CN113798409A - Device and method for automatically correcting tube legs of semiconductor laser - Google Patents
Device and method for automatically correcting tube legs of semiconductor laser Download PDFInfo
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- CN113798409A CN113798409A CN202010531629.4A CN202010531629A CN113798409A CN 113798409 A CN113798409 A CN 113798409A CN 202010531629 A CN202010531629 A CN 202010531629A CN 113798409 A CN113798409 A CN 113798409A
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- tube
- hole
- leg
- pipe
- semiconductor laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/02—Straightening
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a device and a method for correcting an automatic tube leg of a semiconductor laser, belonging to the technical field of laser accessory materials, wherein the device for correcting the automatic tube leg of the semiconductor laser comprises the following steps: the carousel, place the platform, the device pushes down, the rule is just the subassembly, the upper surface of placing the platform still installs the carousel, the carousel rotates and can transmits the tube socket to the below of pushing down the device, the upper surface mounting of carousel has the rule just subassembly, the rule just subassembly can carry out the rule to the leg of the pipe of buckling, the device of pushing down installs in the outside of carousel, thereby the device of pushing down can carry out the rule with the tube socket downwards to the leg of the pipe of buckling. The invention is scientific and reasonable, is safe and convenient to use, reduces the probability of the contact of operators with the tube seats, reduces pollution in large batch, and improves the yield of regular tube legs.
Description
Technical Field
The invention relates to the technical field of laser accessory materials, in particular to a device and a method for calibrating an automatic tube leg of a semiconductor laser.
Background
After decades of development, semiconductor lasers are more and more well known to the society and have been applied in multiple fields, the photoelectric conversion efficiency of semiconductor lasers is more than 60%, which is far higher than that of other similar products, the energy consumption is low, the heat accumulation in devices is less, the service life is long, the collimation is good, the illumination distance is long, and the like, and the semiconductor lasers are more and more widely applied as a new technology in the similar industries of the society. Semiconductor lasers have various advantages, which make them increasingly receive wide attention from all social circles.
Chinese patent document CN102263354B discloses a coaxial laser coupling packaging device clamp, which is suitable for TOSA/ROSA laser welding coupling packaging system. The conical surface is adopted for positioning, so that automatic centering is easy, the verticality of a clamping device is ensured, and the alignment precision during laser coupling welding is improved. By rotating the external threaded rod, the device can be clamped. The bottom of the device is provided with a binding post, a power supply can be automatically connected to a device clamped by the device, and the binding post is adjustable in height and easy to conduct. However, the positioning conditions in the prior art are too harsh to form batch automatic operation.
At present, the alignment of the tube legs for the semiconductor laser is realized by manually correcting the tube legs individually through tweezers, so that the efficiency is very low, the repairing effect is not ideal, and a device and a method for automatically aligning the tube legs for the semiconductor laser are urgently needed to solve the problems.
Disclosure of Invention
The invention aims to provide a device and a method for calibrating an automatic tube leg of a semiconductor laser, which aim to solve the problems in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
an automatic tube leg alignment device of a semiconductor laser comprises: the carousel, place the platform, the lower pressure device and the rule positive subassembly, the upper surface of placing the platform still installs the carousel, the carousel rotates and can transmits the tube socket to the below of lower pressure device, the upper surface mounting of carousel has the rule positive subassembly, the rule positive subassembly can be just to the leg of the pipe of buckling, the lower pressure device is installed in the outside of carousel, thereby the lower pressure device can be with the tube socket down pressing to the leg of the pipe of buckling carry out the rule positive.
As optimization, the correcting assembly comprises a tube seat, a bent tube leg, a correcting hole, a positioning hole and a correcting block, the bent tube leg is connected below the tube seat, the tube seat is placed in the positioning hole, the bent tube leg penetrates through the correcting hole, the correcting hole is located inside the positioning hole, the positioning hole positions the tube seat so that the bent tube leg can penetrate through the correcting hole to be corrected, the positioning hole is arranged on the upper surface of the correcting block, and the correcting block is arranged on the upper surface of the rotary table.
