CN105977398B - A kind of encapsulation cover plate and preparation method thereof, display device - Google Patents
A kind of encapsulation cover plate and preparation method thereof, display device Download PDFInfo
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- CN105977398B CN105977398B CN201610539595.7A CN201610539595A CN105977398B CN 105977398 B CN105977398 B CN 105977398B CN 201610539595 A CN201610539595 A CN 201610539595A CN 105977398 B CN105977398 B CN 105977398B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The embodiment of the present invention provides a kind of encapsulation cover plate and preparation method thereof, display device, is related to display technology field, can increase the bending angle of encapsulation cover plate, and can improve the problem of inorganic layer is easily broken off in long-term use.The encapsulation cover plate includes two layers of first inorganic layers and at least two layers of organic layer between two layers of first inorganic layers and at least one layer of second inorganic layer, first inorganic layer, the organic layer and second inorganic layer are in close contact and are alternately arranged, and the upper surface that the organic layer contacts with second inorganic layer has multiple grooves；The direction on the side bent along the encapsulation cover plate, the groove are intervally arranged；It is identical with the height of the groove of the organic surface for any organic layer and second inorganic layer for being positioned above and contacting, the thickness of second inorganic layer.Manufacture for encapsulation cover plate and OLED display.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of encapsulation cover plate and preparation method thereof, display device.
Background technology
Organic electroluminescent LED (Organic Light Emitting Diode, abbreviation OLED) display has light
Thin, wide viewing angle, low in energy consumption, fast response time, the advantage that Flexible Displays can be achieved, therefore OLED display is in display field and photograph
Bright field is widely applied.
The core component of OLED display is OLED, and it has high colour gamut, high-contrast as New Type Display Devices
The advantages of.But the luminescent material and functional material in OLED are more sensitive to water and oxygen, it is therefore desirable to provide a kind of resistance
The encapsulation cover plate of water proof oxygen, to form the protection to OLED.
Encapsulation cover plate of the prior art, as shown in figure 1, replacing using inoranic membrane 01, organic film 02, inoranic membrane 01
The stepped construction of arrangement.However, due in this structure all inoranic membranes 01 be flat planar structure, and inoranic membrane 01
Toughness is relatively low with respect to organic film 01, when all inoranic membranes 01 are all flat planar structure, can cause the encapsulation of this structure
Cover plate bending angle is smaller.And during long-term use, inoranic membrane 01 easily occurs and is broken and causes the water of encapsulation cover plate
Oxygen barriers function fails.
The content of the invention
Embodiments of the invention provide a kind of encapsulation cover plate and preparation method thereof, display device, can increase encapsulation cover plate
Bending angle, and the problem of inorganic layer is easily broken off in long-term use can be improved.
To reach above-mentioned purpose, embodiments of the invention adopt the following technical scheme that：
First aspect, there is provided a kind of encapsulation cover plate, including two layers of first inorganic layers and positioned at two layers first inorganic layers it
Between at least two layers organic layer and at least one layer of second inorganic layer, first inorganic layer, the organic layer and second nothing
Machine layer is in close contact and is alternately arranged, and the upper surface that the organic layer contacts with second inorganic layer has multiple grooves；Edge
The direction on the bent side of the encapsulation cover plate, the groove are intervally arranged；For any organic layer and it is positioned above
And second inorganic layer of contact, the thickness of second inorganic layer are identical with the height of the groove of the organic surface.
Preferably, each side of the encapsulation cover plate is bent, and multiple grooves positioned at the organic layer upper surface are in net
Trellis is distributed.
Preferably, the side parallel with first direction of the encapsulation cover plate is bent, and the groove edge is hung down with first direction
Straight second direction, opposite side is extended to from a lateral edges of the encapsulation cover plate.
Preferably, the groove is rectangular channel.
Preferably, it is shaped as curve shape along the bearing of trend of the groove, the groove.
It is further preferred that the groove is shaped as waveform.
Preferably, the encapsulation cover plate is 5 layers or 7 Rotating fields.
Preferably, the encapsulation cover plate also includes being arranged on the protective layer on the outside of one layer of first inorganic layer.
Second aspect, there is provided a kind of display device, including it is provided with the substrate of OLED and described for encapsulating
The encapsulation cover plate of OLED, the encapsulation cover plate are the encapsulation cover plate described in first aspect.
The third aspect, there is provided a kind of preparation method of encapsulation cover plate, including form two layers of first inorganic layers and positioned at two
At least two layers organic layer and at least one layer of second inorganic layer between the first inorganic layer of layer, it is first inorganic layer, described organic
Layer and second inorganic layer are in close contact and are alternately arranged.
Wherein, the organic layer and second inorganic layer for being positioned above and contacting are formed, including：Formed organic thin
Film, handled by etching technics, forming surface has the organic layer of multiple grooves；The side on the side bent along the encapsulation cover plate
To the groove is intervally arranged；In the surface inorganic material of the organic layer, the second inorganic layer is formed.
