CN110736375A

CN110736375A - Three-dimensional heat transfer device and manufacturing method thereof

Info

Publication number: CN110736375A
Application number: CN201810794973.5A
Authority: CN
Inventors: 刘垒垒; 张小敏
Original assignee: Cooler Master Co Ltd
Current assignee: Cooler Master Co Ltd
Priority date: 2018-07-19
Filing date: 2018-07-19
Publication date: 2020-01-31
Also published as: TWI690138B; TW202008690A

Abstract

The invention relates to three-dimensional heat transfer devices and a manufacturing method thereof, wherein the three-dimensional heat transfer devices comprise temperature-equalizing plates and 0 heat pipes, the temperature-equalizing plates comprise 1 heat-conducting cavities and at least th th capillary structures, the th capillary structures are overlapped in the heat-conducting cavities, the heat pipes comprise pipe bodies and at least second capillary structures, and at least second capillary structures are overlapped in the pipe bodies, wherein the th capillary structures are connected with at least second capillary structures in a metal bond bonding mode.

Description

Three-dimensional heat transfer device and manufacturing method thereof

Technical Field

The present invention relates to kinds of heat transfer devices, and is especially kinds of stereo heat transfer devices and their making process.

Background

Regarding heat transfer, in order to dissipate heat generated by a heating element, conventional heat transfer devices utilize a heat conducting plate to transfer heat in cooperation with a heat pipe, and utilize a heat sink (e.g., fins and fans) to dissipate heat, which is generally described as follows:

the heat conducting plate contacts the heating element, the hot end of the heat pipe connects the heat conducting plate, and the cold end of the heat pipe connects the radiator, and the capillary structure in the heat pipe leans against the capillary structure of the heat conducting plate, so , when the heat conducting plate absorbs the heat energy of the heating element, the heat energy of the heating element will vaporize the working fluid in the heat pipe into vapor.

However, the capillary structure in the heat pipe and the capillary structure of the heat conducting plate are only simply balanced, so that the return speed of the liquid working fluid is difficult to effectively increase.

Disclosure of Invention

The present invention provides kinds of three-dimensional heat transfer devices and methods for manufacturing the same, so as to solve the problem that the return velocity of the liquid working fluid is difficult to be effectively increased.

The three-dimensional heat transfer device disclosed by the embodiment of the invention comprises a temperature-equalizing plate and a 0 heat pipe, wherein the temperature-equalizing plate comprises a 1 heat-conducting cavity and at least th th capillary structure, the th capillary structure is overlapped in the heat-conducting cavity, the heat pipe comprises a pipe body and at least second capillary structure, at least second capillary structure is overlapped in the pipe body, and the th capillary structure is connected with at least second capillary structure in a metal bond bonding mode.

The three-dimensional heat transfer device disclosed by the embodiment of the invention comprises a temperature-equalizing plate 0 heat pipe and a 1 bonding layer, wherein the temperature-equalizing plate comprises a heat-conducting cavity and at least th capillary structure, at least th th capillary structure is overlapped in the heat-conducting cavity, the heat pipe comprises an pipe body and at least second capillary structure, the second capillary structure is overlapped in the pipe body, the bonding layer has a porous structure, and the bonding layer is bonded with the th capillary structure and the second capillary structure.

In another embodiment of the present invention, a method for manufacturing a three-dimensional heat transfer device includes providing a temperature equalization plate having a th 0 th capillary structure, covering metal powder on at least a portion of the th capillary structure, stacking th capillary structure of heat pipe on the metal powder, and performing sintering process to consolidate the metal powder into a th bonding layer, which is connected to the th capillary structure and the second capillary structure by metal bonding, respectively.

Another embodiment of the present invention discloses a method for manufacturing three-dimensional heat transfer devices, which includes providing temperature equalization plates with 0 st 1 capillary structures, covering metal powder on at least a portion of the capillary structures, overlaying the second capillary structures of the heat pipes on the metal powder, performing sintering process to consolidate the metal powder into a bonding layer of porous structures to connect the th capillary structures and the second capillary structures.

According to the three-dimensional heat transfer device and the manufacturing method thereof of the embodiment, compared with the situation that the capillary structure is simply abutted against the second capillary structure, because the and the second capillary structure which are simply abutted are not connected to , the fluid is absorbed in the second capillary structure because the adhesive force with the second capillary structure is greater than gravity, so that the transfer of the fluid is delayed.

