CN112821954A

CN112821954A - Optical module device

Info

Publication number: CN112821954A
Application number: CN201911119515.2A
Authority: CN
Inventors: 鲍勇年
Original assignee: Shunsin Technology Zhongshan Ltd
Current assignee: Xunyun Electronic Technology Zhongshan Co ltd
Priority date: 2019-11-15
Filing date: 2019-11-15
Publication date: 2021-05-18

Abstract

An optical module apparatus includes a substrate, a photodetector, a supporting device, and an optical demultiplexer. The light detector is arranged on the substrate and used for detecting light signals and generating corresponding electric signals. The supporting device is arranged on the substrate and has a gap with the light detector. The optical demultiplexer is bonded to the support member through glue and is in direct contact with the photodetector. The embodiment of the invention solves the problem of power loss caused by light spot generation and optical path difference loss by reducing the distance between the optical demultiplexer and the optical detector.

Description

Optical module device

Technical Field

The present invention relates to an optical module device, and more particularly, to an optical module device for receiving an optical signal.

Background

Optical transceivers are used to transmit and receive optical signals for a variety of applications, including internet data centers, cable to the home (FTTH) applications, and the like. The optical transceiver may include one or more optical transmitter sub-assemblies (TOSAs) and receiver optical sub-assemblies (ROSAs) for transmitting and receiving optical signals. In the optical receiving module, when the optical signal is transmitted from the optical demultiplexer to the optical detector, the problems of optical spot generation and power loss caused by optical path difference loss must be considered.

Disclosure of Invention

In view of the above, in an embodiment of the present invention, the power loss caused by the generation of the optical spot and the optical path loss is solved by reducing the distance between the optical demultiplexer and the optical detector.

An embodiment of the invention discloses an optical module device, which includes a substrate; the optical detector is arranged on the substrate and used for detecting optical signals and generating corresponding electrical signals; a support device disposed on the substrate and having a gap with the photodetector; and an optical demultiplexer bonded to the supporting device through glue and directly contacting the photodetector.

According to an embodiment of the present invention, the optical signal is directly incident to the optical detector via the optical demultiplexer without passing through the glue.

According to an embodiment of the invention, wherein the thickness of the support device is smaller than the thickness of the light detector.

According to an embodiment of the present invention, the slit is used for accommodating the glue.

According to an embodiment of the present invention, the optical transceiver further includes a receiving processing circuit for amplifying and converting the electrical signal to obtain data corresponding to the optical signal.

Another embodiment of the present invention discloses an optical module device, including a substrate; the photodetector is arranged on the substrate and used for detecting a light signal and generating a corresponding electric signal, the photodetector is of a step-shaped structure and comprises a high-step part and a low-step part, a groove is formed between the high-step part and the low-step part, and the high-step part is in direct contact with the photodetector; and an optical demultiplexer bonded to the lower-stage portion through glue.

According to an embodiment of the present invention, the height of the low-step portion is smaller than the height of the high-step portion.

According to an embodiment of the present invention, the groove is used for accommodating the glue.

Drawings

Fig. 1 is a block diagram of an optical module apparatus according to an embodiment of the invention.

Fig. 2 is a block diagram of an optical module apparatus according to an embodiment of the invention.

Fig. 3 is an external view of an optical module device according to an embodiment of the invention.

Fig. 4 is a side view of an optical module apparatus according to an embodiment of the invention.

Fig. 5 shows a side view of an optical module apparatus according to another embodiment of the invention.

Description of the main elements

Optical module device

100, 200, 300, 400

Optical interface port 10

The

optical demultiplexer

12, 12A

Optical multiplexer 12B

Photodetectors

14, 14A

Laser 14B

Reception processing circuits

16, 16A

Transmission processing circuit 16B

Optical receive sub-module 20A

Light transmitter subassembly 20B

Substrate 30

Optical demultiplexer 32

Bevel 33

Photodetector 34

Support device 36

Reception processing circuit 38

Glue 39

Gap 40

Optical signals L1, L2

Data RX _ D1, RX _ D2, RX _ D3, RX _ D4

Electrical data signals TX _ D1, TX _ D2, TX _ D3, TX _ D4

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The invention will be described in further detail with reference to the following figures and examples in order to facilitate the understanding and practice of the invention for those skilled in the art, it being understood that the invention provides many applicable inventive concepts which can be embodied in a wide variety of specific forms. Those of skill in the art may now make use of the details of these and other embodiments and the various structural, logical, and electrical changes that may be made without departing from the spirit and scope of the present invention.

The present description provides various examples to illustrate the technical features of various embodiments of the present invention. The arrangement of the elements in the embodiments is for illustration and not for limiting the invention. And the reference numbers in the embodiments are repeated to simplify the description, and do not indicate any relationship between the different embodiments. Wherein like reference numerals are used throughout the drawings and the description to refer to the same or like elements. The illustrations of the present specification are in simplified form and are not drawn to precise scale. For clarity and ease of description, directional terms (e.g., top, bottom, up, down, and diagonal) are used with respect to the accompanying drawings. The following description is intended to illustrate but not limit the scope of the invention, unless otherwise indicated by the scope of the claims appended hereto.

Further, in describing some embodiments of the invention, the specification may have presented the method and/or process of the invention as a particular sequence of steps. However, the methods and procedures are not limited to the particular sequence of steps described, as such may not necessarily be performed in the particular sequence of steps described. One skilled in the art will recognize that other sequences are possible embodiments. Therefore, the particular order of the steps set forth in the specification is not intended to limit the scope of the claims. Moreover, the claimed method and/or process is not limited by the order of steps, and those skilled in the art can understand that the order of steps can be modified without departing from the spirit and scope of the invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Some embodiments of the invention are described in detail below with reference to the accompanying drawings. In the following embodiments, features of the embodiments may be combined with each other without conflict.

Fig. 1 is a block diagram of an optical module apparatus according to an embodiment of the invention. According to an embodiment of the present invention, the optical module apparatus 100 is an optical receiving module. As shown in fig. 1, the optical module apparatus 100 includes an optical interface port 10, an optical demultiplexer 12, a photodetector 14, and a reception processing circuit 16. In the present embodiment, the optical module apparatus 100 is connected to an optical cable through the optical interface port 10. The ports of the optical cable may be in the form of ST, SC, FC, LC, etc.

Dense Wavelength Division Multiplexing (DWDM) technology utilizes the bandwidth and low-loss characteristics of single-mode optical fiber, and adopts multiple wavelengths as carriers, allowing each carrier channel to be transmitted simultaneously in the optical fiber. In an embodiment of the present invention, by using the dense wavelength division multiplexing technology, the optical module apparatus 100 can receive four channels by using four different channel wavelengths (λ 1, λ 2, λ 3, λ 4), so that the optical signal L1 received by the optical interface port 10 can have four wavelengths, such as λ 1, λ 2, λ 3, λ 4, and the like. Although this embodiment is illustrated with four channel configurations, other channel configurations (e.g., 2, 4, 16, 32, etc.) are within the scope of the present application.

The optical signal L1 is transmitted to the optical demultiplexer 12 through the optical interface port 10, and according to the embodiment of the present invention, the optical demultiplexer 12 uses an Arrayed Waveguide Grating (AWG) technology to distinguish the optical signal L1 into optical signals corresponding to four wavelengths λ 1, λ 2, λ 3, λ 4, and so on. The photodetectors 14 (four in the embodiment) detect the optical signals and generate corresponding electrical signals, and the generated electrical signals are processed by the amplifying circuit and the converting circuit of the receiving processing circuit 16, so as to obtain the data (e.g., RX _ D1 to RX _ D4) transmitted by the optical signal L1. According to other embodiments of the present invention, the optical demultiplexer 12 may also use a Thin-film filter (TFF) and a Fiber Grating (FBG) to separate the optical signals L1 into different wavelengths.

Fig. 2 is a block diagram of an optical module apparatus according to an embodiment of the invention. According to an embodiment of the present invention, the optical module apparatus 200 is an optical transceiver module. As shown in fig. 2, the Optical module apparatus 200 includes an Optical interface port 10, a Receiver Optical Subassembly (ROSA) 20A, and a Transmitter Optical Subassembly (TOSA) 20B. The rosa 20A includes an optical demultiplexer 12A, a photodetector 14A, and a receive processing circuit 16A. The optical transmitter subassembly 20B includes an optical multiplexer 12B, a laser 14B, and a transmission processing circuit 16B.

The difference between fig. 2 and fig. 1 is that an optical transmitter sub-module 20B is added, and the same elements as those in fig. 1 are omitted here for brevity. The reception processing circuit 16A and the transmission processing circuit 16B can communicate with an external system via a data bus. The electrical data signals (TX _ D1 to TX _ D4) received by the transmission processing circuit 16B are converted and output to the laser 14B, and the laser 14B modulates the received electrical data signals into optical signals, respectively. The Laser 14B may comprise a Distributed Feedback (DFB) Laser with a diffraction grating. In other embodiments, the Laser 14B may comprise an electro-absorption Modulated Laser (EML) Laser diode package. The optical multiplexer 12B converts the modulated optical signals corresponding to the electrical data signals (TX _ D1 through TX _ D4) into optical signals L2 of four wavelengths including λ 1, λ 2, λ 3, λ 4, etc., and transmits to the optical interface port 10 to be output to the optical cable. According to the embodiment of the present invention, the optical receive sub-module 20A and the optical transmit sub-module 20B further include other functional circuit elements, which are well known to those skilled in the art and will not be described herein for brevity.

Fig. 3 is an external view of an optical module device according to an embodiment of the invention. Fig. 4 is a side view of an optical module apparatus according to an embodiment of the invention. The optical module device 300 may correspond to the optical module device 100 of fig. 1 or the rosa 20A of fig. 2. The optical module apparatus 300 includes a substrate 30, an optical demultiplexer 32, a photodetector 34, a supporting device 36, and a reception processing circuit 38.

The photodetector 34 is disposed on the substrate 30. The support device 36 is also disposed on the substrate 30. According to an embodiment of the invention, there is a gap 40 between support device 36 and photodetector 34. The optical demultiplexer 32 is bonded to the support device 36 through glue 39 and is in direct contact with the optical detector 34.

Referring to fig. 4, the optical signal L1 is transmitted to the optical demultiplexer 32, reflected by the reflective film on the inner slope 33 of the optical demultiplexer 32, and then incident on the optical detector 34. In other embodiments, the light signal L1 may be reflected to the light detector 34 by an additional mirror. The material of the glue 39 may include an ultraviolet glue or an epoxy resin. As shown in fig. 4, since glue 39 itself has a thickness, the thickness of support device 36 may be less than the thickness of the light detector 34. It should be noted that, since the glue 39 itself has a thickness, if it exists between the optical demultiplexer 32 and the optical detector 34, increasing the distance between the optical demultiplexer 32 and the optical detector 34 inevitably causes the optical spot to be enlarged, and the optical spot cannot be completely detected by the optical detector 34, thereby causing power loss.

Therefore, in the embodiment of the present invention, the optical demultiplexer 32 and the optical detector 34 do not have the glue 39, but are closely adjacent to each other, so that the optical signal in the optical demultiplexer 32 can directly enter the optical detector 34 without passing through the glue 39, and when the glue 39 is not present in the optical demultiplexer 32 and the optical detector 34, the distance between the optical demultiplexer 32 and the optical detector 34 can be effectively reduced, thereby avoiding the optical spot amplification of the optical signal. Furthermore, since the optical signal in the optical demultiplexer 32 is directly incident to the optical detector 34 without passing through the glue 39, the power loss caused by the optical path loss when the optical signal passes through the glue 39 is effectively avoided. Furthermore, by virtue of the design that a gap 40 is left between the support means 36 and the light detector 34, the gap 40 can accommodate the overflowing glue 39 when there is an overflow of excess glue 39, reducing the risk of the light detector 34 being obscured by the glue 39.

Fig. 5 shows a side view of an optical module apparatus according to another embodiment of the invention. In the present embodiment, the difference between the optical module apparatus 400 and fig. 4 is that the photodetector 42 has a step-like structure, and includes a high-step portion 44A and a low-step portion 44B, the high-step portion 44A directly contacts with the photodetector 34, the optical demultiplexer 32 is bonded to the low-step portion 44B through the glue 39, and the groove 46 is formed between the high-step portion 44A and the low-step portion 44B. By virtue of the design of the groove 46, the groove 46 can accommodate the overflowing glue 39 when there is an overflow of excess glue 39, reducing the risk of the light detector 34 being obscured by the glue 39.

According to the embodiment of the present invention, since the optical demultiplexer 32 and the optical detector 34 are closely adjacent to each other, the distance between the optical demultiplexer 32 and the optical detector 34 is relatively reduced, and the optical signal is prevented from being amplified to cause power loss. In addition, since the optical signal is directly transferred from the optical demultiplexer 32 to the optical detector 34 without passing through the glue 39, power loss due to optical path difference loss is avoided.

The features of the many embodiments outlined above will enable those skilled in the art to better appreciate the scope of the present invention. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may change, replace, and modify the features of the present disclosure without departing from the spirit and scope of the present disclosure, and that such changes and modifications are intended to be included within the scope of the appended claims.

Claims

1. A light module device, comprising:

a substrate;

the optical detector is arranged on the substrate and used for detecting optical signals and generating corresponding electrical signals;

a support device disposed on the substrate and having a gap with the photodetector; and

an optical demultiplexer bonded to the support member through glue and in direct contact with the photodetector.

2. The optical module apparatus according to claim 1, wherein the optical signal is directly incident to the optical detector via the optical demultiplexer without passing through the glue.

3. A light module device as claimed in claim 1, characterized in that the thickness of the support means is smaller than the thickness of the light detector.

4. A light module device as claimed in claim 1, characterized in that said slit is adapted to receive said glue.

5. The optical module apparatus as claimed in claim 1, further comprising a receiving processing circuit for amplifying and converting the electrical signal to obtain data corresponding to the optical signal.

6. A light module device, comprising:

a substrate;

the photodetector is arranged on the substrate and used for detecting a light signal and generating a corresponding electric signal, the photodetector is of a step-shaped structure and comprises a high-step part and a low-step part, a groove is formed between the high-step part and the low-step part, and the high-step part is in direct contact with the photodetector; and

and an optical demultiplexer bonded to the lower-stage portion through glue.

7. The optical module apparatus according to claim 6, wherein the optical signal is directly incident to the optical detector via the optical demultiplexer without passing through the glue.

8. The optical module device according to claim 6, wherein a height of the low-step portion is smaller than a height of the high-step portion.

9. A light module device as claimed in claim 6, characterized in that said groove is adapted to receive said glue.

10. The optical module apparatus as claimed in claim 6, further comprising a receiving processing circuit for amplifying and converting the electrical signal to obtain data corresponding to the optical signal.