CN110643949B

CN110643949B - Evaporation method of revolution type semiconductor evaporation table

Info

Publication number: CN110643949B
Application number: CN201911038682.4A
Authority: CN
Inventors: 景苏鹏; 黄鹏飞; 刘卫平
Original assignee: Suzhou Huakai Microelectronics Co ltd
Current assignee: Suzhou Huakai Microelectronics Co ltd
Priority date: 2019-10-29
Filing date: 2019-10-29
Publication date: 2022-08-05
Anticipated expiration: 2039-10-29
Also published as: CN110643949A

Abstract

The invention discloses an evaporation method of a revolution type semiconductor evaporation table, which comprises the following steps of S1: s11, providing a revolution type evaporation table; s12, starting a vacuumizing device to vacuumize the evaporation cavity; s2, the material taking arm deflects to take down a slide cover from the rotating ring; s3, the material taking arm deflects by 90 degrees to move the slide cover to the evaporation station; s4, rotating the slide glass cover on the evaporation station; s5, starting the electron beam generating device to generate high-energy electron beams, and heating the metal in the crucible to evaporate the metal; s6, after the slide cover is evaporated, reversely swinging the material taking arm by 90 degrees, and placing the evaporated slide cover on the rotating ring; s7, rotating the rotating ring to rotate the other slide cover to the cover taking station; and S8, repeating the steps S2 to S6 until all the slide covers on the rotating ring are evaporated. The evaporation method can finish evaporation on a plurality of slide glass covers in one batch, improves the evaporation efficiency, ensures the evaporation precision and reduces the time for vacuumizing.

Description

Evaporation method of revolution type semiconductor evaporation table

Technical Field

The invention relates to an evaporation method using a revolution type semiconductor evaporation table, and belongs to the technical field of semiconductors.

Background

The evaporation table is a commonly used semiconductor device, the main structure of the evaporation table comprises a lower shell and an upper cover, an evaporation cavity is formed in the inner space between the lower shell and the upper cover, a crucible for placing metal is arranged at the bottom of the evaporation cavity, an electron beam generating device and a vacuumizing device for vacuumizing the evaporation cavity are arranged at the bottom of the evaporation cavity, a slide cover is arranged in the evaporation cavity, and the slide cover is used for placing semiconductor wafers, and the evaporation method of the conventional evaporation table is as follows: firstly, the evaporation cavity is vacuumized to keep a certain vacuum, metal is placed in a crucible, then an electron beam generating device generates a high-energy electron beam, the electron beam generates movement deflection under the action of a magnetic field to directly impact the metal in the crucible, the temperature of the metal is increased to form metal gas, and the metal gas rises to form a metal film on a wafer covered by a slide glass. According to the placing mode of the slide cover, the current evaporation method comprises a Planetary evaporation mode (Planetary) and a revolution evaporation mode, a plurality of slide covers are obliquely arranged around an evaporation cavity in the Planetary evaporation mode and are rotated by a rotating ring, a plurality of slide covers can be evaporated at one time by a Planetary evaporation table, and a plurality of wafers are fixed on each slide cover, so that more wafers can be evaporated at one time, but the evaporation precision of the evaporation table is not high, and because the slide covers are in an inclined state during evaporation, the distances between the wafers on the slide covers and a crucible are unequal, so that the metal film obtained by evaporation is not uniform. In the prior revolution type evaporation method, a slide glass cover driven by a rotating motor to rotate is arranged right above a crucible, the slide glass cover is positioned right above the crucible during evaporation, the distance between a wafer on the slide glass cover and the crucible is equal, and metal gas rises and adheres to the wafer on the slide glass cover.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the evaporation method of the revolution type semiconductor evaporation table is provided, the evaporation on a plurality of slide glass covers can be finished in one batch, the evaporation efficiency is improved, the evaporation precision is ensured, and the vacuumizing time is reduced.

