CN213659025U - Light receiving assembly and optical module - Google Patents
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- 230000003287 optical effect Effects 0.000 title claims abstract description 140
- 230000010287 polarization Effects 0.000 claims abstract description 178
- 230000008878 coupling Effects 0.000 claims abstract description 42
- 238000010168 coupling process Methods 0.000 claims abstract description 42
- 238000005859 coupling reaction Methods 0.000 claims abstract description 42
- 239000010409 thin film Substances 0.000 claims abstract description 20
- 230000001419 dependent effect Effects 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000002955 isolation Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 abstract description 2
- 238000001914 filtration Methods 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000010354 integration Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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Abstract
The application discloses a light receiving component and an optical module, wherein the light receiving component comprises a photon integrated chip, a coupling unit and a wavelength division demultiplexer, wherein the photon integrated chip is provided with a light detector array, an optical waveguide array and a coupler array, and the coupler array is optically connected with the light detector array through the optical waveguide array; the wavelength division demultiplexer comprises a thin film filter array arranged in a free space, each filter of the thin film filter array filters optical signals of different channels respectively, and the coupling unit couples the multiple paths of optical signals output by the wavelength division demultiplexer into the photonic integrated chip. The light receiving component combines the advantages of a wavelength division demultiplexer and a photon integrated chip of the traditional free-space film filtering technology, improves the responsivity speed and the bandwidth of the light receiving component, effectively reduces the coupling loss and the polarization-related loss, and has the advantages of high isolation, good stability, low cost and the like.
Description
Technical Field
The present application relates to the field of optical communication technologies, and in particular, to an optical receiving module and an optical module.
Background
With the continuous development of the information society, the demand of people on the capacity and bandwidth of optical transmission increases exponentially, and the demand of large-capacity optical interconnection increases rapidly. As is known, Wavelength Division Multiplexing (WDM) is an effective means for increasing optical communication capacity, and in combination with photonic integrated chip technology, the size of the device can be effectively reduced, and the integration level of the system can be increased.
In the light receiving module, the selection of the photodetector is a key device that affects the performance such as responsivity. The traditional surface receiving III-IV family optical detector or the responsivity and the dark current performance of GeSi PD are difficult to meet the high-frequency bandwidth responsivity requirement under higher speed, and the responsivity and the dark current performance have obvious bottlenecks. In a high-speed optical module, an integrated waveguide photodetector with high-speed response is usually selected, and the integrated waveguide photodetector has the following advantages: 1. the detection degree at the set wavelength is high, and the response speed is high; 2. has very high 3dB bandwidth; 3. has low dark current and noise characteristics; 4. easy integration with circuit, etc.
With the development of silicon optical chips, integrated waveguide optical detectors are also commercially available, and wavelength division multiplexing/demultiplexing devices, modulators, high-speed optical detectors, lasers and other important devices are generally monolithically integrated in the silicon optical chips, so that the size of the optical module can be effectively reduced, and the integration level is improved. Based on the current technology, at the light emitting end, the wavelength division multiplexing (Mux) on the integrated chip has a relatively mature commercial scheme, but at the light receiving end, the wavelength division demultiplexing (Demux) scheme on the integrated chip is still in the experimental stage and cannot reach the commercial level, so that the commercial use of the high-speed integrated waveguide photodetector is also limited.
Disclosure of Invention
An object of the application is to provide a light receiving component and an optical module, which have the advantages of high response speed, high bandwidth, low coupling loss, high isolation, low polarization-dependent loss and good stability.
In order to achieve one of the above objects, the present application provides a light receiving module including:
the photonic integrated chip is provided with a light detector array, an optical waveguide array and a coupler array, and the coupler array is optically connected with the light detector array through the optical waveguide array;
the wavelength division demultiplexer comprises a thin film filter array arranged in a free space, and each filter of the thin film filter array filters optical signals of different channels respectively;
the coupling unit is arranged between the wavelength division demultiplexer and the photonic integrated chip;
the optical receiving component receives a composite optical signal containing a plurality of channels, the composite optical signal is demultiplexed by the wavelength demultiplexer and then output to the coupling unit, the coupling unit couples multiple optical signals output by the wavelength demultiplexer to a coupler array of the photonic integrated chip, the coupler array couples multiple optical signals into the optical waveguide array, and the multiple optical signals are respectively incident to each optical detector of the optical detector array through each optical waveguide of the optical waveguide array and are converted into multiple electrical signals by the optical detector array to be output.
As a further improvement of the embodiment, the coupler of the coupler array is an end face coupler, and the coupling unit includes a focusing lens array or a single focusing lens.
As a further improvement of the embodiment, the end-face coupler includes a spot-size transformer.
As a further improvement of the embodiment, the coupler of the coupler array is a grating coupler or a vertical coupler, the coupling unit includes a reflective focusing lens array, or the coupling unit includes a combination of a focusing lens array and a reflective prism.
As a further improvement of the embodiment, the couplers of the coupler array are polarization uncorrelated couplers.
As a further improvement of the embodiment, the coupler of the coupler array is a polarization dependent coupler, and the light receiving module further includes a polarization processing unit; the polarization processing unit converts the optical signal received by the optical receiving component into polarized light with the same polarization state as that of the polarization-dependent coupler.
As a further improvement of the implementation, the polarization processing unit includes a polarization beam splitter, the polarization beam splitter is located in the optical path before the wavelength division demultiplexer, and the polarization beam splitter splits the signal light received by the light receiving component into two paths of linearly polarized light with mutually perpendicular polarization states, and then inputs the two paths of linearly polarized light into the wavelength division demultiplexer.
As a further improvement of the implementation mode, the number of the wavelength division demultiplexers is two, and the two paths of linearly polarized light with the polarization states perpendicular to each other are respectively incident into the two wavelength division demultiplexers;
or, the number of the wavelength division demultiplexers is one, the two paths of linearly polarized light with the polarization states perpendicular to each other are incident to the same input port of the wavelength division demultiplexer in parallel, and after the wavelength division demultiplexer demultiplexes, optical signals of each channel output from each output port of the wavelength division demultiplexer are equally divided into two paths of linearly polarized light with the polarization states perpendicular to each other.
As a further improvement of the implementation manner, the polarization processing unit further includes a polarization rotator, the polarization rotator is disposed in the optical path of one path of linearly polarized light between the polarization beam splitter and the wavelength division demultiplexer, and the polarization rotator changes the polarization direction of the linearly polarized light in the optical path, so that the polarization direction of the linearly polarized light is consistent with the polarization direction of the other path of linearly polarized light.
As a further improvement of the implementation, the polarization processing unit includes a polarization splitter array, each polarization splitter of the polarization splitter array is respectively located in an optical path of each channel between the wavelength-division demultiplexer and the photonic integrated chip, and the polarization splitter array divides the signal light of each channel into two paths of linearly polarized light with mutually perpendicular polarization states and inputs the linearly polarized light into the photonic integrated chip.
As a further improvement of the implementation manner, the polarization processing unit further includes a polarization rotator array, each polarization rotator of the polarization rotator array is respectively disposed in one of the light paths of the two linearly polarized lights with mutually perpendicular polarization states in each channel between the polarization splitter array and the photonic integrated chip, and the polarization rotator changes the polarization direction of the linearly polarized light in the light path, so that the polarization direction of the linearly polarized light is consistent with the polarization direction of the other linearly polarized light.
The application also provides an optical module, which comprises a shell and a circuit board, wherein the circuit board is packaged in the shell; the photonic integrated chip of the light receiving assembly is electrically connected with the circuit board.
The beneficial effect of this application: the advantages of the traditional wavelength division demultiplexer in free space and the advantages of the photonic integrated chip are combined, the responsivity speed and the bandwidth of the optical receiving assembly are improved, the coupling loss and the polarization-related loss are effectively reduced, and the advantages of high isolation, good stability, low cost and the like are achieved.
Drawings
Fig. 1 is a schematic structural view of a light receiving element according to embodiment 1 of the present application;
fig. 2 is a schematic structural view of a light receiving element according to embodiment 2 of the present application;
fig. 3 is a schematic structural diagram of a coupling unit used in embodiment 2 of the present application;
fig. 4 is another schematic structural diagram of a coupling unit used in embodiment 2 of the present application;
fig. 5 is a schematic structural view of a variation of the light receiving module in embodiment 2 of the present application;
fig. 6 is a simplified structural diagram of a light receiving element according to embodiment 3 of the present application;
fig. 7 is a simplified structural diagram of a light receiving element according to embodiment 4 of the present application;
fig. 8 is a simplified structural diagram of a light receiving element according to embodiment 5 of the present application;
fig. 9 is a simplified structural diagram of a light receiving module according to embodiment 6 of the present application.
