CN110695516A - High-reflection-resistant laser processing system and processing method - Google Patents
High-reflection-resistant laser processing system and processing method Download PDFInfo
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- CN110695516A CN110695516A CN201911092630.5A CN201911092630A CN110695516A CN 110695516 A CN110695516 A CN 110695516A CN 201911092630 A CN201911092630 A CN 201911092630A CN 110695516 A CN110695516 A CN 110695516A
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- 238000012545 processing Methods 0.000 title claims abstract description 81
- 238000003672 processing method Methods 0.000 title claims abstract description 7
- 238000007781 pre-processing Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 16
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000002310 reflectometry Methods 0.000 abstract description 8
- 238000003754 machining Methods 0.000 description 22
- 238000012360 testing method Methods 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000012994 industrial processing Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract
The high-reflection resistant laser processing system comprises a first laser processing device and a second laser processing device, wherein the wavelength range of laser output by the first laser processing device is 450-700 nm, the processing method is that the first laser processing device outputs laser to irradiate a processed workpiece for preprocessing until the surface of an irradiated area of the workpiece is melted, and the second laser processing device outputs laser to irradiate the melted area of the surface of the workpiece for deep processing. After the surface of the workpiece is melted, the smoothness is damaged, so that the reflectivity of the workpiece is reduced, the absorptivity of the workpiece to light is improved, and the reflected light can be reduced by deep processing at the moment, so that the laser is prevented from being damaged by the reflected light.
Description
Technical Field
The invention relates to the technical field of laser processing.
Background
The materials with smooth surfaces, such as metal and glass, have good light reflection effect, and are called high-reflection (high-reflection light) materials, when the high-reflection materials are processed by laser, most of the laser emitted on the surfaces of the materials can be reflected back, and the laser can be damaged.
High reflection resistance has become an important research topic in the field of laser processing. The existing anti-high-reflection laser processing technology generally utilizes some special devices or structures to strip or strip the reflected light, for example, a cladding light stripper is arranged in a fiber cladding of a fiber laser to strip the reflected light in the cladding, which can only strip the reflected light in the cladding but cannot strip the reflected light in a fiber core. Another solution is to antireflective the reflected light by isolating the output head, which effectively solves the problem of reflected light, but the isolated output head has limited power tolerance. The above-mentioned prior art is based on a laser to solve the problem of reflected light that has already been generated, and does not fundamentally solve the problem of reflected light, that is, reflected light is not reduced.
Disclosure of Invention
Accordingly, the present invention provides a high-reflectivity laser processing system capable of reducing reflected light when processing a high-reflectivity material.
Applicants have discovered that short wavelength visible lasers have low divergence angles and small focused spots, with lower metal reflectivity, allowing more power for processing. I.e., highly reflective materials absorb visible light at short wavelengths significantly better and reflect less. And after the smoothness of the surface of the high-reflectivity material is damaged, the reflection effect on light rays is deteriorated, more light rays are absorbed, and the reflection is less.
In order to achieve the above object, the present invention provides the following technical solutions.
The high-reflection-resistant laser processing system comprises a first laser processing device and a second laser processing device, wherein the wavelength of laser output by the first laser processing device ranges from 450nm to 700nm, the first laser processing device outputs laser to irradiate a processed workpiece for preprocessing until the surface of an irradiated area of the workpiece is melted, and the second laser processing device outputs laser to irradiate the melted area of the surface of the workpiece for deep processing.
The high-reflection-resistant laser processing system comprises two laser processing devices, wherein the first laser processing device is used for preprocessing a workpiece until the surface of a processed area of the workpiece is molten, and after the surface is molten, the smoothness of the surface of the workpiece is damaged, so that the reflectivity of the workpiece is reduced, the absorptivity of the workpiece to light is improved, and the second laser processing device is used for outputting laser to deeply process the workpiece, so that the reflected light can be reduced, and the laser is prevented from being damaged by the reflected light. The wavelength range of the preprocessed laser is 450 nm-700 nm, the preprocessed laser belongs to visible light, the power is low, the workpiece made of the high-reflection material has good absorption and less reflection to the laser in the wavelength range, and the reflected light cannot damage the laser due to the low power. In addition, in the existing laser processing equipment, the high-reflection resistant laser processing system can be formed by additionally arranging a set of laser outputting visible light, the range of materials which can be processed by the existing laser processing equipment can be enlarged, and the refitting cost is low.
Further, the wavelength of the laser light output from the first laser processing device is 450nm, 488nm, 532nm, 635nm, or 650 nm. This is the preferred solution.
Wherein the wavelength of the laser beam output from the second laser processing device is in a range of 1 μm to 1.55 μm. The laser power of the wave band is high, and the laser is commonly used for industrial processing.
Further, the wavelength of the laser light output from the second laser processing device is 1.03 μm, 1.064 μm, 1.08 μm, 1.5 μm, or 1.55 μm. This is the preferred solution.
The invention also provides a high-reflection-resistant laser processing method, and when the method is applied to processing a high-reflection material, reflected light can be reduced.
The high-reflection resistant laser processing method comprises the following steps:
preprocessing: irradiating a processed workpiece by using laser with the wavelength within the range of 450 nm-700 nm until the surface of the irradiated area of the workpiece is melted;
deep processing: and irradiating the melted area of the surface of the workpiece by using laser with another wavelength.
The workpiece is preprocessed firstly until the surface of a processed area of the workpiece is molten, and after the surface is molten, the smoothness of the surface of the workpiece is damaged, so that the reflectivity of the workpiece is reduced, the absorptivity of the workpiece to light is improved, and at the moment, the workpiece is deeply processed, reflected light can be reduced, and the laser is prevented from being damaged by the reflected light. The wavelength range of the preprocessed laser is 450 nm-700 nm, the preprocessed laser belongs to visible light, the power is low, the workpiece made of the high-reflection material has good absorption and less reflection to the laser in the wavelength range, and the reflected light cannot damage the laser due to the low power.
Further, the wavelength of the laser used in the preprocessing step is 450nm, 488nm, 532nm, 635nm or 650 nm.
Wherein the wavelength of the laser used in the deep processing step is in the range of 1 to 1.55 μm.
Further, the wavelength of the laser light used in the deep processing step is 1.03 μm, 1.064 μm, 1.08 μm, 1.5 μm, or 1.55 μm.
Wherein, the preprocessing step lasts for a preset time length, and then the deep processing step is carried out. The test is firstly passed, and then the duration of the preprocessing step is set according to the test data, so that whether the surface of the processed region of the workpiece is molten or not is detected without preprocessing, and when the step is switched to the deep processing step is judged, the structure of a processing system is simplified, and the cost is saved.
Further, the preset time length is obtained according to the material of the processed workpiece and the wavelength of the laser adopted in the preprocessing step. The preprocessing time (i.e. the preset time) is usually closely related to the material of the workpiece to be processed and the wavelength of the laser used for preprocessing, and according to these two factors, the proper preprocessing time can be obtained through experiments.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a high back laser resistance machining system of the present invention;
FIG. 2 is a schematic structural diagram of another embodiment of a high back laser resistance machining system of the present invention;
fig. 3 is a schematic diagram of the laser spot moving during the machining process in one embodiment of the high-reflectivity resisting laser machining system of the present invention.
The reference numerals include:
a workpiece 1 to be machined;
a laser processing system 2, a first laser processing device 21, a second laser processing device 22;
a first spot 31 and a second spot 32.
Detailed Description
The present invention will be described in detail with reference to specific examples.
As shown in fig. 1, the high-reflection resistant laser processing system of the present embodiment includes a first laser processing device 21 for performing preprocessing and a second laser processing device 22 for performing deep processing, wherein the wavelength range of the laser light output by the first laser processing device 21 is above 450nm and below 700nm, the laser light is visible light and is used for melting the surface of the processed workpiece 1 and destroying the smoothness of the surface of the workpiece 1, and the second laser processing device 22 may be an existing laser commonly used for industrial processing. The workpiece 1 to be machined is irradiated with laser light output from the first laser machining device 21 to perform pre-machining of the workpiece 1 until the surface of the region of the workpiece 1 irradiated with the laser light output from the first laser machining device 21 is melted, and then the melted region of the surface of the workpiece 1 is irradiated with laser light output from the second laser machining device 22 to perform deep machining.
Through tests, the wavelength of the laser output by the first laser processing device 21 is 450nm, 488nm, 532nm, 635nm or 650nm, namely, the effect of outputting green light, blue light and red light is better. The wavelength range of the laser beam output from the second laser processing device 22 is 1 μm or more and 1.55 μm or less, and the wavelength of the laser beam output from the second laser processing device 22 is preferably 1.03 μm, 1.064 μm, 1.08 μm, 1.5 μm or 1.55 μm, which is a wavelength of a conventional laser beam generally used for industrial processing, and a high power can be achieved.
In this embodiment, the first laser processing device 21 and the second laser processing device 22 are two independent lasers, which facilitates the modification of the existing laser processing system. In another embodiment, as shown in fig. 2, the first laser machining device 21 and the second laser machining device 22 are two sets of laser machining devices in a multi-output laser machining system 2. It should be noted that the first laser processing apparatus 21 and the second laser processing apparatus 22 are abstract concepts and are not necessarily two entities, and in another embodiment, the first laser processing apparatus 21 and the second laser processing apparatus 22 may be different types when the same laser outputs laser beams having different wavelengths.
The invention also provides a high-reflection-resistant laser processing method, which comprises the following steps:
preprocessing: irradiating the processed workpiece 1 by using laser with the wavelength within the range of 450 nm-700 nm until the surface of the irradiated area of the workpiece 1 is melted;
deep processing: the region of the surface of the workpiece 1 that has been melted is irradiated with laser light of another wavelength.
The wavelength of the laser light used in the preprocessing step is preferably 450nm, 488nm, 532nm, 635nm or 650 nm. The wavelength of the laser light used in the deep processing step may be in the range of 1 μm to 1.55 μm, preferably 1.03 μm, 1.064 μm, 1.08 μm, 1.5 μm or 1.55 μm.
In order to simplify the structure of the laser processing system, the duration of the preprocessing step can be set to be a preset duration, that is, the duration of the preprocessing of the workpiece 1 is the preset duration, and the preset duration can be obtained according to the test data, so that a detection mechanism is not needed to be arranged to detect whether the surface of the workpiece 1 is molten or not, and when the surface is switched to the deep processing step. The preprocessing time duration of workpieces 1 of different materials can be set in the same laser processing system by combining tests according to the materials of the workpieces 1 to be processed and the wavelength of laser adopted by preprocessing. The duration of preprocessing is usually 2s to 5 s.
If the machining operation is moving, for example, cutting or grooving, as shown in fig. 3, the first spot 31 formed by irradiating the workpiece 1 with the first laser machining device 21 and the second spot 32 formed by irradiating the workpiece 1 with the second laser machining device 22 may be arranged side by side along the machining moving direction a (the direction indicated by the arrow a in fig. 3), and the first spot 31 is arranged in front of the first spot 31, and the length L1 of the first spot 31 in the machining moving direction a is set such that: t is L1/V, T is a preset time period for preprocessing the workpiece 1, and V is a speed of moving in the machining moving direction a. Thus, the first laser processing device 21 and the second laser processing device 22 can be simultaneously started to move at a constant speed along the processing moving direction a at the speed V, so that the workpiece 1 can be continuously processed. If the machining such as drilling is carried out, the first laser machining device 21 is started to output laser to irradiate the workpiece 1 for a preset time, at the moment, the surface of the irradiated area (the machined area) of the workpiece 1 is melted, and then the second laser machining device 22 is started to output the laser to irradiate the machined area with the melted surface for drilling.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. The high-reflection-resistant laser processing system is characterized by comprising a first laser processing device and a second laser processing device, wherein the wavelength of laser output by the first laser processing device is 450 nm-700 nm, the first laser processing device outputs laser to irradiate a processed workpiece for preprocessing until the surface of an irradiated area of the workpiece is melted, and the second laser processing device outputs laser to irradiate the melted area of the surface of the workpiece for deep processing.
2. The system of claim 1, wherein the first laser processing device outputs laser light having a wavelength of 450nm, 488nm, 532nm, 635nm, or 650 nm.
3. The system of claim 1, wherein the second laser processing device outputs laser light having a wavelength in a range of 1 μm to 1.55 μm.
4. The system of claim 3, wherein the second laser processing device outputs laser light having a wavelength of 1.03 μm, 1.064 μm, 1.08 μm, 1.5 μm, or 1.55 μm.
5. The high-reflection-resistant laser processing method is characterized by comprising the following steps of:
preprocessing: irradiating a processed workpiece by using laser with the wavelength within the range of 450 nm-700 nm until the surface of the irradiated area of the workpiece is melted;
deep processing: and irradiating the melted area of the surface of the workpiece by using laser with another wavelength.
6. The method according to claim 5, wherein the laser used in the preprocessing step has a wavelength of 450nm, 488nm, 532nm, 635nm or 650 nm.
7. The method according to claim 5, wherein the laser used in the deep processing step has a wavelength in a range of 1 μm to 1.55 μm.
8. The method according to claim 7, wherein the laser used in the deep processing step has a wavelength of 1.03 μm, 1.064 μm, 1.08 μm, 1.5 μm, or 1.55 μm.
9. The method of claim 5, wherein the preprocessing step is continued for a predetermined time period and then the deep processing step is performed.
10. The method of claim 9, wherein the predetermined time period is determined according to the material of the workpiece to be machined and the wavelength of the laser beam used in the preprocessing step.
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|---|---|---|---|---|
| US5272309A (en) * | 1990-08-01 | 1993-12-21 | Microelectronics And Computer Technology Corporation | Bonding metal members with multiple laser beams |
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| CN106232283A (en) * | 2014-02-28 | 2016-12-14 | Ipg光子公司 | Use the multi-beam laser processing of different wave length and/or multiple laser beams in pulse duration |
| CN106270877A (en) * | 2016-09-28 | 2017-01-04 | 深圳市艾贝特电子科技有限公司 | Based on FPC golden finger laser soldering apparatus and welding method |
| CN106312314A (en) * | 2016-11-16 | 2017-01-11 | 南京先进激光技术研究院 | Double laser beam welding system and method |
| JP2017056469A (en) * | 2015-09-15 | 2017-03-23 | 浜松ホトニクス株式会社 | Laser processing method and laser processing device |
| CN107598371A (en) * | 2017-09-21 | 2018-01-19 | 中国科学院长春光学精密机械与物理研究所 | A kind of welding method of coppersmith part |
| CN211072234U (en) * | 2019-11-11 | 2020-07-24 | 佛山市宝光新宇实业有限公司 | Anti-high-reflection laser processing system |
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2019
- 2019-11-11 CN CN201911092630.5A patent/CN110695516A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5272309A (en) * | 1990-08-01 | 1993-12-21 | Microelectronics And Computer Technology Corporation | Bonding metal members with multiple laser beams |
| CN103182604A (en) * | 2013-03-12 | 2013-07-03 | 镭射谷科技(深圳)有限公司 | Laser hybrid welding method and system |
| CN106232283A (en) * | 2014-02-28 | 2016-12-14 | Ipg光子公司 | Use the multi-beam laser processing of different wave length and/or multiple laser beams in pulse duration |
| CN105081568A (en) * | 2014-04-23 | 2015-11-25 | 中国科学院宁波材料技术与工程研究所 | Laser welding method |
| CN104084693A (en) * | 2014-07-25 | 2014-10-08 | 深圳市大族激光科技股份有限公司 | Laser welding method for high-reflecting material |
| JP2017056469A (en) * | 2015-09-15 | 2017-03-23 | 浜松ホトニクス株式会社 | Laser processing method and laser processing device |
| CN106270877A (en) * | 2016-09-28 | 2017-01-04 | 深圳市艾贝特电子科技有限公司 | Based on FPC golden finger laser soldering apparatus and welding method |
| CN106312314A (en) * | 2016-11-16 | 2017-01-11 | 南京先进激光技术研究院 | Double laser beam welding system and method |
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| CN211072234U (en) * | 2019-11-11 | 2020-07-24 | 佛山市宝光新宇实业有限公司 | Anti-high-reflection laser processing system |
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Application publication date: 20200117 |