CN115343801A

CN115343801A - Light emitting device and light receiving device

Info

Publication number: CN115343801A
Application number: CN202210286644.6A
Authority: CN
Inventors: 何广生
Original assignee: Xunyun Electronic Technology Zhongshan Co ltd
Current assignee: Xunyun Electronic Technology Zhongshan Co ltd
Priority date: 2022-03-22
Filing date: 2022-03-22
Publication date: 2022-11-15

Abstract

A light emitting device and a light receiving device. The light emitting device includes a substrate, a light emitting chip, and a light transfer member. The light emitting chip is arranged on the substrate and comprises a body part and an extension part, the body part comprises a laser module, an optical waveguide and an optical multiplexer, and the extension part comprises a limiting groove and a light reflecting part arranged in the limiting groove. The light transmission component comprises a fixing seat and an optical fiber cable, the fixing seat is arranged in the limiting groove, the optical fiber cable is fixed on the light emitting chip through the fixing seat, one end of the optical fiber cable is provided with a condensing lens, and the light reflection part is arranged corresponding to the condensing lens.

Description

Light emitting device and light receiving device

Technical Field

The present disclosure relates to a light emitting device and a light receiving device, and more particularly, to a light emitting chip and a light receiving chip having a limiting groove for disposing a light transmitting member.

Background

Optical transceivers are used to transmit and receive optical signals for a variety of applications, including internet data centers, cable to the home (FTTH) applications, and the like. The optical transceiver may include an optical transmit module (TOSA) and an optical receive module (ROSA) for transmitting and receiving optical signals. When the conventional optical transmission module is assembled, the optical coupling procedure must be performed with the lens, the optical isolator and the optical fiber array, which results in complicated manufacturing process and affects the reliability of the product.

Disclosure of Invention

In one embodiment, the laser module, the optical isolator and the optical waveguide are integrated on a chip, and the limiting groove is added to dispose the optical transmission member and the lensed fiber is used to simplify the optical coupling process.

An embodiment of the application discloses a light emitting device, which comprises a substrate, a light emitting chip and a light transmission member. The light emitting chip is disposed on the substrate, and includes a body portion and an extension portion, the body portion includes a laser module, an optical waveguide and an optical multiplexer, and the extension portion includes a limiting groove and a light reflecting member disposed in the limiting groove. The light transmission component comprises a fixing seat and an optical fiber cable, the fixing seat is arranged in the limiting groove, the optical fiber cable is fixed on the light emitting chip through the fixing seat, one end of the optical fiber cable is provided with a condensing lens, and the light reflection part is arranged corresponding to the condensing lens.

According to an embodiment of the present disclosure, the side wall of the position-limiting groove has a light output surface, and the light signal emitted by the laser module is emitted to the light reflection member through the light output surface in a direction parallel to the surface of the substrate, and is transmitted to the condenser lens in a direction perpendicular to the surface of the substrate after being reflected by the light reflection member.

Another embodiment of the present application discloses a light receiving device, which includes a substrate, a light receiving chip, and a light transmitting member. The light receiving chip is arranged on the substrate and comprises a body part and an extension part, the body part comprises a light detector module, an optical waveguide and an optical demultiplexer, and the extension part comprises a limiting groove and a light reflecting piece arranged in the limiting groove. The light transmission component comprises a fixing seat and an optical fiber cable, the fixing seat is arranged in the limiting groove, the optical fiber cable is fixed on the light emitting chip through the fixing seat, one end of the optical fiber cable is provided with a condensing lens, and the light reflection part is arranged corresponding to the condensing lens.

According to an embodiment of the present invention, the side wall of the stopper groove has a light receiving surface, the condensing lens emits an optical signal toward the light reflecting member, and the optical signal is reflected by the light reflecting member and then transmitted to the light receiving surface in a direction parallel to the surface of the substrate.

According to an embodiment of the present disclosure, the limiting groove has a receiving groove for receiving the light reflecting member, and the light reflecting member is a 90-degree mirror.

According to an embodiment of the present disclosure, the condensing lens is fixed to the fixing base and faces the light reflecting member.

