CN110634406A - Flexible cover plate and preparation method thereof - Google Patents
Flexible cover plate and preparation method thereof Download PDFInfo
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- CN110634406A CN110634406A CN201910911148.3A CN201910911148A CN110634406A CN 110634406 A CN110634406 A CN 110634406A CN 201910911148 A CN201910911148 A CN 201910911148A CN 110634406 A CN110634406 A CN 110634406A
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- pillars
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The invention provides a flexible cover plate and a preparation method thereof, and solves the problem that how to improve the impact resistance and the bending property of the flexible cover plate on the premise of not increasing the film layer structure and the thickness of the flexible cover plate in order to simultaneously enhance the impact resistance and the bending property of the flexible cover plate in the prior art. This flexible apron includes: a substrate; a plurality of columns arranged at intervals on the surface of the substrate; and a hard coating layer covering a surface of the substrate, wherein the plurality of pillars are accommodated in the hard coating layer. The film layer structure of the flexible cover plate is not increased, and meanwhile the shock resistance and the bending performance of the flexible cover plate are improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible cover plate and a preparation method thereof.
Background
At present, the flexible cover plate needs to have damage resistance and meet the test requirements of impact resistance, surface hardness and the like so as to ensure that the flexible cover plate cannot be damaged when in use. Therefore, a hard coating layer may be provided in the flexible sheathing board, but if the thickness of the provided hard coating layer is too thin, the test requirement for impact resistance of the flexible sheathing board may not be satisfied. In order to enhance the impact resistance of the flexible cover plate, the method adopted at present mostly increases the thickness of the hard coating layer, but the too thick hard coating layer reduces the bending property of the flexible cover plate, and when the flexible cover plate is bent, the hard coating layer can generate cracks and even generate interlayer stripping.
Disclosure of Invention
In view of this, embodiments of the present invention provide a flexible cover plate and a manufacturing method thereof, so as to solve the problem in the prior art that how to improve the impact resistance and the bending property of the flexible cover plate on the premise of not increasing the film structure and the thickness of the flexible cover plate in order to simultaneously enhance the impact resistance and the bending property of the flexible cover plate.
According to an aspect of an embodiment of the present invention, there is provided a flexible cover plate including: a substrate; a plurality of columns arranged at intervals on the surface of the substrate; and a hard coating layer covering a surface of the substrate, wherein the plurality of pillars are accommodated in the hard coating layer.
In one embodiment, the plurality of posts includes at least one of: metal columns, inorganic columns and organic columns.
In one embodiment, the metal studs comprise metal compound studs or metal organic studs.
In one embodiment, a shape of a longitudinal section of the plurality of pillars perpendicular to the substrate direction includes at least one of: rectangular, parallelogram, trapezoidal.
In one embodiment, when the plurality of pillars have a trapezoidal longitudinal cross-section, the spaced arrangement includes an alternating spaced arrangement of regular trapezoidal pillars and inverted trapezoidal pillars.
In one embodiment, a spacing between two adjacent pillars of the plurality of pillars is 1 μm to 10 μm, a height of the longitudinal section of each pillar of the plurality of pillars is 1 μm to 3 μm, and/or a maximum width of the longitudinal section of each pillar of the plurality of pillars is 1 μm to 10 μm.
In one embodiment, the material of the metal pillar comprises any one of the following materials: indium tin oxide and fluorine doped tin oxide, and the material of the inorganic upright column comprises any one of the following materials: silicon oxide, silicon nitride and silicon oxynitride, and/or the organic column is made of silicon organic polymer.
In one embodiment, the material of the hard coating layer comprises any one of the following materials: acrylates and resins.
In one embodiment, the material of the hard coating is filled with transparent metal nanoparticles.
In one embodiment, the material of the metal pillars, the material of the inorganic pillars, the material of the organic pillars, and the material of the hard coat layer are transparent materials.