In order to solve the technical problems, the technical scheme of the invention is as follows: an evaporation method of a revolution type semiconductor evaporation table,

s1, preparation of equipment in early stage

S11, providing a revolution type evaporation table, which comprises a lower shell and an upper cover, wherein an evaporation cavity is formed in the inner space between the lower shell and the upper cover, a crucible is arranged at the bottom of the evaporation cavity, metal for evaporation is placed in the crucible, an electron beam generating device and a vacuumizing device for vacuumizing the evaporation cavity are arranged at the bottom of the evaporation cavity, a rotating ring is rotatably arranged on the inner wall of the lower shell and driven by a rotary power device, a plurality of slide covers are uniformly distributed on the circumference of the rotating ring, the working surface of each slide cover faces inwards, a plurality of wafers are fixed on the working surface of each slide cover, the outer side of each slide cover is rotatably arranged on a fixed seat through a rotating shaft, the fixed seat is arranged on the rotating ring through a self-locking structure which can be loosened or locked, a material taking arm is rotatably arranged on the inner cavity of the lower shell, the swinging center line of the material taking arm is collinear with the diameter of the rotating ring and is positioned at the outer side of the rotating ring, the automatic cover-taking device comprises a rotary ring, a cover-taking station, a cover-taking driving device and a self-rotating force device, wherein the material-taking end of the material-taking arm is positioned at the quarter circle of the rotary ring;

s12, starting a vacuumizing device to vacuumize the evaporation cavity to enable the vacuum degree in the evaporation cavity to meet the evaporation requirement;

s2, the deflection power device drives the material taking arm to deflect and move to a cover taking station to take one slide cover off the rotating ring;

s3, driving the material taking arm to swing 90 degrees by the swing power device to move the slide glass cover to the evaporation station, wherein the slide glass cover is positioned above the protective cover and right above the crucible on the evaporation station;

s4, driving the slide glass cover on the evaporation station to rotate by the self-rotation force device;

s5, starting an electron beam generating device to generate high-energy electron beams, heating the metal in the crucible by the electron beams to evaporate the metal, enabling the evaporated metal gas to rise and attach to a wafer of a slide cover on an evaporation station, and protecting other slide covers on a rotating ring by a protective cover;

s6, after the slide cover on the evaporation station is evaporated, stopping the electron beam generating device and the self-rotating force device, driving the material taking arm to reversely deflect by 90 degrees by the deflection power device, and placing the evaporated slide cover on the rotating ring;

s7, rotating the rotary ring to a station, and rotating the other slide cover to a cover taking station;

and S8, repeating the steps S2 to S6 until all the slide covers on the rotating ring are evaporated.

Preferably, in step S12, the inside of the evaporation chamber is heated before the vacuum pumping, and the heating temperature is 180-.

Preferably, the evaporation method further comprises a crucible switching step, wherein a rotary support is rotatably arranged at the bottom of the evaporation cavity, a plurality of crucibles are uniformly distributed on the circumference of the rotary support, an evaporation port is formed in the bottom of the evaporation cavity, and when crucible metal at the evaporation port is used up or different metals need to be evaporated, the rotary support is rotationally switched to enable a new crucible to stay at the evaporation port for waiting for the next evaporation.

Preferably, a deflecting shield is used to block the evaporation port throughout the slide cover switching, and the shield deflects to clear the evaporation port during evaporation of the slide cover.

Preferably, in step S2, the specific manner of moving the material taking arm to the cover taking station to take off one slide cover from the rotating ring is as follows:

a first fixing hole and a second fixing hole are formed in a fixing seat of the slide cover, a first fixing shaft with a first locking hole and a second fixing shaft with a second locking hole are respectively arranged on the rotating ring and the material taking arm, a first lock pin capable of being inserted into the first locking hole is elastically and slidably mounted on the fixing seat, and a second lock pin capable of being inserted into the second locking hole is elastically and slidably mounted on the fixing seat; when the fixed seat is fixed on the rotating ring, the first fixed shaft is inserted into the first fixed hole and locked by the first lock pin, and the second lock pin elastically contracts;

when the material taking arm deflects to the cover taking station, the second fixing shaft on the material taking arm is inserted into the second fixing hole, the states of the first lock pin and the second lock pin are switched, the first lock pin contracts, the second lock pin pops out and is inserted into the second lock hole, and the fixing seat is fixed with the material taking arm and is separated from the rotating ring.

After the technical scheme is adopted, the invention has the effects that: in the evaporation method, the slide cover on the rotating ring can rotate, so that different slide covers move to the cover taking station, then the slide cover on the cover taking station is deflected to the evaporation station right above the crucible by utilizing deflection of the material taking arm, the evaporation precision of the slide cover on the evaporation station is high, the attached metal film is more uniform due to rotation of the slide cover during evaporation, the finished slide cover is placed on the rotating ring by the material taking arm after the evaporation of one slide cover is finished, and then the rotating ring rotates to switch a new slide cover, so that the evaporation work of a plurality of slide covers can be finished by one-time vacuum pumping, and the evaporation efficiency is higher.

