CN110691507A - Image processing apparatus, electronic component mounting apparatus, and electronic component mounting method - Google Patents
Image processing apparatus, electronic component mounting apparatus, and electronic component mounting method Download PDFInfo
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- CN110691507A CN110691507A CN201910599770.5A CN201910599770A CN110691507A CN 110691507 A CN110691507 A CN 110691507A CN 201910599770 A CN201910599770 A CN 201910599770A CN 110691507 A CN110691507 A CN 110691507A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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Abstract
The invention provides an image processing apparatus, an electronic component mounting apparatus, and an electronic component mounting method, and aims to accurately recognize electronic components when a plurality of electronic components having the same shape are mounted on a substrate. The image processing apparatus includes: a reference color data acquisition unit (22) that acquires reference color data representing a reference color; an image data acquisition unit (33) that acquires image data representing an image of the electronic component; a color matching unit (34) that matches a reference color with a captured color of the electronic component derived from the image; and a processing unit (36) that determines the electronic component based on the comparison data of the reference color and the captured color, and outputs the determination data of the electronic component.
Description
Technical Field
The invention relates to an image processing apparatus, an electronic component mounting apparatus and an electronic component mounting method.
Background
In a manufacturing process of an electronic device, an electronic component mounting apparatus for mounting an electronic component on a substrate is used.
Patent document 1: japanese patent No. 5787440
In order to prevent the electronic component from being mounted on the substrate in an erroneous state, it is necessary to accurately recognize the electronic component before mounting on the substrate. When a plurality of electronic components having the same shape are mounted on a substrate, it may be difficult to accurately recognize the electronic components.
Disclosure of Invention
An object of an embodiment of the present invention is to accurately recognize electronic components when a plurality of electronic components having the same shape are mounted on a substrate.
According to an aspect of the present invention, there is provided an image processing apparatus including: a reference color data acquisition unit that acquires reference color data indicating a reference color; an image data acquisition unit that acquires image data representing an image of the electronic component; a color matching unit that matches the reference color with a captured color of the electronic component derived from the image; and a processing unit that determines the electronic component based on comparison data of the reference color and the captured color, and outputs determination data of the electronic component.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the aspect of the present invention, when a plurality of electronic components having the same shape are mounted on a substrate, the electronic components can be accurately recognized.
Drawings
Fig. 1 is a diagram schematically showing an example of an electronic component mounting apparatus according to embodiment 1.
Fig. 2 is a view schematically showing an example of the mounting head according to embodiment 1.
Fig. 3 is a diagram showing an example of the suction nozzle according to embodiment 1.
Fig. 4 is a diagram showing an example of an electronic component according to embodiment 1.
Fig. 5 is a functional block diagram showing an example of the control device and the image processing device according to embodiment 1.
Fig. 6 is a flowchart showing an example of the electronic component mounting method according to embodiment 1.
Fig. 7 is a diagram schematically showing an example of the electronic component mounting method according to embodiment 1.
Fig. 8 is a flowchart showing an example of the electronic component mounting method according to embodiment 2.
Fig. 9 is a diagram schematically showing an example of the electronic component mounting method according to embodiment 2.
Fig. 10 is a functional block diagram showing an example of the control device and the image processing device according to embodiment 3.
Fig. 11 is a flowchart showing an example of the electronic component mounting method according to embodiment 3.
Fig. 12 is a diagram schematically showing an example of the electronic component mounting method according to embodiment 3.
Description of the reference numerals
1 an electronic component mounting device, 2A base member, 3 a substrate conveying device, 3G guide mechanism, 3H holding member, 4 an electronic component supplying device, 4B ball, 4G guide mechanism, 4S emitting portion, 5 mounting head, 5B carriage, 5F base frame, 6 suction nozzle, 6B suction nozzle body, 6D arm driving device, 6H arm, 6Ha fixing arm, 6Hb movable arm, 6P hinge mechanism, 6S axis, 6T boss, 7 mounting head moving device, 7X axis driving device, 7Y axis driving device, 8 suction nozzle moving device, 8R rotation driving device, 8Z axis driving device, 9 photographing device, 10 storage device, 11 camera, 12 detection device, 12A irradiating device, 12B light receiving device, 20 control device, 21 … production program storage section, 22 … reference color data storage section, 23 … reference symbol data storage section, 24 … production program output section, 25 … reference color data transmission section, 26 … reference symbol data transmission section, 27 … control command output section, 30 … image processing apparatus, 31 … reference color data acquisition section, 32 … reference symbol data acquisition section, 33 … image data acquisition section, 34 … color collation section, 35 … symbol collation section, 36 … processing section, 37 … determination data transmission section, C … electronic component, Ca … main component, Cb … bump component, P … substrate, DP … waste position, IP … mounting position, MP … processing position, SP … supply position.
Detailed Description
Embodiments according to the present invention will be described below with reference to the drawings, but the present invention is not limited thereto. The constituent elements of the embodiments described below can be combined as appropriate. In addition, some of the components may not be used.
In the following description, an XYZ rectangular coordinate system is set, and the positional relationship of each portion is described with reference to the XYZ rectangular coordinate system. A direction parallel to an X axis of the predetermined surface is referred to as an X axis direction, a direction parallel to a Y axis orthogonal to the X axis on the predetermined surface is referred to as a Y axis direction, and a direction parallel to a Z axis orthogonal to the predetermined surface is referred to as a Z axis direction. The rotation direction about the X axis is defined as the θ X direction, the rotation direction about the Y axis is defined as the θ Y direction, and the rotation direction about the Z axis is defined as the θ Z direction. The prescribed plane is an XY plane.
[ embodiment 1 ]
Electronic component mounting apparatus
Embodiment 1 will be explained. Fig. 1 is a diagram schematically showing an example of an electronic component mounting apparatus 1 according to the present embodiment. The electronic component mounting apparatus 1 mounts the electronic component C on the substrate P. As shown in fig. 1, the electronic component mounting apparatus 1 includes: a base member 2; a substrate transfer device 3 that transfers the substrate P; an electronic component supply device 4 for supplying an electronic component C; a mounting head 5 for mounting the electronic component C on the substrate P; a suction nozzle 6 supported to the mounting head 5; a mounting head moving device 7 that moves the mounting head 5; a suction nozzle moving device 8 that moves the suction nozzle 6; an imaging device 9 that images the electronic component C; a storage device 10 that stores electronic components C; and a control device 20.