According to another aspect of the embodiments of the present invention, there is provided a method for manufacturing a flexible cover plate, including: providing a substrate; forming a plurality of pillars on a surface of the substrate; and coating a transparent acrylate or resin on a surface of the substrate to form a hard coating layer accommodating the plurality of pillars.
In one embodiment, the preparation method further comprises filling transparent metal nanoparticles in the acrylate or the resin.
In one embodiment, the forming a plurality of pillars on the surface of the substrate includes: coating an organic solution on a surface of the substrate to form an organic glue; exposing, developing and curing the organic glue to form a plurality of organic upright posts; and/or depositing at least one inorganic gas on the surface of the substrate by means of chemical vapor deposition to form an inorganic thin film; and carrying out photoetching, etching and stripping on the inorganic thin film to form a plurality of inorganic upright posts; and/or depositing a metallic material on the surface of the substrate by physical vapor deposition; and photoetching, etching and stripping the metal material to form a plurality of metal columns.
According to the flexible cover plate provided by the embodiment of the invention, the plurality of stand columns are arranged in the hard coating of the flexible cover plate, so that the impact resistance and the bending performance of the flexible cover plate are improved without increasing the film layer structure and the thickness of the flexible cover plate.
Drawings
Fig. 1 is a schematic structural diagram of a longitudinal section of a flexible cover according to an embodiment of the present invention.
Fig. 2 to 4 are schematic structural diagrams illustrating a cross section of a flexible cover according to an embodiment of the present invention.
Fig. 5 to 12 are schematic structural diagrams illustrating a longitudinal section of a flexible cover according to another embodiment of the present invention.
Fig. 13 to 15 are schematic structural diagrams illustrating a longitudinal section of a flexible cover according to still another embodiment of the present invention.
Fig. 16 is a schematic structural diagram illustrating a longitudinal section of a flexible cover according to still another embodiment of the present invention.
Fig. 17 is a structural diagram illustrating dimensions of a pillar according to an embodiment of the present invention.
Fig. 18 is a schematic flow chart illustrating a method for manufacturing a flexible cover according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a longitudinal section of a flexible cover according to an embodiment of the present invention. As shown in fig. 1, the flexible cover plate includes: a substrate 11; a plurality of columns 12 arranged at intervals on the surface of the base plate 11; and a hard coat layer 13 covering a surface of the base plate 11, wherein the plurality of pillars 12 are accommodated in the hard coat layer 13.
It should be understood that the substrate 11 is a transparent substrate, and the material of the transparent substrate may be Polyimide (PI) or polyester resin (PET), and the embodiment of the invention does not limit what material the substrate is specifically made of.
It should be noted that, as shown in fig. 2, the plurality of columns 12 may be regularly arranged on the surface of the substrate 11 in a mutually opposite manner, or the plurality of columns 12 may be regularly arranged on the surface of the substrate 11 in a mutually staggered manner, as shown in fig. 3, and the embodiment of the present invention does not limit the arrangement manner of the columns 12 on the surface of the substrate 11, and the plurality of columns 12 may also be irregularly arranged on the surface of the substrate 11 as shown in fig. 4. Meanwhile, the number of the plurality of columns 12 is not limited in the embodiment of the present invention, and the number may be determined according to the size of the substrate 11 and the distance between the columns 12.
It should be understood that, since the hard coating layer 13 is disposed on the surface of the base plate 11, the hard coating layer 13 covers the plurality of columns 12 so that the plurality of columns 12 are accommodated in the hard coating layer 13, but the present embodiment does not limit the positional relationship between the plurality of columns 12 and the hard coating layer 13, and the plurality of columns 12 may be completely accommodated in the hard coating layer 13, that is, the plurality of columns 12 are completely attached to the hard coating layer 13.
