CN110662366A

CN110662366A - PCB processing method

Info

Publication number: CN110662366A
Application number: CN201810686131.8A
Authority: CN
Inventors: 徐小四
Original assignee: Individual
Current assignee: Individual
Priority date: 2018-06-28
Filing date: 2018-06-28
Publication date: 2020-01-07

Abstract

The invention relates to the field of PCBs (printed circuit boards), in particular to a PCB processing method, which comprises the following steps: forming a brass pattern to be plated of each gold finger on the surface of the outer layer of the PCB; the end part of each golden finger is close to the outer edge of the PCB, and the tail part of each golden finger is close to the inner side of the PCB; forming a brass plating lead on the surface of the outer layer of the PCB; the brass-plated lead wires are arranged at the positions close to the inner side of the PCB and avoid the end positions of the golden fingers, and the brass-plated patterns of the golden fingers are communicated with each other; brass plating treatment is carried out on the to-be-plated brass patterns of the golden fingers on the surface of the outer layer of the PCB through brass plating lead wires; the gold fingers after being plated with brass are mutually conducted through brass plating lead wires; carrying out depth control machining on the outer layer of the PCB on the part of the brass-plated lead wire communicated between the golden fingers, and cutting off the brass-plated lead wire through a non-metal concave structure formed by the depth control machining; and the depth of the depth control machining is less than or equal to the thickness between the gold finger and the PCB inner layer.

Description

PCB processing method

Technical Field

The invention relates to the field of PCBs, in particular to a PCB processing method.

Background

In order to electrically connect the PCB to other electronic devices, such as a motherboard, it is often necessary to form gold fingers on the PCB that serve as electrical connection pins.

In the prior art, in the process of forming the golden fingers on the PCB, brass plating of the golden fingers is realized by means of the temporarily added brass plating lead wires on the PCB, and the brass plating lead wires are removed after the brass plating is finished, so that the golden fingers which need to be independent in electrical performance are prevented from being mutually conducted by the gold plating lead wires. The process specifically comprises the following steps:

firstly, forming a brass pattern to be plated of each golden finger on the surface of the outer layer of the PCB; the end part of each golden finger is used as a contact, the end part of each golden finger is close to the outer edge of the PCB, the tail part of each golden finger is used for conducting the golden finger with a circuit in the PCB, and the tail part of each golden finger is close to the inner side of the PCB;

secondly, forming brass plating lead wires on the surface of the outer layer of the PCB; the brass-plated lead is positioned between the end part of each golden finger and the outer edge of the PCB and mutually communicates the brass patterns to be plated of each golden finger;

then, brass plating treatment is carried out on the to-be-plated brass patterns of the golden fingers on the surface of the outer layer of the PCB through brass plating lead wires; the gold fingers after being plated with brass are mutually conducted through brass plating lead wires;

finally, surface milling is carried out between the end part of each golden finger and the outer edge of the PCB by using a milling cutter so as to remove the brass plated lead wire between the end part of each golden finger and the outer edge of the PCB.

In practical application, in order to meet the timing requirement of electrical connection, the gold fingers may be set to be equal in length or different in length. For the case of equal length of the golden finger, the method of removing the brass-plated lead by surface milling in the above process can ensure that the golden finger with equal length has a correct shape, and for the case of unequal length of the golden finger, as in the method of processing the golden finger of the circuit board and the golden finger circuit board described in CN201410149118.0, the method of removing the brass-plated lead by surface milling in the above process easily causes the lead to remain at the end of the short golden finger, thereby affecting the timing requirements that the golden finger with unequal length needs to meet.

Disclosure of Invention

In view of the deficiencies of the prior art, the present invention provides a method for processing a PCB to improve the yield of the PCB.

In order to solve the technical problems, the technical scheme adopted by the invention is as follows:

a method of processing a PCB, the method comprising:

forming a brass pattern to be plated of each gold finger on the surface of the outer layer of the PCB; the end part of each golden finger is close to the outer edge of the PCB, and the tail part of each golden finger is close to the inner side of the PCB;

forming a brass plating lead on the surface of the outer layer of the PCB; the brass-plated lead wires are arranged at the positions close to the inner side of the PCB and avoid the end positions of the golden fingers, and the brass-plated patterns of the golden fingers are communicated with each other;

brass plating treatment is carried out on the to-be-plated brass patterns of the golden fingers on the surface of the outer layer of the PCB through brass plating lead wires; the gold fingers after being plated with brass are mutually conducted through brass plating lead wires;

carrying out depth control machining on the outer layer of the PCB on the part of the brass-plated lead wire communicated between the golden fingers, and cutting off the brass-plated lead wire through a non-metal concave structure formed by the depth control machining; and the depth of the depth control machining is less than or equal to the thickness between the gold finger and the PCB inner layer.

Furthermore, the brass-plated lead wire penetrates through the to-be-plated brass pattern of each golden finger between the end position and the tail position of each golden finger or at the tail position of each golden finger, and the part of the brass-plated lead wire, which is conducted between the golden fingers, is positioned in the gap between the golden fingers.

Furthermore, the brass-plated lead is close to the inner side of the PCB compared with the tail part of each golden finger, and the part of the brass-plated lead, which is conducted between the golden fingers, is aligned with the gap between the golden fingers.

Furthermore, the depth control machine is processed into a depth control drilling hole, and the non-metal recessed structure is a non-metal blind hole.

Furthermore, the depth control machine is processed into a depth control milling groove, and the non-metal concave structure is a non-metal groove.

Furthermore, the golden fingers are not equal in length.

Further, the method further removes the copper wire existing at the edge of the opening of the non-metal recessed structure after cutting off the brass-plated lead.

The invention has the beneficial effects that: the method of forming first and then melting gold is adopted, so that the formation gold scratch is avoided. The copper surface is scratched slightly due to molding, the copper surface can be roughened and leveled in a micro-etching groove of the gold plating, the appearance of the gold surface can be kept well after the gold plating, and the test is directly carried out after the gold plating, so that the probability that the plate after the gold plating is scratched during molding is eliminated.

Detailed Description

To further disclose the technical solution of the present invention, the following describes an embodiment of the present invention:

example 1

A method of processing a PCB, the method comprising:

The brass-plated lead wire penetrates through the to-be-plated brass patterns of the golden fingers between the end positions and the tail positions of the golden fingers or the tail positions of the golden fingers, and the brass-plated lead wire is positioned in the gaps between the golden fingers at the positions where the golden fingers are conducted.

The brass-plated lead wires are close to the inner side of the PCB compared with the tail parts of the golden fingers, and the parts of the brass-plated lead wires which are conducted between the golden fingers are aligned with gaps between the golden fingers.

Wherein, the depth control machine processing is a depth control drilling hole, and the non-metal recessed structure is a non-metal blind hole.

Wherein, the depth control machine processing is depth control groove milling, and the non-metal concave structure is a non-metal groove.

Wherein, the golden fingers are not equal in length.

And further removing the copper wire existing at the edge of the opening of the non-metal recessed structure after cutting off the brass-plated lead.

The basic idea and the basic principle of the invention have been explained above by way of an introduction to the embodiments listed. The present invention is not limited to the above-mentioned embodiments, and all equivalent changes, modifications and deliberate deterioration actions based on the technical solution of the present invention should fall within the protection scope of the present invention.

Claims

1. A method for processing a PCB, the method comprising:

2. The method for processing the PCB of claim 1, wherein the brass-plated lead wire penetrates through the brass-to-be-plated pattern of each golden finger between the end position and the tail position of each golden finger or the tail position of each golden finger, and the brass-plated lead wire is positioned in the gap between the golden fingers at the position where the brass-plated lead wire is conducted between the golden fingers.

3. The method of claim 1, wherein the brass-plated lead is positioned closer to an inner side of the PCB than a tail portion of each of the gold fingers, and a portion of the brass-plated lead that is conducted between the gold fingers is aligned with a gap between the gold fingers.

4. The method of claim 1, wherein the depth control machine is a depth control drill and the non-metallic recessed structure is a non-metallic blind hole.

5. The method of claim 1, wherein the depth-control machining is depth-control groove milling and the non-metallic recessed structure is a non-metallic groove.

6. The method of claim 1, wherein the gold fingers are not equal in length.

7. The method for processing the PCB of claim 1, wherein the method further removes copper wires existing at the edge of the opening of the non-metal recessed structure after cutting off the brass-plated lead wires.