According to an embodiment of the present disclosure, the fixing base includes a joint end, a cross section of the joint end is an inverted trapezoid structure with a wide top and a narrow bottom, and a top of the limiting groove is engaged with the fixing base.

According to the light emitting device and the light receiving device, the laser module, the optical multiplexer and the optical isolator are integrated on the same photoelectric chip, and the photodetector module, the optical demultiplexer and the optical isolator are integrated on the same photoelectric chip, so that the number of times of optical coupling can be reduced. Moreover, the positioning of the optical fiber and the light reflecting piece can be completed by designing a limiting groove on the optical chip and arranging the optical fiber cable in the limiting groove through the fixing seat, and the optical coupling procedure of the optical fiber and the condensing lens is also omitted by configuring the condensing lens at one end of the optical fiber cable. Through the design of this application embodiment, because the high integrated reason of photoelectricity chip, the subassembly sets up inseparabler, more can promote optical coupling efficiency, and effectively simplifies the complexity and the packaging efficiency of product.

Drawings

Fig. 1A is a block diagram of a light emitting device according to an embodiment of the present application.

Fig. 1B is a block diagram of a light receiving device according to an embodiment of the present application.

Fig. 2 is an external view of a light emitting device according to an embodiment of the present application.

Fig. 3 is a schematic diagram illustrating a light emitting chip and a light transmitting member according to an embodiment of the present application.

FIG. 4 is a partial schematic view of a light transmitting member according to an embodiment of the present application.

Fig. 5 is a partial schematic view illustrating an extension portion of a light emitting chip according to an embodiment of the present application.

Fig. 6 is a schematic diagram illustrating a light emitting chip according to an embodiment of the present application when combined with a light transmission member.

Fig. 7 is an external view of a light receiving device according to an embodiment of the present application.

Fig. 8 is a schematic diagram illustrating a light receiving chip and a light transmitting member according to an embodiment of the present disclosure.

FIG. 9 is a partial schematic view of a light transmitting member according to an embodiment of the present application.

Fig. 10 is a partial schematic view illustrating an extension portion of a light receiving chip according to an embodiment of the present application.

Fig. 11 is a schematic diagram illustrating a light receiving chip according to an embodiment of the present application when combined with a light transmitting member.

Description of the main elements

Light emitting module 10A

Light receiving module 10B

Light emission interfaces

11A, 26A

Light receiving interfaces

11B, 26B

Optical multiplexer 12A, 36A

The

optical demultiplexers

12B, 36B

Laser modules 14A, 32A

Photodetector modules

14B, 32B

Transmission processing circuit 16A

Reception processing circuit 16B

Substrates

20A, 20B

Engaging ends

21A, 21B, 39A, 39B

Holders

22A, 22B

Fiber

optic cables

24A, 24B

Condenser lenses

27A, 27B

Fasteners 28A, 28B

Light emitting chip 30A

Light receiving chip 30B

Light transmission members

31A and 31B

Optical isolators

34A, 34B

Light output face 37A

Light receiving surface 37B

Light reflecting members

38A, 38B

Body parts

40A, 40B

Extension parts

42A, 42B

Limiting

grooves

44A, 44B

Accommodating

grooves

46A, 46B

Optical signals L1, L2

Electrical data signals TX _ D1-TX _ D4, RX _ D1-RX _ D4

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The invention will be described in further detail with reference to the following figures and examples in order to facilitate the understanding and practice of the invention for those skilled in the art, it being understood that the invention provides many applicable inventive concepts which can be embodied in a wide variety of specific forms. Those of skill in the art may now make use of the details of these and other embodiments and the various structural, logical, and electrical changes that may be made without departing from the spirit and scope of the present invention.

The present description provides various examples to illustrate the technical features of various embodiments of the present invention. The arrangement of the elements in the embodiments is for illustration and not for limiting the invention. And the reference numbers in the embodiments are repeated to simplify the description, and do not indicate any relationship between the different embodiments. Wherein like reference numerals are used throughout the drawings and the description to refer to the same or like elements. The illustrations of the present specification are in simplified form and are not drawn to precise scale. For clarity and ease of description, directional terms (e.g., top, bottom, up, down, and diagonal) are used with respect to the accompanying drawings. The following description is intended to illustrate but not limit the scope of the invention, unless otherwise indicated by the scope of the claims appended hereto.

