CN110678779A - Electronic structure unit - Google Patents
Electronic structure unit Download PDFInfo
- Publication number
- CN110678779A CN110678779A CN201880032726.XA CN201880032726A CN110678779A CN 110678779 A CN110678779 A CN 110678779A CN 201880032726 A CN201880032726 A CN 201880032726A CN 110678779 A CN110678779 A CN 110678779A
- Authority
- CN
- China
- Prior art keywords
- housing
- electronic component
- housing cover
- structural unit
- shaped body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 8
- 239000006261 foam material Substances 0.000 claims description 7
- 238000010276 construction Methods 0.000 claims 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
- G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
- G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
- G01S2015/937—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles sensor installation details
Landscapes
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention relates to an electronic component unit (10), in particular a sensor device, comprising a housing (12) that is sealed against the ingress of media, an electronic component (31, 32) that is arranged in an interior (14; 14a) of the housing (12), and a filler element (35; 35a) that reaches the electronic component (31, 32) at least approximately or is in contact with the electronic component.
Description
Technical Field
The invention relates to an electronic component, in particular a sensor arrangement, according to the preamble of claim 1.
Background
An electronic structural unit in the form of an ultrasonic sensor having the features of the preamble of claim 1 is known from DE 102015208561 a 1. The known assembly has a housing for receiving electronic components of the ultrasonic sensor, which are arranged on a circuit carrier, wherein the interior of the housing is filled with a filling material in the form of a water-resistant adhesive, which simultaneously seals the interior against the ingress of media, so that a separate housing cover for closing the interior of the housing can be dispensed with. As an alternative to this configuration of the electronic component, it is mentioned in the same document that instead of the material filling the interior space, a housing cover is used to seal the interior space. The use of a housing cover makes it possible to dispense with a filler arranged in the interior space, which is disadvantageous in this design because the air volume enclosed in the interior space generates air pressure variations in the event of temperature fluctuations, which can lead to a balanced flow through insufficiently sealed regions of the housing, in particular strands of the connecting lines for electrical contacting of the electronic components. In the presence of water or moisture, water or moisture can even be drawn into the interior of the housing, which can lead to corrosion or functional failure of the structural unit.
Disclosure of Invention
The electronic module according to the invention, in particular the sensor device, having the features of claim 1, has the following advantages: the electronic component unit prevents the medium from entering the interior of the housing during temperature changes or air pressure fluctuations when a housing cover is used that sealingly closes the interior of the housing.
The invention is based on the idea of minimizing the influence of temperature or pressure fluctuations by minimizing the volume of air enclosed in the housing. For this purpose, the invention provides that the housing of the electronic assembly has a housing cover which closes the interior, wherein the housing cover is connected to the housing element of the housing in such a way that it prevents the medium from entering the housing interior, and the filling element is formed by at least one molded body which is separate from the housing cover. Alternatively or additionally, the filling element is formed by the housing cover itself. The filler element has a shape adapted to the shape of the electronic component on the side facing the electronic component, such that the filler element is arranged in at least approximately abutting contact with the electronic component.
The electronic module thus constructed additionally has the following advantages: the necessary filling of the interior with a liquid medium can be dispensed with in the case of the filling agents compared with the prior art, so that the production process can be designed more quickly or more cost-effectively, for example, as a result of the unnecessary curing time.
Advantageous embodiments of the electronic component are specified in the dependent claims.
In order to minimize the air volume located in the interior of the housing by means of a corresponding shaping of the housing cover, wherein the housing cover is to be produced in a relatively simple or cost-effective manner, it is provided that the housing cover is designed as an injection-molded part and on the side facing the electronic component is designed with a receiving region for the electronic component, in which the component is arranged with preferably only a small gap or in a contact-bearing manner.
In order to minimize the weight of the housing cover or to save material, it is provided that the housing cover also has a shape at least partially adapted to the shape or arrangement of the electronic component on the side facing away from the electronic component, so that the wall thickness of the housing cover is approximately constant. Furthermore, this configuration also has the following advantages, depending on the application: the injection molding process can be used particularly well for the production of housing covers with high quality and low scrap rates.
In an alternative embodiment of the invention, it is provided that the at least one shaped body is made of plastic when the filling element is formed by the shaped body. Such a particularly rigidly designed shaped body can be designed, for example, as an insert piece that projects into the interior of the housing, i.e., as a separate component from the housing cover. It may also be provided that the separate element is bonded to the housing cover, for example, in order to form a common component. This has the advantage of a simplified production or assembly process, if necessary, since the introduction of the shaped body into the housing and the sealing or bonding of the housing cover to the housing can take place in a single production step.
A further alternative when the filling element is formed by at least one shaped body is to provide that the at least one shaped body is composed of a flexible material, in particular a foam material. Such a configuration of the shaped body has, inter alia, the following advantages: due to the corresponding dimensioning of the shaped body, the shaped body is arranged in direct abutting contact with the electronic component, so that the volume of air enclosed in the interior space can be minimized. Furthermore, the use of a flexible material makes it possible to allow greater tolerances in the arrangement of the electronic component in the interior, since the flexible material is elastically deformed, for example in the case of abutting contact with the electronic component. Furthermore, the use of shaped bodies made of foamed material has the following advantages: additional mechanical fixing or damping of the electronic component in the interior of the housing can be achieved in the case of elastic deformation of the foam material, and the volume of air located in the foam material is minimized by the elastic deformation of the foam material.
In order to achieve a particularly simple and effective sealing of the interior of the housing by the housing cover, it is provided that the housing cover is adhesively bonded to the housing element to form the housing.
The use of the electronic structural unit described so far in the form of an ultrasound transducer as a component of a driver assistance system is particularly preferred.
Drawings
Further advantages, features and details of the invention emerge from the following description of a preferred embodiment and with reference to the drawings.
The figures show:
FIG. 1 is a longitudinal section through an electronic module in the form of an ultrasonic sensor, in which a molded body made of plastic is used to minimize the air volume enclosed in the interior of the electronic module, and
fig. 2 is a partial longitudinal section of the structural unit, wherein a housing cover is used, which is shaped to minimize the air volume in the interior.
Elements that are identical or have the same function are denoted by the same reference numerals in the figures.
Detailed Description
Fig. 1 shows a longitudinal section through an electronic component 10 in the form of an ultrasonic sensor or an ultrasonic transducer 100, which is used in a vehicle, for example, as a component of a driver assistance system for detecting distances and is arranged in particular in the region of a bumper of the vehicle.
The electronic module 10 or the ultrasonic transducer 100 has a multi-part housing 12, which is produced in a known manner and comprises, for example, a housing element 13 for producing an interior 14, produced by injection molding. The housing element 13 can be closed by a housing cover 15, wherein the housing cover 15 is preferably also produced as an injection-molded part from plastic. The housing cover 15 has a circumferential receiving groove 16 in the edge region on the side facing the housing element 13, into which a similarly configured receiving tab 17 of the housing element 13 projects. Furthermore, in order to form a media-tight connection between the housing element 13 and the housing cover 15, an adhesive 18 for bonding the housing cover 15 to the housing element 13 is arranged in the region of the receiving groove 16, so that the inner chamber 14 of the housing 12 prevents the ingress of media.
On the side of the housing element 13 facing away from the housing cover 15, the housing element 13 is connected by means of a compensation element 21 and a fastening ring 22 to a metal diaphragm pot 25, in the region of which a piezoceramic device 26 in the form of a piezoelectric disk is arranged in a manner known per se. The region of the diaphragm pot 25 is filled with damping foam, not shown.
The piezoceramic device 26 is in electrical contact with the connecting pin 28 via a (bonding) line 27, wherein only one line 27 and one connecting pin 28 can be seen in the illustration of fig. 1, since the line 27 or the connecting pin 28 is arranged perpendicular to the plane of the drawing of fig. 1. The connecting pins 28 in turn make electrical contact with a circuit carrier 30 in the form of a circuit board, which is arranged in the inner chamber 14 of the housing 12. The circuit carrier 30 has an electronic circuit with a plurality of different electronic components 31, 32, wherein only some of the components 31, 32 are provided with corresponding reference numerals in the figures. The circuit carrier 30 can be contacted with a cable harness, not shown, of the vehicle by means of a further connecting pin 34, which opens into the region of the connecting plug 33.
In order to minimize the volume of air present in the interior 14 between the circuit carrier 30 or the components 31, 32 and the housing cover 15, it is provided that a filler element 35 is arranged in the interior 14 of the housing 12.
In the exemplary embodiment shown in fig. 1, the filling element 35 is composed of two molded bodies 36, 37 made of plastic, which are arranged on the one hand on the side facing the housing cover 15, preferably in abutting contact therewith, and which are adapted to the shape of the structural elements 31, 32 on the other hand on the side facing the structural elements 31, 32 in such a way that the volume existing between the housing element 13, the housing cover 15 and the structural elements 31, 32 is minimized. For this purpose, the shaped body 37 has, for example, a pot-shaped receiving region 38 for the structural element 32, wherein the receiving region 38 is adapted to the shape of the structural element 32.
It should additionally be mentioned that it is possible to provide that the two shaped bodies 36, 37 are adhesively bonded or welded to the housing cover 15, for example by ultrasonic welding.
Alternatively, it is conceivable for the shaped bodies 36, 37 or the filling element 35 made of plastic to be made of a (resiliently deformable) foam material, so that it can occur in particular that the filling element 35 or the shaped bodies 36, 37 rest against the structural elements 31, 32 with resilient deformation.
Fig. 2 shows an embodiment in which the housing cover 15a itself forms a filling element 35a for minimizing the air volume in the interior chamber 14 a. For this purpose, the housing cover 15a has a shape or a size on the side facing the structural elements 31, 32 such that the housing cover 15a approximately reaches the structural elements 31, 32 or the receiving region 38 for the structural elements 31, 32. Furthermore, it can be provided that the housing cover 15a also has a shape adapted to the shape or arrangement of the structural elements 31, 32 on the outer side 40 facing away from the inner chamber 14, so that the cover element 15a has an at least approximately constant wall thickness s over its entire extent.
The electronic structural unit 10 or the ultrasonic transducer 100 described so far can be modified or changed in various ways without departing from the idea of the present invention. For example, it can be provided in particular that the filling element 35 does not completely fill the volume located in the interior 14, but rather only fills the volume in regions. The filling elements 35 also do not have to be arranged in the region of each structural element 31, 32 or can have different spacings with respect to the structural elements 31, 32. The use of a housing cover 15a specially shaped as in fig. 2 in combination with additional shaped bodies 36, 37 made of plastic or of a foam material is also conceivable. Finally, the invention is not intended to be limited to ultrasonic transducers 100, but can in principle be applied to any electronic module 10 in which there is a risk of media entering the interior 14 due to fluctuations in air pressure or temperature in the air volume enclosed by the housing 12.
Claims (8)
1. An electronic component unit (10), in particular a sensor device, having a housing (12) sealed against the ingress of a medium, an electronic component (31, 32) arranged in an interior (14; 14a) of the housing (12), and a filler element (35; 35a) reaching at least approximately at the electronic component (31, 32) or coming into contact with it,
it is characterized in that the preparation method is characterized in that,
the housing (12) has a housing cover (15; 15a) which closes the inner chamber (14; 14a), the housing cover (15; 15a) being connected to the housing element (13) in a sealed manner in order to prevent the medium from entering the inner chamber (14; 14a), and/or the filling element (35; 35a) being formed by at least one separate shaped body (36, 37) or by the housing cover (15a) which has a shape adapted to the shape of the electronic component (31, 32) on the side facing the component (31, 32).
2. The structural unit according to claim 1,
the housing cover (15a) is designed as an injection-molded part made of plastic and is designed with a receiving region (38) for the electronic component (31, 32) on the side facing the electronic component (31, 32), in which receiving region the component (31, 32) is arranged with preferably only a small gap or in a contact-bearing manner.
3. The structural unit according to claim 1 or 2,
the housing cover (15a) has a shape that at least partially adapts to the shape or arrangement of the electronic component (31, 32) on an outer side (40) facing away from the electronic component (31, 32) when the filling element (35a) is formed by the housing cover (15a), and the wall thickness(s) of the housing cover (15a) is at least approximately constant.
4. The structural unit according to claim 1,
in the case of the construction of the filling element (35) by means of at least one shaped body (36, 37), the at least one shaped body (36, 37) consists of plastic.
5. The structural unit according to claim 1,
in the case of the construction of the filling element (35) by means of at least one shaped body (36, 37), the at least one shaped body (36, 37) consists of a flexible material, in particular a foam material.
6. The structural unit according to claim 5,
the at least one shaped body (36, 37) is arranged at least partially in abutting contact with the electronic component (31, 32).
7. The structural unit according to any one of claims 1 to 6,
the housing cover (15; 15a) is bonded or welded to the housing element (13).
8. The structural unit according to any one of claims 1 to 7,
the structural unit is designed as an ultrasonic transducer (100) of a driver assistance system.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017208352.2 | 2017-05-18 | ||
| DE102017208352.2A DE102017208352A1 (en) | 2017-05-18 | 2017-05-18 | Electronic assembly |
| PCT/EP2018/057867 WO2018210474A1 (en) | 2017-05-18 | 2018-03-28 | Electronic assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110678779A true CN110678779A (en) | 2020-01-10 |
Family
ID=61832500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880032726.XA Pending CN110678779A (en) | 2017-05-18 | 2018-03-28 | Electronic structure unit |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3625587A1 (en) |
| CN (1) | CN110678779A (en) |
| DE (1) | DE102017208352A1 (en) |
| WO (1) | WO2018210474A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018126596B4 (en) * | 2018-10-25 | 2021-09-16 | Valeo Schalter Und Sensoren Gmbh | Ultrasonic sensor with cover to reduce the free space |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4000585A1 (en) * | 1990-01-10 | 1991-07-11 | Wolfgang Brunner | Location transmitting meter for athletes - damped structure transmits ultrasonic signal from electroacoustic transducer and has photoelectric transducer for light signal |
| DE102009022187A1 (en) * | 2009-05-20 | 2010-11-25 | Valeo Schalter Und Sensoren Gmbh | Ultrasound sensor and/or ultrasound converter for use in surrounding field recognition system in motor vehicle, has housing provided with piezo-ceramics for production of ultrasound vibrations in membrane pot and filled with granulates |
| CN102065361A (en) * | 2009-10-29 | 2011-05-18 | 罗伯特·博世有限公司 | Ultrasonic transducer used in fluid medium |
| US20160139250A1 (en) * | 2013-06-20 | 2016-05-19 | Robert Bosch Gmbh | Surroundings-sensing device having a modular ultrasonic transducer, and motor vehicle having such a surroundings-sensing device |
| US20160329037A1 (en) * | 2013-12-23 | 2016-11-10 | Valeo Schalter Und Sensoren Gmbh | Method for producing an ultrasonic sensor for a motor vehicle |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5009311A (en) * | 1990-06-11 | 1991-04-23 | Schenk Robert J | Removable rigid support structure for circuit cards |
| DE19755408A1 (en) * | 1997-12-12 | 1998-12-03 | Braun Ag | Electrical assembly for electrical appliance |
| WO2005069462A1 (en) * | 2004-01-13 | 2005-07-28 | Taisei Plas Co., Ltd. | Electric device for junction and its manufacturing method |
| CN105093228A (en) | 2014-05-08 | 2015-11-25 | 光宝科技股份有限公司 | Supersonic sensing module |
-
2017
- 2017-05-18 DE DE102017208352.2A patent/DE102017208352A1/en not_active Withdrawn
-
2018
- 2018-03-28 EP EP18714488.6A patent/EP3625587A1/en not_active Withdrawn
- 2018-03-28 CN CN201880032726.XA patent/CN110678779A/en active Pending
- 2018-03-28 WO PCT/EP2018/057867 patent/WO2018210474A1/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4000585A1 (en) * | 1990-01-10 | 1991-07-11 | Wolfgang Brunner | Location transmitting meter for athletes - damped structure transmits ultrasonic signal from electroacoustic transducer and has photoelectric transducer for light signal |
| DE102009022187A1 (en) * | 2009-05-20 | 2010-11-25 | Valeo Schalter Und Sensoren Gmbh | Ultrasound sensor and/or ultrasound converter for use in surrounding field recognition system in motor vehicle, has housing provided with piezo-ceramics for production of ultrasound vibrations in membrane pot and filled with granulates |
| CN102065361A (en) * | 2009-10-29 | 2011-05-18 | 罗伯特·博世有限公司 | Ultrasonic transducer used in fluid medium |
| US20160139250A1 (en) * | 2013-06-20 | 2016-05-19 | Robert Bosch Gmbh | Surroundings-sensing device having a modular ultrasonic transducer, and motor vehicle having such a surroundings-sensing device |
| US20160329037A1 (en) * | 2013-12-23 | 2016-11-10 | Valeo Schalter Und Sensoren Gmbh | Method for producing an ultrasonic sensor for a motor vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3625587A1 (en) | 2020-03-25 |
| DE102017208352A1 (en) | 2018-11-22 |
| WO2018210474A1 (en) | 2018-11-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200110 |
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| WD01 | Invention patent application deemed withdrawn after publication |