Therefore, the plurality of the upright posts 12 are arranged in the hard coating 13 of the flexible cover plate, so that the impact resistance and the bending performance of the flexible cover plate are improved while the film layer structure and the thickness of the flexible cover plate are not increased. Specifically, the existence of the plurality of columns 12 can improve the impact resistance of the hard coating layer 13 on the premise of not increasing the thickness of the hard coating layer 13, so that the impact resistance of the whole flexible cover plate is improved; meanwhile, the existence of the plurality of upright columns 12 can improve the bending property of the hard coating 13 on the premise of not reducing the thickness of the hard coating 13, and when the flexible cover plate is bent, the probability of cracks and even interlayer peeling of the hard coating 13 is reduced. Thus, the presence of the plurality of posts 12 provides an improved flexible cover in both opposing dimensions, impact resistance and flexibility.
In an embodiment of the present invention, as shown in fig. 5 to 12, the plurality of columns 12 includes at least one of the following columns: metal pillars 121, inorganic pillars 122, and organic pillars 123.
The plurality of pillars 12 may be any one of or any combination of metal pillars 121, inorganic pillars 122, and organic pillars 123. Specifically, as shown in fig. 5, the plurality of pillars 12 may be only metal pillars 121; as shown in fig. 6, the plurality of pillars 12 may be only inorganic pillars 122; as shown in fig. 7, the plurality of pillars 12 may be only the organic pillars 123; as shown in fig. 8, the plurality of pillars 12 may be an alternating arrangement of organic pillars 123 and inorganic pillars 122; as shown in fig. 9, the plurality of pillars 12 may be an alternate arrangement combination of organic pillars 123 and metal pillars 121; as shown in fig. 10, the plurality of pillars 12 may be an alternating arrangement of inorganic pillars 122 and metal pillars 121; as shown in fig. 11, the plurality of pillars 12 may be an alternating arrangement of organic pillars 123, metal pillars 121, and inorganic pillars 122; and as shown in fig. 12, the plurality of pillars 12 may be a random arrangement combination of organic pillars 123, metal pillars 121, and inorganic pillars 122. However, the embodiment of the present invention does not limit what kind of combination of the plurality of pillars 12, specifically, the metal pillars 121, the inorganic pillars 122, and the organic pillars 123, and also does not limit the arrangement manner of the plurality of pillars 12, specifically, the combination of the metal pillars 121, the inorganic pillars 122, and the organic pillars 123, and besides the combination and the arrangement manner shown in fig. 5 to 12, the embodiment of the present invention also includes other types of combinations and arrangement manners, which are not indicated herein.
It should be noted that, in the embodiment of the present invention, the material of the plurality of columns 12 is not limited, and may be a metal compound material, a metal organic material, an inorganic material, or an organic material, and the present invention is not limited thereto.
It should be understood that, in general, pillars formed of metal compound materials or metal organic materials generally have tensile stress, and pillars formed of inorganic materials or organic materials generally have compressive stress. Therefore, the alternating arrangement combination of the organic pillars 123 and the metal pillars 121 shown in fig. 9, the alternating arrangement combination of the inorganic pillars 122 and the metal pillars 121 shown in fig. 10, and the random arrangement combination of the organic pillars 123, the metal pillars 121, and the inorganic pillars 122 shown in fig. 12 are all that the organic pillars 123 and/or the inorganic pillars 122 are disposed on two sides of the metal pillars 121, so that the tensile stress and the compressive stress are alternately arranged, and the alternate arrangement of the tensile stress and the compressive stress can reduce the stress borne by the hard coating in the bending process, thereby reducing the probability of cracks and even interlayer peeling of the hard coating.
In the embodiment of the present invention, the shape of the longitudinal section of the plurality of pillars 12 perpendicular to the direction of the base plate 11 includes at least one of the following shapes: rectangular, parallelogram, trapezoidal.