The foregoing description of the present disclosure and the following description of the embodiments are provided to illustrate and explain the principles of the present disclosure and to provide further explanation of the invention as claimed in the appended claims at .

Drawings

Fig. 1 is a perspective view schematically illustrating a heat transfer device according to embodiment of the present invention.

Fig. 2 is an exploded view of fig. 1.

Fig. 3 is a schematic cross-sectional view of fig. 1.

Fig. 4 is a partially enlarged schematic view of fig. 3.

Fig. 5 is a perspective view of the heat pipe of fig. 2.

Fig. 6 is a schematic perspective view of a heat pipe according to a second embodiment of the invention.

Fig. 7 is a schematic perspective view of a heat pipe according to a third embodiment of the invention.

Fig. 8 is a schematic perspective view of a heat pipe according to a fourth embodiment of the invention.

Fig. 9 is a schematic perspective view of a heat pipe according to a fifth embodiment of the invention.

Fig. 10 is a schematic perspective view of a heat pipe according to a sixth embodiment of the invention.

Fig. 11 is a schematic perspective view of a heat pipe according to a seventh embodiment of the invention.

Fig. 12 is a schematic perspective view of a heat pipe according to an eighth embodiment of the invention.

Fig. 13 is a schematic perspective view of a heat pipe according to a ninth embodiment of the invention.

Fig. 14 is a schematic perspective view of a heat pipe according to a tenth embodiment of the invention.

Fig. 15 is a schematic perspective view of a heat pipe according to a tenth embodiment of the present invention.

Fig. 16 is a schematic perspective view of a heat pipe according to a twelfth embodiment of the invention.

Fig. 17 is a schematic perspective view of a heat pipe according to a thirteenth embodiment of the invention.

Fig. 18 is a schematic cross-sectional view of fig. 17.

FIG. 19 is a cross-sectional view of the heat pipe of FIG. 17 bonded to a vapor chamber.

Fig. 20 is a cross-sectional view of a heat pipe bonded to a vapor chamber according to a fourteenth embodiment of the invention.

Wherein the reference numerals are:

three-dimensional heat transfer device 10a

Vapor chamber 100a

Heat conducting cavity 110a

th plate 111a

Second plate 112a

Insertion hole 1121a

Flange 1122a

th

capillary structure

120a, 130a

Heat pipes

200a, 200b, 200c, 200d, 200e, 200f, 200g, 200h, 200i, 200j, 200k, 200m, 200n

Tubes

210a, 210b, 210c, 210d, 210e, 210f, 210g, 210h, 210i, 210j, 210k, 210m, 210n

Annular

inner wall surfaces

211a, 211b, 211c, 211d, 211e, 211f, 211g, 211h

Open ends

212a, 212b, 212c, 212d, 212e, 212f, 212g, 212h, 212i, 212j, 212k, 212m

Closed

ends

213a, 213b, 213c, 213d, 213e, 213f, 213g, 213h, 213i, 213j, 213k, 213m

Openings

214a, 214b, 214c, 214d, 214e, 214f, 214g, 214h

Side edges

215a, 215b, 215c, 215d, 215e, 215f, 215g, 215h, 215i

Notches

216c, 216d, 216g, 216h

Second

capillary structures

220a, 220b, 220c, 220d, 220e, 220f, 220g, 220h, 220i, 220j, 220k, 220m

The

protruding sections

221a, 221b, 221c, 221d, 221e, 221f, 221g, 221h, 221i, 221j, 221k, 221m

Bonding layer 300a

Fin set 400a

Chamber S

Detailed Description

Referring to fig. 1 to 5, fig. 1 is a perspective view illustrating a heat transfer apparatus according to an embodiment of the present invention, fig. 2 is an exploded view illustrating fig. 1, fig. 3 is a cross-sectional view illustrating fig. 1, fig. 4 is a partially enlarged view illustrating fig. 3, and fig. 5 is a perspective view illustrating the heat pipe of fig. 2.

The three-dimensional heat transfer device 10a of the present embodiment includes a temperature-uniforming plate 100a, a plurality of heat pipes 200a, and working fluid (not shown) flowing between the inside of the temperature-uniforming plate 100a and the inside of the heat pipes 200 a.