In step S12, the inside of the evaporation chamber is heated to 180-.

And because the evaporation method also comprises a crucible switching step, a rotary bracket is rotatably arranged at the bottom of the evaporation cavity, a plurality of crucibles are uniformly distributed on the circumference of the rotary bracket, an evaporation port is arranged at the bottom of the evaporation cavity, when the metal of the crucible at the evaporation port is used up or different metals need to be evaporated, the rotary bracket is rotationally switched to enable a new crucible to stay at the evaporation port for waiting for the next evaporation, so that long-time evaporation can be ensured by utilizing the crucible switching step, and meanwhile, the evaporation method can also meet the evaporation requirements of different metals.

In step S2, the specific manner of moving the pick arm to the pick station to pick up one slide cover from the rotating ring is as follows:

when the material taking arm deflects to the cover taking station, the second fixing shaft on the material taking arm is inserted into the second fixing hole, the states of the first lock pin and the second lock pin are switched, the first lock pin is contracted, the second lock pin is popped out and inserted into the second lock hole, the fixing seat is fixed with the material taking arm and separated from the rotating ring, the material taking method of the material taking arm is ingenious in action, the fixing switching of the fixing seat is completed by switching the action states of the first lock pin and the second lock pin, and the action is more reliable.

Drawings

The invention is further illustrated with reference to the following figures and examples.

FIG. 1 is a schematic perspective view of an evaporation stage used in the method of the embodiment of the present invention;

FIG. 2 is a cross-sectional view of an evaporation station used in the method of the present invention;

FIG. 3 is a perspective view of an evaporation table used in the method of the present invention with the upper cover hidden;

FIG. 4 is a perspective view of an evaporation station used in the method of the present invention with the top cover hidden from view at another angle;

FIG. 5 is a perspective view of an evaporation station used in the method of the present invention with the lower housing and upper cover hidden;

FIG. 6 is a perspective view of the holder;

FIG. 7 is a perspective view of the self-locking mechanism and the self-locking switching mechanism;

FIG. 8 is a top view of the self-locking and self-locking switching structures with the first mount hidden;

FIG. 9 is a perspective view of the self-locking mechanism and the self-locking switching mechanism with the first mounting base hidden;

FIG. 10 is a perspective view of the take-off arm;

FIG. 11 is a perspective view of a second drive block;

in the drawings: 1. an upper cover; 2. a lower housing; 3. a self-rotating force device; 4. a yaw drive device; 5. a passive deflector rod; 6. a protective cover; 7. avoiding the notch; 8. a slide cover; 9. a fixed seat; 10. a rotating ring; 11. a cover; 12. covering the power device; 13. a crucible; 14. a crucible switching power device; 15. an electric heating device; 16. an active deflector rod; 17. a material taking arm; 171. a take-off end 171; 18. a second driving block; 19. a first fixing hole; 20. a second fixing hole; 21. a first lock pin; 22. a second lock pin; 23. a second deflector rod; 24. a telescopic drive pin; 25. a first pawl; 251. a first top contact portion; 2511. a first pushing inclined plane; 2512. a first positioning plane 252, a first limiting part; 26. a second pawl; 261. a second top contact portion; 2611. a second pushing inclined plane; 2612. a second positioning plane; 262. a second limiting part; 27. a limiting block; 28. a second hook portion; 29. a first acting plate; 30. a second action plate; 31. a torsion spring; 32. a first shift lever; 33. a first hook portion; 34. a second driving groove; 35. a second deflector rod reset groove; 36. a second drive block reset slot; 37. a second fixed shaft 37; 38. a second locking hole; 39. a first drive slot; 40. a first deflector rod reset groove; 41. a first drive block reset slot; 42. a second mounting seat; 43. a first mounting seat; 44. a first drive block.

Detailed Description

The present invention is described in further detail below with reference to specific examples.