Further, in describing some embodiments of the present application, the specification may have presented the method and/or process of the present application as a particular sequence of steps. However, the methods and procedures are not limited to the particular sequence of steps described, as such may not necessarily be performed in the particular sequence of steps described. One skilled in the art will recognize that other sequences are possible embodiments. Therefore, the particular order of the steps set forth in the specification is not intended to limit the scope of the claims. Moreover, the claimed method and/or process is not limited by the order in which the steps are performed, and one skilled in the art can appreciate that the order of the steps may be modified without departing from the spirit and scope of the claimed invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following embodiments, features of the embodiments may be combined with each other without conflict.

Fig. 1A is a block diagram of a light emitting device according to an embodiment of the present application. According to an embodiment of the present application, the light emitting apparatus includes a light emitting interface 11A and a Transmitter Optical Subassembly (TOSA) 10A. The optical transmit module 10A includes a transmit processing circuit 16A, a laser module 14A, and an optical multiplexer 12A. The light emitting device is connected to the optical fiber cable through the light emitting interface 11A. Fig. 1B is a block diagram of a light receiving device according to an embodiment of the present application. According to the embodiment of the present application, the light receiving apparatus includes a light receiving interface 11B and a Receiver Optical Subassembly (ROSA) 10B. The light receiving block 10B includes an optical demultiplexer 12B, a photodetector block 14B, and a reception processing circuit 16B. The light receiving device is connected to the optical fiber cable through the light receiving interface 11B. In the present embodiment, the light emitting interface 11A and the light receiving interface 11B may be in the form of ST type, SC type, FC type, LC type, and the like.

Dense Wavelength Division Multiplexing (DWDM) technology utilizes the bandwidth and low-loss characteristics of single-mode optical fiber, and adopts multiple wavelengths as carriers, allowing each carrier channel to be transmitted simultaneously in the optical fiber. In an embodiment of the present application, by using the dense wavelength division multiplexing technology, the optical module apparatus can receive or transmit data of four channels by using four different channel wavelengths (λ 1, λ 2, λ 3, λ 4), so that the optical signal L1 transmitted by the optical transmitting interface 11A can have four wavelengths of λ 1, λ 2, λ 3, λ 4, etc., while the optical signal L2 received by the optical receiving interface 11B can have four wavelengths of λ 1, λ 2, λ 3, λ 4, etc., and the number of the optical detection components of the optical detector module 14B and the number of the laser components of the laser module 14A are also configured corresponding to the number of the channels. Although the present embodiment is illustrated with four channel configurations, other channel configurations (e.g., 2, 8, 16, 32, etc.) are within the scope of the present application.

Referring to fig. 1A, the electrical data signals (TX _ D1 to TX _ D4) received by the transmission processing circuit 16A are converted and output to the laser module 14A, and the laser module 14A modulates the received electrical data signals into optical signals respectively. The Laser module 14A may include one or more Vertical Cavity Surface Emitting Laser diodes (VCSELs), or Surface Emitting Laser diodes, which form an array and are driven by a driving chip to emit optical signals. In other embodiments, other components that can be used as a light source, such as a Light Emitting Diode (LED), an Edge Emitting Laser Diode (EELD), a Distributed Feedback Laser (DFB) Laser with a diffraction grating, or an electro-absorption Modulated Laser (EML) Diode package, can also be used. The optical multiplexer 12A converts the modulated optical signals corresponding to the electrical data signals (TX _ D1 to TX _ D4) into an optical signal L1 including four wavelengths λ 1, λ 2, λ 3, λ 4, etc., and transmits the optical signal L to the optical transmission interface 11A to output the optical fiber cable.

