CN110677933A - 底板的不对称表面层 - Google Patents

底板的不对称表面层 Download PDF

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CN110677933A
CN110677933A CN201910589242.1A CN201910589242A CN110677933A CN 110677933 A CN110677933 A CN 110677933A CN 201910589242 A CN201910589242 A CN 201910589242A CN 110677933 A CN110677933 A CN 110677933A
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layer
heater
sub
bonded
dielectric layer
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CN110677933B (zh
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C.斯莱恩
N.程
J.胡
G.C.波图拉
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Goodrich Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64C—AEROPLANES; HELICOPTERS
    • B64C1/00—Fuselages; Constructional features common to fuselages, wings, stabilising surfaces or the like
    • B64C1/18—Floors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
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    • B60—VEHICLES IN GENERAL
    • B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00—Heating, cooling or ventilating [HVAC] devices
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    • B60H1/2215—Heating, cooling or ventilating [HVAC] devices the heat being derived otherwise than from the propulsion plant the heat being derived from electric heaters
    • B60H1/2227—Electric heaters incorporated in vehicle trim components, e.g. panels or linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64C—AEROPLANES; HELICOPTERS
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    • B64C1/06—Frames; Stringers; Longerons ; Fuselage sections
    • B64C1/066—Interior liners
    • B64C1/067—Interior liners comprising means for preventing icing or condensation conditions
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F24D13/00—Electric heating systems
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    • F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
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    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
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    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
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    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2274/00—Thermoplastic elastomer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
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    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B64C—AEROPLANES; HELICOPTERS
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Abstract

一种加热器面板包括芯。加热器/介电层以堆栈结合至所述芯，所述加热器/介电层包括在一对介电层之间的正热系数(PTC)加热器层。冲击层结合至所述堆栈，其中所述冲击层包括结合至所述堆栈的用于冲击吸收的第一子层，以及结合至所述第一子层的用于耐切割的第二子层。所述第二子层具有比所述第一子层更高的材料硬度。

Description

底板的不对称表面层
发明背景
1. 技术领域
本公开涉及加热面板，且更具体来说，涉及例如飞机中的加热底板。
2. 相关技术的描述
正热系数(PTC)材料的电阻随着温度升高而增加。由于PTC材料的固有温度限制，PTC材料可用于加热面板，例如，用于加热飞机地板。传统上，通过以所需加热元件图案将基于PTC的油墨丝网印刷为构成面板的一系列层中的层来制造用于飞机底板的碳基PTC加热器。丝网印刷需要制备丝网并且丝网印刷过程需要过量油墨，即丝网印刷过程中的油墨数量必须多于实际进入底板中的最终数量。必须将用于所述过程中的剩余油墨处理掉。
飞机底板遭受实质上尖锐和钝的坠落物体的各种冲击。作为底板的安装和维护的一部分，底板还必须耐刀具切割。底板能够承受冲击和刀具切割对于促进底板的稳固性非常重要。用于复合板中的传统表面层材料通常不能够承受重复的或高的负载冲击以及刀具切割。
传统技术被认为满足其预期目的。然而，总是存在对改进的加热面板以及改进用于制造所述加热面板的过程的需求。本公开提供这种需求的解决方案。
发明内容
一种加热器面板包括芯。加热器/介电层以堆栈结合至所述芯，所述加热器/介电层包括在一对介电层之间的正热系数(PTC)加热器层。冲击层结合至所述堆栈，其中所述冲击层包括结合至所述堆栈的用于冲击吸收的第一子层，以及结合至所述第一子层的用于耐切割的第二子层。所述第二子层具有比所述第一子层更高的材料硬度。
所述芯可以包括蜂窝结构和/或泡沫材料中的至少一种。第一结构饰面可以与所述芯相对地结合至所述加热器/介电层。第二结构饰面可以与所述加热器/介电层相对地结合至所述芯，使得所述第二结构饰面通过所述芯与所述加热器/介电层间隔开。所述第一结构饰面和所述第二结构饰面可以各自包括用树脂浸渍的碳纤维，其中所述树脂包括热塑性材料和/或热固性材料中的至少一种。
所述冲击层的所述第一子层可以包括热塑性塑料、弹性体和/或树脂中的至少一种。所述冲击层的所述第二子层可以包括热塑性塑料、玻璃和/或防弹纤维中的至少一种。
一种制造加热器面板的方法包括将加热器/介电层结合至芯以形成堆栈。所述方法包括将用于冲击吸收的第一子层结合至用于耐切割的第二子层以形成冲击层。所述方法包括将所述冲击层结合至所述堆栈。
所述方法可以包括将第一结构饰面与所述芯相对地结合至所述加热器/介电层。所述方法可以包括将第二结构饰面与所述加热器/介电层相对地结合至所述芯，使得所述第二结构饰面通过所述芯与所述加热器/介电层间隔开。将所述冲击层结合至所述堆栈可以包括将所述冲击层结合至所述第一结构饰面。
从以下结合附图进行的对优选实施方案的详细描述中，本领域技术人员将更容易明白本公开的系统和方法的这些和其它特征。
附图说明
为了使本公开所属领域的技术人员将容易理解如何制造和使用本公开的装置和方法而无需过多经验，下文将参考某些图式在本文中详细描述本公开的优选实施方案，其中：
图1是根据本公开构造的加热器面板的示例性实施方案的示意性截面图，其示出以堆栈结合的加热器/介电层和冲击层；
图2是图1的加热器/介电层的示意性截面图，其示出介电层；
图3是图1的加热器面板的一部分的示意性平面图，其示出加热器/介电层的加热器元件图案；以及
图4是图1的加热器面板的一部分的示意性截面图，其示意性地示出冲击层的子层。
具体实施方式
现在将参考附图，其中相似参考编号表示本公开的类似结构特征或方面。出于解释和说明的目的且非限制性地，根据本公开的加热器面板的示例性实施方案的局部视图在图1中示出并且总体用参考符号100表示。在图2至图4中提供根据本公开的加热器面板的其它实施方案或其方面，如将描述。本文所描述的系统和方法可以用于提供加热器面板，例如，用于飞机地板和其它表面，包括轮廓化表面。
加热器面板100包括芯102和加热器/介电层104。如图2中所示，加热器/介电层104是包括在一对介电层108之间的正热系数(PTC)加热器层106的组件。芯102可以包括蜂窝结构和/或泡沫材料中的至少一种。
第一结构饰面110结合至加热器/介电层104，但是任选地，类似于芯102的第二芯可以包括在加热器/介电层104与第一结构饰面110之间。第二结构饰面112与加热器/介电层104相对地结合至芯102，使得第二结构饰面112通过芯102与加热器/介电层104间隔开。第一结构饰面110和第二结构饰面112各自包括用树脂浸渍的碳纤维，其中所述树脂包括热塑性材料(例如，PEEK、PC、PPS和PEI)和/或热固性材料(例如，环氧树脂、酚醛树脂、双马来酰亚胺树脂(BMI)和苯并恶嗪)中的至少一种。
图3示出PTC加热器层106的示例性加热元件图案，其具有用于使电流从一个汇流条116流动至另一汇流条118的多个冗余电通路。如图2中所示，通过加热器元件图案，在加热器/介电层104中存在介电层108彼此直接接触的位置，以及PTC加热器层106的实际加热器元件夹在介电层108之间的其它位置。本领域技术人员将容易了解，图3中所示的加热器元件图案仅是示例性的，并且在不脱离本公开的范围的情况下可以使用任何其它合适的图案。
再次参考图1，冲击层114结合至堆栈，所述堆栈包括芯102和加热器/介电层104。冲击层114与加热器/介电层104相对地结合至第一结构饰面110。如图4中所示，冲击层114包括结合至堆栈，例如，直接结合至第一结构饰面110的用于冲击吸收的第一子层120，以及结合至第一子层120的用于耐切割的第二子层122。第二子层122具有比第一子层120更高的材料硬度。冲击层114的第一子层120可以包括热塑性塑料、弹性体和/或树脂中的至少一种。冲击层114的第二子层122可以包括热塑性塑料、玻璃和/或防弹纤维中的至少一种。第一子层120是具有能量耗散特性的冲击吸收区段。所述冲击吸收区段可以由较软材料，例如，具有高伸长率的热塑性塑料制成。第二子层122是耐切割层。耐切割层可以包括硬质材料，例如，用以削弱刀刃的力。
包括两个子层120和122的复合冲击层114将两个子层120和122的特性组合。混合两个子层120和122的材料(与将两个子层保持为不同层相反)通常不具有所需效果，因为所得混合材料在耐冲击性和耐切割性这两个方面都有限。益处在于，例如在相应子层120和122中具有两种不同材料的不对称冲击层114可以在比单种材料更轻的重量下实现相同水平的耐冲击性和耐切割性。
制造例如加热器面板100的加热器面板的方法包括将例如加热器/介电层104的加热器/介电层结合至例如芯102的芯，以形成堆栈。所述方法包括将例如子层120的用于冲击吸收的第一子层结合至例如子层122的用于耐切割的第二子层，以形成例如冲击层114的冲击层。所述方法包括将冲击层结合至堆栈。
所述方法包括将例如第一结构饰面110的第一结构饰面与芯相对地结合至加热器/介电层。所述方法包括将例如第二结构饰面112的第二结构饰面与加热器/介电层相对地结合至芯，使得第二结构饰面通过芯与加热器/介电层间隔开。所述方法包括将例如冲击层114的冲击层与芯相对地结合至第一结构饰面。
所述方法可以包括将图3中标记的封闭层124直接写入到加热器/介电层104，以将第二芯103结合至所述加热器/介电层。例如冲击层114和第二结构饰面112的其它层可以根据需要使用薄膜粘合剂等结合至加热器面板100的相应表面。
冲击层114形成可以承受冲击和刀具切割两者的不对称表面层。这种不对称表面层由两个不同区段组成，即包括第二子层122的耐刀具切割上部区段，以及包括第一子层120的耐冲击下部区段。与可能限制应力的在堆栈中间具有耐刀具切割层的对称层相比，这种分层的不对称性质可以最大化下部冲击区段的应力，从而改进耐冲击性。本领域技术人员将容易了解，除了或代替封闭层124和薄膜粘合剂，加热器面板100的区段还可以进行层压或结合以形成不对称表面层，并且可以层压、结合在加热器面板100的面板结构上或与所述面板结构共固化。
如上所述并且在附图中示出的本公开的方法和系统提供相对于传统加热器面板具有优越特性的加热器，所述优越特性包括减少使用PTC油墨、能够制造具有轮廓的加热器面板、耐刀具切割性和耐冲击性得到改进、重量更轻、寿命更长以及稳固性得到改进。尽管已参考优选实施方案示出和描述本公开的设备和方法，但是本领域技术人员将容易了解，在不脱离本公开的范围的情况下可以对其进行改变和/或修改。

Claims (14)

1.一种加热器面板，包括：
芯；
加热器/介电层，所述加热器/介电层包括在一对介电层之间的正热系数(PTC)加热器层，其中所述加热器/介电层以堆栈结合至所述芯；以及
冲击层，所述冲击层结合至所述堆栈，其中所述冲击层包括结合至所述堆栈的用于冲击吸收的第一子层，以及结合至所述第一子层的用于耐切割的第二子层，其中所述第二子层具有比所述第一子层更高的材料硬度。
2.如权利要求1所述的加热器面板，其中所述芯包括蜂窝结构和/或泡沫材料中的至少一种。
3. 如权利要求1所述的加热器面板，还包括：
第一结构饰面，所述第一结构饰面与所述芯相对地结合至所述加热器/介电层；以及
第二结构饰面，所述第二结构饰面与所述加热器/介电层相对地结合至所述芯，使得所述第二结构饰面通过所述芯与所述加热器/介电层间隔开。
4.如权利要求3所述的加热器面板，其中所述第一结构饰面和所述第二结构饰面各自包括用树脂浸渍的碳纤维，其中所述树脂包括热塑性材料和/或热固性材料中的至少一种。
5.如权利要求3所述的加热器面板，其中所述冲击层结合至所述第一结构饰面。
6.如权利要求1所述的加热器面板，其中所述冲击层的所述第一子层包括热塑性塑料、弹性体和/或树脂中的至少一种。
7.如权利要求1所述的加热器面板，其中所述冲击层的所述第二子层包括热塑性塑料、玻璃和/或防弹纤维中的至少一种。
8.一种制造加热器面板的方法，包括：
将加热器/介电层结合至芯以形成堆栈；
将用于冲击吸收的第一子层结合至用于耐切割的第二子层，以形成冲击层；以及
将所述冲击层结合至所述堆栈。
9.如权利要求8所述的方法，其中所述芯包括蜂窝结构和/或泡沫材料中的至少一种。
10. 如权利要求8所述的方法，还包括：
将第一结构饰面与所述芯相对地结合至所述加热器/介电层；以及
将第二结构饰面与所述加热器/介电层相对地结合至所述芯，使得所述第二结构饰面通过所述芯与所述加热器/介电层间隔开。
11.如权利要求10所述的方法，其中所述第一结构饰面和所述第二结构饰面各自包括用树脂浸渍的碳纤维，其中所述树脂包括热塑性材料和/或热固性材料中的至少一种。
12.如权利要求10所述的方法，其中将所述冲击层结合至所述堆栈包括将所述冲击层结合至所述第一结构饰面。
13.如权利要求8所述的方法，其中所述冲击层的所述第一子层包括热塑性塑料、弹性体和/或树脂中的至少一种。
14.如权利要求8所述的方法，其中所述冲击层的所述第二子层包括热塑性塑料、玻璃和/或防弹纤维中的至少一种。
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