The embodiment of the invention discloses an evaporation method of a revolution type semiconductor evaporation table,

s1, preparation of equipment in early stage

S11, a revolution type evaporation table is provided, the evaporation table comprises a lower shell 2 and an upper cover 1, an evaporation cavity is formed in the inner space between the lower shell 2 and the upper cover 1, a crucible 13 is arranged at the bottom of the evaporation cavity, metal for evaporation is placed in the crucible 13, an electron beam generating device and a vacuumizing device for vacuumizing the evaporation cavity are arranged at the bottom of the evaporation cavity, a rotating ring 10 is rotatably installed on the inner wall of the lower shell 2, the rotating ring 10 is driven by a rotary power device, a plurality of slide covers 8 are uniformly distributed on the circumference of the rotating ring 10, the working face of each slide cover 8 faces inwards, a plurality of wafers are fixed on the working face of the slide cover 8, the outer side of each slide cover 8 is rotatably installed on a fixed seat 9 through a rotating shaft, the fixed seat 9 is installed on the rotating ring 10 through a self-locking structure capable of being loosened or locked, a material taking arm 17 is rotatably installed on the inner cavity of the lower shell 2, the swing center line of the material taking arm 17 is collinear with the diameter of the rotating ring 10 and is positioned outside the rotating ring 10, the material taking end 171 of the material taking arm 17 is positioned at a quarter circle of the rotating ring 10, a self-locking switching structure for switching the self-locking structure to fix the fixing seat 9 and the material taking end 171 is arranged between the material taking end 171 and the fixing seat 9, a deflection driving device 4 for driving the material taking arm 17 to deflect from a cover taking station to an evaporation station is arranged on the lower shell 2, a protective cover 6 is arranged at the bottom of the evaporation cavity, a sheet carrying cover 8 is positioned at the upper end of the protective cover 6 and is positioned right above the crucible 13 when positioned at the evaporation station, a self-rotating force device 3 is arranged on the upper cover 1, and the self-rotating force device 3 drives the sheet carrying cover 8 of the evaporation station to rotate;

s2, the deflection power device drives the material taking arm 17 to deflect and move to a cover taking station to take off a slide cover 8 from the rotating ring 10; in step S2, the specific manner of moving the material taking arm 17 to the cover taking station to take off one slide cover 8 from the rotating ring 10 is as follows:

the fixed seat 9 of the slide cover 8 is provided with a first fixed hole 19 and a second fixed hole 20, the rotating ring 10 and the material taking arm 17 are respectively provided with a first fixed shaft with a first locking hole and a second fixed shaft 37 with a second locking hole 38, the fixed seat 9 is elastically and slidably provided with a first lock pin 21 which can be inserted into the first locking hole, and the fixed seat 9 is elastically and slidably provided with a second lock pin 22 which can be inserted into the second locking hole 38; when the fixed seat 9 is fixed on the rotating ring 10, the first fixed shaft is inserted into the first fixed hole 19 and locked by the first lock pin 21, and the second lock pin 22 is elastically contracted;

when the material taking arm 17 deflects to the cover taking station, the second fixed shaft 37 on the material taking arm 17 is inserted into the second fixed hole 20, the states of the first lock pin 21 and the second lock pin 22 are switched, the first lock pin 21 contracts, the second lock pin 22 pops out and is inserted into the second locking hole 38, and the fixed seat 9 is fixed with the material taking arm 17 and is separated from the rotating ring 10.

S3, driving the material taking arm 17 to deflect by 90 degrees by a deflection power device to move the slide glass cover 8 to an evaporation station, wherein the slide glass cover 8 is positioned above the protective cover 6 and right above the crucible 13 on the evaporation station;

s4, the self-rotation force device 3 drives the slide cover 8 on the evaporation station to rotate;

s5, starting an electron beam generating device to generate high-energy electron beams, heating the metal in the crucible 13 by the electron beams to evaporate the metal, enabling the evaporated metal gas to rise and attach to a wafer of the slide cover 8 on an evaporation station, and protecting the slide cover 8 on the other rotary ring 10 by the protective cover 6;

s6, after the evaporation of the slide cover 8 on the evaporation station is finished, stopping the work of the electron beam generating device and the self-rotation force device 3, driving the material taking arm 17 to reversely deflect by 90 degrees by the deflection power device, and placing the evaporated slide cover 8 on the rotating ring 10;

s7, rotating the rotary ring 10 to a station, and rotating the other slide cover 8 to a cover taking station;

s8, the steps S2 to S6 are repeated until all the carrier covers 8 on the rotary ring 10 are evaporated.

Preferably, in step S12, the inside of the evaporation chamber is heated before the vacuum pumping, and the heating temperature is 180-. The heating is performed by an electric heating device 15.

The evaporation method also comprises a crucible 13 switching step, wherein a rotary support is rotatably arranged at the bottom of the evaporation cavity, a plurality of crucibles 13 are uniformly distributed on the circumference of the rotary support, an evaporation port is formed in the bottom of the evaporation cavity, and when the metal of the crucible 13 at the evaporation port is used up or different metals need to be evaporated, the rotary support is rotationally switched to enable a new crucible 13 to stay at the evaporation port to wait for the next evaporation.

