CN110648955B - 一种晶体二极管的生产设备和生产方法 - Google Patents
一种晶体二极管的生产设备和生产方法 Download PDFInfo
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- CN110648955B CN110648955B CN201910798982.6A CN201910798982A CN110648955B CN 110648955 B CN110648955 B CN 110648955B CN 201910798982 A CN201910798982 A CN 201910798982A CN 110648955 B CN110648955 B CN 110648955B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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CN201910798982.6A CN110648955B (zh) | 2019-08-28 | 2019-08-28 | 一种晶体二极管的生产设备和生产方法 |
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CN201910798982.6A CN110648955B (zh) | 2019-08-28 | 2019-08-28 | 一种晶体二极管的生产设备和生产方法 |
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CN110648955A CN110648955A (zh) | 2020-01-03 |
CN110648955B true CN110648955B (zh) | 2021-12-28 |
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CN111215557A (zh) * | 2020-02-18 | 2020-06-02 | 杭州大轶科技有限公司 | 一种ic芯片的引脚加工设备及加工方法 |
Citations (11)
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CN109119587A (zh) * | 2018-10-28 | 2019-01-01 | 深圳市兴禾自动化有限公司 | 一种电芯极耳自动化焊接、裁切、贴胶及折弯生产线及其生产工艺 |
CN109168264A (zh) * | 2018-10-25 | 2019-01-08 | 王朝火 | 柔性线路板贴胶装置和柔性线路板生产设备 |
CN109546228A (zh) * | 2018-12-05 | 2019-03-29 | 广东光博智能科技有限公司 | 一种自动折弯贴胶机 |
CN109802030A (zh) * | 2019-01-25 | 2019-05-24 | 楼显华 | 一种led元件及其生产方法 |
WO2019136974A1 (zh) * | 2018-01-12 | 2019-07-18 | 江苏华存电子科技有限公司 | 一种集成电路ic半自动引脚整型机 |
CN110048152A (zh) * | 2019-05-06 | 2019-07-23 | 广东东博自动化设备有限公司 | 一种电池全自动贴胶生产线 |
CN110087447A (zh) * | 2019-05-28 | 2019-08-02 | 深圳市图谱锐科技有限公司 | 一种编带元器件自动裁切、成型及切脚装置及其加工工艺 |
CN110155422A (zh) * | 2019-05-29 | 2019-08-23 | 深圳市图谱锐科技有限公司 | 一种侧包胶式电容自动成型生产线及其生产工艺 |
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- 2019-08-28 CN CN201910798982.6A patent/CN110648955B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5722514A (en) * | 1995-04-28 | 1998-03-03 | Advantest Corp. | Tray installation rack for test handler |
WO2019136974A1 (zh) * | 2018-01-12 | 2019-07-18 | 江苏华存电子科技有限公司 | 一种集成电路ic半自动引脚整型机 |
CN108925051A (zh) * | 2018-08-08 | 2018-11-30 | 张金仙 | 柔性电路板的生产设备 |
CN108990285A (zh) * | 2018-08-08 | 2018-12-11 | 张金仙 | 贴胶模组和贴胶装置和柔性电路板加工机 |
CN109168264A (zh) * | 2018-10-25 | 2019-01-08 | 王朝火 | 柔性线路板贴胶装置和柔性线路板生产设备 |
CN109119587A (zh) * | 2018-10-28 | 2019-01-01 | 深圳市兴禾自动化有限公司 | 一种电芯极耳自动化焊接、裁切、贴胶及折弯生产线及其生产工艺 |
CN109546228A (zh) * | 2018-12-05 | 2019-03-29 | 广东光博智能科技有限公司 | 一种自动折弯贴胶机 |
CN109802030A (zh) * | 2019-01-25 | 2019-05-24 | 楼显华 | 一种led元件及其生产方法 |
CN110048152A (zh) * | 2019-05-06 | 2019-07-23 | 广东东博自动化设备有限公司 | 一种电池全自动贴胶生产线 |
CN110087447A (zh) * | 2019-05-28 | 2019-08-02 | 深圳市图谱锐科技有限公司 | 一种编带元器件自动裁切、成型及切脚装置及其加工工艺 |
CN110155422A (zh) * | 2019-05-29 | 2019-08-23 | 深圳市图谱锐科技有限公司 | 一种侧包胶式电容自动成型生产线及其生产工艺 |
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Effective date of registration: 20211203 Address after: 276800 No. 166 Guilin Road, Rizhao City, Shandong Province Applicant after: RIZHAO LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. Address before: 322000 12-06, No. 300, Sitong East Road, Shangxi Town, Yiwu City, Jinhua City, Zhejiang Province Applicant before: Lou Xianhua |
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Denomination of invention: A production equipment and method for crystal diodes Effective date of registration: 20230831 Granted publication date: 20211228 Pledgee: Rizhao Donggang Rural Commercial Bank Co.,Ltd. Economic Development Zone sub branch Pledgor: RIZHAO LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2023980054832 |
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