It should be understood that the shape of a longitudinal section of the plurality of columns 12 perpendicular to the substrate 11 direction may be a rectangle as shown in fig. 1, and the three-dimensional shape of the column corresponding to the rectangle may be a cylinder, a pentagonal prism, a cuboid, a cube, or the like; the shape of a longitudinal section of the plurality of columns 12 perpendicular to the direction of the base plate 11 may be a parallelogram as shown in fig. 13; the shape of a longitudinal section of the plurality of columns 12 perpendicular to the substrate 11 may also be a trapezoid as shown in fig. 14 and 15, and a three-dimensional shape of a column corresponding to the trapezoid may be a circular truncated cone or a truncated pyramid.
In the embodiment of the present invention, the specific shape of the longitudinal section of the plurality of columns 12 in the direction perpendicular to the substrate 11 is not limited, and the plurality of columns 12 may be triangular in shape, or the three-dimensional shape of the column corresponding to the triangle may be a cone, a pyramid, or the like, in addition to the shapes shown in fig. 1, 13 to 15. Meanwhile, the embodiment of the present invention also does not limit what kind of shape of the plurality of columns 12 are specifically combined, and the plurality of columns 12 may be combined with columns having the same shape as shown in fig. 1, 13 to 15, or may be any combination of columns having different shapes.
In one embodiment of the present invention, as shown in fig. 16, when the plurality of columns 12 has a trapezoidal longitudinal section, the spaced arrangement includes an alternating spaced arrangement of regular trapezoidal columns 124 and inverted trapezoidal columns 125.
It should be understood that when the longitudinal section of the plurality of vertical columns 12 is a trapezoid as shown in fig. 14 and 15, the plurality of vertical columns 12 may be a combination of regular trapezoid vertical columns 124 and inverted trapezoid vertical columns 125 which are alternately arranged, the alternate arrangement of the regular trapezoid vertical columns 124 and the inverted trapezoid vertical columns 125 not only can reduce the stress borne by the hard coating during the bending process, thereby reducing the probability of cracks and even interlayer peeling of the hard coating, but also can connect the regular trapezoid vertical columns 124 and the inverted trapezoid vertical columns 125 end to end during the bending process, and the end-to-end arrangement of the regular trapezoid vertical columns 124 and the inverted trapezoid vertical columns 125 can further improve the hardness of the hard coating, thereby further improving the impact resistance of the flexible cover plate.
It should also be understood that the regular trapezoid pillar 124 may be made of a metal material, an inorganic material or an organic material, and the inverted trapezoid pillar 125 may be made of a metal material, an inorganic material or an organic material, and the present invention is not limited to what specific materials the regular trapezoid pillar 124 and the inverted trapezoid pillar 125 are made of. The material combination of the regular trapezoid pillars 124 and the inverted trapezoid pillars 125 may be an alternating combination or a random combination among the metal pillars 121, the inorganic pillars 122, and the organic pillars 123 as shown in fig. 5 to 12, but the embodiment of the invention is not limited thereto.
In order to further increase the hardness of the hard coating and further reduce the stress applied to the hard coating, the embodiment of the present invention does not limit the specific shape of the plurality of columns 12, and may be an alternate arrangement of the regular trapezoidal columns 124 and the inverted trapezoidal columns 125, or an alternate arrangement of the parallelogram columns.
In one embodiment of the present invention, as shown in fig. 17, the distance D between two adjacent columns of the plurality of columns 121Is 1 μm to 10 μm, a height D of the longitudinal section of each of the plurality of pillars 122Is 1 μm to 3 μm, and/or a maximum width D of the longitudinal section of each of the plurality of pillars 123Is 1 μm to 10 μm.
It should be understood that the spacing D between two adjacent ones of the plurality of columns 121Is set to 1 μm to 10 μm when the distance D between two adjacent pillars of the plurality of pillars 121Less than 1 μm, due to the spacing D between two adjacent pillars1Too small, which is not conducive to the processing of the upright post; when the distance D between two adjacent columns of the plurality of columns 121Greater than 10 μm, due to the spacing D between two adjacent pillars1Too large, which may cause light emission from the OLED deviceThe phenomena of refraction and dispersion are generated, so that the use experience of a user is reduced; preferably, the distance D between two adjacent columns of the plurality of columns 1215 μm, which is not only beneficial to the processing of the pillar, but also does not cause refraction and dispersion of the light emitted by the OLED device.