In the whole process of switching the slide glass cover 8, a deflected cover shell is used for blocking the evaporation port, in the process of evaporating the slide glass cover 8, the cover shell deflects to make the evaporation port free, and the deflection of the cover shell is driven by a servo motor.

In addition, the embodiment of the invention also discloses an evaporation table for realizing the evaporation method, as shown in fig. 1 to 11, the revolution type semiconductor evaporation table comprises a lower shell 2 and an upper cover 1, an evaporation cavity is formed in the inner space between the lower shell 2 and the upper cover 1, a crucible 13 for placing metal is arranged at the bottom of the evaporation cavity, and an electron beam generating device and a vacuum device for vacuumizing the evaporation cavity are arranged at the bottom of the evaporation cavity. Since the electron beam generating device and the vacuum pumping device are conventional structures in the evaporation stage at present, the structure and principle thereof are clear, and thus, they are not described in detail herein.

In this embodiment, the number of the crucibles 13 is plural, preferably six, and the plurality of crucibles 13 are circumferentially and uniformly distributed on a rotating bracket, the rotating bracket is rotatably installed at the bottom of the evaporation chamber, the bottom of the evaporation chamber is provided with an evaporation port, the rotating bracket is driven by a crucible switching power device 14, the crucible switching power device 14 drives the rotating bracket to rotate and switch, so that the crucibles 13 are stopped at the evaporation port one by one, a cover 11 is rotatably installed inside the evaporation chamber, and the cover 11 is driven by a cover power device 12, so that the evaporation port is covered or exposed. The crucible switching power device 14 and the cover power device 12 in the embodiment are driven by servo motors.

A rotating ring 10 is rotatably mounted on the inner wall of the lower housing 2, the rotating ring 10 is driven by a rotating power device (not shown in the figure), the rotating power device is a rotating servo motor, the rotating servo motor is mounted on the housing, a gear ring concentric with the rotating ring 10 is mounted on the periphery of the rotating ring 10, a gear is mounted on an output shaft of the rotating servo motor, the gear is meshed with the gear ring, and thus the gear rotates to drive the gear ring to rotate, so that the rotating ring 10 is driven to rotate.

A plurality of slide glass covers 8 are uniformly distributed on the circumference of the rotating ring 10, the working surface of each slide glass cover 8 faces the inner side, a plurality of wafers are fixed on the working surface of each slide glass cover 8, and the wafer fixing mode adopts the fixing mode of the slide glass cover 8 of the existing common evaporation table.

The outer side of the slide cover 8 is rotatably mounted on a fixed seat 9 through a rotation shaft, the fixed seat 9 is mounted on a rotating ring 10 through a self-locking structure which can be loosened or locked, a material taking arm 17 is rotatably mounted on an inner cavity of the lower shell 2, a swing center line of the material taking arm 17 is collinear with the diameter of the rotating ring 10 and is located on the outer side of the rotating ring 10, a material taking end 171 of the material taking arm 17 is located at a quarter circle of the rotating ring 10, a self-locking switching structure which enables the fixed seat 9 and the material taking end 171 to be fixed through switching of the self-locking structure is arranged between the material taking end 171 and the fixed seat 9, a deflection driving device 4 which drives the material taking arm 17 to deflect from a cover taking station to an evaporation station is arranged on the lower shell 2, and the deflection driving device 4 is also driven by a servo motor.

The bottom of the evaporation cavity is provided with a protective cover 6, the slide glass cover 8 is positioned at the upper end of the protective cover 6 and right above the crucible 13 when positioned at an evaporation station, the upper cover 1 is provided with a self-rotating force device 3, and the self-rotating force device 3 drives the slide glass cover 8 of the evaporation station to rotate. The protective cover 6 is a cylindrical protective cover 6 or a conical protective cover 6, an avoidance notch 7 corresponding to the cover taking station is arranged on the protective cover 6, and the upper end of the protective cover 6 extends to the upper cover 1. The automatic power device 3 comprises an automatic motor fixed on the upper cover 1, an output shaft of the automatic motor is provided with a driving deflector rod 16, and an automatic rotating shaft of the slide holder cover 8 is provided with a driven deflector rod 5 connected with the driving deflector rod 16. The self-rotating power device 3 is driven by a motor, an output shaft of the self-rotating power device 3 rotates to drive the driving deflector rod 16 to rotate, the driving deflector rod 16 drives the driven deflector rod 5 to rotate, and finally the slide cover 8 rotates on the material taking arm 17 at the evaporation station.

