CN110646900A - Optical module - Google Patents

Optical module Download PDF

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Publication number
CN110646900A
CN110646900A CN201910905272.9A CN201910905272A CN110646900A CN 110646900 A CN110646900 A CN 110646900A CN 201910905272 A CN201910905272 A CN 201910905272A CN 110646900 A CN110646900 A CN 110646900A
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China
Prior art keywords
optical signals
filtering
paths
wave
optical
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CN201910905272.9A
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CN110646900B (en
Inventor
李庭宇
苏敬奎
马洪勇
周日凯
付永安
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Accelink Technologies Co Ltd
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Accelink Technologies Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4215Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/28Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/293Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
    • G02B6/29304Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by diffraction, e.g. grating
    • G02B6/29316Light guides comprising a diffractive element, e.g. grating in or on the light guide such that diffracted light is confined in the light guide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/28Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G02B6/293Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
    • G02B6/29346Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by wave or beam interference

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

The embodiment of the invention discloses an optical module, which comprises: the device comprises a planar optical waveguide wavelength division demultiplexing chip component and a filtering lens component; the planar optical waveguide wavelength division demultiplexing chip component is used for decomposing a received one-path composite optical signal containing at least two wavelengths into at least two-path single-wave optical signals and reflecting the at least two-path single-wave optical signals to the filter lens component; the filtering lens assembly is used for receiving the reflected at least two paths of single-wave optical signals, filtering and focusing the at least two paths of single-wave optical signals, and outputting at least two paths of focused single-wave optical signals with different preset wavelengths.

Description

Optical module
Technical Field
The invention relates to the field of optical communication, in particular to an optical module.
Background
At the present stage, the transmission rate of the optical module port in the data center has gradually transitioned from 40Gb/s and 100Gb/s to 400Gb/s, and in the background of increasing transmission rate, the transmission performance, package size and cost of the optical module have also placed severe requirements.
At present, the optical path structure applied to 100Gb/s and 400Gb/s optical modules mainly adopts a spatial optical thin film optical filter component to realize wavelength division multiplexing or demultiplexing on multichannel optical signals, but the spatial optical filter component has a complex structure and is difficult and high in cost for large-scale manufacturing. Correspondingly, the planar optical waveguide wavelength division multiplexing or demultiplexing chip component can realize multiplexing or demultiplexing of optical signals due to the existence of the optical waveguide structure in the planar optical waveguide wavelength division multiplexing or demultiplexing chip component, so that the planar optical waveguide wavelength division demultiplexing chip component can also be applied to the light receiving module.
However, when the planar optical waveguide wavelength division demultiplexing chip assembly is applied to a light receiving module, when the transmission rate is increased to 400Gb/s or more, each channel in the planar optical waveguide wavelength division demultiplexing chip assembly has large optical crosstalk; at the same time, the coupling efficiency and coupling tolerance are small. These problems present a challenge to the application of the planar optical waveguide wavelength division demultiplexing chip assembly to a high-speed optical receiving module.
Disclosure of Invention
In view of this, embodiments of the present invention are expected to provide an optical module, which can reduce optical crosstalk of the whole optical path and increase coupling tolerance while simplifying the optical path structure, thereby improving coupling efficiency.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
an embodiment of the present invention provides an optical module, including: the device comprises a planar optical waveguide wavelength division demultiplexing chip component and a filtering lens component; wherein the content of the first and second substances,
the planar optical waveguide wavelength division demultiplexing chip component is used for decomposing a received one-path wave-combined optical signal containing at least two wavelengths into at least two-path single-wave optical signals and reflecting the at least two-path single-wave optical signals to the filter lens component;
the filtering lens assembly is used for receiving the reflected at least two paths of single-wave optical signals, filtering and focusing the at least two paths of single-wave optical signals, and outputting at least two paths of focused single-wave optical signals with different preset wavelengths.
In the above scheme, the planar optical waveguide wavelength division demultiplexing chip assembly is at least composed of a wavelength division demultiplexer and a reflection slope; the wavelength division demultiplexer and the reflection inclined plane in the planar optical waveguide wavelength division demultiplexing chip component are integrally formed.