The substrate transport apparatus 3 includes: a holding member 3H which movably holds the substrate P; and a guide mechanism 3G that guides the holding member 3H. The holding member 3H holds the substrate P so that the surface of the substrate P is parallel to the XY plane. The holding member 3H is guided by the guide mechanism 3G to move in the X-axis direction. The substrate transfer device 3 transfers the substrate P to a processing position MP where mounting processing of the electronic component C is performed.
The electronic component supply device 4 sequentially supplies a plurality of electronic components C to the supply position SP. The electronic component supply device 4 includes a ball feeder. The electronic component supply device 4 includes: a ball 4B that houses a plurality of electronic components C; a launch section (shot) 4S connected to the ball 4B; and a guide mechanism 4G disposed on the ball 4B and the launching section 4S, respectively. The supply position SP is defined at the tip of the emitter 4S. A plurality of electronic components C are put into the balls 4B. The electronic component supply device 4 supplies the electronic component C housed in the ball 4B to a supply position SP defined at the tip end of the emitting portion 4S using at least one of vibration force and air force. The electronic component C housed in the ball 4B is guided by the guide mechanism 4G and moved to the supply position SP.
The mounting head 5 holds the electronic component C supplied to the supply position SP of the electronic component supply device 4 by the suction nozzle 6, and mounts the electronic component C on the surface of the substrate P disposed at the processing position MP.
The head moving device 7 includes an X-axis driving device 7X and a Y-axis driving device 7Y. The X-axis driving device 7X and the Y-axis driving device 7Y each include an actuator. The X-axis drive device 7X is coupled to the mounting head 5. By the operation of the X-axis driving device 7X, the mounting head 5 is moved in the X-axis direction. The Y-axis driving device 7Y is connected to the mounting head 5 via the X-axis driving device 7X. By the operation of the Y-axis driving device 7Y, the X-axis driving device 7X is moved in the Y-axis direction, whereby the mounting head 5 is moved in the Y-axis direction.
The storage device 10 stores the electronic components C that are not mounted on the substrate P. The storage device 10 includes a discard position DP. The electronic component C supplied to the supply position SP but not mounted on the board P is discarded to the storage device 10 by the mounting head 5.
< mounting head >
Fig. 2 is a diagram schematically showing an example of the mounting head 5 according to the present embodiment. The mounting head 5 has a suction nozzle 6 which can hold the electronic component C without releasing it. The mounting head 5 is movable in the XY plane so that the suction nozzles 6 are arranged at the supply position SP and the processing position MP, respectively. The mounting head 5 mounts the electronic component C supplied from the electronic component supply device 4 on the board P while being held by the suction nozzle 6.
The suction nozzle 6 holds the electronic component C supplied from the electronic component supply device 4 at the supply position SP. The suction nozzle 6 holds the electronic component C at the supply position SP, and then, transports the electronic component C to the processing position MP and mounts the electronic component C on the substrate P. After the electronic component C is mounted on the substrate P at the processing position MP, the suction nozzle 6 releases the electronic component C.
The mounting head 5 movably supports the suction nozzle 6 in the Z-axis direction and the θ Z direction. The suction nozzle 6 is supported on a base frame 5F of the mounting head 5 via a shaft 6S. The mounting head 5 has a nozzle transfer device 8 capable of transferring the nozzles 6 in the Z-axis direction and the θ Z direction. The nozzle moving device 8 is supported on the base frame 5F. The nozzle moving device 8 includes: a Z-axis drive device 8Z that moves the suction nozzle 6 in the Z-axis direction; and a rotation driving device 8R that rotates the suction nozzle 6 in the θ Z direction. The Z-axis drive device 8Z includes an actuator such as a motor, and generates power for moving the suction nozzle 6 in the Z-axis direction. The rotation driving device 8R includes an actuator such as a motor, and generates power for rotating the suction nozzle 6 in the θ Z direction.
The nozzles 6 are movable in 4 directions of an X axis, a Y axis, a Z axis, and θ Z by the head moving device 7 and the nozzle moving device 8. The suction nozzle 6 may be movable in 6 directions of X, Y, Z, θ X, θ Y, and θ Z.
The imaging device 9 is supported by the base frame 5F of the mounting head 5. The imaging device 9 includes a camera 11 and an image processing device 30. The camera 11 photographs the electronic component C at the supply position SP. The camera 11 acquires image data of the electronic component C disposed at the supply position SP and before being held by the suction nozzle 6. The camera 11 photographs the electronic component C placed at the supply position SP from above. The supply position SP is disposed on the-Y side of the processing position MP. The camera 11 is fixed to the-Y side of the mounting head 5. The image data of the electronic component C acquired by the camera 11 is output to the image processing apparatus 30.
The mounting head 5 further includes a detection device 12 for detecting the state of the electronic component C held by the suction nozzle 6. The state of the electronic component C includes at least one of the shape of the electronic component C and the position of the electronic component C. The detection device 12 detects the state of the electronic component C held by the suction nozzle 6 using laser light as detection light. The detection device 12 is supported by a bracket 5B connected to a lower portion of the base frame 5F.
The detection device 12 includes: an irradiation device 12A capable of irradiating the electronic component C held by the nozzle 6 with laser light; and a light receiving device 12B capable of receiving at least a part of the laser light emitted from the irradiation device 12A. The irradiation device 12A includes a light emitting element capable of emitting laser light. The light receiving device 12B includes a light receiving element capable of receiving laser light. The light receiving device 12B is disposed at a position facing the irradiation device 12A. The position of the irradiation device 12A and the position of the light receiving device 12B in the Z-axis direction are equal. The detection device 12 irradiates the electronic component C held by the suction nozzle 6 with laser light to detect the state of the electronic component C. The detection device 12 causes the irradiation device 12A to irradiate laser light, but may irradiate visible light (LED light) as the irradiation device.
The base frame 5F is moved by the operation of the mounting head moving device 7, whereby the suction nozzles 6, the suction nozzle moving device 8, the imaging device 9, and the detection device 12 supported on the base frame 5F are each moved together with the base frame 5F.