An electric heating device 15 is arranged inside the protective cover 6, and the electric heating device 15 adopts a quartz baking lamp for heating.

The fixed seat 9 is provided with a first fixing hole 19 and a second fixing hole 20, a plurality of first fixing shafts which are in one-to-one insertion fit with the first fixing holes 19 of the fixed seat 9 are evenly distributed on the circumference of the rotating ring 10, first locking holes are formed in the first fixing shafts, a second fixing shaft 37 which is in insertion fit with the second fixing hole 20 is arranged on the material taking end 171 of the material taking arm 17, a second locking hole 38 is formed in the second fixing shaft 37, the first fixing shaft and the second fixing shaft 37 are in a cone frustum shape, and the first fixing hole 19 and the second fixing hole 20 are also in cone frustum holes, so that the guide effect is achieved, and insertion is convenient.

The self-locking structure comprises a first lock pin 21 and a second lock pin 22 which are both elastically and slidably mounted on the fixed seat 9, elastic sliding is achieved between the first lock pin 21 and the second lock pin 22 directly through a compression spring, the self-locking switching structure is arranged on the fixed seat 9 and used for switching the locking state of the first lock pin 21 or the second lock pin 22, and the automatic switching structure switches the first lock pin 21 to be inserted into the first radial locking hole or switches the second lock pin 22 to be inserted into the second locking hole 38.

As shown in fig. 6 to 9, the self-locking switching structure includes a first pawl 25 and a second pawl 26 rotatably mounted on the fixing seat 9, the first pawl 25 and the second pawl 26 are respectively provided with engaging teeth engaged with each other, the first pawl 25 is provided with a first contacting portion 251 and a first limiting portion 252, the second pawl 26 is provided with a second contacting portion 261 and a second limiting portion 262, a limiting block 27 is provided between the first limiting portion 252 and the second limiting portion 262, torsion springs 31 are provided between the first pawl 25 and the fixing seat 9 and between the second pawl 26 and the fixing seat 9, the torsion springs 31 force the first pawl 25 and the second pawl 26 to deflect towards each other so that the first limiting portion 252 and the second limiting portion 262 are matched with the limiting block 27, in this embodiment, a first mounting seat 43 and a second mounting seat 42 are mounted in the fixing seat 9, and a first mounting seat 43 and a second mounting seat 42 are both mounted with the first pawl 25 and the second pawl 26, as shown in fig. 8, the first and second pawls 25 and 26 are provided on both left and right sides of the drawing sheet of the first and second lock pins 21 and 22, so that the first and second acting plates 29 and 30 are more uniformly stressed.

The first abutting part 251 and the second abutting part 261 have the same structure and are arranged in a mirror image manner in the axial direction of the lock pin, that is, in fig. 8, the first abutting part 251 is arranged in a triangular structure with respect to the left and right horizontal planes (the axial direction is the up and down direction in fig. 8), the first abutting part 251 includes a first pushing inclined plane 2511 and a first positioning plane 2512, the second abutting part 261 includes a second pushing inclined plane 2611 and a second positioning plane 2612, and the first lock pin 21 and the second lock pin 22 are respectively provided with a first acting plate 29 and a second acting plate 30; when the first acting plate 29 is in top contact and matching with the first positioning plane 2512, the first locking pin 21 contracts, and at the moment, the second acting plate 30 is positioned at the outer side of the second pushing inclined plane 2611, so that the second locking pin 22 extends out and is clamped into the second locking hole 38; when the second acting plate 30 is in abutting contact with and matched with the second positioning plane 2612, the second locking pin 22 is contracted, and the first acting plate 29 is positioned at the outer side of the first abutting inclined plane 2511 so that the first locking pin 21 extends and is clamped in the first locking hole; and as shown in fig. 8, the state in fig. 8 is that the first lock pin 21 is extended to clamp the first lock hole, and at this time, the second acting plate 30 is in contact with the second positioning plane 2612, and the second acting plate 30 is pushed outwards (upwards) due to the action of the compression spring, so that the second pawl 26 on the right side of the first lock pin 21 is forced to move clockwise, but is limited by the limit block 27 and cannot rotate, so that the second lock pin 22 is locked in a contracting manner.

The fixing seat 9 is provided with a first driving block 44 and a second driving block 18 in a vertically elastic sliding manner, the first driving block 44 extends downwards, and the second driving block 18 extends upwards, wherein as shown in fig. 7 and 8, the upper part in fig. 7 is upward, and the direction of the vertical paper surface in fig. 8 is upward.

The first shift lever 32 and the second shift lever 23 are axially and elastically mounted on the fixing seat 9 in a sliding manner, in this embodiment, the fixing seat 9 is respectively mounted with a first mounting seat 43 and a second mounting seat 42, so that the first shift lever 32 axially and elastically slides on the first mounting seat 43, the second shift lever 23 axially and elastically slides on the second mounting seat 42, one end of the first shift lever 32 is connected with the first driving block 44 through a first direction switching structure, and the first direction switching structure converts the up-and-down movement of the first driving block 44 into the horizontal movement of the first shift lever 32. The other end of the first shift lever 32 is provided with a first hook 33 which contacts with the outer side of the second action plate 30, and when the first driving block 44 slides upwards, the first shift lever 32 is forced to slide axially, so that the first hook 33 hooks the second action plate 30 and the second lock pin 22 contracts; one end of the second shift lever 23 is connected with the second driving block 18 through a second direction switching structure, a second hook 28 contacting with the outer side of the first acting plate 29 is arranged at the other end of the second shift lever 23, and when the second driving block 18 slides downwards, the second shift lever 23 is forced to slide axially, so that the second hook 28 hooks the first acting plate 29, and the first lock pin 21 is contracted.

As shown in fig. 6, 9 and 11, the first driving block 44 and the second driving block 18 have the same structure and opposite directions, and the first direction switching structure and the second direction switching structure have the same structure and opposite directions, wherein the first direction switching structure includes a first driving groove 39, a first driver reset groove 40 and a first driving block reset groove 41 which are disposed on the first driving block 44, the first driver reset groove 40 and the first driving block reset groove 41 are both straight grooves and vertically connected, the extending direction of the first driver reset groove 40 is the same as the sliding direction of the first driver 32, the extending direction of the first driving block reset groove 41 is the same as the sliding direction of the first driving block 44, the upper end of the first driving groove 39 is connected with the upper end of the first driving block reset groove 41, the lower end of the first driving groove 39 is connected with one end of the first driver reset groove 40, the depth of the first driving groove 39 gradually decreases from top to bottom, the groove depth of the lower end of the first driving groove 39 is the same as that of the first driving rod resetting groove 40, the groove depth of the upper end of the first driving groove 39 is deeper than that of the first driving block resetting groove 41, the end part of the first driving rod 32 is elastically provided with a telescopic driving pin 24, and the telescopic driving pin 24 is restricted in the first driving groove 39, the first driving rod resetting groove 40 and the first driving block resetting groove 41.

Similarly, the second direction switching structure includes a second driving groove 34, a second driving lever reset groove 35 and a second driving block reset groove 36 which are arranged on the second driving block 18, the second driving lever reset groove 35 and the second driving block reset groove 36 are both straight grooves and are vertically connected, the extending direction of the second driving lever reset groove 35 is the same as the sliding direction of the second driving lever 23, the extending direction of the second driving block reset groove 36 is the same as the sliding direction of the second driving block 18, the lower end of the second driving groove 34 is connected with the lower end of the first driving block reset groove 41, the upper end of the first driving groove 39 is connected with one end of the first driving lever reset groove 40, the groove depth of the first driving groove 39 is gradually reduced from bottom to top, the groove depth of the upper end of the second driving groove 34 is the same as the groove depth of the second driving lever reset groove 35, the groove depth of the lower end of the second driving groove 34 is deeper than the groove depth of the second driving block reset groove 36, an extensible and retractable driving pin 24 is elastically mounted at the end of the second shift lever 23, and the extensible and retractable driving pin 24 is constrained in the second driving groove 34, the second shift lever reset groove 35 and the second driving block reset groove 36.