Referring to fig. 1B, the optical signal L2 is transmitted to the optical demultiplexer 12B through the optical receiving interface 11B, and according to the embodiment of the present disclosure, the optical demultiplexer 12B divides the optical signal L2 into optical signals corresponding to four wavelengths, i.e., λ 1, λ 2, λ 3, λ 4, by using an Arrayed Waveguide Grating (AWG) technology. The photo-detector modules 14B (four in this embodiment) detect the optical signals and generate corresponding electrical signals, and according to this embodiment, the photo-detector modules 14B may include PIN-in-diode (PIN-N) diodes or Avalanche Photo Diodes (APDs). The electrical signal generated by the photo-detector module 14B is processed by an amplifying circuit (e.g., trans-impedance amplifier (TIA)) and a converting circuit of the receiving processing circuit 16B, so as to obtain electrical data signals (e.g., RX _ D1 to RX _ D4) transmitted by the optical signal L2. According to other embodiments of the present application, the optical demultiplexer 12B may also use a Thin-film filter (TFF) and a Fiber Grating (FBG) to convert the optical signal L2 into optical signals with different wavelengths.

According to the embodiment of the present application, the optical transmitter module 10A and the optical receiver module 10B further include other functional circuit elements, such as a laser driver for driving the laser module 14A, A Power Controller (APC), a Monitor optical Diode (MPD) for monitoring laser Power, other circuit elements necessary for implementing an optical signal transmitting function and receiving an optical signal and processing the optical signal, and a digital signal processing integrated circuit for processing an electrical signal transmitted from the optical receiver module 10B and an electrical signal to be transmitted to the optical transmitter module 10A, which are well known in the art and will not be described herein again for brevity.

Fig. 2 is an external view of a light emitting device according to an embodiment of the present application. As shown in fig. 2, the light emitting device according to an embodiment of the present application is a silicon optical module package including a substrate 20A, a light emitting chip 30A, and a light transmitting member 31A. The light transmission member 31A includes a holder 22A, an optical fiber cable 24A, and a light emission interface 26A. The optical fiber cable 24A is detachably fixed to the light emitting chip 30A through the fixing base 22A. The optical transmit interface 26A is optically coupled to the optical transmit chip 30A through the fiber optic cable 24A. The optical fiber cable 24A is used to transmit the optical signal transmitted through the light emitting chip 30A to the light emitting interface 26A. According to an embodiment of the present invention, the light emitting Chip 30A may be attached to the substrate 20A through an adhesive layer, and electrical connection processes such as Wire Bonding (Wire Bonding), tape Automated Bonding (TAB), flip Chip (FC) and the like may be performed. The substrate 20A may be made of various materials, such as plastic, epoxy, composite, FR-4, or ceramic. The substrate 20A has a pre-designed interconnect structure, a printed circuit formed by screen printing, and circuit elements necessary for implementing the functions of transmitting or receiving optical signals, which are well known to those skilled in the art and will not be described herein for brevity.

The light emitting chip 30A includes a body portion 40A and an extension portion 42A. The main body 40A integrates the laser module 32A, the optical isolator 34A, and the optical multiplexer 36A, and may also integrate a monitoring optical diode as necessary, and transmits an optical signal through an optical waveguide (optical waveguide). The laser module 32A modulates the received electrical data signal into optical signals with different wavelengths, and transmits the optical signals to the optical multiplexer 36A, and the optical multiplexer 36A combines the optical signals with different wavelengths by using a Wavelength Division Multiplexing (WDM) technology, and transmits the optical signals to the optical fiber cable 24A. Between the laser module 32A and the optical multiplexer 36A, an optical isolator 34A may be provided. The optical isolator is a non-reciprocal optical element that allows light to pass only in the direction from the laser module 32A to the optical multiplexer 36A, and provides a strong barrier to reflected light. The optical signal emitted from the laser module 32A is transmitted through the optical waveguide inside the light emitting chip 30A. Regarding the manner and structure of the optical transmitting chip 30A integrating the laser module 32A, the optical isolator 34A, the optical multiplexer 36A and the optical waveguide, those skilled in the art can configure the optical transmitting chip according to actual design, and detailed descriptions thereof are omitted herein for brevity.

Fig. 3 is a schematic diagram illustrating a light emitting chip and a light transmitting member according to an embodiment of the present application. According to an embodiment of the present disclosure, the light emitting chip 30A includes a main body 40A and an extension 42A. The extending portion 42A includes a limiting groove 44A, and the bottom of the limiting groove 44A further has a receiving groove 46A for receiving the light reflection element. The fixing seat 22A of the light transmission member corresponds to the limiting groove 44A and can be disposed in the limiting groove 44A. According to an embodiment of the present application, the fixing base 22A can be fixed to the limiting groove 44A of the extending portion 42A through glue or UV glue. According to another embodiment of the present application, the fixing seat 22A may also be fixed to the extending portion 42A by interference fit with the limiting groove 44A.

FIG. 4 is a partial schematic view of a light transmitting member according to an embodiment of the present application. According to an embodiment of the present application, the fixing base 22A includes an engaging end 21A, and a cross section of the engaging end 21A is an inverted trapezoid structure with a wide top and a narrow bottom. The optical fiber cable 24A has a condensing lens 27A at one end thereof and is fixed to the joint end 21A of the holder 22A through a fixing member 28A. The fixing member 28A may be an adhesive or other fastening structure to fix the condenser lens 27A at a suitable position in the joint end 21A.

Fig. 5 is a partial schematic view illustrating an extension portion of a light emitting chip according to an embodiment of the present disclosure. According to an embodiment of the present application, the side wall of the limiting groove 44A has a light output surface 37A, and the light reflector 38A is a 90-degree reflector having an inclined surface inclined at 45 degrees to the surface of the bottom of the light emitting chip. The top of the limiting groove 44A is provided with a joint end 39A, the side wall of the joint end 39A and the bottom of the limiting groove 44A have an included angle of 60-85 degrees to match the shape of the joint end 21A of the fixing seat 22A, when the light emitting chip is combined with the light transmission member, the joint end 21A of the fixing seat 22A is connected with the joint end 39A of the light emitting chip.

Fig. 6 is a schematic diagram illustrating a light emitting chip according to an embodiment of the present application when combined with a light transmission member. When the light emitting chip is combined with the light transmitting member, the light signal L1 emitted by the laser module of the light emitting chip is emitted to the light reflecting member 38A through the light output surface 37A in a direction parallel to the surface of the bottom of the substrate or the light emitting chip, and the light signal L1 is reflected by the light reflecting member 38A and then transmitted in a direction perpendicular to the surface of the bottom of the substrate or the light emitting chip, as shown in the figure, in a direction away from the light emitting chip. Since the condenser lens 27A and the light reflector 38A are positioned to correspond to each other, the condenser lens 27A faces and aligns the light reflector 38A, so that the optical signal L1 reflected by the light reflector 38A is transmitted to the condenser lens 27A. As shown in fig. 6, when the fixing base 22A is mounted in the limiting groove 44A, the condensing lens 27A of the light transmission member 31A is accurately positioned by the fixing base 22A and the limiting groove 44A to align the light reflection member 38A, so that the optical alignment procedure between the condensing lens 35A of the optical fiber cable 24A and the light emitting chip is completed.

Fig. 7 is an external view of a light receiving device according to an embodiment of the present application. As shown in fig. 7, the light receiving device according to an embodiment of the present application is a silicon optical module package, and includes a substrate 20B, a light receiving chip 30B, and a light transmitting member 31B. The light transmission member 31B includes a holder 22B, an optical fiber cable 24B, and a light receiving interface 26B. The optical fiber cable 24B is detachably fixed to the light receiving chip 30B through the fixing base 22B. The light receiving interface 26B is optically coupled to the light receiving chip 30B through the optical fiber cable 24B. The optical fiber cable 24B is used to transmit the optical signal received via the light receiving interface 26B to the light receiving chip 30B. According to an embodiment of the present disclosure, the light receiving Chip 30B may be attached to the substrate 20B through an adhesive layer, and electrical connection procedures such as Wire Bonding (Wire Bonding), tape Automated Bonding (TAB), flip Chip (FC) and the like are performed. The substrate 20B may be made of various materials, such as plastic, epoxy, composite, FR-4, or ceramic. The substrate 20B has a pre-designed interconnect structure, a printed circuit formed by screen printing, and circuit elements necessary for implementing the functions of transmitting or receiving optical signals, which are well known to those skilled in the art and will not be described herein for brevity.

The light receiving chip 30B includes a body portion 40B and an extension portion 42B. The main body 40B integrates the photodetector module 32B, the optical isolator 34B, and the optical demultiplexer 36B, and transmits an optical signal through an optical waveguide (optical waveguide). The optical demultiplexer 36B separates the received optical signals into optical signals with different wavelengths, and transmits the optical signals to the optical detector module 32B. The photo-detector module 32B detects the optical signal and generates a corresponding electrical signal. Between the optical demultiplexer 36B and the photodetector module 32B, an optical isolator 34B may be provided. The optical isolator is a non-reciprocal optical element that allows the light beam to pass only in the direction from the optical demultiplexer 36B to the photodetector module 32B, and provides a strong barrier to reflected light. The optical signal can be transmitted through the optical waveguide inside the light receiving chip 30B. Techniques for transmitting optical signals through optical waveguides are well known to those skilled in the art and will not be described herein for brevity. Regarding the manner and structure of integrating the photodetector module 32B, the optical isolator 34B, the optical demultiplexer 36B and the optical waveguide into the light receiving chip 30B, those skilled in the art can configure the integrated circuit according to actual design, and will not be described herein for brevity.

Fig. 8 is a schematic diagram illustrating a light receiving chip and a light transmitting member according to an embodiment of the present application. According to an embodiment of the present application, the light receiving chip 30B includes a body portion 40B and an extension portion 42B. The extending portion 42B includes a limiting groove 44B, and the bottom of the limiting groove 44B further has a receiving groove 46B for disposing the light reflector. The fixing seat 22B of the light transmission member corresponds to the limiting groove 44B and can be disposed in the limiting groove 44B. According to an embodiment of the present application, the fixing base 22B can be fixed to the limiting groove 44B of the extending portion 42B by glue or UV glue. According to another embodiment of the present application, the fixing seat 22B may also be fixed to the extending portion 42B by interference fit with the limiting groove 44B.

FIG. 9 is a partial schematic view of a light transmitting member according to an embodiment of the present application. According to an embodiment of the present application, the fixing base 22B includes an engaging end 21B, and a cross section of the engaging end 21B has an inverted trapezoidal structure with a wide top and a narrow bottom. The optical fiber cable 24B has a condensing lens 27B at one end thereof, and is fixed to the joint end 21B of the holder 22B through a fixing member 28B. The fixing member 28B may be an adhesive or other fastening structure to fix the condenser lens 27B in a proper position in the joint end 21B.

Fig. 10 is a partial schematic view illustrating an extension portion of a light receiving chip according to an embodiment of the present application. According to an embodiment of the present application, the side wall of the stopper groove 44B has a light receiving surface 37B, and the light reflecting member 38B is a 90-degree mirror having an inclined surface inclined at 45 degrees to the surface of the bottom of the light receiving chip. The top of the limiting groove 44B is provided with a joint end 39B, the side wall of the joint end 39B and the bottom of the limiting groove 44B have an included angle of 60-85 degrees to match the shape of the joint end 21B of the fixing base 22B, and when the light receiving chip is combined with the light transmission member, the joint end 21B of the fixing base 22B is connected with the joint end 39B of the light receiving chip.

Fig. 11 is a schematic diagram illustrating a light receiving chip according to an embodiment of the present application when combined with a light transmitting member. When the light receiving chip is combined with the light transmitting member, the condenser lens 27B of the optical fiber cable 24B transmits the optical signal L2 toward the light reflector 38B, that is, in a direction orthogonal to the surface of the bottom of the substrate or the light receiving chip. The optical signal L2 is reflected by the light reflecting member 38B and then emitted to the light receiving surface 37B in a direction parallel to the surface of the bottom of the substrate or the light receiving chip, so that the optical signal L2 can be transmitted through the optical waveguide inside the light receiving chip. Since the condenser lens 27B and the light reflection member 38B are positioned in correspondence with each other, the condenser lens 27B faces and aligns the light reflection member 38B so that the optical signal L2 reflected by the light reflection member 38B can be transmitted to the light receiving surface 37B. As shown in fig. 11, when the fixing base 22B is mounted in the limiting groove 44B, the condensing lens 27B of the light transmitting member 31B is accurately positioned by the fixing base 22B and the limiting groove 44B to align the light reflecting member 38B, so that the optical alignment procedure between the condensing lens 35B of the optical fiber cable 24B and the light receiving chip is completed.

According to light emitting device and light receiving arrangement of this application embodiment, integrate laser module, optical multiplexer and optoisolator at same photoelectricity chip to and with photodetector module, optical multiplexer and optoisolator integrated at same photoelectricity chip, the number of times of reducible optical coupling. Furthermore, the positioning of the optical fiber and the light reflection piece can be completed by designing a limiting groove on the optical chip and arranging the optical fiber cable in the limiting groove through the fixing seat, and the optical coupling procedure of the optical fiber and the condensing lens is also omitted by arranging the condensing lens at one end of the optical fiber cable. Through the design of this application embodiment, because the high integrated reason of photoelectricity chip, the subassembly sets up inseparabler, more can promote optical coupling efficiency, and effectively simplifies the complexity and the packaging efficiency of product.

The features of the many embodiments outlined above will enable those skilled in the art to better appreciate the scope of the present invention. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may change, replace, and modify the features of the present disclosure without departing from the spirit and scope of the present disclosure, and that such changes and modifications are intended to be included within the scope of the appended claims.

Claims

1. A light emitting device, comprising:

a substrate;

the optical transmission chip is arranged on the substrate and comprises a body part and an extension part, the body part comprises a laser module, an optical waveguide and an optical multiplexer, and the extension part comprises a limiting groove and an optical reflection part arranged in the limiting groove; and

and the light transmission component comprises a fixed seat and an optical fiber cable, the fixed seat is arranged in the limit groove, the optical fiber cable is detachably fixed on the light emitting chip through the fixed seat, one end of the optical fiber cable is provided with a condensing lens, and the light reflection part is arranged corresponding to the condensing lens.

2. The light-emitting device according to claim 1, wherein the limiting groove has a receiving groove for receiving the light-reflecting member, and the light-reflecting member is a 90-degree mirror.

3. The light emitting device as claimed in claim 1, wherein the side wall of the limiting groove has a light output surface, and the light signal emitted from the laser module is emitted to the light reflecting member through the light output surface in a direction parallel to the surface of the substrate, and is reflected by the light reflecting member and transmitted to the condensing lens in a direction perpendicular to the surface of the substrate.

4. The light-emitting device as claimed in claim 1, wherein the condensing lens is fixed to the fixing base and faces the light-reflecting member.

5. The light-emitting device as claimed in claim 1, wherein the fixing base includes a joint end, the section of the joint end is an inverted trapezoid structure with a wide top and a narrow bottom, and the top of the limiting groove is engaged with the fixing base.

6. A light receiving device characterized by comprising:

a substrate;

a light receiving chip, disposed on the substrate, including a body portion and an extension portion, wherein the body portion includes a photodetector module, an optical waveguide, and an optical demultiplexer, and the extension portion includes a limiting groove and a light reflection element disposed in the limiting groove; and

a light transmission component, including a fixing base and an optical fiber cable, above-mentioned fixing base sets up in above-mentioned spacing groove, above-mentioned optical fiber cable sees through above-mentioned fixing base detachable be fixed in above-mentioned light emission chip, and above-mentioned optical fiber cable's one end has condensing lens, and above-mentioned light reflection piece sets up corresponding to above-mentioned condensing lens.

7. The light receiving device as claimed in claim 6, wherein the limiting groove has a receiving groove for receiving the light reflecting member, and the light reflecting member is a 90 degree mirror.

8. The light receiving device according to claim 6, wherein a side wall of the stopper groove has a light receiving surface, and the condenser lens emits a light signal toward the light reflecting member, and the light signal is transmitted to the light receiving surface in a direction parallel to the surface of the substrate after being reflected by the light reflecting member.

9. The light receiving device of claim 6, wherein the condensing lens is fixed to the fixing base and faces the light reflecting member.

10. The light receiving device as claimed in claim 6, wherein the fixing base includes an engaging end, the engaging end has a cross-section of an inverted trapezoidal structure with a wide top and a narrow bottom, and the top of the limiting groove is engaged with the fixing base.