It should also be understood that the height D of said longitudinal section of each upright is such as to be2The distance between the top surface of the three-dimensional column and the substrate 11, and the height D of the longitudinal section of each column of the plurality of columns 122Can be set to 1 μm to 3 μm when the height D of the longitudinal section of each of the plurality of pillars 122Less than 1 μm, due to the height D of the pillars2Too small, which is not conducive to the processing of the upright post; when the height D of the longitudinal section of each of the plurality of columns 12 is2Greater than 3 μm, due to the height D of the pillars2Too large, which increases the thickness of the hard coating; preferably, the height D of said longitudinal section of each of said plurality of uprights 1222 μm, which not only facilitates the processing of the pillars, but also does not increase the thickness of the hard coating.
It will also be appreciated that, since the uprights are of solid geometry, the width of the longitudinal section is also different for different cross-sections, the maximum width D of said longitudinal section of each upright being based on the size of the width dimension taking into account the different dimensions of the upright3Can refer to the maximum width in the shape of the different longitudinal sections of the uprights in different cross-sections, the maximum width D of said longitudinal section of each upright3It may also refer to the maximum width in the shape of the longitudinal section of the pillar in a cross-sectional view, and the size of the longest base of the trapezoid shown in FIG. 16 is D3. A maximum width D of the longitudinal section of each of the plurality of uprights 123Can be set to 1 μm to 10 μm when the maximum width D of the longitudinal section of each of the plurality of pillars 123Less than 1 μm, due to the width D of the pillars3Too small, which is not conducive to the processing of the upright post; when the maximum width D of the longitudinal section of each of the plurality of uprights 123When the thickness is larger than 10 μm, the vertical columnWidth D of3The size of the column is too large, and the column is positioned in the flexible cover plate closest to human eyes in the OLED module, so that a user can observe the existence of the column, and the use experience of the user is reduced; preferably, the maximum width D of the longitudinal section of each of the plurality of uprights 123Is 5 μm, which not only facilitates the processing of the pillars, but also does not allow the user to observe the presence of the pillars.
It should be noted that, the embodiment of the present invention does not limit the size of the space between two adjacent columns and the size of each column; the embodiment of the invention also does not limit whether the space between any two adjacent upright columns is equal, can be equal or not; the embodiment of the present invention also does not limit whether the sizes of the pillars are equal, and may be equal or unequal.
In the embodiment of the present invention, the material of the metal pillar 121 includes any one of the following materials: indium tin oxide and fluorine doped tin oxide, and the material of the inorganic pillars 122 includes any one of the following materials: silicon oxide, silicon nitride and silicon oxynitride, and/or the material of the organic pillar 123 is a silicon-based organic polymer.
It should be noted that, in the embodiment of the present invention, the metal pillar 121 is not limited to what kind of metal material is specifically formed, and may be Indium Tin Oxide (ITO), fluorine-doped tin oxide (FTO), or other transparent metal oxide materials; the embodiment of the present invention does not limit what kind of inorganic material the inorganic upright 122 is made of, and may be silicon oxide, silicon nitride, silicon oxynitride, or other transparent inorganic materials; the embodiment of the present invention does not limit what kind of organic material the organic pillar 123 is made of, and may be a silicon-based organic polymer, or other transparent organic materials.
It should be understood that the material of the silicon-based polymer is selected based on the organic material which is mainly hard, for example, the silicon-based organic polymer can be silicon rubber (i.e. high molecular weight linear structure polymer), and can also be silicon resin (i.e. linear structure polymer containing active group which can be further cured), etc.
In an embodiment of the present invention, the material of the hard coating layer 13 includes any one of the following materials: acrylates and resins.
In the embodiment of the present invention, the hard coat layer 13 is not limited to a specific material, and may be a polymer organic material containing carbon elements, that is, an acrylate or a resin, or may be another transparent polymer material.