Wherein the work of auto-lock switching structure and auto-lock structure has two kinds of action states:

the first operation state: the action of the first lock pin 21 contracting and the second lock pin 22 popping out is just the action of the material taking arm 17 taking, the material taking arm 17 deflects from top to bottom when taking materials, in the process of the deflection, the second fixed shaft 37 on the material taking end 171 is inserted into the second fixed hole 20, simultaneously, the material taking end 171 extrudes the second driving block 18 from top to bottom, so that the second driving block 18 moves downwards, the telescopic driving pin 24 slides in the second driving groove 34, so that the second driving lever 23 slides towards the upper part in figure 9, when the second driving lever 23 slides, the second hook part 28 stirs the first acting plate 29 to retract the first lock pin 21, in the process of the retraction, the first pushing inclined surface 2511 of the first pawl 25 is compressed, so that the first pawl 25 deflects, wherein as shown in figure 8, the first pawl 25 on the left side deflects anticlockwise, the first pawl 25 on the right side deflects clockwise, the left second pawl 26 deflects clockwise, the right second pawl 26 deflects counterclockwise, so that the second abutting portion 261 toggles the second lock pin 22 to move downward first, and then the second pawl 26 deflects by a certain angle to separate from the second action plate 30, so that under the action of the compression spring, the second lock pin 22 is ejected and locked, the second action plate 30 is located at the outer side of the second abutting inclined surface 2611, and at this time, the first pawl 25 deflects to enable the first action plate 29 to be located at the inner side of the first abutting portion 251 to be matched with the first positioning plane 2512; when the telescopic driving pin 24 is positioned at the upper end of the second driving groove 34, the telescopic driving pin slides into the second driving lever resetting groove 35, so that the second driving lever 23 can be reset, finally, the telescopic driving pin 24 is positioned at the joint of the second driving lever resetting groove 35 and the second driving block resetting groove 36, then the material taking arm 17 deflects to drive the slide cover 8 to deflect, the first driving block 44 is separated from the rotating ring 10 and is not extruded, and therefore the first driving block 44 moves downwards to be reset.

Second operation state: the action of the first latch 21 popping out and the second latch 22 contracting just to make the fetching arm 17 swing to place the evaporated slide cover 8 on the rotating ring 10 again, during the placing, the first driving block 44 is compressed to move upwards, during the upward movement, the first driving block 44 also drives the first shifting lever 32 to slide downwards in fig. 9, when the first shifting lever 32 slides, the first hook part 33 toggles the second acting plate 30 to retract the second latch 22, during the retraction, the second pushing inclined surface 2611 of the second pawl 26 is compressed, so that the second pawl 26 deflects, as shown in fig. 8, wherein the left second pawl 26 deflects clockwise, the right second pawl 26 deflects counterclockwise, so that the left first pawl 25 deflects counterclockwise, the right first pawl 25 deflects clockwise, so that the first positioning plane 2512 of the first top touching part 251 toggles the first latch 21 to move upwards (fig. 8), then, when the first pawl 25 is deflected by a certain angle, the first pawl is separated from the first acting plate 29, so that under the action of the compression spring, the first lock pin 21 is ejected and locked, and the first acting plate 29 is positioned at the outer side of the first pushing inclined surface 2511, and at the moment, the second pawl 26 is deflected to ensure that the second acting plate 30 is positioned at the inner side of the second pushing contact part 261 and is in pushing contact fit with the second positioning plane 2612; such that the second locking pin 22 is retracted and in a position-limiting manner. The take-off arm 17 is then deflected so that the take-off arm 17 disengages from the second drive block 18 and so that the second drive block 18 is reset again.

The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.

Claims

1. An evaporation method of a revolution type semiconductor evaporation table is characterized in that:

s1, preparation of equipment in early stage

2. An evaporation method of a revolving type semiconductor evaporation stage as claimed in claim 1, wherein: in step S12, the interior of the evaporation chamber is heated before vacuum pumping, wherein the heating temperature is 180 ℃ and 230 ℃.

3. An evaporation method of a revolving type semiconductor evaporation stage as claimed in claim 2, wherein: the evaporation method also comprises a crucible switching step, wherein a rotary support is rotatably arranged at the bottom of the evaporation cavity, a plurality of crucibles are uniformly distributed on the circumference of the rotary support, an evaporation port is formed in the bottom of the evaporation cavity, and when the metal of the crucible at the evaporation port is used up or different metals need to be evaporated, the rotary support is rotationally switched to enable a new crucible to stay at the evaporation port to wait for the next evaporation.

4. An evaporation method of a revolving type semiconductor evaporation stage as claimed in claim 3, wherein: in the whole process of switching the slide cover, a deflected cover shell is used for blocking the evaporation port, and in the process of evaporating the slide cover, the cover shell deflects to make way of the evaporation port.

5. An evaporation method of a revolving type semiconductor evaporation stage according to claim 4, wherein: in step S2, the specific manner of moving the pick arm to the pick station to pick one slide cover off the rotating ring is as follows: