CN110648950B - Loading and unloading device and laser diode module wire bonding machine - Google Patents
Loading and unloading device and laser diode module wire bonding machine Download PDFInfo
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- CN110648950B CN110648950B CN201910968818.5A CN201910968818A CN110648950B CN 110648950 B CN110648950 B CN 110648950B CN 201910968818 A CN201910968818 A CN 201910968818A CN 110648950 B CN110648950 B CN 110648950B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
The invention provides a loading and unloading device which comprises a transfer material disc, a material disc driving assembly, a first material taking mechanism and a second material taking mechanism, wherein the top surface of the transfer material disc is provided with at least two positioning holes for adapting to at least two types of raw material tube seats; the invention also provides a laser diode module wire bonding machine which comprises a feeding and discharging device. The invention adopts the transfer tray with at least two positioning holes matched with at least two types of raw material tube seats, and the first material taking mechanism and the second material taking mechanism which can replace the suction nozzle, thereby effectively solving the technical problem that the same loading and unloading device cannot be suitable for various types of laser diode module bonding wires.
Description
Technical Field
The invention belongs to the technical field of laser diode module packaging, and particularly relates to a feeding and discharging device and a laser diode module wire bonding machine.
Background
At present, laser diode modules (TO-CAN) used in the optical communication industry have the types of TO-38, TO-46, TO-56, TO-60 and the like, and different types of laser diode modules need TO be packaged by using wire bonding machines of different types or replacing different feeding and discharging devices on the wire bonding machine of the same type, so that the production cost of laser diode module packaging enterprises is greatly improved, and the packaging efficiency of the laser diode modules is influenced.
Disclosure of Invention
The invention aims to provide a feeding and discharging device and a laser diode module wire bonding machine, which comprises but is not limited to solve the technical problem that the same feeding and discharging device cannot be suitable for bonding wires of various laser diode modules.
In order to achieve the above object, the present invention provides a loading and unloading device for a wire bonding machine of a laser diode module, comprising:
the top surface of the transfer tray is provided with at least two positioning holes for adapting to at least two types of raw material tube seats, and the at least two positioning holes are arranged at equal intervals along the same circumference;
the material tray driving assembly is used for driving the transfer material tray to rotate around the axis of the transfer material tray, and the axis of the transfer material tray is perpendicular to the top surface of the transfer material tray and passes through the circle center of the circumference;
the first material taking mechanism comprises a first material taking arm, at least two first suction nozzles and a first driving assembly, the first material taking arm is arranged on the top side of the transfer material disc, the first suction nozzles are detachably connected to the bottom end of the first material taking arm, and the first driving assembly is used for driving the first material taking arm to convey the raw material tube seats back and forth between the material disc and the transfer material disc; and
the second material taking mechanism comprises a second material taking arm, at least two second suction nozzles and a second driving assembly, the second material taking arm is arranged on the top side of the transfer material disc, the second suction nozzles are detachably connected to the bottom end of the second material taking arm, and the second driving assembly is used for driving the second material taking arm to enable the raw material tube seat to be conveyed back and forth between the transfer material disc and the heating positioning mechanism.
Optionally, sixteen positioning holes for adapting to the four types of raw material tube seats are formed in the top surface of the transfer tray, and the four positioning holes adapted to the same type of raw material tube seats are distributed at equal angular intervals.
Optionally, a first heating assembly for preheating the raw material tube seats is arranged on the transfer tray.
Optionally, the second material taking mechanism comprises:
the two second material taking arms are respectively arranged above the transfer tray and the heating positioning mechanism; and
the second suction nozzles are detachably connected to the bottom ends of the second material taking arms respectively.
Optionally, the second drive assembly comprises:
the two opposite ends of the connecting arm are respectively and fixedly connected with the two second material taking arms;
the rotary driving piece is used for driving the connecting arm to rotate so as to exchange the positions of the two second material taking arms; and
and the second lifting driving piece is used for driving the rotary driving piece to lift.
Optionally, the first drive assembly comprises:
the translational driving piece is used for driving the first material taking arm to move on a plane parallel to the top surface of the transfer tray;
the first lifting driving piece is used for driving the translation driving piece to lift.
Optionally, a first air nozzle for connecting an air exhaust pipe is arranged on the first material taking arm, a first air passage is formed inside the first material taking arm, and the first suction nozzle is communicated with the first air nozzle through the first air passage; the second suction nozzle is communicated with the second air nozzle through the second air passage.
