CN110729203A - Packaging process of open electrocardiogram sensor - Google Patents
Packaging process of open electrocardiogram sensor Download PDFInfo
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- CN110729203A CN110729203A CN201910927545.XA CN201910927545A CN110729203A CN 110729203 A CN110729203 A CN 110729203A CN 201910927545 A CN201910927545 A CN 201910927545A CN 110729203 A CN110729203 A CN 110729203A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/316—Modalities, i.e. specific diagnostic methods
- A61B5/318—Heart-related electrical modalities, e.g. electrocardiography [ECG]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
Abstract
The invention discloses an open type electrocardiogram sensor packaging process, which comprises the following steps: sticking the substrate on the circular ring attached with the UV film, cutting the substrate into a base with a specified size along a preset cutting path, transferring the base onto a film sticking carrier, and sticking a frame; a photosensitive chip pasting process: attaching a plurality of photosensitive chips to a base; a first curing process: curing the base after the photosensitive chip pasting process; a light-emitting chip pasting process: adhering the light-emitting chip to the base after the first curing; a second curing process: curing the base after the light-emitting chip pasting process; a wire welding procedure: electrically connecting the photosensitive chip and the light-emitting chip with the base by using bonding wires; the packaging process of the open type electrocardiogram sensor can prevent the light-emitting chip and the photosensitive chip from being firmly bonded with the substrate and not easily falling off, and the bonding wires are not easy to bend and have high yield.
Description
Technical Field
The invention relates to the technical field of electronic device packaging, in particular to an open type electrocardiogram sensor packaging process.
Background
The electrocardiogram sensor is a sensor which can sense action potential waveforms of cells in different areas of the heart and convert the action potential waveforms into usable output signals, and the packaging process is generally as follows:
1. marking; the dot matrix content is printed on the back of the substrate by laser, so that the tracing effect can be achieved;
2. pasting the first photosensitive chip: the first photosensitive chip is pasted on the substrate,
3. curing for the first time; heating the substrate adhered with the first photosensitive chip to cure the adhesive glue of the first photosensitive chip;
4. pasting the second photosensitive chip: bonding a second photosensitive chip on the substrate after the first curing;
5. and (3) second curing: heating the substrate adhered with the second photosensitive chip to cure the adhesive glue of the second photosensitive chip;
6. pasting a first light-emitting chip: adhering the first light-emitting chip to the substrate subjected to the second curing treatment;
7. and (3) third curing: heating the substrate adhered with the first light-emitting chip to cure the adhesive glue of the first light-emitting chip;
8. pasting the second light-emitting chip; adhering a second light-emitting chip to the substrate subjected to the third curing treatment;
9. fourth curing; heating the substrate adhered with the second light-emitting chip to cure the adhesive glue of the second light-emitting chip;
10. a wire welding procedure: connecting the first photosensitive chip, the second photosensitive chip, the first light-emitting chip and the second light-emitting chip with the substrate by using metal bonding wires;
11. a frame pasting process: adhering the plastic frame to the substrate to form a primary product;
12. film pasting: attaching the primary finished product to a ring with a fixed film;
13. a cutting procedure: cutting is performed along the cutting lines of the substrate surface using a cutting device to divide the preliminary product into a plurality of electrocardiograph sensors.
When the electrocardiogram sensor is processed by adopting the electrocardiogram sensor packaging procedure in the prior art, multiple curing treatments are required, after the bonding glue of the first light-emitting chip, the second light-emitting chip, the first photosensitive chip and the second photosensitive chip is heated and cured for multiple times, the bonding property is reduced, the bonding between the first light-emitting chip or the second light-emitting chip or the first photosensitive chip or the second photosensitive chip and the substrate is insecure and is easy to fall off, and the frame bonding procedure is performed after the wire bonding procedure, the bonding wires on the substrate are transferred to the frame bonding procedure, the bending of the bonding wires or the damage of the substrate and the like are easily caused by manual operation, and the defective rate is high.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide an open type electrocardiogram sensor packaging process, which can simplify the curing step, so that the light-emitting chip and the photosensitive chip are firmly bonded with the substrate and are not easy to fall off, the bonding wires are not easy to bend, and the yield is high.
The purpose of the invention is realized by adopting the following technical scheme:
an open type electrocardiogram inductor packaging process comprises
Film pasting and cutting: and adhering the substrate to the circular ring attached with the UV film, cutting the substrate into a base with a specified size along a preset cutting path, and transferring the base to a film adhering carrier.
A frame pasting process: attaching the plastic frame to the base;
a photosensitive chip pasting process: attaching a plurality of photosensitive chips to a base;
a first curing process: curing the base after the photosensitive chip pasting process;
a light-emitting chip pasting process: adhering the light-emitting chip to the base after the first curing;
a second curing process: curing the base after the light-emitting chip pasting process;
a wire welding procedure: the photosensitive chip and the light-emitting chip are electrically connected with the base by using bonding wires.
Further, the light emitting chip pasting process comprises a first light emitting chip pasting process, a second light emitting chip pasting process and a third light emitting chip pasting process, wherein the light emitting chip pasting process adopts a light emitting chip mounter, the light emitting chip mounter comprises a first light emitting chip mounter, a second light emitting chip mounter and a third light emitting chip mounter, the light emitting chips comprise two first light emitting chips and four second light emitting chips,
in the first light-emitting chip pasting process, the first light-emitting chip mounter pastes two first light-emitting chips on the base;
in the second light-emitting chip pasting process, the second light-emitting chip mounter pastes any two second light-emitting chips on the base;
and in the third light-emitting chip pasting procedure, the third light-emitting chip mounter pastes the two remaining second light-emitting chips on the base.
Further, the film sticking and cutting process comprises a film sticking process and a cutting process, wherein the substrate is stuck to the circular ring with the UV film; and cutting the substrate stuck on the circular ring along a preset cutting path in the cutting process so as to divide the substrate into bases with specified sizes.
Further, at least two substrates are attached to the ring to which the UV film is attached in the film attaching step.
Further, the film sticking and cutting process further comprises a first transfer process, in the transfer process, the fixing film on the film sticking carrier is blown by the chip mounter, so that the fixing film of the film sticking carrier is protruded, the base is taken down from the circular ring and is attached to the fixing film of the film sticking carrier, and the base is transferred to the fixing film of the film sticking carrier.
Further, the sensitization chip includes two first sensitization chips and six second sensitization chips, sensitization chip pastes the process and adopts sensitization chip mounter to accomplish, sensitization chip mounter includes first sensitization chip mounter, second sensitization chip mounter, third sensitization chip mounter and fourth sensitization chip mounter, and sensitization chip pastes the process and includes that sensitization chip pastes the process and include that first sensitization chip mounter, second sensitization chip mounter, third sensitization chip mounter and fourth sensitization chip mounter
A first photosensitive chip pasting process: the first photosensitive chip mounter pastes the two first photosensitive chips on the base;
and a second photosensitive chip pasting process: two second photosensitive chips are attached to the base by a second photosensitive chip mounter;
and a third photosensitive chip pasting process: any two of the remaining four second photosensitive chips are pasted on the base by a third photosensitive chip mounter;
a fourth photosensitive chip pasting process: and the fourth photosensitive chip mounter pastes the remaining two second photosensitive chips on the base.
Further, the frame pasting process comprises a middle plastic frame pasting process and an outer ring plastic frame pasting process, the plastic frame comprises a middle plastic frame and an outer ring plastic frame, the middle plastic frame pasting process is used for pasting the middle frame on the middle portion of the base and waiting for the middle frame to be fixed with glue for solidification, and the outer ring plastic frame pasting process is used for pasting the outer ring plastic frame on the outer edge of the base and waiting for the outer ring plastic frame to be fixed with glue for solidification.
Further, the method further comprises a first cleaning step of cleaning the substrate after the first curing step with plasma gas after the first curing step and before the light emitting chip bonding step after the first curing step,
and a second cleaning step of cleaning the substrate after the second curing step with plasma gas after the second curing step.