It is to be understood that the acrylate may be methyl acrylate, ethyl acrylate, 2-methyl methacrylate, 2-ethyl methacrylate, etc., and the resin may be a natural resin, a synthetic resin, a thermoplastic resin, a thermosetting resin, etc.
In another embodiment of the present invention, the material of the hard coating layer is filled with transparent metal nanoparticles.
It should be understood that the transparent metal nanoparticles are added to the material of the hard coating layer to increase the surface hardness of the hard coating layer, so as to improve the impact resistance of the flexible cover plate, and the embodiment of the present invention does not limit what kind of metal nanoparticles the transparent metal nanoparticles are specifically composed of, and may be indium tin oxide nanoparticles, fluorine-doped tin oxide nanoparticles, and other transparent metal nanoparticles.
In another embodiment of the present invention, the material of the metal pillar 121, the material of the inorganic pillar 122, the material of the organic pillar 123, and the material of the hard coating layer 13 are all transparent materials.
It should be understood that, since the flexible cover plate is located above the OLED device, in order not to affect the light emission of the OLED device, the materials of all the film layers constituting the flexible cover plate are transparent, i.e., the materials of the metal pillars 121, the inorganic pillars 122, the organic pillars 123, the hard coating layer 13, and the substrate are transparent materials.
Fig. 18 is a schematic flow chart illustrating a method for manufacturing a flexible cover according to an embodiment of the present invention. As shown in fig. 18, the preparation method includes:
s101: a substrate is provided.
It should be understood that the substrate provided is a transparent substrate, and the material of the substrate may be Polyimide (PI) or polyester resin (PET), and the embodiment of the present invention does not limit what material the substrate is specifically made of.
S102: a plurality of pillars is formed on a surface of the substrate.
Specifically, a plurality of columns which are staggered or opposite to each other are formed on the surface of the substrate, and the plurality of columns which are staggered or opposite to each other can be regularly or disorderly arranged on the substrate. The number of the plurality of columns is determined according to the size of the provided substrate and the size of the columns, and the columns are arranged on the surface of the substrate as far as possible.
S103: a transparent acrylate or resin is coated on a surface of the substrate to form a hard coating layer accommodating the plurality of pillars.
Specifically, after a plurality of pillars have been formed on the surface of the substrate, an acrylate or a resin is coated on the surface of the substrate, and the coated acrylate or resin may cover the plurality of pillars, and after the acrylate or resin is leveled on the surface of the substrate, a hard coat layer having a flat surface may be formed, and the plurality of pillars are completely accommodated in the hard coat layer.
It should be noted that, in order to ensure the efficiency of production and the effect of coating, the manner of applying the hard coat layer may preferably be spin coating or slit coating, or the like.
Therefore, the flexible cover plate formed through the three steps improves the shock resistance and the bending performance of the flexible cover plate while the film layer structure and the thickness of the flexible cover plate are not increased. Specifically, the existence of the plurality of stand columns can improve the impact resistance of the hard coating on the premise of not increasing the thickness of the hard coating, so that the impact resistance of the whole flexible cover plate is improved; meanwhile, the existence of the plurality of stand columns can improve the bending property of the hard coating on the premise of not reducing the thickness of the hard coating, and when the flexible cover plate is bent, the probability of cracks and even interlayer peeling of the hard coating is reduced. Thus, the presence of a plurality of posts allows the flexible cover to be improved in both opposing dimensions, impact resistance and bendability.
In another embodiment of the present invention, the above preparation method further comprises filling transparent metal nanoparticles in the acrylate or the resin.
It is understood that the addition of transparent metal nanoparticles to the material of the hard coating may increase the surface hardness of the hard coating. In order to sufficiently mix the transparent metal nanoparticles with the acrylate or the resin, the diameter of the transparent metal nanoparticles may be 100nm, but the specific size of the diameter of the transparent metal nanoparticles is not limited in the embodiments of the present invention.