The temperature equalizing plate 100a includes heat conducting cavities 110a and 0 capillary structures 120a, the heat conducting cavity 110a includes 1 st th plate 111a and st second plate 112a, the second plate 112a is joined to the th plate 111a, so that a chamber S is formed between the st plate 111a and the second plate 112a, the chamber S is used for accommodating a working fluid (not shown), in the present embodiment, the th plate 111a and the second plate 112a are combined, but not limited thereto, in other embodiments, the th plate 111a and the second plate 112a may also be body-molded structures.

The th capillary structure 120a is stacked on the 0 th side of the plate 111a close to the second plate 112 a. the 1 th capillary structure 120a is selected from the group consisting of metal mesh, sintered powder and sintered ceramic, for example, the 2 th capillary structure 120a can be a composite of a sintered ceramic and micro grooves, in addition, in the embodiment, the temperature equalizing plate 100a comprises th th capillary structure 130a, the th capillary structure 130a is stacked on the side of the second plate 112a close to the plate 111a, but not limited thereto, in other embodiments, the temperature equalizing plate may have no th capillary structure 130a, that is, the temperature equalizing plate has only the th capillary structure 120a stacked on the plate.

The second plate 112a has a plurality of insertion holes 1121a and a plurality of flanges 1122a corresponding to the insertion holes 1121 a. The number of insertion holes 1121a corresponds to the number of heat pipes 200 a. Therefore, if the number of the heat pipes 200a is changed to a single heat pipe, the number of the insertion holes 1121a is also changed to a single heat pipe, and is not limited by the embodiment. The flanges 1122a are respectively connected to and protrude from the edges of the insertion holes 1121a to facilitate fixing the heat pipe 200 a.

Each heat pipe 200a includes tube 210a and two second capillary structures 220 a. tube 210a is a 0 hollow tube having annular inner wall surface 211 a. in addition, tube 210a has opposing open end 212a and closed end 213 a. open end 212a of tube 210a has opening 214a and skirt 215a surrounding outlet opening 214 a. the two second capillary structures 220a are stacked on annular inner wall surface 211a and spaced apart from each other. of the two second capillary structures 220a are connected to closed end 213a and have protruding sections 221a, respectively, and protruding sections 221a protrude from skirt 215a of tube 210 a. second capillary structure 220a is, for example, but not limited to, a powder sintered body.

The heat pipes 200a are respectively inserted into the insertion holes 1121a, and the second capillary structures 220a are respectively connected to the th capillary structures 120a by metal bond bonding, in detail, the three-dimensional heat transfer device 10a further includes a bonding layer 300a, the bonding layer 300a is made of gold, silver, copper or iron powder, the bonding layer 300a is formed into a porous structure by sintering or other methods, a side of the bonding layer is connected to the th capillary structure 120a by metal bond bonding, and another side of the bonding layer 300a is connected to the second capillary structures 220a by metal bond bonding.

Compared with the situation that the capillary structure is simply abutted against the second capillary structure, since the capillary structure 120a and the second capillary structure 220a of the embodiment are connected by the bonding layer 300a in a metal bond bonding manner, the speed of transferring the fluid from the second capillary structure 220a to the capillary structure 120a can be increased, and the heat dissipation efficiency of the three-dimensional heat transfer device is further improved.

In addition, the method for manufacturing the three-dimensional heat transfer device of the embodiment includes providing the temperature-uniforming plate 100a with the th capillary structure 120a, covering metal powder (not shown) on at least a portion of the th capillary structure 120a, and then overlapping the second capillary structure 220a of the heat pipe 200a on the metal powder, and then performing sintering process to form the bonding layer 300a by the metal powder to connect the th capillary structure 120a and the second capillary structure 220a in a metal bonding manner.

In the present embodiment, the number of the heat pipes 200a is plural, but not limited thereto, and in other embodiments, the number of the heat pipes may be a single heat pipe.

In the present embodiment, the second capillary structure 220a of each heat pipe 200a is connected to the th capillary structure 120a by metal bond bonding, but not limited thereto, and in other embodiments, the second capillary structure 220a of each heat pipe may be connected to the

th capillary structures

120a and 130a by metal bond bonding .

In addition, the three-dimensional heat transfer device 10a of the present embodiment further includes fin sets 400 a. the fin sets 400a are installed on the heat pipes 200a, so that the heat on the heat pipes 200a can be transferred to the fin sets 400a, thereby facilitating the heat dissipation effect of the three-dimensional heat transfer device 10 a.