Detailed Description
The present application will now be described in detail with reference to specific embodiments thereof as illustrated in the accompanying drawings. These embodiments are not intended to limit the present application, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present application.
In the various illustrations of the present application, certain dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration and, thus, are provided to illustrate only the basic structure of the subject matter of the present application.
Also, terms used herein such as "upper," "above," "lower," "below," and the like, denote relative spatial positions of one element or feature with respect to another element or feature as illustrated in the figures for ease of description. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. When an element or layer is referred to as being "on," or "connected" to another element or layer, it can be directly on, connected to, or intervening elements or layers may be present.
Example 1
As shown in fig. 1, this embodiment provides a light receiving assembly 100 including a photonic integrated chip 110, a coupling unit 130, and a wavelength division demultiplexer 120. The photonic integrated chip 110 is provided with a photodetector array 111, an optical waveguide array 112, and a coupler array 113, wherein the coupler array 113 is optically connected to the photodetector array 111 through the optical waveguide array 112. The wavelength division demultiplexer 120 includes a thin film filter array 121 disposed in a free space, and each thin film filter of the thin film filter array 121 filters optical signals of different channels. Here, the thin film filter array 121 of the wavelength division demultiplexer 120 is sequentially disposed on one end surface of a light-transmissive fixed block 122, and the light-transmissive fixed block 122 may be a glass rectangular parallelepiped, or a rectangular parallelepiped made of other light-transmissive materials, or a geometric block having two planes parallel to each other. In other embodiments, the thin film filter array may be arranged in other ways. The coupling unit 130 is located between the wavelength division demultiplexer 120 and the photonic integrated chip 110, and is configured to couple the multiple optical signals output by the wavelength division demultiplexer 120 into the couplers of the coupler array 113 in the photonic integrated chip 110, respectively.
In this embodiment, the couplers of the coupler array 113 in the photonic integrated chip 110 are end-face couplers, such as spot-size converters. The coupling unit 130 employs a focusing lens array or a single focusing lens, such as a convex lens or a plano-convex lens. The composite optical signal including multiple channels received by the optical receiving component 100 is demultiplexed by the wavelength demultiplexer 120 and outputs multiple optical signals, the multiple optical signals are respectively focused and coupled into each coupler of the coupler array 113 of the photonic integrated chip 110 through each focusing lens of the coupling unit 130, are coupled into the optical waveguide array 112 through the coupler array 113, and are respectively incident onto each photodetector of the photodetector array 111 through each optical waveguide of the optical waveguide array 112, and are converted into multiple electrical signals by the photodetector array 111 and output.
The optical receiving component combines the advantages of a traditional free-space wavelength division demultiplexer and a photonic integrated chip, utilizes the advantages of high detection degree, high response speed, very high 3dB bandwidth, lower dark current and noise characteristics of an integrated waveguide optical detector at a set wavelength, easy integration with a circuit and the like, and improves the responsivity speed and the bandwidth of the optical receiving component. Meanwhile, the wavelength division demultiplexer adopting the film filtering of the traditional free space is adopted for wavelength division demultiplexing, so that the coupling loss and the polarization correlation loss are effectively reduced, and the wavelength division demultiplexer has the advantages of high isolation, good stability, low cost and the like
Example 2
As shown in fig. 2 and 3, the light receiving assembly 200 of this embodiment also includes a photonic integrated chip 210, a coupling unit 230, and a wavelength division demultiplexer 220. The wavelength division demultiplexer 220 includes a thin film filter array 221 disposed in a free space, the thin film filter array 221 is sequentially disposed on an end surface of a light-transmitting fixing block 222, and each thin film filter of the thin film filter array 221 filters optical signals of different channels. Unlike embodiment 1, in this embodiment, each coupler of the coupler array 213 in the photonic integrated chip 210 is a grating coupler, and accordingly, the coupling unit 230 is a reflective focusing lens array. In this embodiment, the input port of the grating coupler is located on the upper surface of the photonic integrated chip 210, so the coupling unit 230 employs a reflective focusing lens array as shown in fig. 3, which includes a reflective concave mirror array 231, and the incident light is reflected and focused onto the port of the grating coupler by each reflective concave mirror of the reflective concave mirror array 231.
The grating coupler adopts two-dimensional gratings, such as polarization diversity gratings and the like, and has polarization-independent characteristics, and one grating coupler is connected to the same optical detector through two optical waveguides respectively. After the optical signal in any polarization state received by the optical receiving component 200 is demultiplexed by the wavelength demultiplexing device 220, each path of optical signal output is still light in any polarization state, and is coupled to each grating coupler by the coupling unit 230, and the grating coupler divides the light in any polarization state into two paths of light in TE mode, and the two paths of light are respectively transmitted to the optical detector through two paths of optical waveguides, and are converted into electrical signals by the optical detector to be output.
In this embodiment, the coupling unit 230 may also adopt a structure as shown in fig. 4, including a combination of a focusing lens array 232 and a reflecting prism 233. The reflecting prism 233 has an inclined reflecting surface 233a, which is a 45 ° reflecting surface in common use. The optical signals output by the wavelength division demultiplexer are focused by the focusing lenses of the focusing lens array respectively, reflected by the inclined reflecting surface of the reflecting prism and focused on the couplers of the coupler array.
As shown in fig. 5, the light receiving module 200' is different from fig. 2 in that each coupler of the coupler array 213 is a vertical coupler including an inclined reflective surface 213a for reflecting the optical signal incident into the coupler from the coupling unit 230 into the optical waveguide. The input port of the vertical coupler is also located on the upper surface of the photonic integrated chip 210, and in this embodiment, the coupling unit 230 employs a combination of a focusing lens array 232 and a reflecting prism 233. The inclined reflecting surface 213a of the vertical coupler is generally parallel to the inclined reflecting surface 233a of the reflecting prism 233. In other embodiments, a reflective focusing lens array as shown in FIG. 3 may also be employed. Specifically, the photonic integrated chip 210 includes the substrate 10, the waveguide layer 20 and the cladding layer 30, the photodetector array 211 and the optical waveguide array 212 are located in the waveguide layer 20, and the inclined reflective surface 213a of the vertical coupler is located at the port of the optical waveguide. The coupling unit 230 focuses and reflects the light to the inclined reflecting surface 213a of the vertical coupler, then reflects the light into the optical waveguide through the inclined reflecting surface 213a, and transmits the light to the optical detector through the optical waveguide. Here, the substrate 10 may be a silicon substrate, or a silicon substrate of a silicon-on-insulator (SOI) structure and a silicon dioxide buried oxide layer, and in other embodiments, may also be a substrate of other semiconductor materials, such as a lithium niobate substrate. Waveguide layer 20 is a silicon waveguide, or top silicon of a silicon-on-insulator structure.
Example 3
In the light receiving modules of embodiments 1 and 2, the couplers used in the coupler array are polarization-independent couplers, and can receive light signals in any polarization state. In the light receiving module 300 of this embodiment, the coupler array 313 is a polarization dependent coupler, and the optical signal needs to be processed in a polarization state before being incident on the photonic integrated chip 310, and the simplified structure thereof is shown in fig. 6. The light receiving module 300 includes a photonic integrated chip 310, a coupling unit 330, and a wavelength division demultiplexer 320, and further includes a polarization processing unit. In this embodiment, the polarization processing unit includes a polarization splitter 340, and the polarization splitter 340 is located in the optical path before the wavelength division demultiplexer 320, and is configured to split the signal light received by the light receiving component 300 into two linearly polarized light beams with polarization states perpendicular to each other, and then input the two linearly polarized light beams into the wavelength division demultiplexer 320. The wavelength division demultiplexer 320 also adopts the conventional free space thin film filter technology, and includes a thin film filter array 321, and each thin film filter of the thin film filter array 321 filters optical signals of different channels respectively. In this embodiment, the polarization beam splitter 340 is a Polarization Beam Splitter (PBS), and in other embodiments, other polarization beam splitters such as birefringent crystal may be used.
In this embodiment, the polarization-dependent coupler includes two polarization-dependent input ports, such as a TE input port and a TM input port, and the two polarization-dependent input ports of the same coupler are respectively connected to the same optical detector through two optical waveguides. Of course, in other embodiments, a polarization-independent coupler may be substituted for the polarization-dependent coupler. The optical signal in any polarization state received by the optical receiving component 300 is split into two linearly polarized light beams with mutually perpendicular polarization states, such as TE wave (S light) and TM wave (P light), by the polarization splitter 340, the two linearly polarized light beams are incident into the wavelength division demultiplexer 320, and the wavelength division demultiplexer 320 demultiplexes the two linearly polarized light beams respectively for output. Each channel of light after demultiplexing comprises two paths of linearly polarized light with mutually vertical polarization states: two paths of linearly polarized light with mutually vertical polarization states in the same channel are respectively coupled into two polarization-related input ports of the same coupler through the coupling unit 330, transmitted to the same optical detector through two paths of optical waveguides, and converted into an electric signal through the optical detector to be output.