Embodiments of the invention provide a kind of encapsulation cover plate and preparation method thereof, display device, by forming cap
During plate, the groove that sets the direction on multiple sides bent along encapsulation cover plate to be intervally arranged in organic layer upper surface can be with
When forming the second inorganic layer above the organic layer, make the second inorganic layer it is corresponding with groove partly in the groove and with this
The upper surface flush of organic layer, make the remainder (part i.e. between groove) of the second inorganic layer with respect to the organic layer
Upper surface is formed as raised, and due to the part in groove of either the second inorganic layer, or raised is all interval row
Cloth so that when encapsulation cover plate is bent, pulling force Disjunct distribution that the second inorganic layer is subject to, thus it is inorganic to strengthen second
Toughness of the layer on the direction on the side bent along encapsulation cover plate, so that the bent angle increase of encapsulation cover plate, in addition,
The problem of inorganic layer is easily broken off during this structure can also improve in long-term use, extend the service life of encapsulation cover plate
And its mechanical performance can be improved.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation for encapsulation cover plate that prior art provides；
Fig. 2 is a kind of schematic side view one of encapsulation cover plate provided in an embodiment of the present invention；
Fig. 3 is a kind of schematic side view two of encapsulation cover plate provided in an embodiment of the present invention；
Fig. 4 is a kind of schematic side view of organic layer provided in an embodiment of the present invention；
Fig. 5 be Fig. 2 in along A-A to diagrammatic cross-section one；
Fig. 6 be Fig. 2 in along A-A to diagrammatic cross-section two；
Fig. 7 is along the diagrammatic cross-section of B-B direction in Fig. 2；
Fig. 8 is a kind of schematic side view three of encapsulation cover plate provided in an embodiment of the present invention；
Fig. 9 is a kind of structural representation one of display device provided in an embodiment of the present invention；
Figure 10 is a kind of structural representation two of display device provided in an embodiment of the present invention.
Reference
01- inoranic membranes；02- organic films；The inorganic layers of 10- first；20- organic layers；21- grooves；The inorganic layers of 30- second；40-
Protective layer；60-OLED devices；70- encapsulation cover plates；80- optical cements.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
The embodiment of the present invention provides a kind of encapsulation cover plate 70, as Fig. 2-4 shows, including two layers of first inorganic layers 10 and is located at
At least two layers of organic layer 20 and at least one layer of second inorganic layer 30 between two layers of first inorganic layers 10, the first inorganic layer 10, have
The inorganic layer 30 of machine layer 20 and second is in close contact and is alternately arranged.Wherein, the upper table that organic layer 20 contacts with the second inorganic layer 30
Face has multiple grooves 21；For any organic layer 20 and the second inorganic layer 30 for being positioned above and contacting, second nothing
The thickness of machine layer 30 is identical with the height of the groove 21 on the surface of organic layer 20.
It should be noted that first, all layers of the number of plies for forming encapsulation cover plate 70 is not defined, such as the envelope
Capping plate 70 can be the odd number Rotating fields such as 5 Rotating fields, 7 Rotating fields, 9 Rotating fields.
Wherein, because the first inorganic layer 10, the inorganic layer 30 of organic layer 20 and second are alternately arranged, and first layer and last
Layer is the first inorganic layer 10, and therefore, necessarily organic layer 20 contacted with the first inorganic layer 10, the second inorganic layer 30 is then located at
Between two layers of organic layer 20.
Second, as it is known by the man skilled in the art that the thickness of organic layer 20 is more than the thickness of inorganic layer, therefore, on the one hand,
Can be according to the thickness for forming the second inorganic layer 30 above the organic layer 20 for the height of the groove 21 of the upper surface of organic layer 20
Depending on degree, when forming the second inorganic layer 30, as long as making the second inorganic layer 30 part corresponding with groove 21 be fully located at groove
In 21, and with the upper surface flush for being not provided with groove 21 of the organic layer 20.
On the other hand, due to the second inorganic layer 30 not with 21 corresponding part of groove, then relatively described organic layer 20
Upper surface forms projection, thus above the second inorganic layer 30 during formation organic film, the thicker organic film of thickness can make it
Upper surface planarizes, and on this basis, even if subsequently needing the etching on the organic film to form groove 21, can also ensure own
The consistency of thickness of groove 21.
Wherein, the thickness of the first inorganic layer 10 and the second inorganic layer 30 for example can be 100~1000nm.Organic layer 20
Thickness for example can be 2~10 μm.
In addition, the material of the first inorganic layer 10 and the second inorganic layer 30 can for example be selected from aluminum oxide, zinc oxide, oxidation
One or more of combinations in titanium, silica, silicon nitride and zirconium oxide.The material of organic layer 20 can for example be selected from poly- second
One or more of combinations in enol, urethane acrylate polymer, polyimide resin.
3rd, " upper surface " that the embodiment of the present invention is mentioned, be with the first inorganic layer 10 for being formed at first for reference for
's.In addition, the embodiment of the present invention mention " top " be to form the sequencing during encapsulation cover plate 70 for, for appoint
Two layers of meaning, one layer formed afterwards, then positioned at one layer of top being previously formed.
4th, so that encapsulation cover plate 70 is rectangle as an example, if the side of the horizontal direction of encapsulation cover plate 70 is bent, groove 21
Horizontally spaced arrangement.Now encapsulation cover plate 70 can left and right bend.