In another embodiment of the present invention, the forming of the plurality of pillars on the surface of the substrate includes: coating an organic solution on a surface of the substrate to form an organic glue; exposing, developing and curing the organic glue to form a plurality of organic upright posts; and/or depositing at least one inorganic gas on the surface of the substrate by means of chemical vapor deposition to form an inorganic thin film; and carrying out photoetching, etching and stripping on the inorganic thin film to form a plurality of inorganic upright posts; and/or depositing a metallic material on the surface of the substrate by physical vapor deposition; and photoetching, etching and stripping the metal material to form a plurality of metal columns.
It should be understood that the plurality of pillars formed on the surface of the substrate may be any one of metal pillars, inorganic pillars, and organic pillars, and any combination thereof.
It should be understood that the preparation method for forming a plurality of organic pillars on the surface of the substrate includes: firstly, coating a transparent organic solution on the surface of the substrate to form organic glue, then, according to the set size of the stand column and the distance between the stand column and the stand column, carrying out regional exposure on the organic glue between the stand column and the stand column by using a mask plate, developing the exposed organic glue to strip off the organic glue between the stand column and the stand column, and finally, heating and curing the residual organic glue to form a plurality of organic stand columns.
It should be noted that, in order to ensure the bonding strength between the organic glue and the substrate, the organic glue needs to be heated and cured, and the temperature for heating and curing can be selected to be between 220 ℃ and 300 ℃, preferably 230 ℃; the time for heat curing can be selected from 15min to 60min, preferably 30 min.
It is to be understood that the organic solution may be a transparent silicone-based organic polymer, specifically, a silicone rubber (i.e., a high molecular weight linear structure polymer), a silicone resin (i.e., a linear structure polymer containing a reactive group which can be further cured), and the like.
It should be understood that the preparation method for forming a plurality of inorganic pillars on the surface of the substrate includes: depositing at least one inorganic gas on the surface of the substrate in a chemical vapor deposition mode, carrying out chemical reaction between the at least one inorganic gas to form an inorganic film in the chemical vapor deposition process, photoetching the inorganic film by using a mask plate according to the set size of the stand column and the distance between the stand column and the stand column to deteriorate the inorganic film between the stand column and the stand column, etching the deteriorated inorganic film to etch the deteriorated inorganic film, and finally stripping the inorganic film which is not etched after etching to form a plurality of inorganic stand columns.
It should also be understood that the at least one inorganic gas may be silane, nitrogen, ammonia, etc., and that the at least one gas may be chemical vapor deposited to form transparent inorganic materials such as silicon oxide, silicon nitride, and silicon oxynitride.
It should be appreciated that the method of forming a plurality of metal pillars on a surface of the substrate comprises: depositing a transparent metal material on the surface of the substrate in a physical vapor deposition mode, wherein the physical vapor deposition process comprises the processes of sputtering, evaporation or glow discharge and the like, photoetching the metal material by using a mask plate according to the set size of the stand column and the space between the stand column and the stand column to deteriorate the metal material between the stand column and the stand column, etching the deteriorated metal material to etch the deteriorated metal material, and finally stripping the metal material which is not etched after etching to form a plurality of metal stand columns.
It should also be understood that the metal material may be a transparent metal compound or a transparent metal organic, and specifically may be indium tin oxide or fluorine doped tin oxide, etc.
Specifically, when the plurality of pillars formed on the surface of the substrate include a combination of a metal pillar, an inorganic pillar, and an organic pillar, the above-mentioned method for preparing a metal pillar, the method for preparing an inorganic pillar, and the method for preparing an organic pillar are performed at different designated positions, and the execution times of the above-mentioned method for preparing a metal pillar, the method for preparing an inorganic pillar, and the method for preparing an organic pillar are in order, for example, the method for preparing a metal pillar is performed first, the method for preparing an inorganic pillar is performed after the preparation of a metal pillar is completed, and the method for preparing an organic pillar is performed last after the preparation of an inorganic pillar is completed.
