CN112701208B - Colloid rapid forming device for manufacturing semiconductor light-emitting diode - Google Patents
Colloid rapid forming device for manufacturing semiconductor light-emitting diode Download PDFInfo
- Publication number
- CN112701208B CN112701208B CN202011570532.0A CN202011570532A CN112701208B CN 112701208 B CN112701208 B CN 112701208B CN 202011570532 A CN202011570532 A CN 202011570532A CN 112701208 B CN112701208 B CN 112701208B
- Authority
- CN
- China
- Prior art keywords
- rod
- colloid
- die holder
- movably connected
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000084 colloidal system Substances 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000003292 glue Substances 0.000 claims abstract description 48
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 claims description 20
- 239000007924 injection Substances 0.000 claims description 20
- 239000002775 capsule Substances 0.000 claims description 18
- 230000002146 bilateral effect Effects 0.000 claims description 4
- 210000001503 joint Anatomy 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a quick molding device for colloid for manufacturing a semiconductor light-emitting diode, wherein the tail end of a movable rod is movably connected with an auxiliary rod, the bottom end of the auxiliary rod is movably arranged on the front surface and the rear surface of a side seat, a connecting frame is slidably arranged in the side seat, the top end of the connecting frame is movably connected with a supporting rod, a colloid mold cover is fixedly arranged between the adjacent connecting frames, and the top end of the supporting rod is movably connected with the connecting position of a rotating plate and the movable rod. It is rotatory to drive the movable rod when the rotor plate is rotatory, the movable rod drives the top of auxiliary rod and carries out the luffing motion, swing when the auxiliary rod is downward, the junction of movable rod and auxiliary rod, drive the inside lapse at the side seat of the terminal link of branch, it is downward to drive the colloid die cover simultaneously, the upright pinion rack and the gear engagement back of link bottom this moment, the die holder that drives the support frame top is simultaneously upwards removed, form quick butt joint, guarantee that the colloid surface after the injecting glue shaping is in same water flat line, subsequent rapid prototyping of being convenient for.
Description
Technical Field
The invention belongs to the technical field of semiconductor glue injection, and particularly relates to a colloid rapid forming device for manufacturing a semiconductor light-emitting diode.
Background
The semiconductor light emitting diode is a novel solid cold light source, is used as an indicator lamp in circuits and instruments or forms character or digital display, is the same as a common diode, generally needs to fix colloid on the outer surface of a chip in the manufacturing process to enable the chip to be in a fixed shape, and needs a specific device to ensure that the colloid is quickly molded while being injected.
In the glue injection process, the glue body generally needs to be fixed into a fixed shape, so that the glue injection cannot be performed quickly and effectively while the vertical shape of the formed glue body cannot be ensured, the glue injection efficiency is low, in addition, the forming speed of the glue body is slow after the glue injection, and the subsequent operation steps are not facilitated.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a rapid molding apparatus for a molding compound used in manufacturing a semiconductor light emitting diode, which is achieved by the following specific technical means:
a colloid rapid forming device for manufacturing a semiconductor light-emitting diode comprises a glue injection bin, wherein a rotating plate is installed inside the glue injection bin in a rotating mode, a movable rod is movably connected to the top end of the rotating plate, an auxiliary rod is movably connected to the tail end of the movable rod, the bottom end of the auxiliary rod is movably installed on the front surface and the rear surface of a side seat, a connecting frame is slidably installed inside the side seat, a supporting rod is movably connected to the top end of the connecting frame, a colloid mold cover is fixedly installed between every two adjacent connecting frames, the top end of the supporting rod is movably connected to the connecting position of the auxiliary rod and the movable rod, air outlet cylinders are arranged on the left side and the right side above the colloid mold cover, a piston plate is slidably installed inside the air outlet cylinders, a swing frame is movably connected to the outer end of the piston plate, the center of the swing frame is movably installed inside the glue injection bin, and the top end of the swing frame is movably connected to the front surface of the auxiliary rod, the below of colloid die cover is provided with the die holder, the bottom fixed mounting of die holder has the support frame, and the inside fixedly connected with hose of die holder, the bottom fixedly connected with of hose stores up the capsule, the apparent laminating of the outward appearance of storing up the capsule has the push pedal, the outer end of push pedal is provided with the atress pole, the upper surface of atress pole is provided with the sill bar in the below of link, the surface toothing of support frame has the gear, the surface toothing of gear rotates there is upright pinion rack, upright pinion rack fixed mounting is in the bottom of link.