In this embodiment, the optical path of the light receiving component 300 has only one wavelength division demultiplexer, two paths of linearly polarized light with mutually perpendicular polarization states output by the polarization splitter 340 are incident in parallel to the same input port of the same wavelength division demultiplexer 320, and after being demultiplexed by the wavelength division demultiplexer 320, the optical signals of each path output from each output port of the wavelength division demultiplexer 320 are equally divided into two paths of linearly polarized light with mutually perpendicular polarization states. That is, the apertures of the input port and each output port (thin film filter) of the wavelength division demultiplexer 320 are large, and two paths of linearly polarized light with polarization states perpendicular to each other in the same channel can be transmitted simultaneously. In other embodiments, two wavelength division demultiplexers may be used to demultiplex two linearly polarized light beams with polarization states perpendicular to each other. Two paths of linearly polarized light with mutually vertical polarization states output by the polarization beam splitters respectively enter the two wavelength division demultiplexers and are output after being demultiplexed by the corresponding wavelength division demultiplexers.
Example 4
As shown in fig. 7, unlike embodiment 3, the light receiving module 400 of this embodiment is added with a polarization rotator 450 on the basis of embodiment 3, that is, the polarization processing unit includes a polarization splitter 440 and a polarization rotator 450. The polarization rotator 450 is disposed in the optical path of one path of linearly polarized light between the polarization splitter 440 and the wavelength division demultiplexer 420, and is configured to change the polarization direction of the linearly polarized light in the optical path where the polarization rotator is located, so that the polarization direction of the linearly polarized light of the optical signal in the path is consistent with the polarization direction of the other path of linearly polarized light. In this embodiment, a polarization rotator 450 is added to the optical path of the TM wave output from the polarization splitter 440, and the polarization direction of the optical signal of the path is rotated by 90 ° and then changed into the TE wave, which is input into the wavelength demultiplexer 420 and has the same polarization state as the polarization state of the other path. Then, the two linearly polarized lights with the same polarization state are respectively demultiplexed by the wavelength demultiplexer 420, and then respectively coupled into the coupler array 413 in the photonic integrated chip 410 through the coupling unit 430. Here, each coupling of the coupler array 413 includes two TE input ports. Because the optical waveguide in the photonic integrated chip 410 generally adopts the TE mode for transmission, before being coupled to the photonic integrated chip 410, the polarization state of light is converted into a state matched with the TE mode, and then the light is incident into the photonic integrated chip 410, and the conversion from the TM mode to the TE mode does not need to be specially designed in the photonic integrated chip 410, thereby further reducing the polarization-dependent loss.
Example 5
As shown in fig. 8, the light receiving assembly 500 of this embodiment includes a photonic integrated chip 510, a coupling unit 530, and a wavelength division demultiplexer 520, and further includes a polarization processing unit. In this embodiment, the polarization processing unit includes a polarization beam splitter array 540. Different from embodiment 3, in this embodiment, the polarization beam splitters of the polarization beam splitter array 540 are respectively disposed on the light paths of the channels between the wavelength division demultiplexer 520 and the photonic integrated chip 510, and are used to divide the signal light of each channel into two paths of linearly polarized light with mutually perpendicular polarization states, and then input the linearly polarized light into the photonic integrated chip 510.
In this embodiment, the polarization splitter array 540 is located between the wavelength division demultiplexer 520 and the coupling unit 530. The polarization-dependent coupler comprises two polarization-dependent input ports, such as a TE input port and a TM input port, and the two polarization-dependent input ports of the same coupler are connected to the same optical detector through two paths of optical waveguides respectively. The optical signal in any polarization state received by the optical receiving component 500 is demultiplexed by the wavelength demultiplexing device 520 and outputs multiple paths of optical signals in any polarization state, and each path of optical signal in any polarization state is divided into two paths of linearly polarized light with mutually perpendicular polarization states, such as TE wave (S light) and TM wave (P light), by each polarization beam splitter of the polarization beam splitter array 540. Two paths of linearly polarized light with mutually vertical polarization states in the same channel are respectively coupled into two polarization-related input ports of the same coupler through the coupling unit 530, transmitted to the same optical detector through two paths of optical waveguides, and converted into an electric signal through the optical detector to be output.
Example 6
As shown in fig. 9, the light receiving module of this embodiment is added with a polarization rotator array 650 on the basis of embodiment 5, that is, the polarization processing unit includes a polarization splitter array 640 and a polarization rotator array 650. Each polarization rotator of the polarization rotator array 650 is respectively disposed in one of the light paths of the two linearly polarized lights with mutually perpendicular polarization states in each channel between the polarization beam splitter array 640 and the photonic integrated chip 610, and is configured to change the polarization direction of the linearly polarized light in the light path where the polarization rotator is disposed, so that the polarization direction of the linearly polarized light in the light signal is consistent with the polarization direction of the other linearly polarized light. In this embodiment, a polarization rotator is added to the optical path of the TM wave output by each polarization splitter, and the polarization direction of the TM wave optical signal is rotated by 90 °, and then the TM wave optical signal is converted into a TE wave, which is then coupled into the coupler arrays 613 in the photonic integrated chip 610 through the coupling unit 630. Here, each coupling of coupler array 613 includes two TE input ports.
The optical signal in any polarization state received by the optical receiving component 600 is demultiplexed by the wavelength demultiplexing device 620 and then outputs multiple paths of optical signals in any polarization state, and each path of optical signal in any polarization state is divided into two paths of linearly polarized light with mutually perpendicular polarization states, such as TE wave (S light) and TM wave (P light), by each polarization beam splitter of the polarization beam splitter array 640. The TM wave of each channel is converted into TE wave after the polarization direction is rotated by each polarization rotator of the polarization rotator array 650, and then coupled into the coupler array 613 in the photonic integrated chip 610 through the coupling unit 630 together with the original TE wave.
The optical waveguide in the photonic integrated chip generally adopts a TE mode for transmission, so that before being coupled to the photonic integrated chip, the polarization state of light is converted into a state matched with the TE mode, and then the light is transmitted into the photonic integrated chip, and the conversion from a TM mode to the TE mode does not need to be specially designed in the photonic integrated chip, so that the polarization-dependent loss is further reduced.
Example 7
The embodiment provides an optical module, which comprises a shell, a circuit board and an optical receiving assembly, wherein the circuit board and the optical receiving assembly are packaged in the shell. Wherein, the light receiving component adopts the light receiving component of any one of the above embodiments 1-6, and the photonic integrated chip of the light receiving component is electrically connected with the circuit board. The optical signal received by the optical module is coupled into the photonic integrated chip after being demultiplexed by the wavelength demultiplexer of the optical receiving component, is converted into an electrical signal by the optical detector of the photonic integrated chip and then is transmitted to the circuit board, and is output by the electrical interface of the optical module after being processed by the circuit board.
The above-mentioned embodiments are illustrated by taking a four-channel wavelength division demultiplexer as an example, and in other embodiments, the embodiments may also be used for wavelength division demultiplexing of optical signals of other number of channels, such as eight channels.
The above list of details is only for the concrete description of the feasible embodiments of the present application, they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present application are intended to be included within the scope of the present application.
Claims (12)
1. A light receiving module, comprising:
the photonic integrated chip is provided with a light detector array, an optical waveguide array and a coupler array, and the coupler array is optically connected with the light detector array through the optical waveguide array;
the wavelength division demultiplexer comprises a thin film filter array arranged in a free space, and each filter of the thin film filter array filters optical signals of different channels respectively;
the coupling unit is arranged between the wavelength division demultiplexer and the photonic integrated chip;
the optical receiving component receives a composite optical signal containing a plurality of channels, the composite optical signal is demultiplexed by the wavelength demultiplexer and then output to the coupling unit, the coupling unit couples multiple optical signals output by the wavelength demultiplexer to a coupler array of the photonic integrated chip, the coupler array couples multiple optical signals into the optical waveguide array, and the multiple optical signals are respectively incident to each optical detector of the optical detector array through each optical waveguide of the optical waveguide array and are converted into multiple electrical signals by the optical detector array to be output.
2. The light-receiving module according to claim 1, wherein: the coupler of the coupler array is an end face coupler, and the coupling unit comprises a focusing lens array or a single focusing lens.
3. The light-receiving module according to claim 2, wherein: the end-face coupler includes a spot-size transformer.
4. The light-receiving module according to claim 1, wherein: the coupler of the coupler array is a grating coupler or a vertical coupler, and the coupling unit comprises a reflective focusing lens array, or the coupling unit comprises a combination of a focusing lens array and a reflecting prism.
5. A light receiving module according to any one of claims 1 to 4, wherein: the couplers of the coupler array are polarization independent couplers.
6. A light receiving module according to any one of claims 1 to 4, wherein: the coupler of the coupler array is a polarization-dependent coupler, and the light receiving assembly further comprises a polarization processing unit; the polarization processing unit converts the optical signal received by the optical receiving component into polarized light with the same polarization state as that of the polarization-dependent coupler.
7. The light-receiving module according to claim 6, wherein: the polarization processing unit comprises a polarization beam splitter, the polarization beam splitter is positioned in a light path in front of the wavelength division demultiplexer, and the polarization beam splitter divides the signal light received by the light receiving component into two paths of linearly polarized light with mutually vertical polarization states and then inputs the linearly polarized light into the wavelength division demultiplexer.
8. The light-receiving module according to claim 7, wherein:
the number of the wavelength division demultiplexers is two, and the two paths of linearly polarized light with mutually vertical polarization states are respectively incident into the two wavelength division demultiplexers;
or, the number of the wavelength division demultiplexers is one, the two paths of linearly polarized light with the polarization states perpendicular to each other are incident to the same input port of the wavelength division demultiplexer in parallel, and after the wavelength division demultiplexer demultiplexes, optical signals of each channel output from each output port of the wavelength division demultiplexer are equally divided into two paths of linearly polarized light with the polarization states perpendicular to each other.
9. The light receiving module according to claim 7 or 8, wherein: the polarization processing unit further comprises a polarization rotator, the polarization rotator is arranged in a light path of one path of linearly polarized light between the polarization beam splitter and the wavelength division demultiplexer, and the polarization rotator changes the polarization direction of the linearly polarized light on the light path, so that the polarization direction of the linearly polarized light is consistent with the polarization direction of the other path of linearly polarized light.
10. The light-receiving module according to claim 6, wherein: the polarization processing unit comprises a polarization beam splitter array, each polarization beam splitter of the polarization beam splitter array is respectively positioned in the optical path of each channel between the wavelength division demultiplexer and the photonic integrated chip, and the polarization beam splitter array divides the signal light of each channel into two paths of linearly polarized light with mutually vertical polarization states and then inputs the linearly polarized light into the photonic integrated chip.
11. The light-receiving module according to claim 10, wherein: the polarization processing unit further comprises a polarization rotator array, each polarization rotator of the polarization rotator array is respectively arranged in one path of linearly polarized light of two paths of linearly polarized light with mutually vertical polarization states of each channel between the polarization beam splitter array and the photonic integrated chip, and the polarization rotator changes the polarization direction of the linearly polarized light of the path where the polarization rotator is arranged, so that the polarization direction of the linearly polarized light is consistent with the polarization direction of the other path of linearly polarized light.
12. An optical module, includes casing and circuit board, the circuit board encapsulate in the casing, its characterized in that: the light module further comprises the light receiving assembly of any one of claims 1-11; the photonic integrated chip of the light receiving assembly is electrically connected with the circuit board.
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| CN114070414A (en) * | 2021-11-09 | 2022-02-18 | 中国电子科技集团公司第二十九研究所 | Multichannel radio frequency light receiving arrangement |
| CN114942424A (en) * | 2022-07-25 | 2022-08-26 | 苏州旭创科技有限公司 | Laser radar chip and laser radar |
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| WO2023061024A1 (en) * | 2021-10-13 | 2023-04-20 | 苏州旭创科技有限公司 | Optical receiving assembly and optical module |
| CN114070414A (en) * | 2021-11-09 | 2022-02-18 | 中国电子科技集团公司第二十九研究所 | Multichannel radio frequency light receiving arrangement |
| CN114942424A (en) * | 2022-07-25 | 2022-08-26 | 苏州旭创科技有限公司 | Laser radar chip and laser radar |
| CN114942424B (en) * | 2022-07-25 | 2022-11-25 | 苏州旭创科技有限公司 | Laser radar chip and laser radar |
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