< suction nozzle >
Fig. 3 is a diagram showing an example of the suction nozzle 6 according to the present embodiment. The suction nozzle 6 is a holding suction nozzle that holds at least a part of the electronic component C by holding it therebetween. The suction nozzle 6 has: a nozzle main body 6B; an arm portion 6H supported by the nozzle body 6B and holding the electronic component C; an arm driving device 6D that drives at least a part of the arm portion 6H; and a projection 6T provided on the arm portion 6H. The arm portion 6H includes a fixed arm 6Ha and a movable arm 6 Hb. The movable arm 6Hb is supported by the nozzle main body 6B. The movable arm 6Hb is rotatable around the rotation shaft of the hinge mechanism 6P. The hinge mechanism 6P rotatably connects the movable arm 6Hb and the nozzle main body 6B. The movable arm 6Hb is rotatable about the rotation axis of the hinge mechanism 6P so as to move from one of the direction of approaching and separating from the fixed arm 6Ha to the other. The arm driving device 6D includes an actuator that generates power capable of moving the movable arm 6 Hb. The arm drive device 6D can move the movable arm 6Hb so as to move from one of a direction in which a part of the movable arm 6Hb facing the fixed arm 6Ha approaches the fixed arm 6Ha and a direction in which the part moves away from the fixed arm 6Ha to the other.
The arm portion 6H releasably holds the electronic component C. The arm portion 6H sandwiches and holds the electronic component C by the fixed arm 6Ha and the movable arm 6 Hb. The suction nozzle 6 holds the electronic component C by reducing the distance between the fixed arm 6Ha and the movable arm 6Hb in a state where at least a part of the electronic component C is arranged between the fixed arm 6Ha and the movable arm 6 Hb.
The convex portion 6T is provided on the support surface of the fixing arm 6Ha facing downward. The convex portion 6T is provided between the fixed arm 6Ha and the movable arm 6Hb to protrude downward from the support surface.
< electronic component >
Fig. 4 is a diagram showing an example of an electronic component C according to the present embodiment. The electronic component C is an insertion type electronic component. The electronic component C has: a main body part Ca; and a pair of convex parts Cb that protrude from the main body part Ca. The main body member Ca is made of synthetic resin. The convex part Cb is made of metal. The convex part Cb protrudes downward from the lower surface of the body part Ca. As shown in fig. 3, the suction nozzle 6 holds the body part Ca of the electronic component C by sandwiching it.
As the electronic component C, an automotive fuse, which is one of power fuses, is exemplified. When a current greater than or equal to a rated value is supplied to the electric circuit, the power fuse disconnects the supply of the current to protect the electric circuit.
The color of the main body part Ca is determined based on the rated value of the current to be cut by the power fuse. When the rated value of the current to be cut off by the power fuse is 10[ a ], the color of the main body part Ca is determined to be the 1 st color (for example, red). When the rated value of the current to be cut by the power fuse is 15a, the color of the main body part Ca is determined to be the 2 nd color (for example, blue). When the rated value of the current to be cut off by the power fuse is 20[ a ], the color of the main body part Ca is determined to be the 3 rd color (for example, yellow). When the rated value of the current to be cut off by the power fuse is 30[ a ], the color of the main body part Ca is determined to be the 4 th color (for example, green).
Further, the main body part Ca is provided with a mark based on a rated value of the current to be cut by the power fuse. The indicia includes one or both of text and numbers. When the rated value of the current to be cut off by the power fuse is 10[ a ], the main body part Ca is provided with a symbol "10" or "10A". When the rated value of the current to be cut off by the power fuse is 15[ a ], the main body part Ca is provided with a symbol "15" or "15A". When the rated value of the current to be cut off by the power fuse is 20[ a ], the main body part Ca is provided with a symbol "20" or "20A". When the rated value of the current to be cut off by the power fuse is 30[ a ], the main body part Ca is provided with a symbol "30" or "30A".
In the present embodiment, the plurality of electronic components C are each of the same shape. Even in the case of a plurality of electronic components C of different types, the external shapes and sizes of the plurality of electronic components C are substantially equal. The kind of the electronic component C includes a rated value of the current. Even if the plurality of electronic components C have different rated values of the current and different colors of the body part Ca or different marks provided on the body part Ca, the external shapes and sizes of the plurality of electronic components C are substantially equal. For example, the shape of the electronic component C having the body component Ca of the 1 st color is substantially equal to the shape of the electronic component C having the body component Ca of the 2 nd color.
FIG. 4 shows, as an example, the 1 st type electronic component C with a current rated value of 10[ A ] and the 4 th type electronic component C with a current rated value of 30[ A ]. As shown in fig. 4, the shape of the electronic component C of type 1 and the shape of the electronic component C of type 3 are substantially equal. Although not shown, the shape of the 2 nd type electronic component C having a current rating of 15[ A ] and the shape of the 3 rd type electronic component C having a current rating of 20[ A ] are substantially equal to the shape of the 1 st type electronic component C and the shape of the 4 th type electronic component C.
< control device and image processing device >
Fig. 5 is a functional block diagram showing an example of the control device 20 and the image processing device 30 according to the present embodiment.
The control device 20 includes a computer system that controls the electronic component mounting device 1. The control device 20 includes: an arithmetic Processing unit including a microprocessor such as a cpu (central Processing unit); and a storage device including a memory such as a rom (read Only memory) or a ram (random Access memory) and a storage.
The image processing apparatus 30 includes a computer system that processes an image of the electronic component C captured by the camera 11. The image processing apparatus 30 includes: an arithmetic Processing unit including a microprocessor such as a cpu (central Processing unit); and a storage device including a memory such as a rom (read Only memory) or a ram (random Access memory) and a storage.
The control device 20 can communicate with the image processing device 30. The control device 20 includes: a production program storage section 21, a reference color data storage section 22, a production program output section 24, a reference color data transmission section 25, and a control command output section 27.
The production program storage unit 21 stores a production program representing a program in which the operation procedure of the electronic component mounting apparatus 1 is described. The production program is predetermined based on the electronic device produced by the electronic component mounting apparatus 1 and is stored in the production program storage unit 21.
The reference color data storage unit 22 stores reference color data indicating a reference color related to the color of the electronic component C. The reference color is a color of the electronic component C to be used in the production of the electronic device, that is, a color of the electronic component C to be mounted on the substrate P. That is, the reference color indicates the correct color of the electronic component C to be mounted on the board P. In the present embodiment, the reference color indicates the color of the main body part Ca of the electronic component C to be mounted on the substrate P. The electronic component C to be mounted on the substrate P is predetermined based on the production process. Reference color data indicating a reference color is predetermined based on the production program and stored in the reference color data storage unit 22.
The production program output unit 24 extracts the production program from the production program storage unit 21 and outputs the production program to the control command output unit 27. The production program output unit 24 extracts reference color data indicating the color of the electronic component C to be mounted on the substrate P from the reference color data storage unit 22 based on the production program, and outputs the reference color data to the reference color data transmission unit 25.
The reference color data transmitting unit 25 transmits the reference color data output from the production program output unit 24 to the image processing apparatus 30.
The control command output part 27 outputs a control command for controlling the mounting head 5 based on the production program. The control command for controlling the mounting head 5 includes at least one of a control command for controlling the head moving device 7, a control command for controlling the nozzle moving device 8, and a control command for controlling the arm driving device 6D.
The image processing apparatus 30 includes: a reference color data acquisition unit 31, an image data acquisition unit 33, a color matching unit 34, a processing unit 36, and a determination data transmission unit 37.
The reference color data obtaining unit 31 obtains the reference color data indicating the reference color transmitted from the reference color data transmitting unit 25.
The image data acquisition unit 33 acquires image data representing an image of the electronic component C captured by the camera 11. The camera 11 can acquire a color image of the electronic component C. The image data represents a color image of the electronic component C.
The color matching unit 34 matches the reference color acquired by the reference color data acquisition unit 31 with the captured color of the electronic component C derived from the image acquired by the image data acquisition unit 33. The shooting color refers to a color in an image shot by the camera 11. That is, the shot color indicates the actual color of the electronic component C supplied to the supply position SP. The color matching unit 34 outputs matching data indicating a matching result of the reference color and the captured color to the processing unit 36.
In the present embodiment, the matching data of the reference color and the imaging color shows the degree of matching between the reference color and the imaging color. The color matching unit 34 derives the hue, lightness, and saturation of each of the reference color and the captured color. The color matching unit 34 compares the hue of the reference color with the hue of the captured color, compares the lightness of the reference color with the lightness of the captured color, and compares the saturation of the reference color with the saturation of the captured color. The color matching unit 34 determines that the hue of the reference color and the hue of the captured color match each other when the hue of the reference color and the hue of the captured color match each other or when the difference between the hue of the reference color and the hue of the captured color is smaller than or equal to a predetermined hue threshold value. The color matching unit 34 determines that the lightness of the reference color matches the lightness of the captured color, or that the difference between the lightness of the reference color and the lightness of the captured color is equal to or less than a predetermined lightness threshold value. The color matching unit 34 determines that the saturation of the reference color and the saturation of the image capturing color match each other when the saturation of the reference color and the saturation of the image capturing color match each other or when a difference between the saturation of the reference color and the saturation of the image capturing color is equal to or less than a predetermined saturation threshold. When it is determined that all of the hue, lightness, and saturation of the reference color and the captured color match, the color matching unit 34 determines that the reference color and the captured color match. When it is determined that at least one of the hue, lightness, and chroma of the reference color and the captured color does not match, the color matching unit 34 determines that the reference color and the captured color do not match.
The processing unit 36 determines the electronic component C based on the reference color output from the color matching unit 34 and the matching data of the photographed color.
In the present embodiment, the determination of the electronic component C by the processing unit 36 includes a determination as to whether or not the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P.
The processing unit 36 determines whether or not the electronic component C is an electronic component C to be mounted on the substrate P based on the comparison data of the reference color and the photographed color. The processing unit 36 outputs determination data of the electronic component C indicating a determination result of whether or not the electronic component C is an electronic component C to be mounted on the substrate P to the determination data transmitting unit 37.
The processing unit 36 determines that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P when it is determined that the reference color and the photographed color match each other based on the comparison data of the reference color and the photographed color. The processing unit 36 outputs, to the determination data transmitting unit 37, positive determination data, which is determination data indicating that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P.
When it is determined that the reference color and the photographed color do not match each other based on the comparison data of the reference color and the photographed color, the processing unit 36 determines that the electronic component C supplied to the supply position SP is not the electronic component C to be mounted on the substrate P. The processing unit 36 outputs determination data indicating whether the electronic component C supplied to the supply position SP is not the electronic component C to be mounted on the substrate P, that is, whether the electronic component C is not the electronic component C to be mounted on the substrate P, to the determination data transmitting unit 37.
The determination data transmitting unit 37 transmits the determination data output from the processing unit 36 to the control device 20. The control command output unit 27 acquires the determination data transmitted from the determination data transmitting unit 37. The control command output unit 27 outputs a control command for controlling the mounting head 5 based on the determination data output from the processing unit 36 and transmitted from the determination data transmitting unit 37.
< electronic component mounting method >
Fig. 6 is a flowchart showing an example of the electronic component mounting method according to the present embodiment. Fig. 7 is a diagram schematically showing an example of the electronic component mounting method according to the present embodiment.
In the control device 20, the production program output unit 24 extracts the production program from the production program storage unit 21 and outputs the production program to the control command output unit 27. The production program output unit 24 extracts the reference color data from the reference color data storage unit 22 based on the production program, and outputs the reference color data to the reference color data transmission unit 25. The reference color data transmitting unit 25 transmits the reference color data to the image processing apparatus 30 (step SA 11).
In the image processing apparatus 30, the reference color data obtaining unit 31 obtains the reference color data transmitted from the reference color data transmitting unit 25 (step SB 11).
The control command output part 27 controls the head moving device 7 based on the production program to move the mounting head 5 to the supply position SP (step SA 12).
As shown in fig. 7, the control command output unit 27 captures an image of the electronic component C placed at the supply position SP by the camera 11 before the electronic component C is held by the suction nozzle 6 (step SA 13).
The camera 11 outputs the image data of the electronic component C to the image data acquiring unit 33. The image data obtaining unit 33 obtains image data of the electronic component C (step SB 12).
The color matching unit 34 matches the reference color acquired by the reference color data acquisition unit 31 with the captured color of the electronic component C derived from the image acquired by the image data acquisition unit 33 (step SB 13).
The color matching unit 34 outputs matching data indicating the matching degree between the reference color and the captured color to the processing unit 36. The processing unit 36 determines whether or not the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P based on the comparison data of the reference color and the photographed color (step SB 14).
If it is determined at step SB14 that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P (step SB 14: Yes), the processing unit 36 outputs positive determination data indicating that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P to the determination data transmitting unit 37 (step SB 15).
If it is determined at step SB14 that the electronic component C supplied to the supply position SP is not an electronic component C to be mounted on the substrate P (No at step SB14), the processing unit 36 outputs determination data indicating whether or not the electronic component C supplied to the supply position SP is not an electronic component C to be mounted on the substrate P to the determination data transmitting unit 37 (step SB 16).
The determination data transmitting unit 37 transmits the determination data indicating either the positive determination data or the negative determination data output from the processing unit 36 to the control device 20 (step SB 17).
The control command output unit 27 acquires the determination data transmitted from the determination data transmitting unit 37 (step SA 14).
The control command output unit 27 determines whether or not the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the board P, based on the determination data transmitted from the image processing apparatus 30 (step SA 15).
If it is determined in step SA15 that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P (step SA 15: Yes), the control command output unit 27 outputs a control command to the mounting head 5 so that the electronic component C supplied to the supply position SP is mounted on the substrate P (step SA 16).
The mounting head 5 holds the electronic component C supplied to the supply position SP by the suction nozzle 6 based on the control command, and then conveys the electronic component C to the substrate P disposed at the processing position MP. The mounting head 5 mounts the electronic component C on the surface of the substrate P disposed at the processing position MP.
If it is determined in step SA15 that the electronic component C supplied to the supply position SP is not an electronic component C to be mounted on the substrate P (No in step SA15), the control command output unit 27 outputs a control command to the mounting head 5 to move the electronic component C supplied to the supply position SP to the disposal position DP (step SA 17).
The mounting head 5 holds the electronic component C supplied to the supply position SP by the suction nozzle 6 based on the control command, and then conveys the electronic component C to the storage device 10 including the discard position DP. The mounting head 5 discards the electronic component C to the storage device 10.
< Effect >
As described above, according to the present embodiment, when a plurality of electronic components C having the same shape are sequentially supplied from the electronic component supply device 4, the electronic components C are imaged by the camera 11, the reference color and the imaging color of the electronic components C derived from the image are compared, and whether or not the electronic components C are the electronic components C to be mounted on the substrate P is determined based on the comparison data of the reference color and the imaging color. Since the electronic component C is determined not based on the shape of the electronic component C but based on the color of the electronic component C, the electronic component C can be accurately recognized even when a plurality of electronic components C having the same shape are mounted on the substrate P.
For example, in a production process for mounting the 1 st kind of electronic component C having a rating of 10[ A ], it is possible to supply the electronic component C of a kind different from the 1 st kind (for example, the 2 nd kind) to the supply position SP. In the present embodiment, the electronic component C is an insertion type electronic component and is supplied to the supply position SP by the ball supply device. When the ball feeder is used, the operator puts a large number of electronic components C into the balls 4B. Although all of the plurality of electronic components C put into the ball 4B need only be the 1 st type of electronic component C, there is a possibility that another type (e.g., the 2 nd type) of electronic component C may be mixed into the electronic components C put into the ball 4B due to human error, for example. Since the rated value of the current of the 1 st type of electronic component C is different from the rated value of the current of the 2 nd type of electronic component C, if the 2 nd type of electronic component C is mounted on the substrate P in the production process of mounting the 1 st type of electronic component C, a defective electronic device is produced. Since the shape of the 1 st type of electronic component C is equal to the shape of the 2 nd type of electronic component C, it is difficult to distinguish the 1 st type of electronic component C from the 2 nd type of electronic component C using the detection device 12.
According to the present embodiment, the camera 11 capable of acquiring a color image is provided, and the electronic component C is determined based on the color of the electronic component C supplied to the supply position SP. Therefore, it is suppressed that the electronic component C having the same shape as the electronic component C to be mounted on the substrate P but different in kind (function) is mounted on the substrate P. Electronic components C which should not be mounted on the substrate P are prevented from being erroneously mounted on the substrate P, and defective electronic devices are prevented from being produced.
In the present embodiment, the supply position SP is disposed on the-Y side of the processing position MP, and the camera 11 is fixed to the side surface of the mounting head 5 closest to the-Y side of the supply position SP. This makes it possible to suppress the moving distance of the mounting head 5 when the electronic component C placed at the supply position SP is imaged by the camera 11.
In the present embodiment, the control device 20 that controls the mounting head 5 and the image processing device 30 that determines the electronic component C are different computer systems. The image processing device 30 transmits the determination data to the control device 20, and does not transmit the image data acquired by the camera 11. The imaging device 9 includes a camera 11 and an image processing device 30, and image data acquired by the camera 11 is transmitted to the image processing device 30 and is not transmitted to the control device 20. That is, the image data is communicated inside the imaging device 9, but is not transmitted to the control device 20. If image data having a large data capacity is transferred from the imaging device 9 to the control device 20, the load and time required for data transfer increase. In the present embodiment, since image data having a large data capacity is not transmitted to the control device 20, a delay in determination processing or a delay in installation processing due to, for example, a data transmission delay is suppressed. Therefore, a decrease in productivity of the electronic component mounting apparatus 1 is suppressed.
[ 2 nd embodiment ]
In this embodiment, an example will be described in which electronic components C of different colors are sequentially arranged at the supply position MP, and the type of the electronic component C is determined based on the color of the electronic component C.
< electronic component mounting method >
Fig. 8 is a flowchart showing an example of the electronic component mounting method according to the present embodiment. Fig. 9 is a diagram schematically showing an example of the electronic component mounting method according to the present embodiment.
In the control device 20, the reference color data transmission unit 25 transmits the reference color data to the image processing device 30. In the present embodiment, the reference color data transmitting unit 25 transmits reference color data indicating each of a plurality of reference colors to the image processing apparatus 30 (step SA 21).
In the image processing apparatus 30, the reference color data obtaining unit 31 obtains the reference color data indicating each of the plurality of reference colors transmitted from the reference color data transmitting unit 25 (step SB 21).
The control command output part 27 controls the head moving device 7 based on the production program to move the mounting head 5 to the supply position SP (step SA 22).
The control command output unit 27 captures an image of the electronic component C placed at the supply position SP by the camera 11 before the electronic component C is held by the suction nozzle 6 (step SA 23).
The camera 11 outputs the image data of the electronic component C to the image data acquiring unit 33. The image data obtaining unit 33 obtains image data of the electronic component C (step SB 22).
The color matching unit 34 matches each of the plurality of reference colors acquired by the reference color data acquisition unit 31 with the captured color of the electronic component C derived from the image acquired by the image data acquisition unit 33 (step SB 23).
The color matching unit 34 matches each of the plurality of reference colors with the captured color, and searches for a reference color matching the captured color from among the plurality of reference colors. The color matching unit 34 outputs matching data indicating a reference color matching the captured color from among the plurality of reference colors to the processing unit 36. The processing unit 36 determines the type of the electronic component C supplied to the supply position SP based on the comparison data of the reference color and the photographed color (step SB 24).
The processing unit 36 outputs determination data indicating the type of the electronic component C supplied to the supply position SP to the determination data transmitting unit 37. The determination data transmitting unit 37 transmits the determination data indicating the type of the electronic component C output from the processing unit 36 to the control device 20 (step SB 25).
The control command output unit 27 acquires the determination data transmitted from the determination data transmitting unit 37 (step SA 24).
The control command output unit 27 outputs a control command to the mounting head 5 so that the electronic component C supplied to the supply position SP is mounted on the mounting position IP of the board designated in the board P, based on the determination data sent from the image processing apparatus 30 (step SA 25).
As shown in fig. 9, when it is determined that the imaging color of the electronic component C1 supplied to the supply position SP is the 1 st color (for example, red) and the electronic component C1 supplied to the supply position SP is the 1 st type of electronic component C, the control command output unit 27 outputs a control command to the mounting head 5 so that the electronic component C1 is mounted at the mounting position IP1 of the board P.
When it is determined that the picked-up color of the electronic component C2 supplied to the supply position SP is the 2 nd color (for example, blue) and the electronic component C2 supplied to the supply position SP is the 2 nd type electronic component C, the control command output unit 27 outputs a control command to the mounting head 5 so that the electronic component C2 is mounted at the mounting position IP2 of the board P.
When it is determined that the picked-up color of the electronic component C3 supplied to the supply position SP is the 3 rd color (for example, yellow) and the electronic component C3 supplied to the supply position SP is the 3 rd type electronic component C, the control command output unit 27 outputs a control command to the mounting head 5 so that the electronic component C3 is mounted at the mounting position IP3 of the board P.
When it is determined that the picked-up color of the electronic component C4 supplied to the supply position SP is the 4 th color (for example, green) and the electronic component C4 supplied to the supply position SP is the 4 th type of electronic component C, the control command output unit 27 outputs a control command to the mounting head 5 so that the electronic component C4 is mounted at the mounting position IP4 of the board P.
< Effect >
As described above, according to the present embodiment, each of the plurality of reference colors is collated with the shooting color, and a reference color matching the shooting color is searched for from among the plurality of reference colors. The type of the electronic component C supplied to the supply position SP is determined based on the reference color matching the photographed color. Thus, even if different types of electronic components C are randomly supplied to the supply position SP, the image processing apparatus 30 can determine the type of the electronic component C supplied to the supply position SP. The control device 20 controls the mounting head 5 based on the kind of the electronic component C, thereby enabling the electronic component C to be accurately mounted to the mounting position IP specified based on the production program.
In the present embodiment, the image processing apparatus 30 can also determine whether or not the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P by comparing each of the plurality of reference colors with the captured color.
[ embodiment 3 ]
Embodiment 3 will be explained. In the following description, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
In this embodiment, an example of determining the electronic component C based on a mark provided on the electronic component C will be described. The symbol provided on the electronic component C includes one or both of characters and numbers such as "10" or "30" or "10A" or "30A" as described above with reference to fig. 4.
< control device and image processing device >
Fig. 10 is a functional block diagram showing an example of the control device 20 and the image processing device 30 according to the present embodiment. As shown in fig. 10, in the present embodiment, the control device 20 further includes a reference symbol data storage unit 23 and a reference symbol data transmission unit 26 in addition to the components described in the above-described embodiments.
The reference symbol data storage unit 23 stores reference symbol data indicating reference symbols related to the symbols provided in the electronic component C. The reference mark is a mark provided on the electronic component C to be used for production of electronic equipment, that is, a mark provided on the electronic component C to be mounted on the substrate P. That is, the reference symbol indicates a positive sign provided on the electronic component C to be mounted on the substrate P. In the present embodiment, the reference mark includes one or both of a letter and a numeral provided on the main body part Ca of the electronic component C to be mounted on the substrate P. The electronic component C to be mounted on the substrate P is predetermined based on the production process. Reference mark data indicating reference marks are predetermined based on the production program and stored in the reference mark data storage unit 23.
The production program output unit 24 extracts reference symbol data indicating a symbol provided on the electronic component C to be mounted on the substrate P from the reference symbol data storage unit 23 based on the production program, and outputs the extracted reference symbol data to the reference symbol data transmitting unit 26.
The reference mark data transmitting unit 26 transmits the reference mark data output from the production program output unit 24 to the image processing device 30.
The image processing apparatus 30 includes the reference symbol data acquisition unit 32 and the symbol matching unit 35 in addition to the components described in the above embodiment.
The reference symbol data acquisition unit 32 acquires reference symbol data indicating a reference symbol transmitted from the reference symbol data transmission unit 26.
The symbol matching unit 35 matches the reference symbol acquired by the reference symbol data acquisition unit 32 with the imaging symbol provided on the electronic component C derived from the image acquired by the image data acquisition unit 33. The imaging mark is a mark in the image captured by the camera 11. That is, the shot mark indicates a mark actually provided on the electronic component C supplied to the supply position SP. The reference mark includes one or both of a character and a numeral actually provided on the main body Ca of the electronic component C. The symbol matching unit 35 outputs matching data indicating a matching result between the reference symbol and the captured symbol to the processing unit 36.
In the present embodiment, the matching data of the reference symbol and the shot symbol indicates the degree of coincidence between the reference symbol and the shot symbol. The symbol matching unit 35 uses the reference symbol as a template and determines whether or not the reference symbol and the captured symbol match each other by a template matching method. When the similarity between the reference symbol and the image pickup symbol calculated by the template matching method is equal to or greater than the similarity threshold, the symbol matching unit 35 determines that the reference symbol and the image pickup symbol match. When the similarity between the reference symbol and the image pickup symbol calculated by the template matching method is smaller than the similarity threshold, the symbol matching unit 35 determines that the reference symbol and the image pickup symbol do not match.
The processing unit 36 determines the electronic component C based on the reference mark output from the mark comparison unit 35 and the comparison data of the shot mark.
In the present embodiment, the determination of the electronic component C by the processing unit 36 includes a determination as to whether or not the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P. The determination of the electronic component C by the processing unit 36 includes determination of the orientation of the electronic component C.
The processing unit 36 determines whether or not the electronic component C is an electronic component C to be mounted on the substrate P based on the comparison data of the reference mark and the imaging mark. The processing unit 36 determines the orientation of the electronic component C placed at the supply position SP based on the comparison data of the reference mark and the imaging mark. The processing unit 36 outputs, to the determination data transmitting unit 37, determination data of the electronic component C indicating a determination result of whether or not the electronic component C is an electronic component C to be mounted on the substrate P, and determination data of the electronic component C indicating a determination result of an orientation of the electronic component C.
The processing unit 36 determines that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P when it is determined that the reference mark and the imaging mark match each other based on the matching data of the reference mark and the imaging mark. The processing unit 36 outputs, to the determination data transmitting unit 37, positive determination data, which is determination data indicating that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P.
When the processing unit 36 determines that the reference mark and the imaging mark do not match each other based on the matching data of the reference mark and the imaging mark, it determines that the electronic component C supplied to the supply position SP is not the electronic component C to be mounted on the substrate P. The processing unit 36 outputs determination data indicating whether the electronic component C supplied to the supply position SP is not the electronic component C to be mounted on the substrate P, that is, whether the electronic component C is not the electronic component C to be mounted on the substrate P, to the determination data transmitting unit 37.
When it is determined that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P, the processing unit 36 outputs determination data indicating the orientation of the electronic component C to the determination data transmitting unit 37.
The determination data transmitting unit 37 transmits the determination data output from the processing unit 36 to the control device 20. The control command output unit 27 outputs a control command for controlling the mounting head 5 based on the determination data output from the processing unit 36 and transmitted from the determination data transmitting unit 37.
< electronic component mounting method >
Fig. 11 is a flowchart showing an example of the electronic component mounting method according to the present embodiment. Fig. 12 is a diagram schematically showing an example of the electronic component mounting method according to the present embodiment.
The production program output unit 24 extracts the reference symbol data from the reference symbol data storage unit 23 based on the production program, and outputs the extracted reference symbol data to the reference symbol data transmission unit 26. The reference symbol data transmitting unit 26 transmits the reference symbol data to the image processing device 30 (step SA 31).
In the image processing apparatus 30, the reference symbol data acquisition unit 32 acquires the reference symbol data transmitted from the reference symbol data transmission unit 26 (step SB 31).
The control command output part 27 controls the head moving device 7 based on the production program to move the mounting head 5 to the supply position SP (step SA 32).
The control command output unit 27 photographs the electronic component C placed at the supply position SP with the camera 11 before the electronic component C is held by the suction nozzle 6 (step SA 33).
The camera 11 outputs the image data of the electronic component C to the image data acquiring unit 33. The image data obtaining unit 33 obtains image data of the electronic component C (step SB 32).
The mark matching unit 35 matches the reference mark acquired by the reference mark data acquisition unit 32 with the imaging mark of the electronic component C derived from the image acquired by the image data acquisition unit 33 (step SB 33).
The symbol matching unit 35 outputs matching data indicating the matching degree between the reference symbol and the photographed symbol to the processing unit 36. The processing unit 36 determines whether or not the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P based on the comparison data of the reference mark and the imaging mark (step SB 34).
If it is determined at step SB34 that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P (step SB 34: Yes), the processing unit 36 outputs positive determination data indicating that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P to the determination data transmitting unit 37 (step SB 35).
If it is determined at step SB34 that the electronic component C supplied to the supply position SP is not an electronic component C to be mounted on the substrate P (No at step SB34), the processing unit 36 outputs determination data indicating whether or not the electronic component C supplied to the supply position SP is not an electronic component C to be mounted on the substrate P to the determination data transmitting unit 37 (step SB 36).
If it is determined at step SB34 that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P, the processing unit 36 outputs determination data of the electronic component C indicating the determination result of the orientation of the electronic component C supplied to the supply position SP to the determination data transmitting unit 37.
The determination data transmitting unit 37 transmits the determination data indicating either the positive determination data or the negative determination data output from the processing unit 36 to the control device 20 (step SB 37).
The control command output unit 27 acquires the determination data transmitted from the determination data transmitting unit 37 (step SA 34).
The control command output unit 27 determines whether or not the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the board P, based on the determination data transmitted from the image processing apparatus 30 (step SA 35).
If it is determined in step SA35 that the electronic component C supplied to the supply position SP is an electronic component C to be mounted on the substrate P (step SA 35: Yes), the control command output unit 27 outputs a control command to the mounting head 5 so that the electronic component C supplied to the supply position SP is mounted on the substrate P (step SA 36).
As shown in fig. 12, when a plurality of electronic components C are sequentially supplied to the supply position SP by the ball supply unit, there is a possibility that the orientations of the plurality of electronic components C in the XY plane are different. The electronic components C have the same shape. In the present embodiment, each of the plurality of electronic components C in the XY plane has a rectangular outer shape. If only the outer shape of the electronic component C is focused, even when a plurality of electronic components C can be viewed as being oriented in the same direction, as shown in fig. 12, when the plurality of electronic components C are viewed from a predetermined direction (for example, the-Y direction) in the XY plane, there may be an electronic component C in which the symbol can be accurately viewed and an electronic component C in which the symbol appears upside down.
The control command output unit 27 outputs a control command so that the plurality of electronic components C face the same direction on the substrate P based on the determination data indicating the directions of the electronic components C output from the processing unit 36. That is, as shown in fig. 12, when the plurality of electronic components C mounted on the board P are viewed from a predetermined direction (for example, the-X direction) in the XY plane, the control command output unit 27 outputs the control command to the mounting head 5 so that the marks provided on all the electronic components C can be accurately viewed.
The mounting head 5 holds the electronic component C supplied to the supply position SP by the suction nozzle 6 based on the control command, and then conveys the electronic component C to the substrate P disposed at the processing position MP. The mounting head 5 mounts the electronic component C on the surface of the substrate P disposed at the processing position MP. When the plurality of electronic components C are observed from a predetermined direction (for example, -X direction) in the XY plane, the mounting head 5 mounts the electronic components C on the substrate P so that the marks provided on all the electronic components C can be accurately observed.
If it is determined in step SA35 that the electronic component C supplied to the supply position SP is not an electronic component C to be mounted on the substrate P (No in step SA35), the control command output unit 27 outputs a control command to the mounting head 5 so that the electronic component C supplied to the supply position SP is moved to the disposal position DP (step SA 37).
The mounting head 5 holds the electronic component C supplied to the supply position SP by the suction nozzle 6 based on the control command, and then conveys the electronic component C to the storage device 10 including the disposal position DP. The mounting head 5 discards the electronic component C to the storage device 10.
< Effect >
As described above, according to the present embodiment, when a plurality of electronic components C having the same shape are sequentially supplied from the electronic component supply device 4, the electronic components C are imaged by the camera 11, the reference mark and the imaging mark of the electronic component C derived from the image are compared, and whether or not the electronic component C is an electronic component C to be mounted on the substrate P is determined based on the comparison data of the reference mark and the imaging mark. Since the electronic component C is determined not based on the shape of the electronic component C but based on the mark provided on the electronic component C, the electronic component C can be accurately recognized even when a plurality of electronic components C having the same shape are mounted on the substrate P.
According to the present embodiment, since the mark provided on the electronic component C supplied to the supply position SP is photographed by the camera 11, it is possible to determine in which direction the electronic component C is directed at the supply position SP. The control command output unit 27 can output a control command so that the marks of the plurality of electronic components C are oriented in the same direction on the substrate P based on the determination data. In the electronic device to be produced, the marks provided on the plurality of electronic components C are oriented in the same direction, and therefore, the design of the electronic device can be improved.
In the present embodiment, the processing unit 36 may determine the electronic component C using both the color and the symbol of the electronic component C.
Claims (12)
1. An image processing apparatus having:
a reference color data acquisition unit that acquires reference color data indicating a reference color;
an image data acquisition unit that acquires image data representing an image of the electronic component;
a color matching unit that matches the reference color with a captured color of the electronic component derived from the image; and
and a processing unit that determines the electronic component based on the comparison data of the reference color and the captured color, and outputs determination data of the electronic component.
2. The image processing apparatus according to claim 1,
the processing unit determines whether or not the electronic component is an electronic component to be mounted on a substrate based on the comparison data.
3. The image processing apparatus according to claim 1,
the reference color data acquisition unit acquires the reference color data indicating each of the plurality of reference colors,
the color matching unit matches each of the plurality of reference colors with the captured color,
the processing unit determines the type of the electronic component based on the comparison data.
4. The image processing apparatus according to any one of claims 1 to 3, wherein:
a reference symbol data acquisition unit that acquires reference symbol data indicating a reference symbol; and
a symbol matching unit for matching the reference symbol with a captured symbol provided on the electronic component and derived from the image,
the processing unit determines the electronic component based on the reference mark and the matching data of the shot mark, and outputs the determination data of the electronic component.
5. The image processing apparatus according to claim 4,
the processing unit determines the orientation of the electronic component based on the comparison data.
6. The image processing apparatus according to claim 5,
the reference mark and the photographing mark each include one or both of a letter and a number.
7. An electronic component mounting apparatus, comprising:
a mounting head for mounting an electronic component on a substrate; and
a control device capable of communicating with the image processing apparatus according to claim 6, and outputting a control command for controlling the mounting head based on the determination data output from the processing unit.
8. An electronic component mounting method comprising the steps of:
acquiring reference color data indicating a reference color;
acquiring image data representing an image of an electronic component;
comparing the reference color with a captured color of the electronic component derived from the image;
determining the electronic component based on the reference color and the matching data of the photographed color, and outputting the determination data of the electronic component; and
based on the determination data, a control command for controlling a mounting head for mounting an electronic component on a substrate is output.
9. The electronic component mounting method according to claim 8, wherein,
the determination of the electronic component includes a determination of whether or not the electronic component is an electronic component to be mounted on a substrate,
and outputting the control command so that the electronic component is mounted on the substrate when the electronic component is determined to be the electronic component to be mounted on the substrate based on the determination data, and outputting the control command so that the electronic component is moved to a disposal position when the electronic component is determined not to be the electronic component to be mounted on the substrate.
10. The electronic component mounting method according to claim 8, wherein,
comparing each of the plurality of reference colors with the photographing color,
the determination of the electronic component includes a determination of a kind of the electronic component,
and outputting the control command based on the determination data so that the electronic component is mounted at the specified mounting position of the substrate.
11. The electronic component mounting method according to any one of claims 8 to 10, comprising the steps of:
acquiring reference symbol data indicating a reference symbol;
comparing the reference mark with a photographed mark provided on the electronic component derived from the image; and
the electronic component is determined based on the reference mark and the comparison data of the shot mark, and the determination data of the electronic component is output.
12. The electronic component mounting method according to claim 11, wherein,
the determination of the electronic component includes a determination of an orientation of the electronic component,
outputting the control command based on the determination data so that the plurality of electronic components face the same direction in the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2018127834A JP7197292B2 (en) | 2018-07-04 | 2018-07-04 | Electronic component mounting apparatus and electronic component mounting method |
| JP2018-127834 | 2018-07-04 |
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| WO2021181592A1 (en) * | 2020-03-12 | 2021-09-16 | 株式会社Ｆｕｊｉ | Identification device and parts holding system |
| JP7398309B2 (en) * | 2020-03-25 | 2023-12-14 | ヤマハ発動機株式会社 | Surface mounter and image data transmission method |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2020009842A (en) | 2020-01-16 |
| CN110691507B (en) | 2023-03-10 |
| JP7197292B2 (en) | 2022-12-27 |
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