CN110659713A - 一种铜版纸作为基材的rfid标签及其制作方法 - Google Patents
一种铜版纸作为基材的rfid标签及其制作方法 Download PDFInfo
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Abstract
本发明提供一种铜版纸作为基材的RFID标签,包括从上至下依次设置的IC芯片、天线层、胶水层和耐蚀刻纸,天线层绑定IC芯片,天线层与耐蚀刻纸通过胶水层相连,耐蚀刻纸由铜版纸的正反面涂上耐蚀刻涂层构成。本发明的有益效果是:使用铜版纸代替PET薄膜作为RFID标签的基材,利用其表面平整、耐高温、易分解有利于环保等性能,制成低价格、高性能的新型RFID标签,简化工艺加工流程,去除将标签贴在lable纸上的流程,铜版纸作为RFID标签的直接基材,芯片绑定在天线上之后可以直接使用。
Description
技术领域
本发明涉及射频通信技术领域,更具体地说涉及一种铜版纸作为基材的RFID标签及其制作方法。
背景技术
RFID技术目前已经开始广泛的应用于:门禁控制、航空包裹识别、文档追踪管理、包裹追踪识别、后勤管理、移动商务、产品防伪、运动计时、票证管理、汽车晶片防盗器、停车场管制、生产线自动化、物料管理等等,将成为我们生活中必不可分的一部分。
目前RFID标签行业采用的天线制作是:1)选用PET薄膜作为天线主基材;2)通过干式复合机将铝箔通过胶水贴合于PET薄膜之上,得到天线半成品(复合膜);3)再通过印刷机,在天线半成品上印制天线的图形;4)通过蚀刻将天线半成品上的图形制成蚀刻天线;5)在天线铝箔面绑定芯片,形成RFID标签;6)将RFID标签贴在Lable纸上进行使用;
但这种工艺存在的主要缺点:1)PET薄膜表面附着力差,其表面光滑没有打印的功能,不利于产业的后续发展;2)PET薄膜在收放卷过程中易产生静电,在高速缠绕模式下无法有效去除静电,易造成对天线产品的破坏;3)PET薄膜耐温性能差,天线在加工成标签过程中经过200℃左右的高温,会出现收缩,变形严重,呈翘曲状,造成标签成品外观及性能不良;4)PET薄膜由聚对苯二甲酸乙二醇酯为主要成分组成,不易分解不利于环保;5)PET薄膜做成的RFID标签不能直接使用,需要二次加工到准备好的Lable纸上使用,成本较高。
发明内容
本发明克服了现有技术中的不足,本发明目的之一是提供一种铜版纸作为基材的RFID标签,发明的另一目的是提供一种铜版纸作为基材的RFID标签的制作工艺。本发明的目的通过下述技术方案予以实现。
一种铜版纸作为基材的RFID标签,包括从上至下依次设置的IC芯片、天线层、胶水层和耐蚀刻纸,所述天线层绑定所述IC芯片,所述天线层与所述耐蚀刻纸通过所述胶水层相连,所述耐蚀刻纸由铜版纸的正反面涂上耐蚀刻涂层构成。
进一步,所述铜版纸为双面铜版纸。
进一步,所述天线层为铝箔或者铜箔。
进一步,所述胶水层由胶水、固化剂、溶剂混合搅拌构成,其中,胶水、固化剂、溶剂之间的配比为:10:0.8:6,搅拌时间30min。
进一步,所述胶水为三井PP5430,所述固化剂为I-3000,所述溶剂为乙酸乙酯。
进一步,所述耐蚀刻涂层由聚酯树脂30-40份,双酚A氰酸树脂5-10份,丙烯酸树脂5-10份,醇酸树脂1-3份,环氧树脂1-2份,消泡剂0.5-2份,醋酸乙酯40-50份组成。
一种铜版纸作为基材的RFID标签的制作方法,包括如下步骤:
步骤1:制作防水、防酸碱的耐蚀刻纸;
步骤2:制作RFID天线;
步骤3:制作RFID标签。
进一步,所述步骤1中得到防水、防酸碱的耐蚀刻纸的方法为:通过涂布机在所述双面铜版纸的正反面涂上耐蚀刻涂层。
进一步,所述耐蚀刻涂层由聚酯树脂30-40份,双酚A氰酸树脂5-10份,丙烯酸树脂5-10份,醇酸树脂1-3份,环氧树脂1-2份,消泡剂0.5-2份,醋酸乙酯40-50份组成。