Furthermore, the outer surface of the support frame is provided with a tooth block corresponding to the gear, the support frame and the vertical tooth plate are arranged in parallel from left to right, and the support frame is arranged in bilateral symmetry by taking the center of the die holder as a reference.
Further, the colloid die cover and the die holder are arranged in a vertically corresponding manner, the colloid die cover and the die holder are internally provided with glue grooves at equal intervals, and the die holder and the capsule storage are of an intercommunicating structure.
Further, fixed connection between the bottom of commentaries on classics board and the drive shaft, the link is T shape structure, and the link uses the center of colloid die cover to be accurate and be bilateral symmetry setting, link and sill bar correspond the setting from top to bottom, and it is rotatory to drive the movable rod when changeing the board rotation, and the movable rod drives the top of auxiliary rod and carries out the luffing motion, and when the auxiliary rod swing was downward, the junction of movable rod and auxiliary rod drove the terminal link of branch and slides downwards in the inside of side seat, drives the colloid die cover downwards simultaneously.
Furthermore, the outer surface of the bottom rod is sleeved with a spring, the bottom end of the bottom rod is designed to be an inclined plane, and the top of the bottom rod is provided with a pasting wheel corresponding to the connecting frame.
Further, the stress rod is inclined and arranged based on the inside of the glue injection bin, the push plate and the capsule storage are correspondingly arranged left and right, after the connecting frame moves to the bottom end, the connecting frame drives the bottom rod to move downwards, the bottom rod extrudes the stress rod, the stress rod pushes the push plate to move inwards simultaneously, and therefore the capsule is extruded and stored into the glue groove in the glue mold cover and the mold base, and glue injection forms glue.
Compared with the prior art, the invention has the following beneficial effects:
1. when glue needs to be injected, a chip of a light-emitting diode is placed in a glue groove in a die holder, a driving shaft drives a rotating plate to rotate, a movable rod is driven to rotate when the rotating plate rotates, the movable rod drives the top end of an auxiliary rod to swing up and down, when the auxiliary rod swings downwards, the connecting part of the movable rod and the auxiliary rod drives a connecting frame at the tail end of a supporting rod to slide downwards in the side seat and simultaneously drive a glue die cover to move downwards, and at the moment, after a vertical toothed plate at the bottom of the connecting frame is meshed with a gear, the die holder at the top of the supporting frame is driven to move upwards at the same time to form rapid butt joint, so that the surfaces of glue after glue injection molding are ensured to be in the same horizontal line.
2. When the connecting frame moves to the bottom end, the connecting frame drives the bottom rod to move downwards, the bottom rod extrudes the stress rod, the stress rod pushes the push plate to move inwards at the same time, so that the capsule is extruded into the rubber grooves in the rubber mold cover and the rubber mold base, rubber is injected to form a rubber body, after a primary rubber body is formed, the connecting frame drives the rubber mold cover and the rubber mold base to separate, the auxiliary rod drives the piston plate at the tail end of the swing frame to move inwards at the same time, hot air in the air outlet cylinder is extruded to be in contact with the rubber body which is formed in the primary molding mode, the rubber body can be molded quickly, and the molding speed of the rubber injection is increased.
Drawings
FIG. 1 is a schematic view of the internal structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the glue injection chamber of the present invention;
FIG. 3 is a schematic view of the structure of the joint between the movable rod and the auxiliary rod according to the present invention;
FIG. 4 is a schematic view of the connection between the die holder and the capsule storage unit.