As optimization, the tube seat is provided with a tube seat guide groove, the inner wall of the positioning hole is provided with a guide protrusion, and the guide protrusion can be clamped into the tube seat guide groove to enable the bent tube leg to smoothly pass through the correcting hole to be corrected.
The shape of the regular hole is conical, the regular hole can be used for correcting the bent pipe leg, the circular range of the upper end of the regular hole can be enlarged by the conical regular hole, the pipe leg can conveniently and smoothly pass through the regular hole, the edge of the round hole at the lower end of the regular hole is smooth and flat, the bent pipe leg can exert an extrusion acting force on the bent pipe leg when passing through the regular hole, and the bent pipe leg can be straightened by the extrusion acting force.
Preferably, the cylinders are arranged on two sides of the rotary table, the material discharging suction nozzle and the material taking suction nozzle are respectively arranged below the cylinders on the two sides, the pressing device is arranged between the material discharging suction nozzle and the material taking suction nozzle along the outer side of the rotary table, and the material discharging suction nozzle and the material taking suction nozzle are driven to move up and down by the up-and-down movement of the cylinders.
Preferably, the pressing device is a leveling cylinder, and the leveling cylinder presses down to push the pipe seat to move downwards so that the bent pipe leg passes through the leveling hole.
For optimization, the angle interval between the installation positions of the cylinders on the two sides along the turntable is multiple of 30 degrees, and the angle interval between the installation positions of the regular cylinders and the installation positions of the cylinders is multiple of 30 degrees.
A method for calibrating an automatic tube leg of a semiconductor laser comprises the following steps:
step one, placing a tube seat on a turntable of a placing table;
step two, rotating the turntable;
step three, regulating the downward pressing of the cylinder;
step four, correcting the bent pipe legs;
and step five, taking out the tube seat.
As optimization, when the tube seats are placed on the turntable of the placing table in the step one, the tube seats are placed in alignment with the positioning holes in the turntable by using the material taking suction nozzles;
rotating the turntable, and stopping placing the tube seats one by the material taking suction nozzle every 30 degrees of rotation;
in the third step, the time for pressing down the correcting cylinder is that the tube seat is pressed down when rotating to the lower part of the correcting cylinder along with the turntable;
when the bent pipe leg is calibrated in the fourth step, the pipe leg moves downwards and penetrates through the conical hole to be calibrated, the diameter of the hole at the lower end of the calibrating hole is 1-1.5mm, the depth of the calibrating hole is 2-4mm, the gap between a small hole at the bottom end of the calibrating hole and the bent pipe leg is less than 0.1mm, the edge of the round hole at the lower end of the calibrating hole is smooth, the bent pipe leg can exert an extrusion acting force on the bent pipe leg when passing through the calibrating hole, and the bent pipe leg can be straightened and no longer bent by the extrusion acting force;
in the step five, the pipe seat is taken out by the material taking suction nozzle under the driving of the cylinder;
preferably, in the process that the tube legs move downwards in the fourth step, the guide protrusions in the positioning holes are clamped into the tube seat guide grooves to guide the tube seats, the depth of the positioning holes is 0.5-1.0mm, chamfering processing is carried out on the edges of the positioning holes, the chamfering processing is repeated chamfering, the size of each chamfering processing is 0.1-0.5mm, the chamfering processing is to enable the tube seats to be smoothly placed into the positioning holes when the top end edges of the positioning holes are expanded and the tube seats are conveniently placed, and the gap between the tube seat guide grooves and the guide protrusions is smaller than 0.1 mm.
Compared with the prior art, the invention has the beneficial effects that:
in the prior art, the pipe legs are corrected individually by tweezers manually, the efficiency is very low, the repair effect is not ideal, the pipe legs are easy to damage or scratch the outer sides of the pipe legs in the manual repair process, so that the bent pipe legs cannot be used continuously to cause resource waste, the probability of contact of operators with pipe seats is reduced by adopting an automatic pipe leg alignment method, the pollution is reduced in large batch, the rate of finished product of the pipe legs is improved, and the operators cannot contact the pipe legs to cause scratches on the pipe legs by utilizing a suction nozzle suction mode.