In the above scheme, the wavelength division demultiplexer is configured to receive a combined optical signal including at least two wavelengths, decompose the combined optical signal including at least two wavelengths into at least two single-wave optical signals, and transmit the at least two single-wave optical signals to the reflection slope;
the reflection inclined plane is used for reflecting the at least two paths of single-wave optical signals to the filter lens assembly.
In the above aspect, the filtering lens assembly includes: a first side, a second side; the first side and the second side are opposite sides;
wherein the first side of the filtering lens assembly comprises at least two filtering assemblies and the second side of the filtering lens assembly comprises at least two focusing assemblies; the at least two filtering components correspond to centers of the at least two focusing components.
In the above scheme, the at least two filtering assemblies are configured to receive the reflected at least two paths of single-wave optical signals, perform filtering processing on the reflected at least two paths of single-wave optical signals to obtain at least two paths of single-wave optical signals with different preset wavelengths, and send the at least two paths of single-wave optical signals with different preset wavelengths to the at least two focusing assemblies;
the at least two focusing components are used for carrying out focusing processing on the at least two paths of single-wave optical signals with different preset wavelengths to obtain at least two paths of focused single-wave optical signals with different preset wavelengths.
In the above scheme, the center of each of the at least two filter assemblies corresponds to the central optical path of the at least two single-wave optical signals reflected by the planar optical waveguide wavelength division demultiplexing chip assembly.
In the above scheme, distances between at least two filtering assemblies of the filtering lens assembly and adjacent filtering assemblies and focusing assemblies of the at least two focusing assemblies are equal.
In the above aspect, the optical module further includes: at least two detector chips; the centers of the at least two detector chips are aligned with the centers of the at least two filtering assemblies and the at least two focusing assemblies one by one.
In the above scheme, each of the at least two detector chips comprises a photosensitive device;
the photosensitive device is used for receiving at least two paths of focusing single-wave optical signals with different preset wavelengths sent by the filter lens assembly and converting the at least two paths of focusing single-wave optical signals with different preset wavelengths into electric signals.
In the above aspect, the optical module further includes: a circuit board, an optical mount; wherein the content of the first and second substances,
the planar optical waveguide wavelength division demultiplexing chip assembly and the at least two detector chips are positioned on the circuit board and are electrically connected with the circuit board;
the optical bracket is positioned above the detector chip and used for bearing the filtering lens component.
In the optical module provided by the embodiment of the present invention, a wavelength division demultiplexing chip component of a planar optical waveguide is used to receive a combined optical signal containing at least two wavelengths, decompose the received combined optical signal containing at least two wavelengths into at least two single-wave optical signals, and reflect the at least two single-wave optical signals to the filter lens component; and the at least two paths of single-wave optical signals are filtered and focused by the filtering lens assembly, so that at least two paths of focused single-wave optical signals with different preset wavelengths are output without crosstalk. Therefore, the interference is reduced and the coupling efficiency is improved on the basis of the cooperation of the planar optical waveguide wavelength division demultiplexing chip component and the filtering lens component on the basis of greatly simplifying the optical path structure and the packaging difficulty of the optical module.
Drawings
Fig. 1 is a schematic structural diagram of an optical module according to an embodiment of the present invention;
fig. 2 is a side view of a filter lens assembly in an optical module according to an embodiment of the present invention;
fig. 3 is a top view of a filter lens assembly in an optical module according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating a filtering process in a filtering lens assembly in an optical module according to an embodiment of the present invention;
FIG. 5 is a spectral plot of optical power versus wavelength for 4 single-wave optical signals reflected to a filter assembly on a first side of the filter lens assembly;
fig. 6 is a schematic spectrum diagram of a relationship between optical power and wavelength of a single-wave optical signal processed by a filtering component according to an embodiment of the present invention;
FIG. 7 is a coupling tolerance curve of an optical module when the wavelength division demultiplexing chip assembly for planar optical waveguides is shifted along a vertical axis;
FIG. 8 is a coupling tolerance curve of an optical module when the planar lightwave circuit wavelength division demultiplexing chip assembly is shifted along the horizontal axis;
fig. 9 is a schematic 3D structure diagram of an optical module according to an embodiment of the present invention;
fig. 10 is a partially enlarged schematic view of a 3D structure of an optical module according to an embodiment of the present invention;
fig. 11 is a schematic optical path diagram of an optical module according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to reduce optical crosstalk in a wavelength division multiplexing chip assembly of a planar optical waveguide, an embodiment of the present invention provides an optical module, fig. 1 is a schematic structural diagram of an optical module provided in an embodiment of the present invention, and as shown in fig. 1, the optical module 100 includes: the device comprises a planar optical waveguide wavelength division demultiplexing chip component 101 and a filter lens component 102; wherein the content of the first and second substances,
the planar optical waveguide wavelength division demultiplexing chip component 101 is configured to decompose a received one-path multiplexed optical signal including at least two wavelengths into at least two single-wave optical signals, and reflect the at least two single-wave optical signals to the filter lens component;
the filtering lens assembly 102 is configured to receive the reflected at least two single-wave optical signals, perform filtering and focusing on the at least two single-wave optical signals, and output at least two focused single-wave optical signals with different preset wavelengths.
It should be noted that the one-wave-combined optical signal including at least two wavelengths may be emitted from an optical port and transmitted to the planar optical waveguide wavelength division demultiplexing chip assembly through an optical fiber; the optical port refers to a port capable of emitting optical signals in various optical devices.
The planar optical waveguide wavelength division demultiplexing chip component at least comprises a wavelength division demultiplexer and a reflection inclined plane; the wavelength division demultiplexer and the reflection inclined plane in the planar optical waveguide wavelength division demultiplexing chip component are integrally formed.
The wavelength division demultiplexer is configured to receive a combined optical signal including at least two wavelengths, decompose the combined optical signal including at least two wavelengths into at least two single-wave optical signals, and transmit the at least two single-wave optical signals to the reflection slope; the reflection inclined plane is used for reflecting the at least two paths of single-wave optical signals to the filter lens assembly.
It should be noted that the wavelength division demultiplexer includes: an incident waveguide, an exit waveguide; the wavelength division demultiplexer realizes demultiplexing of the one-path wave-combined optical signal containing at least two wavelengths through a series of optical waveguide structures. Here, the optical Waveguide structure includes a Mach-Zehnder interference (Mach-Zehnder interferometer) Waveguide structure, an Arrayed Waveguide Grating (Arrayed Waveguide Grating) structure.
Based on this, the transmission process of the optical signal can be described as follows: a wave-combining optical signal containing at least two wavelengths is emitted from an optical port and transmitted to an incident waveguide of a wave decomposition multiplexer in the planar optical waveguide wavelength division demultiplexing chip component through an optical fiber; the optical fiber enters the interior of a wave decomposition multiplexer in the planar optical waveguide wavelength division demultiplexing chip assembly through an incident waveguide, the one-path composite optical signal containing at least two wavelengths is decomposed into at least two-path single-wave optical signals through an optical waveguide structure in the wave decomposition demultiplexer, the two-path single-wave optical signals are output to the reflection inclined plane in the planar optical waveguide wavelength division demultiplexing chip assembly through an emergent waveguide of the wavelength division demultiplexer, and the two-path single-wave optical signals are reflected to a filter lens assembly through the reflection inclined plane.
It should be noted that, in the embodiment of the present invention, the wavelength demultiplexer and the reflective bevel in the planar optical waveguide wavelength demultiplexing chip assembly are integrally formed.
It should be further noted that, in order to implement the filtering and focusing processes, the filtering lens assembly may be composed of a filtering assembly and a focusing assembly, that is, the filtering lens assembly includes: a first side, a second side; the first side and the second side are opposite sides; the first side of the filtering lens assembly comprises at least two filtering assemblies, and the second side of the filtering lens assembly comprises at least two focusing assemblies; the at least two filtering components correspond to centers of the at least two focusing components.
The at least two filtering assemblies are used for receiving the reflected at least two paths of single-wave optical signals, filtering the reflected at least two paths of single-wave optical signals to obtain at least two paths of single-wave optical signals with different preset wavelengths, and sending the at least two paths of single-wave optical signals with different preset wavelengths to the at least two focusing assemblies; the at least two focusing components are used for carrying out focusing processing on the at least two paths of single-wave optical signals with different preset wavelengths to obtain at least two paths of focused single-wave optical signals with different preset wavelengths.
As to the structure of the filtering lens assembly, as shown in fig. 2, fig. 2 is a side view of the filtering lens assembly in the optical module according to the embodiment of the present invention, in fig. 2, a represents a first side of the filtering lens assembly 102, and B represents a second side of the filtering lens assembly 102; 1021 represents a filtering component included on a first side a of the filtering lens assembly 102, and 1022 represents a focusing component included on a second side B of the filtering lens assembly 102.
As shown in fig. 2, the filtering lens assembly 102 includes four filtering elements 1021 on a first side a and four focusing elements 1022 on a second side B; the centers of the four filtering elements 1021 correspond one-to-one to the centers of the four focusing elements 1022. The distances between at least two filtering components 1021 and at least two adjacent filtering components 1022 and focusing components in the filtering lens component 102 are equal.
The filtering component 1021 on the first side a of the filtering lens component 102 is a plane surface, and the surface is plated with four optical films corresponding to four channels respectively for optical passband filtering. The filtering component 1021 may be a filter segment.
The focusing assembly 1022 on the second side B of the filtering lens assembly 102 may be a convex mirror, and may be a spherical surface or an aspherical surface, for focusing and aligning the light exiting from the planar optical waveguide wavelength division demultiplexing chip assembly onto the photosensitive surface of the detector chip. The centers of the optical films and the convex mirrors are aligned, the distances between the adjacent optical films and the adjacent convex mirrors are equal, and the optical films and the adjacent convex mirrors are sequentially aligned to the corresponding photosurfaces and the emergent waveguides of the wave decomposition multiplexers in the planar optical waveguide wavelength division demultiplexing chip assembly.
It should be noted that the filter lens assembly may be made of a silicon-based material, and in practical application, an array lens may be manufactured by using monocrystalline silicon, and then an optical film is plated on a plane of the lens array, that is, an optical film is plated on the plane of the lens array; optical coating refers to a process of coating one or more layers of metal/dielectric films on the surface of an optical part. Here, the purpose of coating the surface of the optical component is to reduce or increase the reflection, beam splitting, color separation, light filtering, polarization, and other requirements of light.
There are two methods for optical coating on the plane of a silicon-based multipass lens array:
(1) the mask separation method is to make a separable mask on the plane of the silicon substrate, and to use the mask to limit the area where the film is deposited during the coating process to obtain the required multi-channel optical film.
(2) And the spin coating method is to spin coat the liquid optical filter medium on the four coating areas in sequence by adopting a spin coater, and then to solidify the liquid optical filter medium by heating, baking and other modes to form the optical film.
The optical module according to the embodiment of the present invention is not limited to the above-described optical coating method, and the optical coating method is not limited thereto.
It should be noted that, besides the silicon-based material, the filter lens assembly may also be made of glass, plastic, polymer, etc. Similarly, the material of the filtering lens assembly is not limited in the embodiments of the present invention.
It should be further noted that, single-wave optical signals with different preset wavelengths can be obtained through the filtering process of the filtering component on the first side of the filtering lens component. The preset wavelength refers to a wavelength set to avoid crosstalk. Here, the wavelengths of each of the at least two single-wave optical signals are different, and the preset wavelengths obtained by performing the filtering process are different.
As an example, assume that the optical signal emitted by the optical port is a composite optical signal including 4 wavelengths, the central wavelengths of the 4 optical signals are: λ 1, λ 2, λ 3, λ 4. The combined wave optical signal containing 4 wavelengths is transmitted to an incident waveguide of a wave decomposition multiplexer in the planar optical waveguide wavelength division demultiplexing chip component through an optical fiber; the optical signals enter the interior of a wave decomposition multiplexer in the planar optical waveguide wavelength division demultiplexing chip assembly through an incident waveguide, the combined optical signals containing 4 wavelengths are decomposed into 4 paths of single-wave optical signals through an optical waveguide structure in the interior of the wavelength division demultiplexer, the 4 paths of single-wave optical signals are output to a reflection inclined plane in the planar optical waveguide wavelength division demultiplexing chip assembly through an emergent waveguide of the wavelength division demultiplexer, and then the 4 paths of single-wave optical signals are reflected by the reflection inclined plane and respectively reach 4 filter assemblies on the first side of the filter lens assembly, if the 4 filter assemblies only allow light waves with corresponding central wavelengths within a range of +/-1/2 delta lambda to pass through, the single-wave optical signals with corresponding preset wavelengths can be obtained after filtering processing of the 4 filter assemblies. Here, the preset wavelength includes one of λ 1 ± 1/2 Δ λ, λ 2 ± 1/2 Δ λ, λ 3 ± 1/2 Δ, λ 4 ± 1/2 Δ λ.
Fig. 3 is a top view of a filter lens assembly in an optical module according to an embodiment of the present invention, as shown in fig. 3, the filter assembly 300 is a filter plate; thus, in fig. 3, the at least two filtering components may refer to 4 filtering segments 301; in fig. 3, the filter segments 301 are square, and the intervals between two adjacent filter segments 301 are equal.
The following describes the optical paths of the at least two reflected single-wave optical signals transmitted in the filtering lens assemblies in fig. 2 and 3:
fig. 4 is a schematic diagram of a filtering process in a filtering lens assembly in an optical module according to an embodiment of the present invention, and as shown in fig. 4, a center wavelength of 4 single-wave optical signals reflected to a filtering assembly 401 on a first side of the filtering lens assembly 400 is: λ 1, λ 2, λ 3, λ 4. Correspondingly, the optical films on the 4 channels (channels 1-4) corresponding to the four filter assemblies 401 only allow light waves with the corresponding central wavelength ± 1/2 Δ λ to pass, i.e., only allow light waves with the corresponding preset wavelength to pass. The optical signal with the preset wavelength reaches the focusing assembly 402 in the filtering lens assembly 400, is focused and output to O1, O2, O3 and O4. O1, O2, O3 and O4 are the centers of the photosensitive surfaces of the detector chips.
Fig. 5 is a graph of optical power versus wavelength for 4 single-wave optical signals reflected to a filter assembly on a first side of the filter lens assembly, where the center wavelengths of the 4 single-wave optical signals are λ 1, λ 2, λ 3, and λ 4, respectively, as shown in fig. 5. As shown in fig. 5, there is crosstalk between channels 1-4 for 4 single-wave optical signals. The dotted lines represent the range of wavelengths that each filter component is capable of passing through.
Thus, after the filtering processing of the filtering component, as shown in fig. 6, single-wave optical signals which do not interfere with each other can be obtained; fig. 6 is a schematic spectrum diagram of a relationship between optical power and wavelength of a single-wave optical signal processed by a filtering component according to an embodiment of the present invention; in fig. 6, the single-wave optical signals of the 4 channels (channels 1-4) do not cross-talk with each other.
After the filtering processing, the at least two paths of single-wave optical signals are respectively focused through a focusing component, namely a convex lens. Here, the coupling efficiency and coupling tolerance curve of the optical module according to the present invention are simulated by modeling simulation. As shown in fig. 7 and 8; fig. 7 is a coupling tolerance curve of the optical module when the planar optical waveguide wavelength division demultiplexing chip assembly is shifted along the vertical axis direction, and fig. 8 is a coupling tolerance curve of the optical module when the planar optical waveguide wavelength division demultiplexing chip assembly is shifted along the horizontal axis direction. As is apparent from fig. 7 and 8, the coupling efficiency of the optical module can reach more than 98% by the action of the filtering lens assembly. The tolerance in the X/Y direction can reach +/-6 um, the tolerance in the Z direction can reach +/-50 um, the reliability requirement can be fully ensured, and the large-scale packaging and manufacturing are facilitated. Here, when the tolerance in the X \ Y direction reaches ± 6um and the tolerance in the Z direction reaches ± 50um, the coupling efficiency of the entire optical module is > 80%.
The following describes the overall structure of the optical module:
the light module further includes: the center of each detector chip in the at least two detector chips is aligned with the centers of the at least two filtering assemblies and the at least two focusing assemblies one by one.
Each detector chip of the at least two detector chips comprises a photosensitive device;
the photosensitive device is used for receiving at least two paths of focusing single-wave optical signals with different preset wavelengths output by the filter lens assembly and converting the at least two paths of focusing single-wave optical signals with different preset wavelengths into electric signals.
The light module further includes: a circuit board, an optical mount; the planar optical waveguide wavelength division demultiplexing chip assembly and the at least two detector chips are located on the circuit board and are electrically connected with the circuit board;
the optical bracket is positioned above the detector chip and used for bearing the filtering lens component.
Fig. 9 is a schematic 3D structure diagram of an optical module according to an embodiment of the present invention, and as shown in fig. 9, a detector chip 904 and a planar optical waveguide wavelength division demultiplexing chip assembly in the optical module are both disposed on a printed circuit board PCBA905, and a wavelength division demultiplexer 901 and a reflection slope 902 in the planar optical waveguide wavelength division demultiplexing chip assembly are integrally formed; wherein, the detector chip 904 and the PCBA905 are directly electrically connected. An optical mount 907 is used to carry the filtering lens assembly 903. The planar optical waveguide wavelength division demultiplexing chip component receives an optical signal emitted from the optical port 906 through a single-mode optical fiber.
Fig. 10 is a partially enlarged schematic view of a 3D structure of an optical module according to an embodiment of the present invention; as shown in fig. 10, the wavelength demultiplexer 1001 and the reflective bevel 1002 in the planar optical waveguide wavelength demultiplexing chip assembly are integrally formed. The at least two optical signals are reflected by the reflection inclined plane 1002, reach the filter assembly on the first side of the filter lens assembly 1003, are output to the focusing assembly on the second side of the filter lens assembly 1003 through the filtering processing of the filter assembly, and are focused on the photosensitive surface of the detector chip 1004 through the focusing assembly. The optical holder 1007 is used to carry the filtering lens assembly 1003.
The whole optical path is described below, and fig. 11 is a schematic optical path diagram of an optical module according to an embodiment of the present invention. As shown in fig. 11, a combined-wave optical signal including at least two wavelengths emitted from an optical port enters a wavelength division demultiplexer 1101 in a planar optical waveguide wavelength division demultiplexing chip assembly through an optical fiber, the wavelength division demultiplexer 1101 in the planar optical waveguide wavelength division demultiplexing chip assembly decomposes the combined-wave optical signal including at least two wavelengths to obtain at least two single-wave optical signals, outputs the at least two single-wave optical signals to a reflection slope 1102, outputs the at least two single-wave optical signals to a filter assembly on a first side of a filter lens assembly 1103 in a vertical direction through reflection of the reflection slope 1102, outputs the at least two single-wave optical signals to a focusing assembly on a second side of the filter lens assembly 1103 through filtering processing of the filter assembly, and focuses the at least two single-wave optical signals on a photosensitive surface of a detector chip 1104 through the focusing assembly.
The center of each filter assembly in the at least two filter assemblies corresponds to the central light path of the at least two paths of single-wave optical signals reflected by the planar optical waveguide wavelength division demultiplexing chip assembly.
It should be noted that the filtering lens assembly may also be composed of four single-channel filtering lenses. Likewise, the single-channel filter lens comprises a first side and a second side; the first side is opposite to the second side, the first side of the single-channel filtering lens component comprises a filtering component, and the second side of the filtering lens component comprises a focusing component; the filtering component on the single-channel filtering lens component corresponds to the center of the focusing component.
The filtering lens components corresponding to the multiple channels are manufactured in a single manufacturing and processing mode and then assembled into the optical device/module through the packaging technology.
Taking the application of a 4 × 100Gb/s CWDM or LWDM receiving optical module as an example, an optical signal incident from an optical port is a composite optical signal including four wavelengths, and enters an incident waveguide of a wavelength division demultiplexer of a planar optical waveguide wavelength division demultiplexing chip assembly through an optical fiber, and thus enters the wavelength division demultiplexer of the planar optical waveguide wavelength division demultiplexing chip assembly; the optical signal is demultiplexed and output from the four output waveguides through an optical waveguide structure of a wave decomposition multiplexer in the planar optical waveguide wavelength demultiplexing chip component, and is reflected to a first side and a second side of the filter lens component through reflection inclined planes, optical filtering is carried out through the filter component on the first side, focusing is carried out through lens focusing on the second side, and four paths of optical signals are output to a photosensitive surface of the detector chip respectively. Finally, the detector chip converts the optical signal into an electrical signal, thereby performing information processing in the electrical domain.
In the optical module provided by the embodiment of the invention, a path of wave-combined optical signal containing at least two wavelengths is received by a planar optical waveguide wavelength division and demultiplexing chip component, the path of wave-combined optical signal containing at least two wavelengths is decomposed into at least two paths of single-wave optical signals, and then the at least two paths of single-wave optical signals are reflected to a filter lens component; and the at least two paths of single-wave optical signals are filtered and focused by the filtering lens assembly, so that at least two paths of focused single-wave optical signals with different preset wavelengths are output without crosstalk. Therefore, the interference is reduced and the coupling efficiency is improved on the basis of the cooperation of the planar optical waveguide wavelength division demultiplexing chip component and the filtering lens component on the basis of greatly simplifying the optical path structure and the packaging difficulty of the optical module.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
It should be understood that, in various embodiments of the present invention, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention. The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Claims (10)

1. A light module, characterized in that the light module comprises: the device comprises a planar optical waveguide wavelength division demultiplexing chip component and a filtering lens component; wherein the content of the first and second substances,
the planar optical waveguide wavelength division demultiplexing chip component is used for decomposing a received one-path wave-combined optical signal containing at least two wavelengths into at least two-path single-wave optical signals and reflecting the at least two-path single-wave optical signals to the filter lens component;
the filtering lens assembly is used for receiving the reflected at least two paths of single-wave optical signals, filtering and focusing the at least two paths of single-wave optical signals, and outputting at least two paths of focused single-wave optical signals with different preset wavelengths.
2. The optical module of claim 1, wherein the planar optical waveguide wavelength division demultiplexing chip assembly is at least composed of a wavelength division demultiplexer and a reflective bevel; the wavelength division demultiplexer and the reflection inclined plane in the planar optical waveguide wavelength division demultiplexing chip component are integrally formed.
3. The light module of claim 2,
the wavelength division demultiplexer is configured to receive a combined optical signal including at least two wavelengths, decompose the combined optical signal including at least two wavelengths into at least two single-wave optical signals, and transmit the at least two single-wave optical signals to the reflection slope;
the reflection inclined plane is used for reflecting the at least two paths of single-wave optical signals to the filter lens assembly.
4. The light module of claim 1, wherein the filter lens assembly comprises: a first side, a second side; the first side and the second side are opposite sides;
wherein the first side of the filtering lens assembly comprises at least two filtering assemblies and the second side of the filtering lens assembly comprises at least two focusing assemblies; the at least two filtering components correspond to centers of the at least two focusing components.
5. The light module of claim 4,
the at least two filtering assemblies are used for receiving the reflected at least two paths of single-wave optical signals, filtering the reflected at least two paths of single-wave optical signals to obtain at least two paths of single-wave optical signals with different preset wavelengths, and sending the at least two paths of single-wave optical signals with different preset wavelengths to the at least two focusing assemblies;
the at least two focusing components are used for carrying out focusing processing on the at least two paths of single-wave optical signals with different preset wavelengths to obtain at least two paths of focused single-wave optical signals with different preset wavelengths.
6. The light module of claim 4,
the center of each filter assembly in the at least two filter assemblies corresponds to the central light path of the at least two paths of single-wave optical signals reflected by the planar optical waveguide wavelength division demultiplexing chip assembly.
7. The optical module of claim 4, wherein distances between adjacent ones of the at least two filter assemblies and at least two focusing assemblies of the filter lens assemblies are equal.
8. The light module of claim 4, further comprising: at least two detector chips; the centers of the at least two detector chips are aligned with the centers of the at least two filtering assemblies and the at least two focusing assemblies one by one.
9. The optical module of claim 8, wherein each of the at least two detector chips comprises a photosensor thereon;
the photosensitive device is used for receiving at least two paths of focusing single-wave optical signals with different preset wavelengths sent by the filter lens assembly and converting the at least two paths of focusing single-wave optical signals with different preset wavelengths into electric signals.
10. The light module of claim 9, further comprising: a circuit board, an optical mount; wherein the content of the first and second substances,
the planar optical waveguide wavelength division demultiplexing chip assembly and the at least two detector chips are positioned on the circuit board and are electrically connected with the circuit board;
the optical bracket is positioned above the detector chip and used for bearing the filtering lens component.
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