In the figure: 1. injecting a glue bin; 2. rotating the plate; 3. a movable rod; 4. an auxiliary lever; 5. a side seat; 6. a connecting frame; 7. a strut; 8. a colloid mold cover; 9. an air outlet cylinder; 10. a piston plate; 11. placing a frame; 12. a die holder; 13. a support frame; 14. a hose; 15. storing the capsules; 16. pushing the plate; 17. a stress beam; 18. a bottom bar; 19. a gear; 20. a vertical toothed plate.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
the invention provides a colloid rapid forming device for manufacturing a semiconductor light-emitting diode, which is shown in the attached drawings 1 to 4: the glue injection device comprises a glue injection bin 1, wherein a rotating plate 2 is rotatably arranged inside the glue injection bin 1, the bottom end of the rotating plate 2 is fixedly connected with a driving shaft, the top end of the rotating plate 2 is movably connected with a movable rod 3, the tail end of the movable rod 3 is movably connected with an auxiliary rod 4, the bottom end of the auxiliary rod 4 is movably arranged on the front surface and the rear surface of a side seat 5, a connecting frame 6 is slidably arranged inside the side seat 5, the top end of the connecting frame 6 is movably connected with a supporting rod 7, a glue mold cover 8 is fixedly arranged between adjacent connecting frames 6, the connecting frame 6 is of a T-shaped structure, the connecting frame 6 is arranged in a left-right symmetrical mode by taking the center of the glue mold cover 8 as the reference, the connecting frame 6 and a bottom rod 18 are arranged in an up-down corresponding mode, the movable rod 3 is driven to rotate when the rotating plate 2 rotates, the movable rod 3 drives the top end of the auxiliary rod 4 to vertically swing, when the auxiliary rod 4 swings downwards, the movable rod 3 is connected with the auxiliary rod 4, drive the terminal link 6 of branch 7 in the inside lapse of side seat 5, it is downward to drive colloid mould lid 8 simultaneously, the spring has been cup jointed to the surface of sill bar 18, and the bottom of sill bar 18 is the inclined plane design, the top of sill bar 18 is provided with the wheel of pasting corresponding with link 6, the top swing joint of branch 7 is in the junction of movable rod 3 and auxiliary rod 4, both sides all are provided with out tuber pipe 9 about the top of colloid mould lid 8, the inside slidable mounting who goes out tuber pipe 9 has piston plate 10, the outer end swing joint of piston plate 10 has rocker 11, swing joint is located at the center of rocker 11 in the inside of injecting glue storehouse 1, and the top swing joint of rocker 11 is at the front surface of auxiliary rod 4.
A die holder 12 is arranged below the colloid die cover 8, a support frame 13 is fixedly arranged at the bottom of the die holder 12, a hose 14 is fixedly connected inside the die holder 12, a capsule storage 15 is fixedly connected at the bottom end of the hose 14, the colloid die cover 8 and the die holder 12 are arranged in an up-down corresponding manner, glue grooves are uniformly distributed in the colloid die cover 8 and the die holder 12, the die holder 12 and the capsule storage 15 are of an intercommunicating structure, a push plate 16 is attached to the outer surface of the capsule storage 15, a stress rod 17 is arranged at the outer end of the push plate 16, the stress rod 17 is obliquely arranged with the inner part of the glue injection bin 1 as a criterion, the push plate 16 and the capsule storage 15 are arranged in a left-right corresponding manner, when the connecting frame 6 moves to the bottom end, the connecting frame 6 drives the bottom rod 18 to move downwards, the bottom rod 18 extrudes the stress rod 17, the stress rod 17 pushes the push plate 16 to move inwards at the same time, so as to extrude the capsule storage 15 to extrude into the glue grooves in the colloid die cover 8 and the die holder 12, glue is injected to form a colloid, a bottom rod 18 is arranged on the upper surface of the stress rod 17 below the connecting frame 6, a gear 19 is meshed on the outer surface of the support frame 13, a vertical toothed plate 20 is meshed on the outer surface of the gear 19 in a rotating mode, the vertical toothed plate 20 is fixedly installed at the bottom of the connecting frame 6, toothed blocks corresponding to the gear 19 are arranged on the outer surface of the support frame 13, the support frame 13 and the vertical toothed plate 20 are arranged in a left-right parallel mode, and the support frame 13 is arranged in a left-right symmetrical mode with the center of the die holder 12 as the standard.
The specific use mode and function of the embodiment are as follows:
in the invention, when glue needs to be injected, a chip of a light emitting diode is placed in a glue groove in a die holder 12, a rotating plate 2 is driven to rotate by a driving shaft, a movable rod 3 is driven to rotate when the rotating plate 2 rotates, the movable rod 3 drives the top end of an auxiliary rod 4 to swing up and down, when the auxiliary rod 4 swings downwards, a connecting frame 6 at the tail end of a supporting rod 7 is driven to slide downwards in a side seat 5 at the connecting position of the movable rod 3 and the auxiliary rod 4, a colloid die cover 8 is driven to move downwards, at the moment, a vertical toothed plate 20 at the bottom of the connecting frame 6 is meshed with a gear 19, the die holder 12 at the top of a supporting frame 13 is driven to move upwards at the same time to form quick butt joint, the surface of the colloid after glue injection molding is ensured to be in the same horizontal line, after the connecting frame 6 drives a bottom rod 18 to move downwards, the bottom rod 18 extrudes a stress rod 17, the stress rod 17 pushes a push plate 16 to move inwards at the same time, thereby 15 crowds into the inside in colloid groove in colloid die cover 8 and the die holder 12 of extrusion storage capsule, the injecting glue forms the colloid, after forming preliminary colloid, link 6 drives and separates the back between colloid die cover 8 and the die holder 12, auxiliary rod 4 drives the terminal piston plate 10 of rocker 11 and moves to the inboard simultaneously, extrude the hot-air in the play dryer 9 and separately preliminary fashioned colloid contact for the colloid can rapid prototyping, accelerate the shaping speed of injecting glue.