Further, the wire bonding process further comprises a second transfer process, wherein the base processed by the wire bonding process is transferred to the magazine in the second transfer process.
Further, the second transfer process comprises a film turning process.
Compared with the prior art, the invention has the beneficial effects that:
compared with the original open type electrocardiogram sensor packaging process, the curing process is carried out for the first time after the photosensitive chip pasting process is finished, and the curing process is carried out for the second time after the luminous chip pasting process is finished, so that the heating curing times of glue of the photosensitive chip and the luminous chip are few, the influence on the adhesiveness of the glue is small, the photosensitive chip and the luminous chip are firmly adhered to the base, and the photosensitive chip and the luminous chip are not easy to fall off in the subsequent processing process; in addition, the frame pasting process is placed before the wire welding process, the plastic frame is installed on the base before the wire welding process, so that the plastic frame can protect the substrate and the wire welding, and the phenomenon that the qualified rate is influenced due to the fact that the wire welding is deformed and bent or the base, the photosensitive chip or the light-emitting chip is damaged due to manual operation in the transferring process is avoided.
Drawings
FIG. 1 is a flow chart of an open ECG sensor packaging process of the present invention;
the figure is as follows: 1. film pasting; 2. a cutting procedure; 3. a first transfer step; 4. baking; 5. a middle plastic frame pasting process; 6. an outer ring plastic frame pasting process; 7. a first photosensitive chip pasting process; 8. a second photosensitive chip pasting process; 9. a third photosensitive chip pasting process; 10. a fourth photosensitive chip pasting process; 11. a first curing process; 12. a first cleaning step; 13. a first light-emitting chip pasting process; 14. a second light emitting chip pasting process; 15. a third light-emitting chip pasting process; 16. a second curing process; 17. a second cleaning step; 18. a wire welding procedure; 19. and a second transfer step.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
The packaging process of the open type electrocardiogram sensor shown in figure 1 comprises
Film pasting and cutting: the substrate is attached to the circular ring attached with the UV film, the cutting device cuts along a preset cutting path on the substrate, the cut substrate comprises a base which is cut into preset sizes, and the base is transferred to the film attaching carrier.
In the pad pasting cutting process, the degree of depth of cutting need be controlled for after the cutting, the upper and lower face of base plate has link up completely along the cutting way, is that completely separate between the base on the base plate promptly, can not cut the UV membrane through simultaneously, and the bottom of UV membrane needs to have partly not cut promptly, thereby makes all bases can link into a whole through the UV membrane, in order to avoid the base displacement to appear in the follow-up processing.
A frame pasting process: attaching the plastic frame to the base;
a photosensitive chip pasting process: and attaching a plurality of photosensitive chips to the base. Specifically, the photosensitive chip is pasted on a photosensitive chip mounting position arranged on the base through a chip mounter.
First curing step 11: and curing the base after the photosensitive chip pasting process so as to cure the glue for pasting the photosensitive chip. Specifically, the base adhered with the plastic frame and the photosensitive chip is placed in an oven for high-temperature treatment, so that the glue is cured.
A light-emitting chip pasting process: adhering the light-emitting chip to the base after the first curing; specifically, the light emitting chip is pasted on a photosensitive chip mounting position arranged on the base through a chip mounter.
Second curing step 16: curing the base after the light-emitting chip bonding process to cure the glue for bonding the light-emitting chip; specifically, the base adhered with the plastic frame, the photosensitive chip and the light-emitting chip is placed in an oven for high-temperature treatment, so that the glue is cured.
Wire bonding step 18: the photosensitive chip and the light-emitting chip are electrically connected with the base by using bonding wires.
The pasting of the sensing chip in the existing open type electrocardiogram sensor packaging process is generally carried out in two steps: firstly, sticking two first photosensitive chips on a base, sticking six second photosensitive chips on the base, sticking the two first photosensitive chips on the base, curing the base stuck with the first photosensitive chips, curing the bonding glue of the first photosensitive chips by adopting a high-temperature heating mode during curing, sticking the six second photosensitive chips on the base, curing the glue of the second photosensitive chips, sticking the light-emitting chips, sticking two infrared light-emitting diodes on the base, curing the bonding glue of the infrared light-emitting diodes by high-temperature heating, sticking four green light-emitting diodes on the base, curing the bonding glue of the green light-emitting diodes, and performing multiple curing processes in the sticking process of the light-emitting chips and the photosensitive chips, however, after the glue is heated and cured for many times, the adhesiveness of the glue is reduced, the photosensitive chip and the light-emitting chip are not firmly adhered to the base, and the photosensitive chip or the light-emitting chip is easy to fall off from the base in the subsequent processing process. In addition, the cutting of the substrate in the conventional open-type electrocardiograph sensor packaging process is generally performed after the plastic frame, the photosensitive chip and the light-emitting chip are pasted, when the cutting is performed, the cutting tool needs to enter a cutting gap surrounded by adjacent plastic frames on the substrate, then the cutting tool is operated to be in contact with a substrate cutting channel, the substrate is cut along the cutting channel so as to cut off the substrate, the cutting stroke of the cutting tool in the process is the thickness of the plastic frame plus the thickness of the substrate (namely 650 μm), wherein the effective stroke is 130 μm, namely the thickness of the substrate, and the rest part is an ineffective stroke, so that the consumed time is long; compared with the existing open type electrocardiogram sensor packaging process, the substrate is firstly cut into the base with the specified size, the cutting stroke of the cutting tool is the thickness of the substrate (namely 130 mu m) during cutting, then the plastic frame, the photosensitive chip and the light-emitting chip are pasted and the wire bonding treatment is carried out, and the processing is carried out by adopting the method, so that the cutting stroke of the cutting tool during cutting can be reduced, the cutting time is shortened, the working efficiency is improved, the consumed time is short, and the working efficiency is high.
In addition, different with current open-type ECG sensor packaging technology put the frame pasting process after bonding wire process 18, put the frame pasting process before bonding wire process 18 in this application, install the plastic frame on the base earlier before the bonding wire for the plastic frame can protect base plate and bonding wire, in order to avoid transferring the in-process, and the manual operation leads to the bonding wire to warp crooked, influences the qualification rate. In addition, the photosensitive chip pasting process is placed before the light-emitting chip pasting process, but not after the light-emitting chip pasting process, so that the center of the substrate is used as a positioning point of the patch to be positioned in the whole packaging process, and the improvement of the precision of each patch process is facilitated.
The initial temperature for the first curing is 65-75 ℃, and after 0.5 hour, the temperature is raised to 195-.
The initial temperature for the second curing is 145-155 ℃, and after 0.5 hour, the temperature is raised to 195-205 ℃ for 1.5-2 hours.
Specifically, the photosensitive chip comprises two first photosensitive chips and six second photosensitive chips, the photosensitive chip pasting process is completed by a photosensitive chip mounter, the photosensitive chip mounter comprises a first photosensitive chip mounter, a second photosensitive chip mounter, a third photosensitive chip mounter and a fourth photosensitive chip mounter, and the photosensitive chip pasting process comprises
First photosensitive chip bonding step 7: the first photosensitive chip mounter pastes the two first photosensitive chips on the base;
second photosensitive chip bonding step 8: two second photosensitive chips are attached to the base by a second photosensitive chip mounter;
third photosensitive chip bonding step 9: any two of the remaining four second photosensitive chips are pasted on the base by a third photosensitive chip mounter;
fourth photosensitive chip bonding step 10: and the fourth photosensitive chip mounter pastes the remaining two second photosensitive chips on the base. The first photosensitive chip is a Photo diode 940nm photoreceptor, and the second photosensitive chip is a Photo diode525nm photoreceptor.
Compared with the prior art that the sticking of the photosensitive chip in the packaging process of the open type electrocardiogram sensor is divided into two parts, and one step is completed by two chip mounters, the sticking of the photosensitive chip is divided into four parts, so that the sticking of the photosensitive chip can be completed by four chip mounters, each chip mounter only needs to be responsible for sticking two photosensitive chips, the consumption time of the sticking work is short, the photosensitive chip can be quickly transmitted to the next chip mounter for chip mounting work after the sticking is completed, the idle time of the chip mounter in the next step is short, and the production efficiency is high; the original photosensitive chips are pasted by two chip mounters, one chip mounter is used for pasting two first photosensitive chips, the other chip mounter is used for pasting six second photosensitive chips, when the chip mounter works, the chip mounter can continue to work after waiting for the other chip mounter to paste the six second photosensitive chips, the idle time of the chip mounter is long, the production efficiency is low, and the chip mounter is not beneficial to rapid production.
In addition, the existing light-emitting chip bonding process generally divides the bonding of the light-emitting chips into two parts and hands the two parts to two chip mounters, when the light-emitting chip bonding process works, one chip mounter needs to be responsible for the bonding work of two first light-emitting chips, the other chip mounter needs to be responsible for the bonding work of four second light-emitting chips, when the light-emitting chip bonding process works, one chip mounter needs to wait for the other chip mounter to bond the four second light-emitting chips, and then the light-emitting chip bonding process can continue to work, so that the idle time of the chip mounter is long, the production efficiency is low. The first light emitting chip is a 940nm infrared light emitting diode, and the second light emitting chip is a 525nm green light emitting diode.
And the luminous chip pastes the process including the luminous chip of the first time and pastes process 13, the luminous chip of the second time pastes process 14 and the luminous chip of the third time and pastes process 15, luminous chip pastes the process and adopts the luminous chip mounter, the luminous chip mounter includes first luminous chip mounter, second luminous chip mounter and third luminous chip mounter, through dividing luminous chip pasting the process into three parts, accomplish by three chip mounters, every chip mounter only needs to be responsible for the work of pasting of two first luminous chips or second luminous chips, paste the work consumption time short, can transmit to next chip mounter fast and carry out the paster work after pasting the completion, the chip mounter idle time of next step is short, high in production efficiency. Specifically, the flow is as follows, in the first light emitting chip pasting process 13, a first light emitting chip mounter pastes two first light emitting chips on a base; in the second light-emitting chip bonding process 14, the second light-emitting chip mounter bonds any two second light-emitting chips to the base; in the third light-emitting chip bonding process 15, the remaining two second light-emitting chips are bonded to the base by the third light-emitting chip mounter.
Specifically, the film sticking and cutting process comprises a film sticking process 1 and a cutting process 2, wherein the substrate is stuck to the circular ring with the UV film in the film sticking process 1; the substrate attached to the ring is cut along a preset cutting street in the cutting process 2 to cut the substrate into a susceptor of a designated size.
In the film laminating step 1, the number of substrates to be laminated at a time may be set according to the sizes of the substrates and the ring. In the embodiment of the invention, at least two substrates are adhered to the circular ring attached with the UV film, so that two blades of the cutting machine are fully utilized, the cutting and cleaning are simultaneously carried out, the efficiency is high, the surface space of the UV film is fully utilized, and the production cost is reduced.
The film cutting process also comprises a first transfer process 3, in the transfer process, an air blowing device corresponding to the position of the film carrier in the chip mounter is used for blowing air to the fixed film on the film carrier so as to enable the fixed film of the film carrier to bulge, the base is taken down from the circular ring and is adhered to the fixed film of the film carrier so as to transfer the base to the fixed film of the film carrier, in the process, the fixed film on the film carrier is blown so as to increase the contact area between the fixed film of the film carrier and the base so as to extrude the air between the fixed film of the film carrier and the base, in addition, the adhering speed of the base and the fixed film of the film carrier is 0.5 mu m/s so as to extrude the air between the base and the fixed film of the film carrier, the base stands for more than 9 hours after the adhering is finished so as to enable the air between the base and the fixed film of the film carrier to avoid the expansion of the air when baking is carried out, the base is separated from the fixed film of the film sticking carrier.
And a baking step 4 is further included after the film pasting cutting step and before the frame pasting step, the film pasting carrier is baked in the baking step 4, the baking temperature is 155-175 ℃, specifically 165 ℃, the heating times are two, and the duration time of each time is 2 hours, so that the moisture remained on the base during cutting is removed, and the glue is prevented from diffusing during subsequent gluing.
Specifically, the frame pasting process comprises a middle plastic frame pasting process 5 and an outer ring plastic frame pasting process 6, the plastic frames comprise a middle plastic frame and an outer ring plastic frame, the middle plastic frame is pasted in the middle of the base in the middle plastic frame pasting process 5 and waits for the middle frame fixing glue to be cured, the curing temperature is 145-155 ℃, the duration time is 0.5-1 hour, the outer ring plastic frame is pasted on the outer edge of the base in the outer ring plastic frame pasting process 6 and waits for the outer ring plastic frame fixing glue to be cured, the curing temperature is 145-155 ℃, and the duration time is 0.5-1 hour. The middle plastic frame is a structural member formed by plastic materials in one step, and the middle plastic frame is a structural member which is surrounded and shielded all around and is communicated with the middle. The size of the middle plastic frame is matched with the size of the area occupied by the light-emitting chip mounting position on the base. The middle plastic frame is used for protecting the light-emitting chip arranged on the light-emitting chip mounting position and the bonded gold wire. Wherein, the height of the middle plastic frame is less than that of the peripheral plastic frame. The outer ring plastic frame comprises a frame body and a step part, the frame is of a hollow structure, the step part is formed on the back surface of the frame body, the frame body is arranged on the front surface of the base through the step part, and the frame body, the step part and the front surface of the base can enclose a containing groove for containing overflowing glue to prevent the overflowing glue from overflowing and flowing to the back surface of the base along the side surface of the base to form glue stains so as to influence subsequent processing and use. In addition this application shelters from in order forming through setting up outer lane plastic frame and middle plastic frame, avoids external object direct and bonding wire contact to lead to the bonding wire to warp crooked.
In addition, a first cleaning process 12 is further included after the first curing process 11 and before the light emitting chip bonding process, the substrate after the first curing process 11 is cleaned by plasma gas in the first cleaning process 12, a second cleaning process 17 is further included after the second curing process 16 and before the wire bonding process 18, the substrate after the second curing process 16 is cleaned by plasma gas in the second cleaning process 17, and the plasma gas used in the first cleaning process 12 and the second cleaning process 17 is 95% argon and 5% hydrogen to remove glue volatiles and activate the surface activity of a wire bonding pad, so that the bonding force between the bonding wire and the base is enhanced.
The wire bonding step 18 is followed by a second transfer step 19, in which the substrate processed by the wire bonding step 18 is transferred to a magazine 19. Specifically, the second transfer step 19 includes a film turning step of placing an unused fixed film on a film rotating table (in this case, the fixed film placed on the film rotating table is referred to as a film a), bringing the side of the film sticking carrier having the base toward the film rotating table and sticking it to the film a, rolling the film sticking carrier with rollers so that the base and the film sticking carrier stick to the film a, removing the fixed film on the film sticking carrier, removing the film a having the base and the film sticking carrier from the film rotating table, placing an unused fixed film (the fixed film is a film B) on the film rotating table, rotating the film a so that the side having the film sticking carrier and the base faces the film rotating table, sticking the film sticking carrier and the substrate to the film B, rolling with rollers so that the base and the film sticking carrier on the film a are stuck to the film B, removing the film a, transferring the film sticking carrier and the substrate to the film B, so as to facilitate subsequent processing.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. An open electrocardiogram sensor packaging process is characterized by comprising the following steps:
film pasting and cutting: attaching the substrate to a circular ring attached with a UV film, cutting the substrate into bases with specified sizes along a preset cutting path, and transferring the bases to a film attaching carrier;
a frame pasting process: attaching the plastic frame to the base;
a photosensitive chip pasting process: attaching a plurality of photosensitive chips to a base;
a first curing process: curing the base after the photosensitive chip pasting process;
a light-emitting chip pasting process: adhering the light-emitting chip to the base after the first curing;
a second curing process: curing the base after the light-emitting chip pasting process;
a wire welding procedure: the photosensitive chip and the light-emitting chip are electrically connected with the base by using bonding wires.
2. The packaging process of the open electrocardiogram sensor as claimed in claim 1, wherein: the light-emitting chip pasting process comprises a first light-emitting chip pasting process, a second light-emitting chip pasting process and a third light-emitting chip pasting process, wherein the light-emitting chip pasting process adopts a light-emitting chip mounter, the light-emitting chip mounter comprises a first light-emitting chip mounter, a second light-emitting chip mounter and a third light-emitting chip mounter, the light-emitting chips comprise two first light-emitting chips and four second light-emitting chips,
in the first light-emitting chip pasting process, the first light-emitting chip mounter pastes two first light-emitting chips on the base;
in the second light-emitting chip pasting process, the second light-emitting chip mounter pastes any two second light-emitting chips on the base;
and in the third light-emitting chip pasting procedure, the third light-emitting chip mounter pastes the two remaining second light-emitting chips on the base.
3. The packaging process of the open electrocardiogram sensor as claimed in claim 1, wherein: the film sticking and cutting process comprises a film sticking process and a cutting process, wherein the substrate is stuck to the circular ring with the UV film; and cutting the substrate stuck on the circular ring along a preset cutting path in the cutting process so as to divide the substrate into bases with specified sizes.
4. The packaging process of the open electrocardiograph sensor according to claim 3, wherein: in the film attaching step, at least two substrates are attached to the ring to which the UV film is attached.
5. The packaging process of the open electrocardiograph sensor according to claim 3, wherein: the film sticking cutting process further comprises a first transfer process, wherein the fixed film on the film sticking carrier is blown by the chip mounter in the transfer process so that the fixed film of the film sticking carrier protrudes, and the base is taken down from the circular ring and attached to the fixed film of the film sticking carrier so as to be transferred onto the fixed film of the film sticking carrier.
6. The packaging process of the open electrocardiogram sensor as claimed in claim 1, wherein: the sensitization chip includes two first sensitization chips and six second sensitization chips, sensitization chip pastes the process and adopts sensitization chip mounter to accomplish, sensitization chip mounter includes first sensitization chip mounter, second sensitization chip mounter, third sensitization chip mounter and fourth sensitization chip mounter, and sensitization chip pastes the process and includes that first sensitization chip mounter, second sensitization chip mounter, third sensitization chip mounter and fourth sensitization chip mounter
A first photosensitive chip pasting process: the first photosensitive chip mounter pastes the two first photosensitive chips on the base;
and a second photosensitive chip pasting process: two second photosensitive chips are attached to the base by a second photosensitive chip mounter;
and a third photosensitive chip pasting process: any two of the remaining four second photosensitive chips are pasted on the base by a third photosensitive chip mounter;
a fourth photosensitive chip pasting process: and the fourth photosensitive chip mounter pastes the remaining two second photosensitive chips on the base.
7. The packaging process of the open electrocardiogram sensor as claimed in claim 1, wherein: the frame pasting process comprises a middle plastic frame pasting process and an outer ring plastic frame pasting process, the plastic frame comprises a middle plastic frame and an outer ring plastic frame, the middle plastic frame is pasted in the middle of the base in the middle pasting process and waits for the solidification of the middle frame fixing glue, and the outer ring plastic frame is pasted in the outer edge of the base in the outer pasting process and waits for the solidification of the outer ring plastic frame fixing glue.
8. The packaging process of the open electrocardiogram sensor as claimed in claim 1, wherein: the method further includes a first cleaning step of cleaning the substrate after the first curing step with plasma gas after the first curing step, and a second cleaning step of cleaning the substrate after the second curing step with plasma gas after the second curing step before the wire bonding step.
9. The packaging process of the open electrocardiogram sensor as claimed in claim 1, wherein: the wire welding process also comprises a second transfer process, wherein the base processed by the wire welding process is transferred into the magazine in the second transfer process.
10. The packaging process of the open electrocardiograph sensor according to claim 9, wherein: the second transfer process comprises a film turning process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910927545.XA CN110729203B (en) | 2019-09-27 | 2019-09-27 | Packaging process of open electrocardiogram sensor |
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