The invention also provides a laser diode module wire bonding machine which comprises a material tray, a wire bonding device and the feeding and discharging device, wherein the material tray and the wire bonding device are respectively arranged at the side of the feeding and discharging device, and the wire bonding device comprises a heating and positioning mechanism for heating and positioning the raw material tube seat and a wire bonding mechanism for completing wire bonding on the raw material tube seat.
Further, the heating positioning mechanism comprises:
the top surface of the base is provided with a material placing position;
the positioning clamp comprises a first sliding block, a second sliding block, a third sliding block and a fourth sliding block, wherein the first sliding block, the second sliding block, the third sliding block and the fourth sliding block are respectively connected to the base in a sliding mode, arranged around the circumferential direction of the material placing position and distributed at equal angle intervals, the first sliding block and the third sliding block can slide towards opposite directions to be close to or far away from the material placing position, and the second sliding block and the fourth sliding block can slide towards opposite directions to be close to or far away from the material placing position;
the locking assembly is used for locking the first sliding block and the third sliding block;
the third driving assembly is used for driving the second sliding block and the fourth sliding block to close or separate; and
and the second heating assembly is used for heating the raw material tube seat.
Optionally, a positioning protrusion for adapting to the raw material tube seat positioning groove is arranged on the end surface of the first sliding block facing the material placing position.
The feeding and discharging device and the laser diode module wire bonding machine provided by the invention have the beneficial effects that: the transfer tray with the at least two positioning holes matched with the at least two types of raw material tube seats and the material taking arm with the replaceable suction nozzle are adopted, so that when the laser diode module wire welding machine produces the at least two types of laser diode modules, only the first suction nozzle and the second suction nozzle matched with the raw material tube seats on a production line need to be replaced, the technical problem that the same feeding and discharging device cannot be suitable for various types of laser diode module bonding wires is effectively solved, the application range of the feeding and discharging device is widened, and the production cost of enterprises is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a partial perspective view of a laser diode module wire bonding machine according to an embodiment of the present invention;
fig. 2 is a schematic perspective view of a transfer tray in the loading and unloading device according to the embodiment of the present invention;
fig. 3 is a schematic perspective view of a heating and positioning mechanism in the wire bonding apparatus according to the embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
1-laser diode module wire bonding machine, 10-loading and unloading device, 20-heating positioning mechanism, 11-transfer tray, 12-first material taking mechanism, 13-second material taking mechanism, 21-base, 110-positioning hole, 111-first material taking position, 112-second material taking position, 121-first material taking arm, 122-first suction nozzle, 123-first air nozzle, 131-second material taking arm, 132-second suction nozzle, 133-connecting arm, 134-rotary driving member, 135-second air nozzle, 210-material placing position, 221-first slide block, 222-second slide block, 223-third slide block, 224-fourth slide block, 110 a-first positioning hole, 110 b-second positioning hole, 110 c-third positioning hole, 110 d-fourth positioning hole, 2210-positioning protrusion.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that: when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. When a component is referred to as being "electrically connected" to another component, it can be electrically connected by conductors, or can be electrically connected by radios, or can be connected by various other means capable of carrying electrical signals. The terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the patent, and the specific meanings of the above terms will be understood by those skilled in the art according to specific situations. The terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The term "plurality" means two or more unless specifically limited otherwise.
The loading and unloading device provided by the invention is explained.
Referring to fig. 1 and 2, the loading and unloading device 10 for the laser diode module wire bonding machine 1 includes a transfer tray 11, a tray driving assembly, a first material taking mechanism 12 and a second material taking mechanism 13, wherein at least two positioning holes 110 are formed on the top surface of the transfer tray 11, the at least two positioning holes 110 are adapted to at least two types of raw material tube seats, and the at least two positioning holes 110 are arranged at equal intervals along the same circumference; the material tray driving component is used for driving the transfer material tray 11 to rotate around the axis of the transfer material tray, the axis of the transfer material tray 11 is vertical to the top surface of the transfer material tray 11, and the axis of the transfer material tray 11 passes through the circle center of the circumference; the first material taking mechanism 12 comprises a first material taking arm 121, at least two first suction nozzles 122 and a first driving assembly, the first material taking arm 121 is arranged on the top side of the transfer tray 11, the first suction nozzle 122 is detachably connected to the bottom end of the first material taking arm 121, and the first driving assembly is used for driving the first material taking arm 121 to convey the raw material tube to and fro between a tray (not shown) and the transfer tray 11; the second material taking mechanism 13 includes a second material taking arm 131, at least two second suction nozzles 132 and a second driving assembly, the second material taking arm 131 is disposed on the top side of the transfer tray 11, the second suction nozzle 132 is detachably connected to the bottom end of the second material taking arm 131, and the second driving assembly is used for driving the second material taking arm 131 to convey the raw material tube to and fro between the transfer tray 11 and the heating positioning mechanism 20. Here, the raw material tube bases include TO-38, TO-46, TO-56, TO-60 and the like. It can be understood that the loading and unloading device 10 can be electrically connected to a control device disposed on the laser diode module wire bonding machine 1, or electrically connected to a separately disposed control device, and the loading and unloading device 10 is controlled by the control device to operate.
When the laser diode module wire bonding is performed, the first suction nozzle 122 and the second suction nozzle 132 which are adapted to the raw material tube seats on the production line are required to be respectively installed on the bottom ends of the first material taking arm 121 and the second material taking arm 131, then the driving program of the control device is adjusted, the tray driving component is controlled to drive the positioning hole 110 which is adapted to the raw material tube seats to reciprocally rotate to the first material taking position 111 and the second material taking position 112 of the transfer tray 11, wherein the first material taking position 111 is used for the first material taking arm 121 to take and place the raw material tube seats, the second material taking position 112 is used for the second material taking arm 122 to take and place the raw material tube seats, then the loading and unloading device 10 is started, the first driving component drives the first material taking arm 121 to move from the upper part of the tray of the laser diode module wire bonding machine 1 to the upper part of the first material taking position 111, and the raw material tube seats are grabbed from the tray and conveyed into the, then the tray driving component drives the transfer tray 11 to rotate, the positioning hole 110 loaded with the raw material tube seat rotates to the second material taking position 112, then the second driving component drives the second material taking arm 131 to move from the upper part of the transfer tray 11 to the upper part of the heating positioning mechanism 20 of the laser diode module wire bonding machine 1, and the raw material tube seat is grabbed and conveyed from the positioning hole 110 to the heating positioning mechanism 20 through the second suction nozzle 132, after wire bonding is completed, the second driving component drives the second material taking arm 131 to move from the upper part of the heating positioning mechanism 20 to the upper part of the second material taking position 112, and the raw material tube seat completing wire bonding is grabbed and conveyed from the heating positioning mechanism 20 to the positioning hole 110 through the second suction nozzle 132, then the tray driving component drives the transfer tray 11 to rotate, the positioning hole 110 loaded with the raw material tube seat completing wire bonding is rotated back to the first material taking position 111, then the first driving component drives the first material taking arm 121 to move from the upper part of the first material taking position 111 to Furthermore, the raw material tube seat with wire bonding completed is grabbed from the positioning hole 110 by the first suction nozzle 122 and transported to the tray to complete the wire bonding cycle of one laser diode module, and the wire bonding of other laser diode modules is repeated according to the above steps, which is not described herein again.
The feeding and discharging device 10 provided by the invention adopts the transfer tray 11 with at least two positioning holes 110 adapted to at least two types of raw material tube seats and the material taking arm capable of replacing the suction nozzle, so that when the laser diode module wire welding machine 1 produces the at least two types of laser diode modules, only the first suction nozzle 121 and the second suction nozzle 122 adapted to the raw material tube seats on a production line need to be replaced, thereby effectively solving the technical problem that the same feeding and discharging device cannot be applied to various types of laser diode module bonding wires, improving the application range of the feeding and discharging device 10 and being beneficial to reducing the production cost of enterprises.
Optionally, referring to fig. 1 and fig. 2, as a specific embodiment of the loading and unloading device provided by the present invention, sixteen positioning holes 110 are formed on the top surface of the transfer tray 11, and the sixteen positioning holes 110 are used for adapting to four types of raw material tube seats, and four positioning holes 110 adapted to the same type of raw material tube seat are distributed at equal angular intervals. Specifically, four positioning holes 110 are formed on the top surface of the transfer tray 11, each positioning hole 110 is adapted TO one type of raw material tube seat, and the number of each positioning hole 110 is four, here for convenience of description, the four positioning holes 110 are respectively named as a first positioning hole 110a, a second positioning hole 110b, a third positioning hole 110c, and a fourth positioning hole 110d, wherein the first positioning hole 110a can be adapted TO a TO-38 tube seat, the second positioning hole 110b can be adapted TO a TO-46 tube seat, the third positioning hole 110b can be adapted TO a TO-56 tube seat, the fourth positioning hole 110d can be adapted TO a TO-60 tube seat, and the first positioning hole 110a, the second positioning hole 110b, the third positioning hole 110c, and the fourth positioning hole 110d are arranged at equal intervals in sequence along a circumference with the intersection point of the axis of the transfer tray 11 and the top surface of the transfer tray 11 as a circle center, the first positioning hole 110a to the next first positioning hole 110a requires the transfer tray 11 to rotate 90 ° around its axis, and so on for the other positioning holes. If: at present, a TO-38 laser diode module needs TO be produced, a technician only needs TO adjust a driving program of the control device TO enable one of the first positioning holes 110a TO be located at a first material taking position 111 of the transfer tray 11, TO enable the other first positioning hole 110a located at a position opposite TO the first positioning hole 110a TO be located at a second material taking position 112 of the transfer tray 11, and TO adjust the tray driving component TO drive the transfer tray 11 TO rotate at an intermittent angle of 90 degrees, so that when the first material taking arm 121 carries the raw material tube seats back and forth between the tray and the transfer tray 11, the second material taking arm 131 does not need TO stand by, and similarly, when the first material taking arm 121 carries the raw material tube seats back and forth between the tray and the transfer tray 11, the first material taking arm 121 does not need TO stand by, thereby effectively improving the production efficiency of the laser diode module bonding machine 1. Here, the tray driving assembly includes a motor and a transmission member, and since the transmission member is a mechanical component that is commonly used in the art and can cooperate with the motor to drive the tray 11 to rotate, the description thereof is omitted here.
Optionally, as a specific embodiment of the loading and unloading device provided by the present invention, a first heating assembly (not shown) is disposed on the transfer tray 11, and the first heating assembly is used for preheating the raw material tube seats. Because the raw material tube seat needs to be heated to about 150 ℃ when the laser diode module performs wire bonding, the wire bonding can be completed and a better wire bonding effect can be obtained, but the raw material tube seat needs to be heated to 150 ℃ for a longer time, so that the wire bonding efficiency of the laser diode module is reduced, the first heating component is additionally arranged on the transfer tray 11, the raw material tube seat can be preheated to about 90 ℃ in the process of transferring the raw material tube seat, and therefore after the raw material tube seat is sent into the heating positioning mechanism 20, the heating time can be greatly shortened, and the production efficiency of the laser diode module wire bonding machine 1 is effectively improved. It can be understood that the first heating assembly is a heater commonly used in the art, the transfer tray 11 is made of a heat conductive material, and when the first heating assembly heats the transfer tray 11, the raw material tube seats in the positioning holes 11 can be heated at the same time.
Further, referring to fig. 1, as an embodiment of the loading and unloading device provided by the present invention, the second material taking mechanism 13 includes two second material taking arms 131 and at least two times of second suction nozzles 132, wherein the two second material taking arms 131 are respectively disposed above the transfer tray 11 and the heating and positioning mechanism 20, the at least two times of second suction nozzles 132 are respectively detachably connected to bottom ends of the two second material taking arms 131, that is, one second material taking arm 131 is at least provided with two second suction nozzles 132. Thus, the two second material taking arms 131 operate simultaneously, when one second material taking arm 131 grabs the raw material tube seat on the second material taking position 112 of the transfer tray 11, the other second material taking arm 131 can grab the raw material tube seat on the heating positioning mechanism 20 to complete wire bonding, and then the positions of the two are exchanged, so that the transfer time is greatly reduced, and the production efficiency of the laser diode module wire bonding machine 1 is effectively improved.
Further, referring to fig. 1, as an embodiment of the loading and unloading apparatus provided by the present invention, the second driving assembly includes a connecting arm 133, a rotary driving member 134 and a second lifting driving member, wherein two opposite ends of the connecting arm 133 are respectively and fixedly connected to the two second material taking arms 131, the rotary driving member 134 is used for driving the connecting arm 133 to rotate so as to exchange positions of the two second material taking arms 131, and the second lifting driving member (not shown) is used for driving the rotary driving member 134 to lift. Specifically, the rotary driving member 134 is a motor, a rotation shaft thereof is fastened to a midpoint between the two opposite ends of the connecting arm 133, the second lifting driving member may be a cylinder or a screw motor, and since the combination of the second lifting driving member and the rotary driving member 134 is a conventional means in the art, it is not described herein again; when wire bonding is performed on the laser diode module, the second lifting driving member drives the connecting arm 133 and the two second material taking arms 131 to descend simultaneously through the rotating driving member 134, the two second suction nozzles 132 respectively suck the preheated raw material tube seats and the raw material tube seats completing the wire bonding from the positioning holes 110 of the second material taking positions 112 and the heating positioning mechanism 20, then the second lifting driving member drives the connecting arm 133 and the two second material taking arms 131 to ascend simultaneously through the rotating driving member 134, the two second suction nozzles 132 respectively suck the preheated raw material tube seats and the raw material tube seats completing the wire bonding from the transfer tray 11 and the heating positioning mechanism 20, then the rotating driving member 134 drives the two second material taking arms 131 to rotate 180 degrees through the connecting arm 133 to complete position exchange, and then the second lifting driving member drives the connecting arm 133 and the two second material taking arms 131 to descend simultaneously through the rotating driving member 134, the two second suction nozzles 132 respectively feed the preheated raw material tube seats to the heating and positioning mechanism 20 and the wire-welded raw material tube seats to the positioning holes 110 of the second material taking position 112, the second lifting drive then drives the connecting arm 133 and the two second take-off arms 131 simultaneously by rotating the drive 134, then the tray driving assembly drives the transferring tray 11 to rotate a certain angle, so that the next positioning hole 110 loaded with raw material tube seats rotates to the second material taking position 112, at this time, the preheated raw material tube seats are heated and welded on the heating and positioning mechanism 20, then repeating the steps, and continuously cycling in a reciprocating way to preheat the next raw material tube seat when the previous raw material tube seat is subjected to wire welding, thereby fully utilizing the time interval of heating the wire bonding of the raw material tube seat, shortening the standby time of the loading and unloading device 10 and effectively improving the production efficiency of the laser diode module wire bonding machine 1.
Further, as an embodiment of the loading and unloading apparatus provided by the present invention, the first driving assembly (not shown) includes a translational driving member and a first lifting driving member, the translational driving member is used for driving the first material taking arm 121 to move on a plane parallel to the top surface of the transfer tray 11, and the first lifting driving member is used for driving the translational driving member to lift. Specifically, the translational driving member may be a sliding table or a screw motor, and the first lifting driving member may be an air cylinder or a screw motor, and since the combination of the translational driving member and the first material taking arm 121 and the combination of the first lifting driving member and the translational driving member are conventional means in the art, the details thereof are omitted here.
Optionally, referring to fig. 1, as a specific embodiment of the loading and unloading device provided by the present invention, a first air nozzle 123 is disposed on the first material taking arm 121, the first air nozzle 123 is used for connecting an air suction pipe, a first air passage (not shown) is disposed inside the first material taking arm 121, and the first suction nozzle 122 is communicated with the first air nozzle 123 through the first air passage; meanwhile, a second air nozzle 135 is arranged on the second material taking arm 131, the second air nozzle 135 is used for connecting an air suction pipe, a second air passage (not shown) is arranged inside the second material taking arm 131, and the second suction nozzle 132 is communicated with the second air nozzle 135 through the second air passage. It can be understood that a vacuum pump is disposed on or outside the laser diode module wire bonding machine 1, one end of the exhaust tube is connected to the vacuum pump, and the other end of the exhaust tube is connected to the first air nozzle 123 and the second air nozzle 135. In this way, the first air passage and the second air passage are respectively vacuumized by the first air nozzle 123 and the second air nozzle 135, so that a suction force is formed at the first suction nozzle 122 and the second suction nozzle 132 to suck the raw material tube base.
Referring to fig. 1, the present invention further provides a laser diode module wire bonding machine 1, which includes a tray, a wire bonding device and a loading and unloading device 10, wherein the tray and the wire bonding device are respectively disposed beside the loading and unloading device 10, the wire bonding device includes a heating and positioning mechanism 20 and a wire bonding mechanism (not shown), the heating and positioning mechanism 20 is used for heating and positioning a raw material tube seat, the wire bonding mechanism is used for completing wire bonding on the raw material tube seat, and the wire bonding mechanism adopts a mechanical structure commonly used in the art, and therefore, the description thereof is omitted.
The laser diode module wire bonding machine 1 provided by the invention adopts the loading and unloading device 10, and at least two types of raw material tube seats can be matched through the transfer tray 11, the first material taking mechanism 12 and the second material taking mechanism 13, so that when the laser diode module wire bonding machine 1 produces at least two types of laser diode modules, only the first suction nozzle 121 and the second suction nozzle 122 matched with the raw material tube seats on a production line need to be replaced, the technical problem that the same loading and unloading device cannot be suitable for various types of laser diode module wire bonding is effectively solved, and the production cost of enterprises is reduced.
Optionally, referring to fig. 3, as an embodiment of the laser diode module wire bonding machine provided by the present invention, the heating and positioning mechanism 20 includes a base 21, a positioning clamp, a locking component, a third driving component and a second heating component, wherein a material placing position 210 is disposed on a top surface of the base 21; the positioning clamp comprises a first sliding block 221, a second sliding block 222, a third sliding block 223 and a fourth sliding block 224, wherein the first sliding block 221, the second sliding block 222, the third sliding block 223 and the fourth sliding block 224 are respectively connected to the base 21 in a sliding mode, the first sliding block 221, the second sliding block 222, the third sliding block 223 and the fourth sliding block 224 are arranged around the material placing position 210 in the circumferential direction and distributed at equal angle intervals, the first sliding block 221 and the third sliding block 223 can slide towards opposite directions to be close to or far from the material placing position 210, and the second sliding block 222 and the fourth sliding block 224 can slide towards opposite directions to be close to or far from the material placing position 210; the locking assembly is used for locking the first sliding block 221 and the third sliding block 223; the third driving assembly is used for driving the second slider 222 and the fourth slider 224 to close or separate; the second heating assembly is used for heating the raw material tube seat. Specifically, the first slider 221 and the third slider 223 are distributed oppositely, the second slider 222 and the fourth slider 224 are distributed oppositely, a first track and a second track are formed on the base 21, the length direction of the first track is perpendicular to the length direction of the second track, the material placing position 210 is located at the intersection of the first track and the second track, the first slider 221 and the third slider 223 can slide along the first track, the second slider 222 and the fourth slider 224 can slide along the second track, the locking component can be two screws, the two screws can respectively penetrate through the first slider 221 and the third slider 223 and fix the first slider 221 and the third slider 223 on the first track, the third driving component can include a double-acting cylinder and a pressure sensor, and the second heating component is a heater commonly used in the field. Before wire bonding of the laser diode module, the distance between the first sliding block 221 and the third sliding block 223 is adjusted, so that the material placing position 210 can be just placed into a raw material tube seat, then the first sliding block 221 and the third sliding block 223 are fixed on the base 21 through the locking assembly, then the laser diode module wire bonding machine 1 is started, the preheated raw material tube seat is placed into the material placing position 210 by the second material taking arm 131, then the third driving assembly drives the second sliding block 222 and the fourth sliding block 224 to respectively slide towards the material placing position 210 until the second sliding block 222 and the fourth sliding block 224 respectively abut against the two opposite sides of the raw material tube seat, the raw material tube seat is positioned, then the second heating assembly is started, the raw material tube seat is heated, and preparation is prepared for next wire bonding operation. Of course, according to specific situations and requirements, in other embodiments of the present invention, the locking assembly may be a clamp, the third driving assembly may include a lead screw motor, etc., and is not limited herein.