Drawings
FIG. 1 is a schematic structural diagram of a front view of an automatic pipe leg alignment device of a semiconductor laser according to the present invention;
FIG. 2 is a schematic diagram of a turntable structure of an automatic pipe leg alignment device of a semiconductor laser according to the present invention;
FIG. 3 is a schematic structural diagram of a tube seat of an automatic leg alignment apparatus for a semiconductor laser according to the present invention;
FIG. 4 is a schematic diagram of a positioning hole of an automatic tube leg alignment apparatus for a semiconductor laser according to the present invention;
FIG. 5 is a schematic flow chart of a method for automatic leg alignment of a semiconductor laser according to the present invention;
reference numbers in the figures: 1. a discharging suction nozzle; 2. a correcting cylinder; 3. a material taking suction nozzle; 4. a tube holder; 5. bending the pipe legs; 6. a placing table; 7. a turntable; 8. calibrating the hole; 9. a guide projection; 10. positioning holes; 11. a tube seat guide groove; 12. a cylinder; 13. and (7) correcting the block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
as shown in fig. 1 to 4, an automatic tube leg calibrating device for a semiconductor laser comprises: carousel 7, place platform 6, the device that pushes down, the positive subassembly of regulation, the upper surface of placing platform 6 still installs carousel 7, 7 carousel rotations of carousel can transmit tube socket 4 to the below of pushing down the device, the last surface mounting of carousel 7 has the positive subassembly of regulation, the positive subassembly of regulation can be regulated to the leg of a pipe 5 of buckling, the device that pushes down installs in the outside of carousel 7, thereby the device that pushes down can be with tube socket 4 pushing down to the leg of a pipe 5 of buckling carry out the regulation.
The alignment assembly comprises a tube seat 4, a bent tube leg 5, an alignment hole 8, a positioning hole 10 and an alignment block 13, wherein the bent tube leg 5 is connected below the tube seat 4, the tube seat 4 is placed in the positioning hole 10, the bent tube leg 5 passes through the alignment hole 8, the alignment hole 8 is positioned inside the positioning hole 10, the tube seat 4 is positioned by the positioning hole 10 so that the bent tube leg 5 can pass through the alignment hole 8 for alignment, the positioning hole 10 is arranged on the upper surface of the alignment block 13, when the bent tube leg 5 is aligned, the tube seat 4 needs to be sucked up by a discharging suction nozzle 1, then an air cylinder 12 where the discharging suction nozzle 1 is located moves downwards to drive the discharging suction nozzle 1 to move downwards together, the tube seat 4 is placed opposite to the positioning hole 10, the bent tube leg 5 passes through the alignment hole 8, the rotary table 7 rotates after placement is completed, the rotary table 7 stops after 30 degrees of rotation, the discharging suction nozzle 1 then aligns the tube seat 4 to the positioning hole 10, when the position of the pipe seat 4 is below the regulating cylinder 2, the regulating cylinder 2 is pressed downwards to press the pipe seat 4 into the positioning hole 10, the pipe seat 4 is pressed downwards, and meanwhile, the parts of the bent pipe legs 5 which do not pass through the regulating hole 8 move downwards together to pass through the regulating hole 8 for regulating.
The tube seat 4 is provided with a tube seat guide groove 11, the inner wall of the positioning hole 10 is provided with a guide protrusion 9, and in the downward moving process of the tube seat 4, the guide protrusion 9 can be clamped into the tube seat guide groove 11, so that the bent tube leg 5 smoothly passes through the leveling hole 8 for leveling.
The regulating block 13 is arranged on the upper surface of the rotary table 7, the shape of the regulating hole 8 is conical, and the regulating hole 8 can regulate the bent pipe leg 5.
The cylinder 12 is installed on the both sides of carousel 7, installs blowing suction nozzle 1 and gets the material suction nozzle 3 below the cylinder 12 of both sides respectively, installs the push-down device along the outside of carousel 7 between blowing suction nozzle 1 and the material suction nozzle 3, is being driven by the reciprocating motion of cylinder 12 blowing suction nozzle 1 and is getting the material suction nozzle 3 and reciprocate.
The pressing device is a regulating cylinder 2, the regulating cylinder 2 presses down to push the tube seat to move downwards, and the bent tube leg 5 penetrates through the regulating hole 8.
The angle interval of the positions where the cylinders 12 on the two sides are installed along the rotating disc 7 is multiple of 30 degrees, and the angle interval of the installation positions of the alignment cylinders 2 and the installation positions of the cylinders 12 is multiple of 30 degrees, so that the tube seat 4 can be rotated to the lower side of the alignment cylinder 2 when the rotating disc 7 rotates 30 degrees.
Example two:
firstly, a material taking suction nozzle moves up and down to place a tube seat in alignment with a positioning hole in a turntable, wherein the depth of the positioning hole is 0.5 mm;
secondly, after the turntable stops rotating for 30 degrees, the material taking suction nozzles align with the positioning holes and place the tube seats one by one;
thirdly, when the pipe seat rotates to the position below the alignment cylinder along with the turntable, the pipe seat is pressed downwards, and the alignment cylinder presses the pipe seat towards the inside of the positioning hole;
fourthly, the tube leg moves downwards and penetrates through the correcting hole to be corrected, the diameter of the hole at the lower end of the correcting hole is 1mm, the depth of the correcting hole is 2mm, the gap between a small hole at the bottom end of the correcting hole and the bent tube leg is 0.05mm, meanwhile, a guide bulge in the positioning hole can be clamped into a tube seat guide groove to complete the guide of the tube seat, and the gap between the tube seat guide groove and the guide bulge is 0.05 mm;
and step five, the tube seat is sucked out by the material taking suction nozzle under the driving of the cylinder, and the normalized tube leg is taken out.
Example three:
firstly, a material taking suction nozzle moves up and down to place a tube seat in alignment with a positioning hole in a turntable, wherein the depth of the positioning hole is 0.75 mm;
secondly, after the turntable stops rotating for 30 degrees, the material taking suction nozzles align with the positioning holes and place the tube seats one by one;
thirdly, when the pipe seat rotates to the position below the alignment cylinder along with the turntable, the pipe seat is pressed downwards, and the alignment cylinder presses the pipe seat towards the inside of the positioning hole;
fourthly, the tube leg moves downwards and penetrates through the correcting hole to be corrected, the diameter of the hole at the lower end of the correcting hole is 1.25mm, the depth of the correcting hole is 3mm, the gap between a small hole at the bottom end of the correcting hole and the bent tube leg is 0.07mm, meanwhile, a guide bulge in the positioning hole can be clamped into a tube seat guide groove to complete the guide of the tube seat, and the gap between the tube seat guide groove and the guide bulge is 0.07 mm;
and step five, the tube seat is sucked out by the material taking suction nozzle under the driving of the cylinder, and the normalized tube leg is taken out.
Example four:
firstly, a material taking suction nozzle moves up and down to place a tube seat in alignment with a positioning hole in a turntable, wherein the depth of the positioning hole is 1 mm;
secondly, after the turntable stops rotating for 30 degrees, the material taking suction nozzles align with the positioning holes and place the tube seats one by one;
thirdly, when the pipe seat rotates to the position below the alignment cylinder along with the turntable, the pipe seat is pressed downwards, and the alignment cylinder presses the pipe seat towards the inside of the positioning hole;
fourthly, the tube leg moves downwards and penetrates through the correcting hole to be corrected, the diameter of the hole at the lower end of the correcting hole is 1.5mm, the depth of the correcting hole is 4mm, the gap between a small hole at the bottom end of the correcting hole and the bent tube leg is 0.09mm, meanwhile, a guide bulge in the positioning hole can be clamped into a tube seat guide groove to complete the guide of the tube seat, and the gap between the tube seat guide groove and the guide bulge is 0.09 mm;
and fifthly, the tube seat is sucked out by the material taking suction nozzle under the driving of the cylinder, and the tube leg which is calibrated is taken out.
The working principle is as follows: when the bending pipe leg 5 is regulated, the pipe seat 4 needs to be sucked up by the discharging suction nozzle 1, then the air cylinder 12 where the discharging suction nozzle 1 is located moves downwards to drive the discharging suction nozzle 1 to move downwards together, the pipe seat 4 is placed opposite to the positioning hole 10, the bending pipe leg 5 penetrates through the regulating hole 8, the rotary table 7 rotates after the placing is completed, when the position of the pipe seat 4 is located below the regulating air cylinder 2, the regulating air cylinder 2 presses downwards to press the pipe seat 4 into the positioning hole 10, the pipe seat 4 is pressed downwards, and meanwhile, the part, which does not penetrate through the regulating hole 8, of the bending pipe leg 5 also moves downwards to penetrate through the regulating hole 8 together to be regulated.
In the downward moving process of the tube seat 4, the guide bulge 9 can be clamped into the tube seat guide groove 11, so that the bent tube leg 5 smoothly passes through the regulation hole 8 for regulation, after the regulation is completed, the tube seat 4 is sucked out by the material taking suction nozzle 3 under the driving of the cylinder 12, and the regulated tube leg is taken out.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. The utility model provides an automatic pipe leg of semiconductor laser rule regular device which characterized in that: including carousel (7), place platform (6), push down device and rule subassembly, the last surface mounting who places platform (6) has carousel (7), the last surface mounting of carousel (7) has the rule subassembly, push down the device and install in the outside of carousel (7).
2. The automatic tube leg alignment device for semiconductor laser as claimed in claim 1 wherein: the normalizing assembly comprises a tube seat (4), a bent tube leg (5), a normalizing hole (8), a positioning hole (10) and a normalizing block (13), the bent tube leg (5) is connected to the lower portion of the tube seat (4), the tube seat (4) is placed in the positioning hole (10), the bent tube leg (5) penetrates through the normalizing hole (8), the normalizing hole (8) is located in the positioning hole (10), the positioning hole (10) is arranged on the upper surface of the normalizing block (13), and the normalizing block (13) is arranged on the upper surface of the rotary table (7).
3. The automatic tube leg alignment device for semiconductor laser as claimed in claim 2 wherein: the pipe seat (4) is provided with a pipe seat guide groove (11), and the inner wall of the positioning hole (10) is provided with a guide bulge (9).
4. The automatic tube leg alignment device for semiconductor laser as claimed in claim 2 wherein: the regular hole (8) is conical.
5. The automatic tube leg alignment device for semiconductor laser as claimed in claim 1 wherein: the cylinder (12) is installed to the both sides of carousel (7), both sides blowing suction nozzle (1) and material suction nozzle (3) are installed respectively to the below of cylinder (12), along the outside of carousel (7) is installed and is pushed down the device between blowing suction nozzle (1) and material suction nozzle (3).
6. The automatic pipe leg alignment device of a semiconductor laser as claimed in claim 5 wherein: the pressing device is a regular cylinder (2).
7. The apparatus of claim 6, wherein the apparatus further comprises: the cylinder (12) on the two sides is installed along the turntable (7) at a position angle interval which is a multiple of 30 degrees, and the installation position of the correcting cylinder (2) is arranged at an installation position angle interval which is a multiple of 30 degrees with the cylinder (12).
8. A method for calibrating an automatic tube leg of a semiconductor laser is characterized by comprising the following steps: the method comprises the following steps:
step one, placing a tube seat on a turntable of a placing table;
step two, rotating the turntable;
step three, regulating the downward pressing of the cylinder;
step four, correcting the bent pipe legs;
and step five, taking out the tube seat.
9. The method of claim 7 for automatic leg alignment of a semiconductor laser, wherein:
when the tube seat is placed on the turntable of the correcting block in the first step, the tube seat is placed in alignment with the positioning hole in the turntable by using the material taking suction nozzle;
in the second step, the turntable rotates, and the tube seats are placed one by the material taking suction nozzle when the turntable rotates for 30 degrees;
the time for pressing down the correcting cylinder in the third step is that the tube seat is pressed down when rotating to the position below the correcting cylinder along with the turntable;
when the bent pipe legs are calibrated in the fourth step, the pipe legs move downwards and penetrate through the calibrating holes to be calibrated, the gap between a small hole at the bottom end of the calibrating hole and the bent pipe legs is smaller than 0.1mm, the diameter of the hole at the lower end of the calibrating hole is 1-1.5mm, and the depth of the calibrating hole is 2-4 mm;
and in the step five, the pipe seat is taken out by the material taking suction nozzle under the driving of the cylinder.
10. The method of claim 7 for automatic leg alignment of a semiconductor laser, wherein: in the process that the pipe legs move downwards in the fourth step, the guide protrusions in the positioning holes can be clamped into the pipe seat guide grooves to complete the guide of the pipe seats, the depth of the positioning holes is 0.5-1.0mm, chamfering processing is carried out on the edges of the positioning holes, the chamfering processing is repeated chamfering, the size of each chamfering processing is 0.1-0.5mm, and the gap between the pipe seat guide grooves and the guide protrusions is smaller than 0.1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010531629.4A CN113798409A (en) | 2020-06-11 | 2020-06-11 | Device and method for automatically correcting tube legs of semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010531629.4A CN113798409A (en) | 2020-06-11 | 2020-06-11 | Device and method for automatically correcting tube legs of semiconductor laser |
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| Publication Number | Publication Date |
|---|---|
| CN113798409A true CN113798409A (en) | 2021-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010531629.4A Pending CN113798409A (en) | 2020-06-11 | 2020-06-11 | Device and method for automatically correcting tube legs of semiconductor laser |
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| CN (1) | CN113798409A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07168065A (en) * | 1993-12-13 | 1995-07-04 | Matsushita Electric Ind Co Ltd | Optical semiconductor module |
| JPH10200029A (en) * | 1996-11-15 | 1998-07-31 | Taiyo Densan Kk | Method and device for correcting lead of electronic part |
| JP2003152154A (en) * | 2001-11-19 | 2003-05-23 | Nec Eng Ltd | Lead correctional device and comb tooth employed therefor |
| CN103786033A (en) * | 2014-02-18 | 2014-05-14 | 南通新三能电子有限公司 | Electrolytic condenser laser welding device and working method thereof |
| CN204310494U (en) * | 2014-12-03 | 2015-05-06 | 山东浪潮华光光电子股份有限公司 | Semiconductor laser base transfer machine angular adjustment vacuum slot |
| CN110648950A (en) * | 2019-10-12 | 2020-01-03 | 武汉东飞凌科技有限公司 | Loading and unloading device and laser diode module wire bonding machine |
| CN210242678U (en) * | 2019-08-12 | 2020-04-03 | 潍坊华光光电子有限公司 | Device for testing pipe cap and calibrating concentricity of quick pipe seat of semiconductor laser |
-
2020
- 2020-06-11 CN CN202010531629.4A patent/CN113798409A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07168065A (en) * | 1993-12-13 | 1995-07-04 | Matsushita Electric Ind Co Ltd | Optical semiconductor module |
| JPH10200029A (en) * | 1996-11-15 | 1998-07-31 | Taiyo Densan Kk | Method and device for correcting lead of electronic part |
| JP2003152154A (en) * | 2001-11-19 | 2003-05-23 | Nec Eng Ltd | Lead correctional device and comb tooth employed therefor |
| CN103786033A (en) * | 2014-02-18 | 2014-05-14 | 南通新三能电子有限公司 | Electrolytic condenser laser welding device and working method thereof |
| CN204310494U (en) * | 2014-12-03 | 2015-05-06 | 山东浪潮华光光电子股份有限公司 | Semiconductor laser base transfer machine angular adjustment vacuum slot |
| CN210242678U (en) * | 2019-08-12 | 2020-04-03 | 潍坊华光光电子有限公司 | Device for testing pipe cap and calibrating concentricity of quick pipe seat of semiconductor laser |
| CN110648950A (en) * | 2019-10-12 | 2020-01-03 | 武汉东飞凌科技有限公司 | Loading and unloading device and laser diode module wire bonding machine |
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