CN110711607B - Method for manufacturing patterned surface charge, hydrophobic insulating film and application thereof - Google Patents
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Abstract
The invention discloses a method for manufacturing patterned surface charges, a hydrophobic insulating film and application thereof. In this way, the method for manufacturing patterned surface charges of the present invention utilizes an external power source, can obtain patterned surface charges by controlling the distribution of the conductive droplets and changing the size of the conductive droplets, and can adjust the charge density of the bound charges on the surface of the material by changing the magnitude of the applied voltage or the time of the applied voltage; the method is convenient, rapid, simple and easy to implement, can be realized by applying smaller voltage, and has low production cost.
Description
Technical Field
The invention relates to the technical field of material preparation, in particular to a method for manufacturing patterned surface charges, a hydrophobic insulating film and application thereof.
Background
The existence of surface charge plays an important role in many technical fields of hydrophobic insulating materials, such as micro-nano fluid, micro-nano electron, biomolecule surface adsorption, micro-nano self-assembly, new energy acquisition and the like. It is of great importance to produce surface bound charges that have a specific pattern and that can be stable on the surface of hydrophobic insulating materials, especially in humid or some extreme environments. The current method for producing patterned surface charges is a method of electron beam irradiation, but the method requires the use of high voltage of over kilovolts, and has complicated process, high equipment cost and high production cost.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a method of manufacturing a patterned surface charge and a hydrophobic insulating film and applications thereof.
The technical scheme adopted by the invention is as follows: a method of fabricating a patterned surface charge, comprising the steps of:
s1, arranging a lower electrode layer on the lower substrate; then, a hydrophobic insulating layer is arranged on the surface, deviating from the lower substrate, of the lower electrode layer;
s2, arranging conductive liquid drops on the surface, away from the lower electrode layer, of the hydrophobic insulating layer;
s3, arranging an upper electrode on the conductive liquid drop, wherein the upper electrode is in contact with the conductive liquid drop;
s4, applying a voltage between the upper electrode and the lower electrode layer;
and S5, removing the conductive liquid drop after the voltage is removed.
In step S3, a voltage is applied between the upper electrode and the lower electrode, a bound charge is generated at a position on the surface of the hydrophobic insulating layer corresponding to the three-phase line of the conductive liquid droplet, and during the application of the voltage, a contact angle between the conductive liquid droplet and the hydrophobic insulating layer changes, and the three-phase line of the conductive liquid droplet moves, so as to form a patterned surface charge on the surface of the hydrophobic insulating layer. Generally, the greater the applied voltage in step S4, the greater the density of the surface bound charges generated, but the applied voltage generally does not exceed the voltage that the hydrophobic insulating layer can withstand, and can be generally-30V, -60V, -80V, -90V, -120V, etc.
In the manufacturing process, conductive liquid drops can be arranged on the surface of the hydrophobic insulating layer, which is far away from the lower electrode layer, according to a required surface charge target pattern, and then voltage is applied to the conductive liquid drops through the upper electrode layer and the lower electrode layer one by one or simultaneously by utilizing an external power supply so as to prepare patterned surface charge; alternatively, the setting of a single or multiple conductive droplets and the corresponding manufacturing of the surface charge pattern may be performed first, and then the above operations of setting the conductive droplets and manufacturing the surface charge pattern may be repeated to complete the manufacturing of the target pattern of surface charges in several times.
Preferably, in step S3, the upper electrode is an electrode rod inserted into the conductive liquid droplet; in step S4, the lower electrode layer is grounded, and a voltage is applied to the upper electrode. The electrode rod may be in various shapes such as a cylinder, a rectangular parallelepiped, a cone, etc.; the surface of the electrode rod may be smooth or rough.
Preferably, in step S3, the upper electrode is an upper electrode layer disposed on the upper substrate; step S2 specifically includes: arranging spacing support members on the hydrophobic insulating layer, and then arranging conductive liquid drops on the hydrophobic insulating layer in the areas where the spacing support members are not arranged; step S3 specifically includes: and arranging an upper electrode layer on the upper substrate, and then arranging the upper substrate on the interval support, wherein the upper electrode layer on the upper substrate faces the conductive liquid drop and is in contact with the conductive liquid drop.
The upper substrate and the lower substrate may be rigid or flexible substrates, and may be specifically a glass substrate, a plastic substrate or a metal substrate, and the materials of the upper substrate and the lower substrate may be the same or different. The material of the upper electrode and the lower electrode layer can be metal, two-dimensional conductive material, indium tin oxide or heavily doped semiconductor. The spacer support pad typically has a thickness of 10nm to 5 mm.
Preferably, the conductive liquid droplets are ultrapure water, an aqueous solution, an ionic liquid, or a liquid metal. The volume of the conductive droplets is generally 0.1uL to 10 mL.
Preferably, the material of the hydrophobic insulating layer comprises at least one of PTFE, Teflon AF, Cytop, Hyflon, PDMS. The thickness of the hydrophobic insulating layer is generally 10nm to 5mm, preferably 10nm to 10 um.
Preferably, step S1 specifically includes: and arranging a lower electrode layer on the lower substrate, arranging an insulating layer on the surface of the lower electrode layer, which is far away from the lower substrate, and arranging a hydrophobic insulating layer on the surface of the insulating layer, which is far away from the lower electrode layer.
Preferably, the material of the insulating layer is a silicon-based dielectric material, a fluoropolymer or Parylene.
The present invention also provides a hydrophobic insulating film having a patterned surface charge, which is manufactured by any of the above methods of manufacturing a patterned surface charge. The hydrophobic insulating film with the patterned surface charges can be applied to preparation of microfluidic devices, nanofluidic devices and micro-nano electronic devices, so that the invention also provides application of more than one hydrophobic insulating film with the patterned surface charges in preparation of microfluidic devices, nanofluidic devices or micro-nano electronic devices.
The beneficial technical effects of the invention are as follows: the invention provides a method for manufacturing patterned surface charges, a hydrophobic insulating film and application thereof. According to the principle of electrowetting technology, when voltage is applied between a lower electrode layer and an upper electrode in contact with a conductive liquid drop, the contact angle of the conductive liquid drop on the surface of a hydrophobic insulating layer is reduced, a wedge shape is formed at a solid-liquid-gas triple-phase line of the conductive liquid drop, and the electric field intensity of a tip of the wedge shape is locally increased, so that bound charges are generated on the surface of the hydrophobic insulating layer and are gathered near the tip of the wedge shape formed at the edge of the liquid drop; because the surface charges are gathered near the three-phase line of the conductive liquid drop, the contact angle between the conductive liquid drop and the hydrophobic insulating layer is influenced by the electric field energy generated by the bound charges to change in the power-on process, the three-phase line of the conductive liquid drop moves in the power-on process, and the moving range of the three-phase line is the width range of the formed surface charges; therefore, the moving range of the three-phase line of the conductive liquid drop on the hydrophobic insulating layer can be controlled by controlling the applied voltage, and the pattern formed by the bound charges on the surface can be further controlled; meanwhile, the charge density of the surface bound charges can be adjusted by changing the magnitude of the applied voltage and the time of the applied voltage, and the surface potential of the hydrophobic insulating layer can be changed accordingly. Through the mode, the method for manufacturing the patterned surface charge can obtain the patterned surface charge by controlling the distribution setting of the conductive liquid drops or changing the sizes of the conductive liquid drops and the like by utilizing an external power supply, and can generate the patterned stable surface charge from a micrometer scale to a micro-nano system by controlling the form and displacement of solid-liquid-gas three-phase contact lines of the conductive liquid drops through the external power supply; the method is convenient, fast, simple and feasible, can be realized by applying smaller voltage, does not need expensive instruments and complex processes, and has low production cost.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic view of a method of manufacturing a patterned surface charge of example 1;
FIG. 2 is a graph showing the results of measuring the surface potential and surface morphology of the material having patterned surface charges obtained in example 1;
FIG. 3 is a schematic view of a method of manufacturing a patterned surface charge according to example 2;
FIG. 4 is a photograph of a projection of the conductive drop edge three-phase line taken from the bottom of the lower substrate of FIGS. 3 (a) and (b), respectively, up;
FIG. 5 is a graph showing the results of measuring the surface potential and surface topography at the corresponding locations near the three-phase line of the original conductive droplet on the material with patterned surface charges obtained in example 2;
FIG. 6 is the surface potential (U) of the corresponding position on the surface of the hydrophobic insulating layer material obtained in example 3 at the three-phase line of the original conductive liquid drop T ) And surface charge density (. sigma.) T ) Upon application of a voltage (U) C ) A graph of variation of (a);
FIG. 7 is the surface potential (U) of the corresponding position of the three-phase line of the original conductive liquid drop on the surface of the hydrophobic insulating layer material obtained in example 4 T ) And surface charge density (σ) T ) A plot of Time over Time of applied voltage (Time);
FIG. 8 is a schematic view of a method of manufacturing a patterned surface charge of example 5;
FIG. 9 is a schematic view of a method of manufacturing a patterned surface charge according to example 6;
fig. 10 is a graph showing the results of the surface charge stability test of the hydrophobic insulating layer material obtained in example 6.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
Example 1
A method of manufacturing a patterned surface charge, as shown in fig. 1 (a), comprising the steps of:
s1, taking a glass substrate as a lower substrate, wherein the thickness of the glass substrate is 1 mm; a lower electrode layer 11 is disposed on one surface of a glass substrate (not shown in the figure), the material of the lower electrode layer 11 is Indium Tin Oxide (ITO), and the thickness is 30 nm; then, a Teflon AF 1600X material is adopted to arrange an insulating hydrophobic layer 12 with the thickness of 1 mu m on the surface, deviating from the glass substrate, of the lower electrode layer 11;
s2, dropping a conductive liquid drop 13 on the surface, away from the lower electrode layer 11, of the hydrophobic insulating layer 12, wherein the conductive liquid drop 13 is ultrapure water, and the volume of the conductive liquid drop 13 is 5 uL;
s3, inserting an electrode bar 14 on the conductive liquid drop 13, wherein the electrode bar 14 is in contact with the conductive liquid drop 13;
s4, grounding the lower electrode layer 11, and applying-120V voltage to the electrode bar 14 for 5 min;
s5, removing the voltage, and then removing the conductive liquid droplet 13, wherein the obtained material structure is as shown in fig. 1 (b), and includes a lower electrode layer 11 and an insulating hydrophobic layer 12 disposed on the lower electrode layer 11, and a surface of the insulating hydrophobic layer 12 facing away from the lower electrode layer 11 has surface charges 15 in a ring-shaped pattern.
Detecting the surface potential of the above hydrophobic insulating layer material by Kelvin probe force microscopy, and detecting its surface morphology, the obtained result is shown in FIG. 2, wherein (a) is the surface potential curve of the above prepared material; (b) the surface potential curve of the M position is shown as a curve A in (B), and the curve B is a surface height curve of the material at the M position; (c) and (d) measurement images representing the surface topography and surface potential at the M position in (a), respectively, which correspond to the curve B and the curve a in (B), respectively.
From the test results shown in fig. 2, it can be seen that the surface potential of the material at the position corresponding to the original conductive liquid drop solid-liquid-gas three-phase line is increased, which indicates that the surface charge is generated; the surface charges are gathered at the positions corresponding to the three-phase contact lines to form a circular pattern; the surface charges are gathered near the three-phase lines, so that the contact angle between the conductive liquid and the hydrophobic insulating layer is influenced by electric field energy generated by the bound charges to change in the voltage applying process, the three-phase lines move in the voltage applying process, the moving range of the three-phase lines is the width of the formed surface charge area, and the ring width of the circular ring-shaped surface charge pattern is 150-400 mu m. In addition, as can be seen from (b), (c) and (d) in fig. 2, the surface potential of the material at the position corresponding to the three-phase line of the original conductive liquid drop is increased, but the surface of the material is very flat and uniform in appearance, so that the change of the surface potential of the material is not caused by the change of the surface height.
Example 2
A method of fabricating a patterned surface charge, comprising:
s1, taking a glass substrate as a lower substrate, wherein the thickness of the glass substrate is 1 mm; arranging a lower electrode layer on one surface of a glass substrate, wherein the lower electrode layer is made of Indium Tin Oxide (ITO) and has the thickness of 30 nm; then, a Teflon AF 1600X material is adopted to arrange an insulating hydrophobic layer on the surface of the lower electrode layer, which is far away from the glass substrate, and the thickness of the insulating hydrophobic layer is 1 mu m;
s2, arranging spacing supporting pieces on two sides of the hydrophobic insulating layer, wherein the spacing supporting pieces are glass spacing gaskets and have the thickness of 100 mu m; then, arranging conductive liquid drops in the areas, where the interval supporting parts are not arranged, on the surface of the hydrophobic insulating layer, wherein the conductive liquid drops 14 adopt ultrapure water, and the volume of the conductive liquid drops 14 is 1 uL; in other embodiments, a photoresist layer may be used as a spacer support by disposing a photoresist on a hydrophobic insulating layer in a region where surface patterning charges do not need to be manufactured by photolithography;
s3, taking another glass substrate as an upper substrate, arranging an upper electrode layer on the upper substrate, arranging the upper substrate on the spacing glass support, and enabling the upper electrode layer on the upper substrate to face the conductive liquid drops and contact with the conductive liquid drops; as shown in fig. 3 (a), the overall structure includes a lower substrate (not shown), a lower electrode layer 21, a hydrophobic insulating layer 22, a spacer (not shown), an upper electrode layer 23, and an upper substrate (not shown), wherein the upper substrate, the lower electrode layer 21, and the hydrophobic insulating layer 22 are sequentially stacked, and the hydrophobic insulating layer is provided with a conductive liquid droplet 23; the upper electrode layer 24 is attached to the upper substrate, the upper substrate provided with the upper electrode layer 24 and the lower substrate are oppositely arranged at intervals through the spacing support, and the upper electrode layer 24 is contacted with the conductive liquid drops 23;
s4, applying-90V voltage between the upper electrode layer and the lower electrode layer, wherein the voltage application time is 5 min; the whole structure is shown as (b) in fig. 3;
and S5, removing the voltage, and then removing the glass substrate with the upper electrode layer and the conductive liquid drops.
Respectively taking projection photographs of the three-phase line at the edge of the conductive liquid drop from the bottom of the lower substrate of (a) and (b) in fig. 3 upwards by using a projection camera, wherein the obtained results are respectively shown in fig. 4, and (c) in fig. 4 is a projection photograph of the three-phase line at the edge of the conductive liquid drop before voltage is applied to (a) in fig. 3; fig. 4 (d) is a projection photograph of the three-phase line at the edge of the conductive droplet after the voltage is applied in fig. 3 (b). As can be seen from comparing (c) and (d) of fig. 4, the edge in (c) is thicker than the edge in (d) because the contact angle formed by the conductive liquid and the hydrophobic insulating layer is obtuse when no voltage is applied, and a relatively thick edge is photographed from the bottom of the lower substrate; after voltage is applied, the surface free energy of the hydrophobic insulating layer is changed by the voltage, the contact angle between the conductive liquid drop and the hydrophobic insulating layer becomes small, even becomes an acute angle, and a lower thin edge is shot from the bottom of the lower substrate.
In addition, in a similar manner to example 1, a kelvin probe force microscope was used to detect the surface potential and the surface height of the corresponding position near the three-phase line of the original conductive liquid drop on the surface of the hydrophobic insulating material obtained above, and the obtained results are shown in fig. 5; fig. 5 (e) is a surface potential measurement image of a corresponding position near the three-phase line of the original conductive liquid drop on the material, and fig. 5 (f) is a surface potential and surface height curve diagram of a corresponding position near the three-phase line of the original conductive liquid drop on the material. As can be seen from fig. 5, the surface potential of the material at the corresponding position near the three-phase line of the original conductive droplet is raised, but the surface height is substantially unchanged, and the surface potential pattern of the area is caused by the patterned bound charges on the surface of the material, and the edge width of the bound charge pattern is about 20 μm.
Example 3
In substantially the same manner as in example 1, different patterned surface charges were produced by changing the magnitude of the applied voltage in step S4 for 5 min. Detecting the surface potential (U) of the corresponding position of the three-phase line of the original conductive liquid drop on the surface of the hydrophobic insulating layer material finally obtained by adopting an electrowetting nonequilibrium response method T ) And surface charge density (. sigma.) T ) To examine the applied voltage (U) C ) The surface potential (U) of the corresponding position of the three-phase line of the original conductive liquid drop on the surface of the final hydrophobic insulating layer material T ) And surface charge density (σ) T ) The results obtained are shown in FIG. 6.
As can be seen from fig. 6, according to the above method for manufacturing patterned surface charges, the surface potential and the surface charge density of the corresponding positions at the three-phase line of the original conductive liquid drop on the surface of the final hydrophobic insulating layer material increase with the increase of the applied voltage.
Example 4
In substantially the same manner as in example 1, a voltage of-120V was applied between the upper electrode layer and the lower electrode layer in step S4, and the time for applying the voltage was changed to produce different patterned surface charges. Using electrowetting non-equilibrium soundTesting the surface potential (U) of the corresponding position of the three-phase line of the original conductive liquid drop on the surface of the hydrophobic insulating layer material finally obtained by the corresponding method T ) And surface charge density (σ) T ) So as to investigate the Time (Time) of voltage application on the surface potential (U) of the corresponding position of the three-phase line of the original conductive liquid drop on the surface of the final hydrophobic insulating layer material T ) And surface charge density (σ) T ) The results obtained are shown in FIG. 7.
As can be seen from fig. 7, according to the above method for manufacturing patterned surface charges, the surface potential and the surface charge density of the corresponding positions of the original conductive liquid drop at the three-phase line on the surface of the final hydrophobic insulating layer material increase with the time of applying voltage.
Example 5
A method of fabricating a patterned charge, comprising: taking down the substrate; arranging an ITO lower electrode layer on one surface of the upper substrate, and then arranging an insulating hydrophobic layer on the surface, deviating from the upper substrate, of the lower electrode layer by adopting a Teflon material; arranging conductive liquid drops on the surface of the hydrophobic insulating layer, which is far away from the lower electrode layer, according to a required surface charge target pattern, wherein in the embodiment, the surface charge target pattern is a circle which is linearly arranged at intervals, so that the conductive liquid drops are linearly arranged at intervals, and as shown in (a) in FIG. 8, the conductive liquid drops adopt ultrapure water; then inserting electrode rods contacted with the conductive liquid drops on the conductive liquid drops, grounding the lower electrode layer, applying-100V voltage to the electrode rods for 5min, removing the voltage, and applying the voltage to the conductive liquid drops one by one or simultaneously; and finally, removing the conductive liquid drop, and forming a plurality of small circular rings on the insulating hydrophobic layer to form surface charges in a linear interval arrangement shape, as shown in (b) in fig. 8.
Example 6
A method of fabricating patterned charges, a target pattern of surface charges being linear, the method comprising: taking a lower substrate, arranging an ITO lower electrode layer on one surface of the upper substrate, and then arranging an insulating hydrophobic layer on the surface, deviating from the upper substrate, of the lower electrode layer by adopting a Teflon material; insulating and protecting the edge of the lower electrode layer between the upper substrate and the insulating hydrophobic layer, immersing the lower electrode layer into a container containing conductive liquid, and enabling the liquid level of the conductive liquid to coincide with a target linear pattern of surface charges, as shown in (a) of fig. 9; then taking an electrode bar, inserting the electrode bar into the conductive liquid in the container, and applying-80V voltage between the electrode bar and the lower electrode layer through an external power supply for 10 min; after the voltage is removed, the material is taken out of the conductive liquid, the conductive liquid on the surface of the material is removed, and a linear surface charge is formed on the insulating hydrophobic layer, as shown in fig. 9 (b).
In addition, the electrowetting imbalance response method in the document Banpurkar, Aren G., et al, "capacitive electric field of fluorescent-water interface by electric field", Faraday dispersions 199(2017):29-47, was used to perform a 12h lasting surface charge density test on the finally obtained hydrophobic insulating layer material in this example to study the stability of the patterned surface charge on the material, and during the test, the liquid drop remained on the surface with the surface charge for 12h, and the test result is shown in FIG. 10. As can be seen from fig. 10, the hydrophobic insulating layer material was continuously measured for 12h, and the surface charge was not attenuated, and it can be seen that the patterned stable surface charge was produced by the above method.
The method for manufacturing the patterned surface charge in the above embodiment utilizes an external power supply, and can obtain the patterned surface charge by controlling the distribution setting of the conductive liquid droplets and changing the size of the conductive liquid droplets, and the like, specifically can control the form and displacement of three-phase lines of the conductive liquid droplets (or the conductive liquid) by the applied voltage of the external power supply, generate the patterned stable surface charge from micrometer scale to micro-nanometer scale, and can adjust the charge density of bound charges on the surface of the material by changing the size of the applied voltage or the time of the applied voltage, and then change the surface potential of the adjusted material; the method is convenient, quick, simple and feasible, can be realized by applying smaller voltage, does not need expensive instruments and complex processes, and has low production cost; the hydrophobic insulating film with patterned surface charges can be prepared by the method, and can be applied to preparation of microfluidic devices, nanofluidic devices, micro-nano electronic devices and the like.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A method of fabricating a patterned surface charge, comprising the steps of:
s1, arranging a lower electrode layer on the lower substrate; then, a hydrophobic insulating layer is arranged on the surface, deviating from the lower substrate, of the lower electrode layer;
s2, arranging conductive liquid drops on the surface, facing away from the lower electrode layer, of the hydrophobic insulating layer;
s3, arranging an upper electrode on the conductive liquid drop, wherein the upper electrode is in contact with the conductive liquid drop;
s4, applying a voltage between the upper electrode and the lower electrode layer;
s5, removing the conductive liquid drops after the voltage is removed;
arranging conductive liquid drops on the surface of the hydrophobic insulating layer, which is far away from the lower electrode layer, according to a required surface charge target pattern, and applying voltage to the conductive liquid drops through the upper electrode layer and the lower electrode layer one by one or simultaneously by utilizing an external power supply to prepare patterned surface charge; or, firstly, arranging one or more conductive liquid drops and correspondingly manufacturing a surface charge pattern, and then repeating the arrangement of the conductive liquid drops and the operation of manufacturing the surface charge pattern to finish the manufacture of the target pattern of the surface charge in times; in the power-up process, the contact angle between the conductive liquid drop and the hydrophobic insulating layer is influenced by the electric field energy generated by the bound charges to change, the three-phase line of the conductive liquid drop moves in the power-up process, and the moving range of the three-phase line is the width range of the formed surface charges; controlling the moving range of the conductive liquid drop three-phase line on the hydrophobic insulating layer by controlling the applied voltage so as to control the pattern formed by the bound charges on the surface; meanwhile, by changing the magnitude of the applied voltage and the time of the applied voltage to adjust the charge density of the surface bound charges, the surface potential of the hydrophobic insulating layer is changed.
2. The method of manufacturing a patterned surface charge according to claim 1, wherein in step S3, the upper electrode is an electrode rod inserted in the conductive droplet; in step S4, the lower electrode layer is grounded, and a voltage is applied to the upper electrode.
3. The method of claim 1, wherein in step S3, the upper electrode is an upper electrode layer disposed on an upper substrate;
step S2 specifically includes: arranging spacing support members on the hydrophobic insulating layer, and then arranging conductive liquid drops on the hydrophobic insulating layer in the areas where the spacing support members are not arranged;
step S3 specifically includes: and arranging an upper electrode layer on the upper substrate, and then arranging the upper substrate on the interval support, wherein the upper electrode layer on the upper substrate faces the conductive liquid drop and is in contact with the conductive liquid drop.
4. The method of fabricating a patterned surface charge according to claim 1, wherein the conductive liquid droplet is ultrapure water, an aqueous solution, an ionic liquid, or a liquid metal.
5. The method of claim 1, wherein the material of the hydrophobic insulating layer comprises at least one of PTFE, Teflon AF, Cytop, Hyflon, PDMS.
6. The method of claim 5, wherein the hydrophobic insulating layer has a thickness of 10nm to 5 mm.
7. The method for manufacturing a patterned surface charge according to claim 1, wherein the step S1 specifically comprises: and arranging a lower electrode layer on the lower substrate, then arranging an insulating layer on the surface of the lower electrode layer, which is far away from the lower substrate, and then arranging a hydrophobic insulating layer on the surface of the insulating layer, which is far away from the lower electrode layer.
8. The method of claim 7, wherein the insulating layer is made of a silicon-based dielectric material, a fluoropolymer, or Parylene.
9. A hydrophobic insulating film having a patterned surface charge, which is obtained by the method for producing a patterned surface charge according to any one of claims 1 to 8.
10. Use of the hydrophobic insulating film with patterned surface charge of claim 9 in the manufacture of a microfluidic device, a nanofluidic device, or a micro-nano electronic device.
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| CA2436488A1 (en) * | 2001-01-29 | 2002-08-08 | Genset S.A. | Method for carrying out a biochemical protocol in continuous flow in a microreactor |
| CN104907238A (en) * | 2015-05-05 | 2015-09-16 | 华南师范大学 | Method for preparing coating on surface of hydrophobic insulating layer |
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