CN110690151B - LED packaging equipment for improving dispensing curing shape - Google Patents

LED packaging equipment for improving dispensing curing shape Download PDF

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Publication number
CN110690151B
CN110690151B CN201911093163.8A CN201911093163A CN110690151B CN 110690151 B CN110690151 B CN 110690151B CN 201911093163 A CN201911093163 A CN 201911093163A CN 110690151 B CN110690151 B CN 110690151B
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Prior art keywords
movably connected
gear
storage bag
support frame
far away
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CN201911093163.8A
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Chinese (zh)
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CN110690151A (en
Inventor
何锴璐
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SHENZHEN TONGYIFANG OPTOELECTRONIC TECHNOLOGY CO.,LTD.
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Shenzhen Tongyifang Optoelectronic Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations

Abstract

The invention relates to the technical field of LED packaging, and discloses LED packaging equipment for improving the dispensing curing shape, which comprises a support frame, wherein the top of the support frame is fixedly connected with a hollow channel, the interior of the hollow channel is movably connected with a fan wheel, the surface of the fan wheel is movably connected with a shaking body, one end of the shaking body, far away from the fan wheel, is movably connected with a storage bag, two sides of the storage bag are fixedly connected with folding rods, and one end of each folding rod, far away from the storage bag, is movably connected with a gear. The gear that can drive its bottom moves about the pinion rack surface, can make tooth and pinion rack mesh mutually when the gear removes, so the both ends of folding rod all can be extruded, deposit the bag promptly and be extruded, its inside colloid is extruded the release and flows to corresponding some glue inslot through the pipeline, in addition, the hot gas flow that blows off can dry the support frame after the washing, and also can directly go on the support frame when needs point is glued to the effect that has reached the reduction and has shifted and fix a position the number of times.

Description

LED packaging equipment for improving dispensing curing shape
Technical Field
The invention relates to the technical field of LED packaging, in particular to LED packaging equipment for improving a dispensing curing shape.
Background
The LED is a light emitting diode, wherein the light emitting diode package is a package for a light emitting chip, which is greatly different from the package for an integrated circuit, and the light emitting diode package not only requires protection of a wick, but also requires sufficient light transmittance.
The packaging of the light emitting diode is generally made by the steps of cleaning, mounting, pressure welding, dispensing and the like, the manufacturing of the light emitting diode can be completed only after one set of process, and adaptive equipment is required to be used for each step.
Although these devices can form a complete assembly line, the light emitting chips are precise components, the risk of damage is undoubtedly increased due to the increase of transfer times, and the devices need to be repositioned after each transfer, which is time-consuming and labor-consuming; in addition, when the light-emitting chip is subjected to dispensing, the shape of the cured colloid has strict requirements, because the shape directly relates to the light-emitting brightness of a backlight finished product, and the existing equipment does not have corresponding curing and shape-fixing equipment, so that the LED packaging equipment for improving the dispensing and curing shape is produced.
Disclosure of Invention
In order to achieve the purposes of reducing transfer and positioning times and stabilizing the form after glue dispensing and curing, the invention provides the following technical scheme: the utility model provides a improve LED encapsulation equipment of point solidification shape, includes the support frame, the top fixedly connected with cavity passageway of support frame, the inside swing joint of cavity passageway has a flabellum wheel, and the surperficial swing joint of flabellum wheel has the body of shaking, and the one end swing joint that the flabellum wheel was kept away from to the body of shaking has the storage bag, the equal fixedly connected with folding rod in both sides of storage bag, the one end swing joint that the bag was kept away from to the folding rod has the gear, and the surperficial swing joint of gear has tooth, and the one end swing joint that the gear was kept away from to tooth has the spring, and the spout has been seted up to the inside of gear.
The invention has the beneficial effects that:
1. through putting the support frame surface after will treating the LED die of encapsulation washing, start the drive assembly and blow in the hot gas flow through hollow channel, the gear that can drive its bottom when rocking the body and rocking moves about on the pinion rack surface, the gear removes and can make tooth and pinion rack mesh mutually, so the both ends of folding rod all can be extrudeed, deposit the bag promptly and be extruded, its inside colloid is extruded the release and flows to corresponding some glue inslot through the pipeline, in addition, the hot gas flow that blows off can be dried the support frame after the washing, and also can directly go on the support frame when needs point is glued, thereby reached the effect that reduces and shift and location number of times.
2. The fan impeller is blown by hot air flow to rotate, the flowing direction of the hot air flow is disturbed by the rotation of the fan impeller, the air flow enters the interior of the shaking body through the guide plate, when the colloid enters the interior of the dispensing groove through the liquid flow pipe, the air flow flows to the surface of the dispensing groove, and the adjacent dispensing grooves are communicated, so that the effect of stabilizing the shape after dispensing and curing is achieved.
Preferably, the surface of the teeth is movably connected with a toothed plate, and the toothed plate plays a role in extruding the teeth.
Preferably, the surface of the shaking body is movably connected with a dispensing slot, and the dispensing slot is fixed, so that the position of the dispensed LED tube core is fixed.
Preferably, the surface of the dispensing groove is movably connected with a flexible pipe, and the flexible pipe plays a role of connecting each dispensing groove in series, so that the temperatures of the dispensing grooves are the same, namely the dispensing shapes after molding are also the same.
Preferably, a guide plate is fixedly connected to the surface of the shaking body and located at the bottom of the fan wheel, and the guide plate plays a role in guiding the flowing direction of the airflow.
Preferably, the inside of the glue dispensing groove is movably connected with a liquid flow pipe, and the liquid flow pipe plays a role in guiding the flowing direction of the glue.
Preferably, one end of the folding rod, which is far away from the storage bag, is movably connected with the sliding groove.
Preferably, the diameter of the teeth is smaller than that of the toothed plate, so that the teeth are pressed when in contact.
Drawings
FIG. 1 is a front cross-sectional view of the support frame structure of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is a schematic view of the shaking body structure according to the present invention;
FIG. 4 is a schematic view of a fan blade wheel structure according to the present invention;
fig. 5 is a schematic view of a toothed plate structure of the present invention;
FIG. 6 is a schematic view of a folding bar according to the present invention;
fig. 7 is a schematic view of the tooth structure of the present invention.
In the figure: 1-support frame, 2-hollow channel, 3-impeller, 4-shaking body, 5-storage bag, 6-folding rod, 7-gear, 8-tooth, 9-spring, 10-sliding chute, 11-toothed plate, 12-glue dispensing groove, 13-flexible tube, 14-guide plate and 15-liquid flow tube.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, an LED package apparatus for improving dispensing curing shape includes a supporting frame 1, an LED die to be packaged is placed on a surface of the supporting frame 1, a hollow channel 2 is fixedly connected to a top of the supporting frame 1, the cleaned supporting frame 1 can be dried by a hot air flow blown out from the supporting frame, a fan blade wheel 3 is movably connected to an interior of the hollow channel 2, a shaking body 4 is movably connected to a surface of the fan blade wheel 3, a dispensing groove 12 is movably connected to a surface of the shaking body 4, a liquid flow tube 15 is movably connected to an interior of the dispensing groove 12, the liquid flow tube 15 plays a role of guiding a flow direction of a colloid, the colloid is silver colloid, the silver colloid is also called white colloid, milk white, and conductive adhesive (baking temperature: 100 ℃/1.5H) silver powder (conductive, heat dissipation, fixed wafer) + epoxy resin (cured silver powder) + diluent (easy to stir).
The dispensing groove 12 is fixed, so that the position of the LED tube core to be dispensed is fixed, the surface of the dispensing groove 12 is movably connected with a flexible tube 13, the flexible tube 13 plays a role of connecting each dispensing groove 12 in series, so that the temperature of the dispensing groove 12 is the same, namely the dispensing shape after forming is the same, the surface of the shaking body 4 and the bottom of the fan wheel 3 are fixedly connected with a guide plate 14, the fan wheel 3 rotates to disturb the flow direction of hot air, air flow enters the interior of the shaking body 4 through the guide plate 14, the guide plate 14 plays a role of guiding the flow direction of the air flow, one end of the shaking body 4 far away from the fan wheel 3 is movably connected with a storage bag 5, both sides of the storage bag 5 are fixedly connected with folding rods 6, one end of the folding rods 6 far away from the storage bag 5 is movably connected with a gear 7, the surface of the gear 7 is movably connected with teeth 8, and the surface of the teeth 8 is movably connected with a toothed plate 11, the shaking body 4 can drive the gear 7 at the bottom of the shaking body to move left and right on the surface of the toothed plate 11 while shaking, the diameter of the teeth 8 is smaller than that of the toothed plate 11, the teeth 8 are conveniently extruded when in contact, the toothed plate 11 plays a role of extruding the teeth 8, one end, far away from the gear 7, of each tooth 8 is movably connected with a spring 9, the springs 9 contract inwards to extrude the folding rod 6, because the gears 7 are symmetrically arranged, both ends of the folding rod 6 can be extruded, a sliding groove 10 is formed in the gear 7, and one end, far away from the storage bag 5, of the folding rod 6 is movably connected with the sliding groove 10; the hot air flow can endow the colloid with a certain temperature while drying the support frame 1, so that the colloid flows more smoothly, and the colloid can be directly combined with the LED tube core by adjusting the flowing temperature of the colloid, so that the redundant drying and bonding work is saved.
When the device is used, the driving part is started to blow hot air flow into the hollow channel 2, the air flow blows the fan wheel 3 to rotate, the fan wheel 3 rotates to drive the shaking moving body 4 to shake left and right, the gear 7 moves and simultaneously enables the teeth 8 to be meshed with the toothed plate 11, the teeth 8 meshed with the gear and the toothed plate can extrude the spring 9, namely the storage bag 5 is extruded, and colloid in the storage bag is extruded and released to flow into the corresponding glue dispensing groove 12 through a pipeline; the fan impeller 3 is blown by hot air flow to rotate, when colloid enters the colloid dispensing groove 12 through the liquid flow pipe 15, the air flow flows to the surface of the colloid dispensing groove 12, and part of the air flow enters the flexible pipe 13, so that the effect of stabilizing the shape of the solidified colloid dispensing is achieved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.

Claims (1)

1. The utility model provides an improve LED encapsulation equipment of point solidification shape, includes support frame (1), its characterized in that: the top of the support frame (1) is fixedly connected with a hollow channel (2), the interior of the hollow channel (2) is movably connected with a fan wheel (3), the surface of the fan wheel (3) is movably connected with a shaking body (4), and one end, far away from the fan wheel (3), of the shaking body (4) is movably connected with a storage bag (5); folding rods (6) are fixedly connected to two sides of the storage bag (5), one end, far away from the storage bag (5), of each folding rod (6) is movably connected with a gear (7), teeth (8) are movably connected to the surface of each gear (7), one end, far away from the gears (7), of each tooth (8) is movably connected with a spring (9), and a sliding groove (10) is formed in each gear (7); a toothed plate (11) is movably connected to the surface of the teeth (8); the surface of the shaking moving body (4) is movably connected with a glue dispensing groove (12); the surface of the glue dispensing groove (12) is movably connected with a flexible pipe (13); a guide plate (14) is fixedly connected to the surface of the shaking moving body (4) and positioned at the bottom of the fan impeller (3); a liquid flow pipe (15) is movably connected inside the glue dispensing groove (12); one end of the folding rod (6) far away from the storage bag (5) is movably connected with the sliding groove (10); the diameter of the teeth (8) is smaller than that of the toothed plate (11).
CN201911093163.8A 2019-11-11 2019-11-11 LED packaging equipment for improving dispensing curing shape Active CN110690151B (en)

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CN110690151B true CN110690151B (en) 2021-12-24

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112024308A (en) * 2020-09-01 2020-12-04 张富荣 Diode encapsulation is with location design auxiliary assembly
CN112701208B (en) * 2020-12-26 2021-12-17 江苏永鼎股份有限公司 Colloid rapid forming device for manufacturing semiconductor light-emitting diode

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200440728Y1 (en) * 2007-01-23 2008-06-27 주식회사 두원정밀 Dispensing Apparatus for LED Package
CN109701828A (en) * 2019-02-27 2019-05-03 肖金坚 A kind of dispenser for LED lamp production
CN208878942U (en) * 2019-01-31 2019-05-21 南京正涵光电科技有限公司 A kind of point glue equipment for LED light
CN209406722U (en) * 2018-11-20 2019-09-20 深圳市新天源电子有限公司 A kind of liquid crystal display automatic dispensing machine

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030185096A1 (en) * 2002-11-26 2003-10-02 Hollstein Thomas E. Apparatus and methods for dispensing minute amounts of liquid

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200440728Y1 (en) * 2007-01-23 2008-06-27 주식회사 두원정밀 Dispensing Apparatus for LED Package
CN209406722U (en) * 2018-11-20 2019-09-20 深圳市新天源电子有限公司 A kind of liquid crystal display automatic dispensing machine
CN208878942U (en) * 2019-01-31 2019-05-21 南京正涵光电科技有限公司 A kind of point glue equipment for LED light
CN109701828A (en) * 2019-02-27 2019-05-03 肖金坚 A kind of dispenser for LED lamp production

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Effective date of registration: 20211207

Address after: 518100 east side of floors 1-5, plant 4, xinlianhe Industrial Park, Heyi West Industrial Zone, Shajing street, Bao'an District, Shenzhen, Guangdong

Applicant after: SHENZHEN TONGYIFANG OPTOELECTRONIC TECHNOLOGY CO.,LTD.

Address before: 3b67, floor 3, No. 18, Zhongguancun Street, Haidian District, Beijing 100089

Applicant before: He Jielu

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