进一步,所述涂布机的涂布量达到9-15g/㎡。
进一步,所述涂布机烘道温度为90-150℃,涂布速度为25-35m/min,涂布压力为0.5-0.7MPA。
进一步,所述步骤2中制作RFID天线的方法为:第一步,通过复合机将铝箔/铜箔和耐蚀刻纸复合在一起,得到纸天线半成品;第二步,通过印刷机,在耐蚀刻纸天线半成品上印制天线的图形;第三步,通过蚀刻机将耐蚀刻纸天线半成品上的图形制成蚀刻天线。
进一步,所述铝箔/铜箔和耐蚀刻纸复合后剥离力为4±1N/15mm。
进一步,所述复合温度为70-90℃,所述熟化温度为50±5℃,熟化时间不小于96h。
进一步,所述第一步中胶水层由胶水、固化剂、溶剂混合搅拌构成,其中,胶水、固化剂、溶剂之间的配比为:10:0.8:6,搅拌时间30min。
进一步,所述胶水为三井PP5430。
进一步,所述固化剂为I-3000。
进一步,所述溶剂为乙酸乙酯。
进一步,所述步骤3中制备RFID标签的方法为,利用所述步骤2中得到的RFID天线绑定芯片,形成RFID标签。
进一步,所述绑定时,热压温度为180±5℃;热压压力为0.5-1N,热压时间为7-8s,试频率为860-960MHZ。
本发明的有益效果为:本发明所采用铜版纸作为基材的RFID超高频标签天线,其作用优势主要表现如下:
1.铜版纸可以直接在表面打印,增加的客户的选择度,利于产业的开发发展;
2.铜版纸不产生静电,不会对天线产品产生破坏;
3.铜版纸可耐高温,200℃内不会收缩变形,完全满足天线在标签加工过程中的高温加热;
4.铜版纸主要由纤维素、半纤维素、木素成分组成,易分解,利于环保;
5.精简工艺,去除标签二次加工流程。
附图说明
图1是本发明RFID电子标签的结构示意图;
图中:
1、IC芯片;2、天线层;3、胶水层;4、耐蚀刻涂层;5、铜版纸;6、耐蚀刻涂层。
具体实施方式
下面通过具体的实施例对本发明的技术方案作进一步的说明。
一种铜版纸作为基材的RFID标签,包括从上至下依次设置的IC芯片1、天线层2、胶水层3和耐蚀刻纸,天线层2绑定所述IC芯片1,天线层2为铝箔或者铜箔,天线层2与所述耐蚀刻纸通过胶水层3相连,所述耐蚀刻纸由铜版纸5的正反面涂上耐蚀刻涂层6构成。
铜版纸5为双面铜版纸;
胶水层3由胶水、固化剂、溶剂混合搅拌构成,其中,胶水、固化剂、溶剂之间的配比为:10:0.8:6,搅拌时间30min,所述胶水为三井PP5430,所述固化剂为I-3000,所述溶剂为乙酸乙酯。
所述耐蚀刻涂层由聚酯树脂30-40份,双酚A氰酸树脂5-10份,丙烯酸树脂5-10份,醇酸树脂1-3份,环氧树脂1-2份,消泡剂0.5-2份,醋酸乙酯40-50份组成。
该耐蚀刻涂层具有良好的防水性、耐酸碱性、流平性,3#蔡恩粘度杯测试50±5S,以保证需要的涂布量,可有效地保护基材不受酸碱、高温、水汽等侵蚀,涂布后表面可以打印,文字及图像清晰。
使用铜版纸代替PET薄膜作为RFID标签的基材,利用其表面平整、耐高温、易分解有利于环保等性能,制成低价格、高性能的新型RFID标签,简化工艺加工流程,去除将标签贴在lable纸上的流程,铜版纸作为RFID标签的直接基材,芯片绑定在天线上之后可以直接使用。
一种铜版纸作为基材的RFID标签的制作方法,包括如下步骤:
步骤1:制作防水、防酸碱的耐蚀刻纸;所述步骤1中得到防水、防酸碱的耐蚀刻纸的方法为:通过涂布机在所述双面铜版纸的正反面涂上耐蚀刻涂层;所述耐蚀刻涂层由聚酯树脂30-40份,双酚A氰酸树脂5-10份,丙烯酸树脂5-10份,醇酸树脂1-3份,环氧树脂1-2份,消泡剂0.5-2份,醋酸乙酯40-50份组成。
所述铝箔/铜箔和耐蚀刻纸复合后剥离力为4±1N/15mm,所述复合温度为70-90℃,所述熟化温度为50±5℃,熟化时间不小于96h。
步骤2:制作RFID天线;所述步骤2中制作RFID天线的方法为:第一步,通过复合机将铝箔/铜箔和耐蚀刻纸复合在一起,得到纸天线半成品;第二步,通过印刷机,在耐蚀刻纸天线半成品上印制天线的图形;第三步,通过蚀刻机将耐蚀刻纸天线半成品上的图形制成蚀刻天线。所述第一步中胶水层由胶水、固化剂、溶剂混合搅拌构成,其中,胶水、固化剂、溶剂之间的配比为:10:0.8:6,搅拌时间30min,所述胶水为三井PP5430,所述固化剂为I-3000,所述溶剂为乙酸乙酯。
步骤3:制作RFID标签。所述步骤3中制备RFID标签的方法为,利用所述步骤2中得到的RFID天线绑定芯片,形成RFID标签。
所述绑定时,热压温度为180±5℃;热压压力为0.5-1N,热压时间为7-8s,试频率为860-960MHZ。
所述涂布机的涂布量达到9-15g/㎡,所述涂布机烘道温度为90-150℃,涂布速度为25-35m/min,涂布压力为0.5-0.7MPA。
1)使用铜版纸代替PET薄膜作为RFID标签的基材,利用其表面平整、耐高温、易分解有利于环保等性能,制成低价格、高性能的新型RFID标签。
2)简化工艺加工流程,去除将标签贴在lable纸上的流程,铜版纸作为RFID标签的直接基材,芯片绑定在天线上之后可以直接使用。
以上对本发明的一个实施例进行了详细说明,但所述内容仅为本发明的较佳实施例,不能被认为用于限定本发明的实施范围。凡依本发明申请范围所作的均等变化与改进等,均应仍归属于本发明的专利涵盖范围之内。
Claims (10)
1.一种铜版纸作为基材的RFID标签,其特征在于:包括从上至下依次设置的IC芯片、天线层、胶水层和耐蚀刻纸,所述天线层绑定所述IC芯片,所述天线层与所述耐蚀刻纸通过所述胶水层相连,所述耐蚀刻纸由铜版纸的正反面涂上耐蚀刻涂层构成。
2.根据权利要求1所述的铜版纸作为基材的RFID标签,其特征在于:所述铜版纸为双面铜版纸。
3.根据权利要求1所述的铜版纸作为基材的RFID标签,其特征在于:所述天线层为铝箔或者铜箔。
4.根据权利要求1所述的铜版纸作为基材的RFID标签,其特征在于:所述胶水层由胶水、固化剂、溶剂混合搅拌构成,其中,胶水、固化剂、溶剂之间的配比为:10:0.8:6,搅拌时间30min。
5.根据权利要求1所述的铜版纸作为基材的RFID标签,其特征在于:所述胶水为三井PP5430,所述固化剂为I-3000,所述溶剂为乙酸乙酯。
6.根据权利要求1所述的铜版纸作为基材的RFID标签,其特征在于:所述耐蚀刻涂层由聚酯树脂30-40份,双酚A氰酸树脂5-10份,丙烯酸树脂5-10份,醇酸树脂1-3份,环氧树脂1-2份,消泡剂0.5-2份,醋酸乙酯40-50份组成。
7.一种铜版纸作为基材的RFID标签的制作方法,其特征在于:包括如下步骤:
步骤1:制作防水、防酸碱的耐蚀刻纸;
步骤2:制作RFID天线;
步骤3:制作RFID标签。
8.根据权利要求7所述的铜版纸作为基材的RFID标签的制作方法,其特征在于:所述步骤1中得到防水、防酸碱的耐蚀刻纸的方法为:通过涂布机在所述双面铜版纸的正反面涂上耐蚀刻涂层。
9.根据权利要求8所述的铜版纸作为基材的RFID标签的制作方法,其特征在于:所述耐蚀刻涂层由聚酯树脂30-40份,双酚A氰酸树脂5-10份,丙烯酸树脂5-10份,醇酸树脂1-3份,环氧树脂1-2份,消泡剂0.5-2份,醋酸乙酯40-50份组成。
10.根据权利要求7所述的铜版纸作为基材的RFID标签的制作方法,其特征在于:所述步骤2中制作RFID天线的方法为:第一步,通过复合机将铝箔/铜箔和耐蚀刻纸复合在一起,得到纸天线半成品;第二步,通过印刷机,在耐蚀刻纸天线半成品上印制天线的图形;第三步,通过蚀刻机将耐蚀刻纸天线半成品上的图形制成蚀刻天线。
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