It should be noted that if the plurality of pillars includes two types of pillars (i.e., any two of metal pillars, inorganic pillars, and organic pillars), the pillar preparation needs to be performed twice, and if the plurality of pillars includes three types of pillars (i.e., metal pillars, inorganic pillars, and organic pillars), the pillar preparation needs to be performed three times.
It should be noted that the combination of the features in the present application is not limited to the combination described in the claims or the combination described in the embodiments, and all the features described in the present application may be freely combined or combined in any manner unless contradictory to each other.
It should be noted that the above-mentioned embodiments are only specific examples of the present invention, and obviously, the present invention is not limited to the above-mentioned embodiments, and many similar variations exist. All modifications which would occur to one skilled in the art and which are, therefore, directly derived or suggested from the disclosure herein are deemed to be within the scope of the present invention.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and the like that are within the spirit and principle of the present invention are included in the present invention.
Claims (10)
1. A flexible cover sheet, comprising:
a substrate;
a plurality of columns arranged at intervals on the surface of the substrate; and
a hard coating overlying a surface of the substrate, wherein the plurality of posts are received in the hard coating.
2. The flexible cover sheet of claim 1, wherein the plurality of posts comprises at least one of: metal columns, inorganic columns and organic columns.
3. The flexible cover sheet of claim 2, wherein the shape of the longitudinal cross-section of the plurality of posts perpendicular to the base direction comprises at least one of: rectangular, parallelogram, trapezoidal.
4. The flexible cover sheet of claim 3, wherein the spaced arrangement comprises an alternating spaced arrangement of regular trapezoidal and inverted trapezoidal shaped posts when the plurality of posts are trapezoidal in longitudinal cross section.
5. The flexible cover sheet of any one of claims 2 to 4, wherein the material of the hard coating comprises any one of the following materials: acrylates and resins.
6. The flexible cover sheet of claim 5, wherein the material of the hard coating is filled with transparent metal nanoparticles.
7. The flexible cover sheet of claim 5, wherein the material of the metal studs, the material of the inorganic studs, the material of the organic studs, and the material of the hard coating are transparent materials.
8. A method for preparing a flexible cover plate is characterized by comprising the following steps:
providing a substrate;
forming a plurality of pillars on a surface of the substrate; and
a transparent acrylate or resin is coated on a surface of the substrate to form a hard coating layer accommodating the plurality of pillars.
9. The method of claim 8, further comprising filling transparent metal nanoparticles in the acrylate or resin.
10. The method of claim 8 or 9, wherein the forming a plurality of pillars on the surface of the substrate comprises:
coating an organic solution on a surface of the substrate to form an organic glue; and
exposing, developing and curing the organic glue to form a plurality of organic upright posts; and/or
Depositing at least one inorganic gas on the surface of the substrate by means of chemical vapor deposition to form an inorganic thin film; and
photoetching, etching and stripping the inorganic thin film to form a plurality of inorganic upright posts; and/or
Depositing a metal material on the surface of the substrate by means of physical vapor deposition; and
and photoetching, etching and stripping the metal material to form a plurality of metal columns.
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| CN113763808A (en) * | 2020-06-05 | 2021-12-07 | 华为技术有限公司 | Flexible display cover plate, preparation method thereof and flexible display module |
| CN113990205A (en) * | 2021-11-24 | 2022-01-28 | 合肥维信诺科技有限公司 | Cover plate and display module |
| CN114360386A (en) * | 2022-01-28 | 2022-04-15 | 合肥维信诺科技有限公司 | Flexible cover plate and display device |
| CN114596785A (en) * | 2022-03-18 | 2022-06-07 | 合肥维信诺科技有限公司 | Flexible cover plate and manufacturing method thereof, flexible display module and flexible display device |
| WO2024000639A1 (en) * | 2022-06-29 | 2024-01-04 | 武汉华星光电半导体显示技术有限公司 | Display module and display device |
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