GeTe作为光敏层,利于探测器材料和下一代读出电路的整合,便于器件的小型化和集成化。
附图说明
图1为本发明探测器结构示意图。
图2为GeTe薄膜退火前后XRD图;
图中可以明显看出退火后GeTe薄膜从非晶变为晶体。
图3为GeTe薄膜退火前后的紫外-可见-红外吸收光谱图;
图中可以明显看出退火前后薄膜对光谱的吸收不同。
图4为实施例2探测器无光照和红外光照射条件下的I-V曲线图;
图中可以明显看出器件对红外光照射有较大响应。
图5为实施例2探测器的探测率图;
明显看出器件探测率大约为1014J。
其中,基底1,α相GeTe光敏层2,金属电极层3。
具体实施方式
实施例1:α相GeTe宽光谱红外探测器,从下往上分别是基底1、α相GeTe光敏层2和金属电极层3。
其中,基底1为石英玻璃;α相GeTe光敏层2厚度为20nm;金属电极层3为Al电极,厚度50nm。
所述的探测器,具体制备步骤如下:
S1,基底清洗:先将基底浸泡于离子水、双氧水和氨水按照2:1:1配比混合的溶液中,在80℃下,清洗60min。随后,用去离子水冲洗干净,再用压缩空气吹干,以彻底清除基底表面吸附的杂质。
S2,α相GeTe薄膜层溅射:将基底放在磁控溅射机中,先抽真空到10-5Pa,随后充Ar气,使腔体气压保持在3Pa范围后,使用α相GeTe靶材溅射180s,厚度达到20nm。
S3,退火:将溅射好的GeTe薄膜的基底取出,并在300℃范围退火10min。
S4,Al电极蒸镀:将退火后的器件放入真空蒸镀室中,当真空度小于10-5Pa后,蒸镀Al电极30s,厚度达50nm。
实施例2:α相GeTe宽光谱红外探测器,从下往上分别是基底1、α相GeTe光敏层2和金属电极层3。
其中,基底1为普通玻璃;α相GeTe薄膜层2厚度30nm;金属电极层3为Al电极,厚度100nm。
所述的探测器,具体制备步骤如下:
S1,基底清洗:先将基底浸泡于离子水、双氧水和氨水按照2.5:1:1配比混合的溶液中,在80℃下,清洗50min。随后,用去离子水冲洗干净,再用压缩空气吹干,以彻底清除基底表面吸附的杂质。
S2,α相GeTe薄膜层溅射:将基底放在磁控溅射机中,先抽真空到10-5Pa,随后充Ar气,使腔体气压保持在5Pa范围后,使用GeTe靶材溅射120s,使厚度达到30nm。
S3,退火:将溅射好GeTe薄膜的基底取出,并在260℃范围退火10min。
S4.Al电极蒸镀:将退火后的器件放入真空蒸镀室中,当真空度小于10-5Pa后,蒸镀Al电极60s,使厚度达到100nm。
实施例3:α相GeTe宽光谱红外探测器,从下往上分别是基底1、α相GeTe光敏层2和金属电极层3。
其中,基底1为SiO2;α相GeTe光敏层2,厚度为60nm,金属电极层3为Al电极,厚度150nm。
所述的探测器,具体制备步骤如下:
S1,基底清洗:先将基底浸泡于离子水、双氧水和氨水按照3:1:1配比混合的溶液中,在100℃下,清洗30min。随后,用去离子水冲洗干净,再用压缩空气吹干,以彻底清除基底表面吸附的杂质。
S2,α相GeTe薄膜层溅射:将基底放在磁控溅射机中,先抽真空到10-5Pa,随后充Ar气,使腔体气压保持在4Pa范围后,使用GeTe靶材溅射200s,使厚度达60nm。
S3,退火:将溅射好GeTe薄膜的基底取出,并在260℃范围退火20min。
S4,Al电极蒸镀:将退火后的器件放入真空蒸镀室中,当真空度小于10-5Pa后,蒸镀Al电极90s,使厚度达150nm。
Claims (4)
1.α相GeTe宽光谱红外探测器,其特征在于α相GeTe宽光谱红外探测器,从下往上分别是基底、α相GeTe光敏层和金属电极层。
2.如权利要求1所述的α相GeTe宽光谱红外探测器,其特征在于所述基底为不导电介质,如:普通玻璃、石英玻璃、SiO2,所述金属电极层为Al、Au或ITO。
3.如权利要求1所述的α相GeTe宽光谱红外探测器,其特征在于所述α相GeTe薄膜层厚度为20-60nm,金属电极层的厚度50-150nm。
4.权利要求1所述α相GeTe宽光谱红外探测器,其特征在于该探测器的制备步骤如下:
S1,基底清洗吹干,以彻底清除基底表面吸附的杂质;
S2,α相GeTe薄膜层溅射:在磁控溅射机中,10-5Pa真空环境下,充Ar气,使腔体气压保持在3-5Pa,使用GeTe靶材溅射60-200s,使得厚度达到20-60nm;
S3,退火:将溅射好GeTe薄膜的基底取出,并在260-300℃范围退火10-20min;
S4,电极蒸镀:将退火后的器件放入真空蒸镀室中,真空度小于10-5Pa后,蒸镀电极30-90s,使得厚度达到50-150nm。
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CN111341861A (zh) * | 2020-02-17 | 2020-06-26 | 昆明物理研究所 | 基于p-GeTe/n-Si光伏型红外探测器及其制备方法 |
CN113388803A (zh) * | 2021-06-15 | 2021-09-14 | 北京航空航天大学杭州创新研究院 | 一种高热电功率因子碲化锗薄膜及其制备方法 |
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CN106601837A (zh) * | 2016-11-23 | 2017-04-26 | 中山大学 | 一种超宽光谱光敏材料和应用该光敏材料的光电探测器 |
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