The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.
Claims (6)
1. The utility model provides a semiconductor is colloid rapid prototyping device for emitting diode manufacturing, includes injecting glue storehouse (1), its characterized in that: the glue injection bin is characterized in that a rotating plate (2) is rotatably arranged inside the glue injection bin (1), a movable rod (3) is movably connected to the top end of the rotating plate (2), an auxiliary rod (4) is movably connected to the tail end of the movable rod (3), the bottom end of the auxiliary rod (4) is movably arranged on the front surface and the rear surface of a side seat (5), a connecting frame (6) is slidably arranged inside the side seat (5), a supporting rod (7) is movably connected to the top end of the connecting frame (6), a glue mold cover (8) is fixedly arranged between adjacent connecting frames (6), the top end of the supporting rod (7) is movably connected to the connecting position of the movable rod (3) and the auxiliary rod (4), air outlet cylinders (9) are arranged on the left side and the right side above the glue mold cover (8), a piston plate (10) is slidably arranged inside the air outlet cylinders (9), and a swing frame (11) is movably connected to the outer end of the piston plate (10), the center of the swing frame (11) is movably arranged in the glue injection bin (1), the top end of the swing frame (11) is movably connected to the front surface of the auxiliary rod (4), a die holder (12) is arranged below the colloid die cover (8), a support frame (13) is fixedly arranged at the bottom of the die holder (12), a hose (14) is fixedly connected inside the die holder (12), the bottom end of the hose (14) is fixedly connected with a capsule storage (15), a push plate (16) is obviously attached to the outer surface of the capsule storage body (15), a stress rod (17) is arranged at the outer end of the push plate (16), the upper surface of the stress rod (17) is provided with a bottom rod (18) below the connecting frame (6), the outer surface meshing of support frame (13) has gear (19), the outer surface meshing rotation of gear (19) has vertical toothed plate (20), vertical toothed plate (20) fixed mounting is in the bottom of link (6).
2. The apparatus for rapidly molding the colloid for manufacturing the semiconductor light emitting diode according to claim 1, wherein: the outer surface of the support frame (13) is provided with a tooth block corresponding to the gear (19), the support frame (13) and the vertical tooth plate (20) are arranged in parallel left and right, and the support frame (13) is arranged in bilateral symmetry with the center of the die holder (12) as the reference.
3. The apparatus for rapidly molding the colloid for manufacturing the semiconductor light emitting diode according to claim 1, wherein: the colloid die cover (8) and the die holder (12) are arranged up and down correspondingly, the colloid die cover (8) and the die holder (12) are provided with glue grooves at equal intervals inside, and the die holder (12) and the capsule storage (15) are of an intercommunicating structure.
4. The apparatus for rapidly molding the colloid for manufacturing the semiconductor light emitting diode according to claim 1, wherein: fixed connection between the bottom of commentaries on classics board (2) and the drive shaft, link (6) are T shape structure, and link (6) use the center of colloid mould lid (8) to be accurate and be bilateral symmetry setting, link (6) and sill bar (18) are corresponding the setting from top to bottom.
5. The apparatus for rapidly molding the colloid for manufacturing the semiconductor light emitting diode according to claim 1, wherein: the outer surface of the bottom rod (18) is sleeved with a spring, the bottom end of the bottom rod (18) is designed to be an inclined plane, and the top of the bottom rod (18) is provided with a pasting wheel corresponding to the connecting frame (6).
6. The apparatus for rapidly molding the colloid for manufacturing the semiconductor light emitting diode according to claim 1, wherein: the stress rod (17) is obliquely arranged by taking the inside of the glue injection bin (1) as a reference, and the push plate (16) and the capsule storage (15) are correspondingly arranged left and right.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011570532.0A CN112701208B (en) | 2020-12-26 | 2020-12-26 | Colloid rapid forming device for manufacturing semiconductor light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011570532.0A CN112701208B (en) | 2020-12-26 | 2020-12-26 | Colloid rapid forming device for manufacturing semiconductor light-emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112701208A CN112701208A (en) | 2021-04-23 |
| CN112701208B true CN112701208B (en) | 2021-12-17 |
Family
ID=75511107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011570532.0A Active CN112701208B (en) | 2020-12-26 | 2020-12-26 | Colloid rapid forming device for manufacturing semiconductor light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112701208B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101677071A (en) * | 2008-09-16 | 2010-03-24 | 玉晶光电股份有限公司 | Demoulding mechanism used in encapsulation process of light-emitting diode |
| CN108437547A (en) * | 2018-03-21 | 2018-08-24 | 郑州华美彩印纸品有限公司 | A kind of glue economizing type pressure setting |
| WO2019136991A1 (en) * | 2018-01-09 | 2019-07-18 | 南通斯迈尔精密设备有限公司 | Helically downward rotating glue injection assembly for semiconductor packaging mold |
| CN110202751A (en) * | 2019-06-17 | 2019-09-06 | 泉州市永茂电子科技有限公司 | A kind of injection mould slanted structure |
| CN110690151A (en) * | 2019-11-11 | 2020-01-14 | 何锴璐 | LED packaging equipment for improving dispensing curing shape |
-
2020
- 2020-12-26 CN CN202011570532.0A patent/CN112701208B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101677071A (en) * | 2008-09-16 | 2010-03-24 | 玉晶光电股份有限公司 | Demoulding mechanism used in encapsulation process of light-emitting diode |
| WO2019136991A1 (en) * | 2018-01-09 | 2019-07-18 | 南通斯迈尔精密设备有限公司 | Helically downward rotating glue injection assembly for semiconductor packaging mold |
| CN108437547A (en) * | 2018-03-21 | 2018-08-24 | 郑州华美彩印纸品有限公司 | A kind of glue economizing type pressure setting |
| CN110202751A (en) * | 2019-06-17 | 2019-09-06 | 泉州市永茂电子科技有限公司 | A kind of injection mould slanted structure |
| CN110690151A (en) * | 2019-11-11 | 2020-01-14 | 何锴璐 | LED packaging equipment for improving dispensing curing shape |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112701208A (en) | 2021-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112917831A (en) | Adjustable die for decorative materials | |
| CN211917613U (en) | Rapid demoulding device is used in production of military project machine tool casing | |
| CN214239266U (en) | Quick demoulding and cooling die device for die production | |
| CN219357713U (en) | Rack and pinion formula mould ejection of compact structure | |
| CN115121646B (en) | Complete die set of automobile LED lamp radiator | |
| CN112701208B (en) | Colloid rapid forming device for manufacturing semiconductor light-emitting diode | |
| CN210851271U (en) | Automatic labeling manipulator for blow molding barrel | |
| CN213006207U (en) | Injection molding machine for producing automobile parts | |
| CN208197333U (en) | A kind of plastic mould demoulding mechanism | |
| CN112172058B (en) | Intelligent injection molding device for fireproof window frame of window | |
| CN220031067U (en) | Injection mold for automobile headlamp | |
| CN217968167U (en) | Injection mold for automobile rear lamp shade | |
| CN108501314B (en) | Plastic gear injection mold | |
| CN219727296U (en) | Decoction piece tabletting device free of demoulding | |
| CN112622122A (en) | Cooling device is used in plastic mould processing | |
| CN219598073U (en) | Forming glue injection machine for metal bottle caps | |
| CN215039567U (en) | Can prepare moulding equipment of cavity building blocks | |
| CN221212568U (en) | Automobile decorative cover die | |
| CN220500057U (en) | Automatic molding press | |
| CN216300139U (en) | Combined plastic suction mould | |
| CN213137588U (en) | Heat dissipation mechanism for injection mold | |
| CN218227676U (en) | Plastic chair leg mold | |
| CN216782372U (en) | Forming die for processing rubber products | |
| CN219522933U (en) | Secondary ejection structure of plastic mold | |
| CN218640230U (en) | Multi-channel injection mold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20211129 Address after: 212511 north of Luxu section at 74k of national highway 318, Lili Town, Wujiang District, Suzhou City, Jiangsu Province Applicant after: Jiangsu Etern Co.,Ltd. Applicant after: Jiangsu Yongding Optoelectronic Technology Co.,Ltd. Applicant after: Suzhou Dingxin Photoelectric Technology Co.,Ltd. Address before: 510632 A418, room 1409, 365 Huangpu Avenue West, Tianhe District, Guangzhou City, Guangdong Province Applicant before: Guangzhou rongzhe Technology Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |