CN110708860A - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN110708860A CN110708860A CN201910893174.8A CN201910893174A CN110708860A CN 110708860 A CN110708860 A CN 110708860A CN 201910893174 A CN201910893174 A CN 201910893174A CN 110708860 A CN110708860 A CN 110708860A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- chip
- area
- reinforcing sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
Abstract
The invention provides a flexible circuit board, which is characterized in that a circuit connection area and a non-functional area adjacent to the circuit connection area are arranged on the flexible circuit board, so that the combination of a chip and the circuit connection area is realized. In addition, the hollow-out area is arranged in the non-functional area, so that a part of the chip can cover the hollow-out area, the heat dissipation of the chip is improved, and the reinforcing sheet is arranged on the back of the non-functional area, so that the chip and the flexible circuit board are combined to provide good supporting strength and a flat surface, the combination capability of the chip and the flexible circuit board is improved, the combination interface of the chip and the flexible circuit board is improved, the heat dissipation capability of the chip is also improved, and the corrosion resistance of the combination interface of the flexible circuit board and the chip is also improved. Due to the design of the hollow-out area of the non-functional area, the reinforcing sheet can be in direct contact with the chip to improve the heat dissipation capacity, so that the service life of the chip on the flexible circuit board is prolonged, and the performance of the whole device is improved.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a flexible circuit board.
Background
Flexible Printed Circuit (FPC) is preferred because it breaks through conventional interconnection technology with excellent characteristics such as light weight, thin thickness, and free flexibility and folding. When the chip is packaged with the flexible circuit board, the chip does not have a stable substrate for packaging due to the soft and bendable characteristics of the flexible circuit board, and often after packaging, a plurality of air gaps are left between the chip and the flexible circuit board, which causes the problems of insecure chip packaging, easy falling and the like, thereby causing the failure of the whole packaging structure.
In addition, the light-emitting chip generates a large amount of heat, but the heat dissipation between the chip and the flexible circuit board is blocked, so that the heat is accumulated, and the service life and the performance of a final product are reduced.
Disclosure of Invention
In order to overcome the above problems, the present invention is directed to provide a flexible circuit board, so as to improve the bonding capability between the flexible circuit board and a chip and improve the heat dissipation performance of the chip.
In order to achieve the above object, the present invention provides a flexible circuit board comprising:
a circuit region for transmitting electrical signals;
a circuit connection region connected to the circuit region for connecting the chip and the circuit region;
and a non-functional region disposed adjacent to the circuit connection region for contact bonding with the chip.
In some embodiments, the non-functional area includes a hollow-out area for covering the chip on the hollow-out area, and at least a portion of the chip is in contact with and bonded to the non-hollow-out area of the non-functional area.
In some embodiments, the hollowed-out area is a mixture of one or more of a rectangle, a sector, a circle, and a triangle.
In some embodiments, the hollow-out region comprises a plurality of sub hollow-out regions arranged in an array.
In some embodiments, the hollowed-out area is a grid.
In some embodiments, the non-functional area is a protrusion, and the width of the protrusion is smaller than the width of the flexible circuit board.
In some embodiments, the flexible circuit board has a thickness of 0.1 to 0.2 mm.
In some embodiments, a ratio of the minimum width of the non-functional region to the width of the flexible circuit board is greater than 1/5 and less than 1.
In some embodiments, a reinforcing sheet is bonded to the back surface of the non-functional region.
In some embodiments, the reinforcing sheet is a ceramic reinforcing sheet.
In some embodiments, a reinforcing sheet is bonded to the back of the non-functional area, covers the hollowed-out area and is bonded to the non-hollowed-out area of the non-functional area at least in part in contact with the hollowed-out area.
In some embodiments, the width of the stiffener is less than the width of the flexible circuit board; the length of the reinforcing sheet is smaller than that of the flexible circuit board.
In some embodiments, the reinforcing sheet has a thickness of 0.05 to 1 mm.
In some embodiments, the reinforcing sheet is a ceramic reinforcing sheet.
In some embodiments, the material of the ceramic reinforcing sheet is a composite of one or more of aluminum nitride, aluminum oxide, or silicon nitride.
According to the flexible circuit board, the circuit connection area and the non-functional area adjacent to the circuit connection area are arranged on the flexible circuit board, so that the chip and the circuit connection area are combined. Moreover, the hollow-out area is arranged in the non-functional area, so that a part of the chip can cover the hollow-out area, the heat dissipation of the chip is improved, and the reinforcing sheet is arranged on the back of the non-functional area, so that the chip and the flexible circuit board are combined to provide good supporting strength and a flat surface, the combination capability of the chip and the flexible circuit board is improved, the combination interface of the chip and the flexible circuit board is improved, the heat dissipation capability of the chip is also improved, and the corrosion resistance of the combination interface of the flexible circuit board and the chip is improved. Furthermore, due to the design of the hollow-out region of the non-functional region, the reinforcing sheet and the chip can be in direct contact to improve the heat dissipation capability, and in addition, the reinforcing sheet is preferably a ceramic reinforcing sheet which not only can improve the heat dissipation capability, but also can resist corrosion, such as acid and alkali, so that the service life of the chip on the flexible circuit board and the performance of the whole device are improved.
Drawings
FIG. 1 is a schematic diagram of a flexible package structure according to an embodiment of the present invention
FIG. 2 is a schematic structural view of the cross section along AA' direction in FIG. 1
FIG. 3 is a schematic diagram of a flexible package structure according to an embodiment of the invention
FIG. 4 is a schematic structural view of the cross section along AA' direction of FIG. 3
FIG. 5 is a schematic structural diagram of a non-functional area according to an embodiment of the present invention
FIG. 6 is a schematic structural diagram of a non-functional area according to an embodiment of the present invention
FIG. 7 is a schematic structural diagram of a non-functional area according to an embodiment of the present invention
Detailed Description
In order to make the contents of the present invention more comprehensible, the present invention is further described below with reference to the accompanying drawings. The invention is of course not limited to this particular embodiment, and general alternatives known to those skilled in the art are also covered by the scope of the invention.
The present invention will be described in further detail with reference to the accompanying drawings 1 to 7 and specific embodiments. It should be noted that the drawings are in a simplified form and are not to precise scale, and are only used for conveniently and clearly achieving the purpose of assisting in describing the embodiment.
Referring to fig. 1 and 2, a flexible chip package structure of the present embodiment includes
A flexible circuit board 00;
a ceramic reinforcing sheet 02 disposed on the back surface of the flexible circuit board 00;
and the chip W is arranged on the front surface of the flexible circuit board 00, the chip W is opposite to the ceramic reinforcing sheet 02, and the ceramic reinforcing sheet 02 supports the back surface of the chip W.
The flexible circuit board 00 herein may have a non-functional region 01, the non-functional region 01 being adjacent to a circuit connection region, a ceramic reinforcing sheet being disposed in the non-functional region, and a chip W electrically connected to the circuit connection region.
Referring to fig. 3 and 4, the non-functional area 01 includes a hollow area Q, and the ceramic reinforcing sheet 02 is in contact with the back surface of the chip W through the hollow area Q. Here, in order to improve the supporting capability of the chip W after the ceramic reinforcing sheet 02 is combined with the circuit board 00, the width of the ceramic reinforcing sheet 02 is smaller than that of the flexible circuit board 00 and larger than that of the chip W; the length of the ceramic reinforcing sheet 02 is smaller than that of the flexible circuit board 00. Further here, the ratio of the minimum width of the nonfunctional area to the width of the flexible circuit board is greater than 1/5 and less than 1.
Here, the ceramic reinforcing sheet 02 and the back surface of the non-functional region 01 of the flexible circuit board 00 may be bonded by thermocompression. In order to improve the bonding strength between the ceramic reinforcing sheet 02 and the flexible circuit board 00 and the supporting force for the chip W after the ceramic reinforcing sheet 02 and the flexible circuit board 00 are bonded under a hot pressing process or other bonding processes, the thickness of the ceramic reinforcing sheet 02 is 0.05-1 mm, preferably, the thickness of the flexible circuit board 00 is 0.1-0.2 mm, and the thickness of the ceramic reinforcing sheet 02 is 0.1-0.2 mm. In order to achieve the above-mentioned thinner thickness and make the ceramic reinforcing sheet 02 at the thinner thickness have the required rigidity and strength, the material of the ceramic reinforcing sheet 02 may be one or a composite of more of aluminum nitride, aluminum oxide or silicon nitride. The ceramic reinforcing sheet 02 may be prepared in size by cutting.
The preparation method of the flexible chip packaging structure of the embodiment comprises the following steps:
step 01: bonding a ceramic reinforcing sheet on the back of a flexible circuit board; specifically, the ceramic reinforcing sheet may be bonded to the back surface of the flexible circuit board by thermocompression bonding.
In order to form a hollow-out region in the non-functional region of the flexible circuit board, step 01 may specifically include:
step 101: arranging a non-functional area on the flexible circuit board, and forming a hollow area in the non-functional area; the formation of the hollowed-out area can be realized by stamping or cutting.
Step 102: and bonding the ceramic reinforcing sheet on the back of the non-functional area of the flexible circuit board and aligning to the hollow area so as to cover the hollow area. Here, a ceramic reinforcing sheet is bonded to the back surface of the nonfunctional area of the flexible circuit board using a hot pressing process.
Step 02: and adhering the back surface of a chip to the front surface of the flexible circuit board and corresponding to the ceramic reinforcing sheet.
Specifically, the back surface of the chip and the flexible circuit board may be bonded by soldering.
In the present invention, preferably, the hollowed-out area may be a mixture of one or more of a rectangle, a sector, a circle, a triangle, and the like. The hollow-out area may include sub hollow-out areas, a plurality of sub hollow-out areas are arranged in an array, and the sub hollow-out areas may be one or a mixture of more of rectangles, sectors, circles, triangles and the like. In addition, the hollow-out area can also be in a grid shape.
Referring to fig. 5, a schematic structural diagram of a non-functional area according to another embodiment of the invention is shown. In fig. 5, the non-functional region 01 is also a hollow structure, and two bands are used as the non-functional region, and a hollow region is formed between the two bands.
Referring to fig. 6, a schematic structural diagram of a non-functional area according to another embodiment of the invention is shown. The non-functional region 01 in fig. 6 is a projection extending along the circuit connection region 03. The width of the projection is smaller than that of the flexible circuit board
Referring to fig. 7, a schematic structural diagram of a non-functional area according to another embodiment of the invention is shown. In fig. 7, the non-functional area 01 has a hollow area, and the hollow area is a semicircle or a sector.
In the present embodiment, the ceramic reinforcing sheet is described as an example, but in other embodiments, the ceramic reinforcing sheet may be replaced with another reinforcing sheet having rigidity and strength.
Although the present invention has been described with reference to preferred embodiments, which are illustrated for the purpose of illustration only and not for the purpose of limitation, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (15)
1. A flexible circuit board, comprising:
a circuit region for transmitting electrical signals;
a circuit connection region connected to the circuit region for connecting the chip and the circuit region;
and a non-functional region disposed adjacent to the circuit connection region for contact bonding with the chip.
2. The flexible circuit board of claim 1, wherein the non-functional area comprises a hollowed-out area for covering the chip on the hollowed-out area, and at least a portion of the chip is in contact with and bonded to the non-hollowed-out area of the non-functional area.
3. The flexible circuit board of claim 1, wherein the hollowed-out area is a mixture of one or more of rectangular, fan-shaped, circular, and triangular.
4. The flexible circuit board of claim 3, wherein the hollowed-out area comprises sub hollowed-out areas, and the sub hollowed-out areas are arranged in an array.
5. The flexible circuit board of claim 1, wherein the hollowed-out area is a grid.
6. The flexible circuit board of claim 1, wherein the non-functional area is a protrusion, and the width of the protrusion is smaller than the width of the flexible circuit board.
7. The flexible circuit board of claim 1, wherein the flexible circuit board has a thickness of 0.1-0.2 mm.
8. The flexible circuit board according to claim 1, wherein a ratio of a minimum width of the nonfunctional area to a width of the flexible circuit board is greater than 1/5 and less than 1.
9. The flexible circuit board of claim 1, wherein a reinforcing sheet is bonded to a back surface of the nonfunctional area.
10. The flexible circuit board of claim 9, wherein the stiffener is a ceramic stiffener.
11. The flexible circuit board of claim 2, wherein a reinforcing sheet is bonded to the back surface of the non-functional area, and the reinforcing sheet covers the hollowed-out area and is bonded to the non-functional area in a contact manner at least in part.
12. The flexible circuit board of claim 11, wherein the stiffener has a width less than a width of the flexible circuit board; the length of the reinforcing sheet is smaller than that of the flexible circuit board.
13. The flexible circuit board according to claim 9 or 11, wherein the thickness of the reinforcing sheet is 0.05 to 1 mm.
14. The flexible circuit board of claim 9 or 11, wherein the stiffener is a ceramic stiffener.
15. The flexible circuit board of claim 14, wherein the ceramic stiffener is a composite of one or more of aluminum nitride, aluminum oxide, or silicon nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910893174.8A CN110708860A (en) | 2019-09-20 | 2019-09-20 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910893174.8A CN110708860A (en) | 2019-09-20 | 2019-09-20 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110708860A true CN110708860A (en) | 2020-01-17 |
Family
ID=69195610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910893174.8A Pending CN110708860A (en) | 2019-09-20 | 2019-09-20 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110708860A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110600496A (en) * | 2019-09-20 | 2019-12-20 | 上海显耀显示科技有限公司 | Micro-LED chip packaging structure |
| CN111707712A (en) * | 2020-07-15 | 2020-09-25 | 襄阳臻芯传感科技有限公司 | Manufacturing method for increasing ceramic strength of nitrogen-oxygen sensor chip |
| CN115240550A (en) * | 2022-07-22 | 2022-10-25 | 湖北长江新型显示产业创新中心有限公司 | Display device |
-
2019
- 2019-09-20 CN CN201910893174.8A patent/CN110708860A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110600496A (en) * | 2019-09-20 | 2019-12-20 | 上海显耀显示科技有限公司 | Micro-LED chip packaging structure |
| CN111707712A (en) * | 2020-07-15 | 2020-09-25 | 襄阳臻芯传感科技有限公司 | Manufacturing method for increasing ceramic strength of nitrogen-oxygen sensor chip |
| CN111707712B (en) * | 2020-07-15 | 2023-10-10 | 襄阳臻芯传感科技有限公司 | Manufacturing method for increasing strength of porcelain body by using nitrogen-oxygen sensor chip |
| CN115240550A (en) * | 2022-07-22 | 2022-10-25 | 湖北长江新型显示产业创新中心有限公司 | Display device |
| CN115240550B (en) * | 2022-07-22 | 2023-08-18 | 湖北长江新型显示产业创新中心有限公司 | Display device |
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