Please refer to fig. 6 to 12. Fig. 6 is a schematic perspective view of a heat pipe according to a second embodiment of the invention. Fig. 7 is a schematic perspective view of a heat pipe according to a third embodiment of the invention. Fig. 8 is a schematic perspective view of a heat pipe according to a fourth embodiment of the invention. Fig. 9 is a schematic perspective view of a heat pipe according to a fifth embodiment of the invention. Fig. 10 is a schematic perspective view of a heat pipe according to a sixth embodiment of the invention. Fig. 11 is a schematic perspective view of a heat pipe according to a seventh embodiment of the invention. Fig. 12 is a schematic perspective view of a heat pipe according to an eighth embodiment of the invention.

The embodiment of fig. 6-12 is similar to the example, and will be described below with respect to a differential heat pipe.

As shown in fig. 6, each heat pipe 200b includes a tube body 210b and two second capillary structures 220b, the tube body 210b has an inner annular wall surface 211b 0 and an open end 212b and a closed end 213b , the open end 212b of the tube body 210b has an opening 214b and a skirt 215b surrounding the opening 214b, the two second capillary structures 220b are stacked on the inner annular wall surface 211b and separated from each other, the end of the two second capillary structures 220b is separated from the closed end 213b, the other end has a protruding section 221b , and the protruding section 221b protrudes from the skirt 215b of the tube body 210b, more specifically, the length of the second capillary structure 220b is, for example, approximately half the length of the tube body 210 b.

As shown in FIG. 7, each heat pipe 200c includes a tube body 210c and two second capillary structures 220c, the tube body 210c having an inner annular wall surface 211c and opposing open ends 212c and 213c , the open end 212c of the tube body 210c having an opening 214c and a skirt 215c surrounding the opening 214c, the second capillary structures 220c overlying the inner annular wall surface 211c and being spaced apart from each other, the end of the second capillary structures 220c being connected to the closed end 213c and the end being aligned with the skirt 215c, more specifically, the second capillary structures 220c having a length, e.g., approximately that of the tube body 210 c. in addition, the tube body 210c has a plurality of notches 216c, notches 216c recessed inwardly from the skirt 215c and communicating with the

openings

214c, 216c for the working fluid, e.g., vapor, to flow through.

As shown in fig. 8, each heat pipe 200d includes a tube body 210d and two second capillary structures 220d, the tube body 210d having an annular inner wall surface 211d and opposing closed ends 213d and , the open end 212d of the tube body 210d having an opening 214d and a rim 215d surrounding the opening 214d, the second capillary structures 220d overlying the annular inner wall surface 211d and spaced apart from each other, the end of the second capillary structures 220d being spaced apart from the closed end 213d and the end being aligned with the rim 215d, more specifically, the second capillary structures 220d having a length, e.g., approximately half the length of the tube body 210d, the tube body 210d further having a plurality of notches 216d, the notches 216d being recessed inwardly from the rim 215d and communicating with the opening 214d, the notches 216d for the working fluid, e.g., vapor, to flow through.

As shown in fig. 9, each heat pipe 200e includes a tube 210e and 0 second capillary structure 220e, the tube 210e has a annular inner wall surface 211e and opposite open ends 212e and closed ends 213e, the open end 212e of the tube 210e has a opening 214e and a skirt 215e surrounding the opening 214e, the second capillary structure 220e is circumferentially formed on the annular inner wall surface 211e of the tube 210e, ends of the second capillary structure 220e are connected to the closed ends 213e, ends each have a protruding section 221e, and the protruding section 221e protrudes from the skirt 215e of the tube 210e, more specifically, the length of the second capillary structure 220e is, for example, the length of the tube 210 e.

As shown in fig. 10, each heat pipe 200f includes tubes 210f and 0 second capillary structure 220 f. tube 210f has 1 annular inner wall surface 211f and opposite open end 212f and closed end 213 f. tube 210f has an opening 214f and skirt 215f surrounding opening 214 f. second capillary structure 220f is circumferentially formed on tube 210f annular inner wall surface 211 f. the end of second capillary structure 220f is separated from closed end 213f, ends each have a protruding section 221f, and protruding section 221f protrudes from skirt 215f of tube 210 f. more specifically, the length of second capillary structure 220f is, for example, half the length of of tube 210 f.