Further, referring to fig. 3, as an embodiment of the laser diode module wire bonding machine of the present invention, a positioning protrusion 2210 is disposed on an end surface of the first slider 221 facing the material placing position 210, and the positioning protrusion 2210 is adapted to a positioning groove of the raw material tube seat. When the raw material tube holder is placed in the placement position 210, the positioning protrusion 2210 extends into the positioning groove of the raw material tube holder to form positioning, which is advantageous for improving the accuracy of positioning the raw material tube holder by the heating and positioning mechanism 20.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. Go up unloader for on laser diode module bonding wire machine, its characterized in that includes:
the transfer material disc is provided with at least two positioning holes for being matched with at least two types of raw material tube seats on the top surface, the at least two positioning holes are arranged at equal intervals along the same circumference, and the transfer material disc comprises a first material taking position and a second material taking position;
the material tray driving assembly is used for driving the transfer material tray to rotate around the axis of the transfer material tray so as to enable the positioning hole to rotate to the first material taking position and the second material taking position in a reciprocating mode, and the axis of the transfer material tray is perpendicular to the top surface of the transfer material tray and passes through the circle center of the circumference;
the first material taking mechanism comprises a first material taking arm, at least two first suction nozzles and a first driving assembly, the first material taking arm is arranged on the top side of the transfer tray, the first suction nozzles are detachably connected to the bottom end of the first material taking arm, and the first driving assembly is used for driving the first material taking arm to convey the raw material tube seats back and forth between the tray and the first material taking position; and
the second material taking mechanism comprises a second material taking arm, at least two second suction nozzles and a second driving assembly, wherein the second material taking arm is arranged on the top side of the transfer material disc, the second suction nozzles are detachably connected to the bottom end of the second material taking arm, and the second driving assembly is used for driving the second material taking arm to drive the raw material tube seat to convey the raw material tube seat back and forth between the second material taking position and the heating positioning mechanism.
2. The loading and unloading device as claimed in claim 1, wherein sixteen positioning holes for adapting to four types of raw material tube seats are formed on the top surface of the transfer tray, and the four positioning holes adapted to the same type of raw material tube seats are distributed at equal angular intervals.
3. The loading and unloading device as claimed in claim 2, wherein the transfer tray is provided with a first heating assembly for preheating the raw material tube seats.
4. The loading and unloading device of claim 3, wherein the second material taking mechanism comprises:
the two second material taking arms are respectively arranged above the transfer tray and the heating positioning mechanism; and
the second suction nozzles are detachably connected to the bottom ends of the second material taking arms respectively.
5. The loading and unloading device according to claim 4, wherein the second driving assembly comprises:
the two opposite ends of the connecting arm are respectively and fixedly connected with the two second material taking arms;
the rotary driving piece is used for driving the connecting arm to rotate so as to exchange the positions of the two second material taking arms; and
and the second lifting driving piece is used for driving the rotary driving piece to lift.
6. The loading and unloading device according to any one of claims 1 to 5, wherein the first driving assembly comprises:
the translational driving piece is used for driving the first material taking arm to move on a plane parallel to the top surface of the transfer tray;
the first lifting driving piece is used for driving the translation driving piece to lift.
7. The loading and unloading device as recited in claim 6, wherein the first material taking arm is provided with a first air nozzle for connecting with an air suction pipe, a first air passage is formed inside the first material taking arm, and the first air nozzle is communicated with the first air nozzle through the first air passage; the second suction nozzle is communicated with the second air nozzle through the second air passage.
8. Laser diode module wire bonding machine characterized in that, includes charging tray, bonding wire device and any one of claim 1 to 7 last unloader, the charging tray with bonding wire device locates respectively the side of last unloader, bonding wire device includes the heating positioning mechanism who is used for heating and location the raw materials tube socket and is used for accomplishing the bonding wire mechanism of bonding wire on the raw materials tube socket.
9. The laser diode module wire bonding machine of claim 8 wherein said heating and positioning mechanism comprises:
the top surface of the base is provided with a material placing position;
the positioning clamp comprises a first sliding block, a second sliding block, a third sliding block and a fourth sliding block, wherein the first sliding block, the second sliding block, the third sliding block and the fourth sliding block are respectively connected to the base in a sliding mode, arranged around the circumferential direction of the material placing position and distributed at equal angle intervals, the first sliding block and the third sliding block can slide towards opposite directions to be close to or far away from the material placing position, and the second sliding block and the fourth sliding block can slide towards opposite directions to be close to or far away from the material placing position;
the locking assembly is used for locking the first sliding block and the third sliding block;
the third driving assembly is used for driving the second sliding block and the fourth sliding block to close or separate; and
and the second heating assembly is used for heating the raw material tube seat.
10. The laser diode module bonding wire machine of claim 9 wherein the end surface of the first slider facing the placement location is provided with a positioning protrusion for fitting the positioning slot of the raw material tube seat.
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| CN201910968818.5A CN110648950B (en) | 2019-10-12 | 2019-10-12 | Loading and unloading device and laser diode module wire bonding machine |
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| CN107127420A (en) * | 2017-06-02 | 2017-09-05 | 广东瑞谷光网通信股份有限公司 | LD chips weld shift mechanism |
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