CN212461713U - Flexible packaging structure of chip - Google Patents
Flexible packaging structure of chip Download PDFInfo
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- CN212461713U CN212461713U CN201921577343.9U CN201921577343U CN212461713U CN 212461713 U CN212461713 U CN 212461713U CN 201921577343 U CN201921577343 U CN 201921577343U CN 212461713 U CN212461713 U CN 212461713U
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- chip
- circuit board
- flexible circuit
- reinforcing sheet
- flexible
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Abstract
The utility model provides a chip flexible packaging structure has set up the enhancement piece at the flexible circuit board back, not only provides good support intensity and flat surface for the combination of chip and flexible circuit board, has improved the combining ability of chip and flexible circuit board, and improved chip and flexible circuit board combination interface, still improved the heat-sinking capability of chip to and the resistance to corrosion of flexible circuit board and chip combination interface.
Description
Technical Field
The utility model relates to a chip packaging technology field, concretely relates to flexible packaging structure of chip.
Background
Flexible Printed Circuit (FPC) is preferred because it breaks through conventional interconnection technology with excellent characteristics such as light weight, thin thickness, and free flexibility and folding. When the chip is packaged with the flexible circuit board, the chip does not have a stable substrate for packaging due to the soft and bendable characteristics of the flexible circuit board, and often after packaging, a plurality of air gaps are left between the chip and the flexible circuit board, which causes the problems of insecure chip packaging, easy falling and the like, thereby causing the failure of the whole packaging structure.
In addition, the light-emitting chip generates a large amount of heat, but the heat dissipation between the chip and the flexible circuit board is blocked, so that the heat is accumulated, and the service life and the performance of a final product are reduced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above problems, the utility model aims to provide a flexible packaging structure of chip improves chip and flexible circuit board's combining ability, improves packaging structure's heat dispersion.
In order to achieve the above object, the utility model provides a chip flexible packaging structure, include:
a flexible circuit board;
the reinforcing sheet is arranged on the back surface of the circuit board;
the chip is arranged on the front side of the circuit board, the chip is opposite to the reinforcing sheet, and the reinforcing sheet supports the back side of the chip.
In some embodiments, the flexible circuit board has a non-functional region adjacent to a circuit connection region, the stiffener is disposed in the non-functional region, and the chip is electrically connected to the circuit connection region.
In some embodiments, the non-functional region includes a hollow region, and the reinforcing sheet is in contact with the back surface of the chip through the hollow region.
In some embodiments, the chip is a micro-LED chip.
In some embodiments, the width of the stiffener is smaller than the width of the flexible circuit board and larger than the width of the chip; the length of the reinforcing sheet is smaller than that of the flexible circuit board.
In some embodiments, the stiffener is bonded to the back side of the flexible circuit board by thermocompression.
In some embodiments, the reinforcing sheet has a thickness of 0.05 to 1 mm.
In some embodiments, the thickness of the flexible circuit board is 0.1-0.2 mm, and the thickness of the reinforcing sheet is 0.1-0.2 mm.
In some embodiments, the material of the stiffener is a composite of one or more of aluminum nitride, aluminum oxide, or silicon nitride.
In order to achieve the above object, the present invention further provides a method for manufacturing a chip flexible package structure, including:
step 01: bonding a reinforcing sheet on the back of a flexible circuit board;
step 02: and adhering the back surface of a chip to the front surface of the flexible circuit board and corresponding to the reinforcing sheet.
In some embodiments, in step 01, the reinforcing sheet is bonded to the back surface of the flexible circuit board by thermocompression bonding.
In some embodiments, the step 01 specifically includes:
step 101: arranging a non-functional area on the flexible circuit board, and forming a hollow area in the non-functional area;
step 102: and bonding the reinforcing sheet on the back of the non-functional area of the flexible circuit board and aligning to the hollow area so as to cover the hollow area.
The utility model discloses a flexible chip packaging structure has set up the enhancement piece at the flexible circuit board back, not only provides good support intensity and flat surface for the combination of chip and flexible circuit board, has improved the combining ability of chip and flexible circuit board to and improved chip and flexible circuit board combination interface, has still improved the heat-sinking capability of chip to and the resistance to corrosion of flexible circuit board and chip combination interface.
Drawings
Fig. 1 is a schematic view of a flexible packaging structure according to an embodiment of the present invention
FIG. 2 is a schematic structural view of the cross section along AA' direction in FIG. 1
Fig. 3 is a schematic view of a flexible packaging structure according to an embodiment of the present invention
FIG. 4 is a schematic structural view of the cross section along AA' direction of FIG. 3
FIG. 5 is a schematic structural diagram of a non-functional area according to an embodiment of the present invention
FIG. 6 is a schematic structural diagram of a non-functional area according to an embodiment of the present invention
FIG. 7 is a schematic structural diagram of a non-functional area according to an embodiment of the present invention
Detailed Description
In order to make the contents of the present invention clearer and more understandable, the contents of the present invention are further explained below with reference to the drawings of the specification. Of course, the invention is not limited to this specific embodiment, and general alternatives known to those skilled in the art are also within the scope of the invention.
The present invention will be described in further detail with reference to the accompanying drawings 1 to 7 and specific embodiments. It should be noted that the drawings are in a simplified form and are not to precise scale, and are only used for conveniently and clearly achieving the purpose of assisting in describing the embodiment.
Referring to fig. 1 and 2, a chip flexible package structure of the present embodiment includes
A flexible circuit board 00;
a reinforcing sheet 02 disposed on the back surface of the flexible circuit board 00;
the chip W is arranged on the front surface of the flexible circuit board 00, and the chip W is opposite to the reinforcing sheet 02, and the reinforcing sheet 02 supports the back surface of the chip W. The chip W here may be a micro-LED chip. The reinforcing sheet 02 may be a ceramic reinforcing sheet.
The flexible circuit board 00 herein may have a non-functional region 01, the non-functional region 01 being adjacent to a circuit connection region, a ceramic reinforcing sheet being disposed in the non-functional region, and a chip W electrically connected to the circuit connection region.
Referring to fig. 3 and 4, the non-functional area 01 includes a hollow area Q, and the reinforcing sheet 02 contacts the back surface of the chip W through the hollow area Q. Here, in order to improve the supporting capability of the chip W after the reinforcing sheet 02 is combined with the circuit board 00, the width of the reinforcing sheet 02 is smaller than that of the flexible circuit board 00 and larger than that of the chip W; the length of the reinforcing sheet 02 is smaller than that of the flexible circuit board 00. Further here, the ratio of the minimum width of the nonfunctional area to the width of the flexible circuit board is greater than 1/5 and less than 1.
Here, the reinforcing sheet 02 and the back surface of the non-functional region 01 of the flexible circuit board 00 may be bonded by thermocompression. In order to improve the bonding strength between the reinforcing sheet 02 and the flexible circuit board 00 and the supporting force for the chip W after the ceramic reinforcing sheet 02 and the flexible circuit board 00 are bonded under the hot pressing process or other bonding processes, the thickness of the reinforcing sheet 02 is 0.05-1 mm, preferably, the thickness of the flexible circuit board 00 is 0.1-0.2 mm, and the thickness of the reinforcing sheet 02 is 0.1-0.2 mm. In order to achieve the above-mentioned thinner thickness and make the reinforcing sheet 02 at the thinner thickness have the required rigidity and strength, the material of the reinforcing sheet 02 may be one or a composite of more of aluminum nitride, aluminum oxide or silicon nitride. The reinforcing sheet 02 may be sized by cutting.
The preparation method of the flexible chip packaging structure of the embodiment comprises the following steps:
step 01: bonding a reinforcing sheet on the back of a flexible circuit board; specifically, the reinforcing sheet may be bonded to the back surface of the flexible circuit board by thermocompression bonding.
In order to form a hollow-out region in the non-functional region of the flexible circuit board, step 01 may specifically include:
step 101: arranging a non-functional area on the flexible circuit board, and forming a hollow area in the non-functional area; the formation of the hollowed-out area can be realized by stamping or cutting.
Step 102: and bonding the reinforcing sheet on the back of the non-functional area of the flexible circuit board and aligning to the hollow area so as to cover the hollow area. Here, a ceramic reinforcing sheet is bonded to the back surface of the nonfunctional area of the flexible circuit board using a hot pressing process.
Step 02: and adhering the back surface of a chip to the front surface of the flexible circuit board and corresponding to the reinforcing sheet.
Specifically, the back surface of the chip and the flexible circuit board may be bonded by soldering.
The utility model discloses in, the preferred, fretwork region can be the mixture of one kind or more of rectangle, fan-shaped, circular, triangle-shaped etc.. The hollow-out area may include sub hollow-out areas, a plurality of sub hollow-out areas are arranged in an array, and the sub hollow-out areas may be one or a mixture of more of rectangles, sectors, circles, triangles and the like. In addition, the hollow-out area can also be in a grid shape.
Fig. 5 is a schematic structural diagram of a non-functional area according to another embodiment of the present invention. In fig. 5, the non-functional region 01 is also a hollow structure, and two bands are used as the non-functional region, and a hollow region is formed between the two bands.
Fig. 6 is a schematic structural diagram of a non-functional area according to another embodiment of the present invention. The non-functional region 01 in fig. 6 is a projection extending along the circuit connection region 03. The width of the projection is smaller than that of the flexible circuit board
Fig. 7 is a schematic structural diagram of a non-functional area according to another embodiment of the present invention. In fig. 7, the non-functional area 01 has a hollow area, and the hollow area is a semicircle or a sector.
In the present embodiment, the ceramic reinforcing sheet is described as an example, but in other embodiments, the ceramic reinforcing sheet may be replaced with another rigid sheet having rigidity and strength.
Although the present invention has been described with reference to the preferred embodiments, which are given by way of illustration only, and not by way of limitation, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A chip flexible packaging structure is characterized by comprising:
a flexible circuit board;
the reinforcing sheet is arranged on the back surface of the circuit board;
the chip is arranged on the front side of the circuit board, the chip is opposite to the reinforcing sheet, and the reinforcing sheet supports the back side of the chip.
2. The chip flexible package structure according to claim 1, wherein the flexible circuit board has a non-functional region adjacent to a circuit connection region, the stiffener being disposed in the non-functional region, the chip being electrically connected to the circuit connection region.
3. The chip flexible package structure according to claim 2, wherein the non-functional region includes a hollowed-out region, and the stiffener contacts the back surface of the chip through the hollowed-out region.
4. The chip flexible package structure according to claim 1, wherein the chip is a micro-LED chip.
5. The chip flexible package structure according to claim 1, wherein the stiffener has a width smaller than that of the flexible circuit board and larger than that of the chip; the length of the reinforcing sheet is smaller than that of the flexible circuit board.
6. The chip flexible package structure according to claim 1, wherein the stiffener is bonded to the back surface of the flexible circuit board by thermocompression.
7. The chip flexible package structure according to claim 1, wherein the thickness of the stiffener is 0.05-1 mm.
8. The chip flexible package structure of claim 7, wherein the thickness of the flexible circuit board is 0.1-0.2 mm, and the thickness of the stiffener is 0.1-0.2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921577343.9U CN212461713U (en) | 2019-09-20 | 2019-09-20 | Flexible packaging structure of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921577343.9U CN212461713U (en) | 2019-09-20 | 2019-09-20 | Flexible packaging structure of chip |
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| Publication Number | Publication Date |
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| CN212461713U true CN212461713U (en) | 2021-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921577343.9U Active CN212461713U (en) | 2019-09-20 | 2019-09-20 | Flexible packaging structure of chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110600496A (en) * | 2019-09-20 | 2019-12-20 | 上海显耀显示科技有限公司 | Micro-LED chip packaging structure |
| CN110635011A (en) * | 2019-09-20 | 2019-12-31 | 上海显耀显示科技有限公司 | Chip flexible packaging structure and preparation method thereof |
-
2019
- 2019-09-20 CN CN201921577343.9U patent/CN212461713U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110600496A (en) * | 2019-09-20 | 2019-12-20 | 上海显耀显示科技有限公司 | Micro-LED chip packaging structure |
| CN110635011A (en) * | 2019-09-20 | 2019-12-31 | 上海显耀显示科技有限公司 | Chip flexible packaging structure and preparation method thereof |
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