As shown in fig. 11, each heat pipe 200g includes tubes 210g and second capillary structure 220g, tube 210g having annular inner wall surface 211g and opposing open end 212g and closed end 213g, tube 210g having open end 212g with opening 214g and skirt 215g surrounding outlet opening 214g, second capillary structure 220g formed in a surrounding manner on tube 210g annular inner wall surface 211g, second capillary structure 220g having end connected to closed end 213g and end aligned with skirt 215g of tube 210g, more specifically, second capillary structure 220g having a length of tube 210g, further, tube 210g having a plurality of notches 216g, notches 216g recessed from skirt 215g, and

openings

214g, 216g for working fluid to flow through.

As shown in fig. 12, each heat pipe 200h includes tubes 210h and 0 second capillary structure 220h, tube 210h has annular inner wall surface 211h and opposite open end 212h and closed end 213h, tube 210h has open end 212h with opening 214h and skirt 215h surrounding outlet opening 214h, second capillary structure 220h is circumferentially formed on tube 210h annular inner wall surface 211h, second capillary structure 220h has end spaced from closed end 213h and end aligned with skirt 215h of tube 210h, more specifically, second capillary structure 220h has a length, for example, half the length of tube 210h, tube 210h further has a plurality of

notches

216h, 216h recessed inwardly from skirt 215h, and

opening

214h, 216h for working fluid to flow through and communicate with the working fluid, for example, vapor.

Referring to fig. 13 to 16, fig. 13 is a schematic perspective view of a heat pipe according to a ninth embodiment of the present invention, fig. 14 is a schematic perspective view of a heat pipe according to a tenth embodiment of the present invention, fig. 15 is a schematic perspective view of a heat pipe according to a tenth embodiment of the present invention, and fig. 16 is a schematic perspective view of a heat pipe according to a twelfth embodiment of the present invention.

The embodiment of fig. 13-16 is similar to the example, and will be described below with respect to a differential heat pipe.

As shown in FIG. 13, each heat pipe 200i includes tubes 210i and second capillary structures 220 i. tube 210i has opposing open ends 212i and closed ends 213 i. open end 212i of tube 210i has side edge 215 i. second capillary structure 220i is disposed within tube 210i and is configured as a micro-groove. furthermore, end of second capillary structure 220i is connected to closed end 213i, and end is aligned with side edge 215i of tube 210 i. more specifically, the length of second capillary structure 220i is, for example, the length of tube 210 i.

As shown in FIG. 14, each heat pipe 200j includes a tube , 210j and , a second capillary structure 220j, the tube 210j having opposing ends , 212j, , 213j, the open end 212j of the tube 210j having a side edge , 215j, the second capillary structure 220j disposed within the tube 210j and being, for example, a micro-groove, the end of the second capillary structure 220j being spaced apart from the closed end 213j, the end being aligned with the side edge 215j of the tube 210j, and more specifically, the length of the second capillary structure 220j being, for example, half of the length of the tube 210 j.

As shown in FIG. 15, each heat pipe 200k includes a tube body 210k and two second capillary structures 220 k. the tube body 210k has opposing open ends 212k and 213k . the open end 212k of the tube body 210k has a rim 215k . the two second capillary structures 220k are disposed in the tube body 210k and spaced apart from each other. the second capillary structures 220k are each, for example, micro-grooves. furthermore, the ends of the two second capillary structures 220k are connected to the closed ends 213k, and the ends are aligned with the rim 215k of the tube body 210 k. more specifically, the length of the second capillary structures 220k is, for example, the length of the tube body 210 k.

As shown in FIG. 16, each heatpipe 200m includes a pipe body 210m and two second capillary structures 220 m. the pipe body 210m has opposite open ends 212m and closed ends 213 m. the open end 212m of the pipe body 210m has a skirt 215 m. the two second capillary structures 220m are disposed in the pipe body 210m and separated from each other. the second capillary structures 220m are each, for example, micro-grooves. furthermore, the ends of the two second capillary structures 220m are separated from the closed ends 213m, and the ends are aligned with the skirt 215m of the pipe body 210 m. more specifically, the length of the second capillary structures 220m is, for example, half of the length of the pipe body 210 m.

The second capillary structure is exemplified by a single metal mesh, a sintered powder body, a sintered ceramic body, or a micro groove, but not limited thereto, please refer to fig. 17 and 18, fig. 17 is a perspective view of a heat pipe according to a thirteenth embodiment of the invention, and fig. 18 is a cross-sectional view of fig. 17.

Each heat pipe 200n includes a tube n and two secondary capillary structures 220 n. tube 210n has opposing open end 212n and closed end 213 n. tube 210n open end 212n has side edges 215 n. two secondary capillary structures 220n are disposed within tube 210 n.

In this embodiment, each of the second capillary structure 220n comprises 0 th layer 2201n and 1 st second layer 2202n, th layer 2201n formed inside the tube body 210n, and the second layer 2202n is stacked on the th layer 2201n, the th layer 2201n of the second capillary structure 220n is, for example, a micro-groove, and the th layer 22025 n has a end connected to the closed end 213n and another end aligned with the side edge 215n of the tube body 210n, the second layer 2202n of the second capillary structure 220n is, for example, a metal mesh, a sintered powder body or a sintered ceramic body, and the end of the second layer 2202n is connected to the closed end 213n and another end aligned with the side edge 215n of the tube body 210 n.

Referring to fig. 19, fig. 19 is a cross-sectional view of the heat pipe of fig. 17 bonded to a vapor chamber.

The heat pipe 200n passes through the insertion hole 1121n of the temperature equalization plate 110n, and the th layer 2201n and the second layer 2202n of the second capillary structure 220n are connected with the th capillary structure 120n by metal bond through the bonding layer 300 n.

Referring to fig. 20, fig. 20 is a cross-sectional view illustrating a heat pipe bonded to a temperature-uniforming plate according to a fourteenth embodiment of the present invention, in the embodiment shown in fig. 17, a -th capillary structure 120o of the temperature-uniforming plate 100o is also a composite capillary structure, in detail, each -th capillary structure 120o includes 1 -th layers 1201o and 3-th layers 1202 o. the -th layer 1201o is formed on the inner side of the -th plate body 111o, and the -th layer 1201o of the -th layer 1201 o- -th capillary structure 120o is, for example, a micro-groove, and the second layer 1202n of the second capillary structure 120o is, for example, a metal mesh, a sintered body, or a ceramic sintered body, therefore, the heat pipe 200o is inserted into the capillary hole 1121o of the temperature-uniforming plate 110o, and the layers 2201o and 539 o of the second structures 220o are bonded to the second capillary structure through the bonding layer o and the bonding layer -th capillary structure 120o by bonding layer 300 o.

According to the three-dimensional heat transfer device and the manufacturing method thereof in the embodiment, compared with the situation that the capillary structure is simply abutted against the second capillary structure, because the and the second capillary structure which are simply abutted are not connected to , the fluid is absorbed in the second capillary structure because the adhesive force with the second capillary structure is greater than gravity, so that the transfer of the fluid is delayed.

Although the present invention has been described with reference to the foregoing embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

A three-dimensional heat transfer device of claim 1, , comprising:

vapor chamber including heat-conducting cavity and at least capillary structure, wherein the at least capillary structure is stacked in the heat-conducting cavity, and

heat pipe, comprising tube and at least second capillary structure, wherein the at least second capillary structure is overlapped in the tube;

wherein, the at least st th capillary structure is connected with the at least second capillary structure in a metal bond bonding mode.
2. The stereoscopic heat transfer device of claim 1, further comprising a bonding layer, wherein side of the bonding layer is connected to the th capillary structure by means of metal bond bonding, and the other side of the bonding layer is connected to the second capillary structure by means of metal bond bonding.
3. The solid heat transfer device according to claim 2, wherein the material of the bonding layer is gold, silver, copper or iron powder.
4. The volumetric heat transfer device according to claim 2, wherein the th capillary structure and the second capillary structure are selected from the group consisting of a metal mesh, a sintered powder body, and a sintered ceramic body.
5. The volumetric heat transfer device of claim 4, wherein the open end of the tube has openings and side edges surrounding the openings, the second wick structure being aligned with the side edges.
6. A volumetric heat transfer device according to claim 5, characterized in that the tubular body has notches recessed inwardly from the side edge and communicating with the opening.
7. The volumetric heat transfer device according to claim 5, wherein the tube body has closed ends, the closed ends being opposite to the open ends, the second capillary structure being connected to the closed ends.
8. The volumetric heat transfer device according to claim 5, wherein the tube body has closed ends, the closed ends are opposite to the open ends, and the second capillary structure is separated from the closed ends.
9. The solid heat transfer device according to claim 7 or 8, wherein the tube body has annular inner wall surface, and the at least second wick structure is formed in a surrounding manner on the annular inner wall surface of the tube body.
10. The solid heat transfer device according to claim 7 or 8, wherein the tube body has annular inner wall surface, the number of the at least second capillary structures is two, the two second capillary structures are stacked on the annular inner wall surface of the tube body, and the two second capillary structures are separated.
11. The volumetric heat transfer device of claim 4, wherein the end of the tube has a opening and a side edge surrounding the opening, and the at least second capillary structure has a protruding section that protrudes from the side edge of the tube.
12. The volumetric heat transfer device of claim 11, wherein the tube has closed ends, the closed ends being opposite to the open ends, the second capillary structure being connected to the closed ends.
13. The volumetric heat transfer device of claim 11, wherein the tube has closed ends, the closed ends being opposite to the open ends, the second capillary structure being separated from the closed ends.
14. A solid heat transfer device according to claim 12 or 13, wherein the tube body has annular inner wall surface, and the second wick structure is formed in a surrounding manner on the annular inner wall surface of the tube body.
15. The solid heat transfer device according to claim 12 or 13, wherein the tube body has annular inner wall surface, the number of the at least second capillary structures is two, the two second capillary structures are stacked on the annular inner wall surface of the tube body, and the two second capillary structures are separated from each other.
16. The volumetric heat transfer device of claim 2, wherein the th capillary structure and the second capillary structure are selected from the group consisting of metal mesh, sintered powder and sintered ceramic bodies and microchannels.
17. The volumetric heat transfer device of claim 16, wherein the open end of the tube has openings and a skirt surrounding the openings, the second wick structure being aligned with the skirt.
18. A volumetric heat transfer device according to claim 17, wherein the tube has notches recessed inwardly from the side edge and communicating with the opening.
19. The volumetric heat transfer device of claim 17, wherein the tube has closed ends, the closed ends being opposite to the open ends, the second capillary structure being connected to the closed ends.
20. The volumetric heat transfer device of claim 17, wherein the tube has closed ends, the closed ends being opposite to the open ends, the second capillary structure being separated from the closed ends.
21. A volumetric heat transfer device according to claim 19 or 20, characterized in that the tubular body has annular inner wall surface, and the at least second wick structure is formed in a surrounding manner on the annular inner wall surface of the tubular body.
22. The solid heat transfer device according to claim 19 or 20, wherein the tube body has annular inner wall surface, the number of the at least second capillary structures is two, the two second capillary structures are stacked on the annular inner wall surface of the tube body, and the two second capillary structures are separated from each other.
23. The solid heat transfer device according to claim 1, wherein the heat conducting cavity comprises the th plate and the second plate, the th plate is joined with the second plate to form chamber between the th plate and the second plate, the second plate has insertion holes and flanges corresponding to the insertion holes, the heat pipe is inserted through the insertion holes, and the flanges surround the heat pipe.
24. The stereoscopic heat transfer device according to claim 23, wherein the th capillary structure is stacked on the side of the th plate body close to the second plate body.
25. The stereoscopic heat transfer device according to claim 23, wherein the number of the th capillary structures is two, and the two th capillary structures are respectively stacked on the side of the th plate body close to the second plate body and the side of the second plate body close to the th plate body.
26. The volumetric heat transfer device of claim 1, further comprising an fin set mounted on the heat pipe.
A volumetric heat transfer device of the type 27, , comprising:

temperature equalization plate, comprising heat conduction cavity and at least capillary structure, wherein the at least capillary structure is overlapped in the heat conduction cavity;

heat pipe, comprising tube and at least second capillary structure, wherein the at least second capillary structure is overlapped in the tube;

bonding layer having a porous structure, the bonding layer bonding the at least capillary structure and the at least second capillary structure.
28, A method for manufacturing a three-dimensional heat transfer device, comprising:

providing a vapor chamber having an st th capillary structure;

covering the metal powder on at least part of the capillary structure;

stacking second capillary structures of heat pipes on the metal powder, and

sintering process is performed to solidify the metal powder into bonding layers, which are connected to the capillary structure and the second capillary structure respectively in a metal bond bonding manner.
29, A method for manufacturing a three-dimensional heat transfer device, comprising:

providing a vapor chamber having an st th capillary structure;

covering the metal powder on at least part of the capillary structure;

stacking second capillary structures of heat pipes on the metal powder, and

sintering process is performed to consolidate the metal powder into a bonding layer porous structure to connect the capillary structure with the second capillary structure.