If the side of the vertical direction of encapsulation cover plate 70 is bent, groove 21 is vertically intervally arranged.Now encapsulate
Cover plate 70 front and rear can be bent.
If the horizontal direction of encapsulation cover plate 70 and the side of vertical direction can be bent simultaneously, groove 21 is in the horizontal direction and perpendicular
Nogata is to being intervally arranged.Now encapsulation cover plate 70 can left and right, front and rear bend.
The embodiment of the present invention provides a kind of encapsulation cover plate 70, by during encapsulation cover plate 70 is formed, in organic layer 20
Upper surface sets the groove 21 that the direction on multiple sides bent along encapsulation cover plate 70 is intervally arranged, can be on the organic layer 20
It is square into the second inorganic layer 30 when, make the part corresponding with groove 21 of the second inorganic layer 30 in the groove 21 and organic with this
The upper surface flush of layer 20, and make the remainder (part i.e. between groove 21) of the second inorganic layer 30 organic with respect to this
The upper surface of layer 20 is formed as raised, and due to the part in groove 21 of either the second inorganic layer 30, or projection
All it is intervally arranged so that when encapsulation cover plate is bent, pulling force Disjunct distribution that the second inorganic layer 30 is subject to, thus can
Strengthen toughness of second inorganic layer 30 on the direction along the bent side of encapsulation cover plate 70 so that encapsulation cover plate 70 can
Bending angle increases, in addition, this structure can also improve in long-term use during inorganic layer the problem of being easily broken off, extend
The service life of encapsulation cover plate 70 and its mechanical performance can be improved.
Preferably, the size of groove 21 of the upper surface of organic layer 20 is identical and uniform arrangement.
Preferably, the thickness of two layers of first inorganic layers 10 can be identical；When the second inorganic layer 30 has multilayer, the second inorganic layer
30 thickness is identical.The thickness of first inorganic layer 10 and the second inorganic layer 30 may be the same or different.
Preferably, each side of encapsulation cover plate 70 is bent, and multiple grooves 21 positioned at the upper surface of organic layer 20 are in grid
Shape is distributed.
That is, AA is to splitting along Fig. 2, as shown in figure 5, the part in groove 21 of the second inorganic layer 30 is in latticed
Distribution.
Specifically, with reference to shown in figure 5, if two sides parallel with first direction of encapsulation cover plate 70 can be bent, with
Two parallel sides of second direction can also be bent, then, multiple grooves 21 positioned at the upper surface of organic layer 20 are along first party
To and second direction, be arranged at intervals, so that multiple grooves 21 of the upper surface of organic layer 20 distribute as net shape.Wherein,
One direction can be horizontal direction, and second direction can be vertical direction.
The embodiment of the present invention by multiple grooves 21 on the surface of organic layer 20 by being arranged to distributed in grid so that any
The second inorganic layer 30 is set to be intervally arranged in the part in groove 21 on the direction of bendable flanging, the portion between groove 21
(i.e. raised) is divided also to be intervally arranged, so as to enhance the second inorganic layer 30 on the direction along 70 each bending edge of encapsulation cover plate
Toughness, and then cause bent angle increase of the encapsulation cover plate 70 on each overbending direction.
It is further preferred that groove 21 is identical with the size of projection.
Preferably, the side parallel with first direction of encapsulation cover plate 70 is bent, and groove 21 is along vertical with first direction
Second direction, opposite side is extended to from a lateral edges of the encapsulation cover plate 70.
That is, AA is to splitting along Fig. 2, as shown in fig. 6, the part in groove 21 of the second inorganic layer 30 is from cap
One lateral edges of plate 70 extend to opposite side.
Specifically, with reference to shown in figure 6, if the side parallel with first direction of encapsulation cover plate 70 can be bent, it is located at
The groove 21 of the upper surface of organic layer 20 is arranged at intervals in the first direction, and is bar shaped, and each groove 21 along with first direction
Vertical second direction, opposite side is extended to from a lateral edges of the encapsulation cover plate 70.
Wherein, first direction can be horizontal direction or vertical direction.
The embodiment of the present invention by groove 21 by being arranged to bar shaped, and the edge second direction vertical with first direction, groove
21 extend to opposite side from a lateral edges of the encapsulation cover plate 70, can make side hair parallel with first direction in encapsulation cover plate 70
During raw bending, increase encapsulation cover plate 70 along the toughness on its overbending direction.
Preferably, the groove 21 is rectangular channel.
The embodiment of the present invention by groove 21 by being arranged to rectangular channel so that the He of the second inorganic layer 30 in groove 21
It is contact and the second inorganic layer 30 in groove 21 that the second inorganic layer 30 between groove 21, which can have a line,
And the shape of the second inorganic layer 30 between groove 21 is equal so that along the diagonally adjacent stress of rectangular channel than more uniform,
So as to strengthen the second organic layer 30 along the diagonally adjacent toughness of rectangular channel.
Preferably, as shown in fig. 7, along groove 21 bearing of trend, groove 21 is shaped as curve shape.Such as can be
Arc, S-shaped, waveform etc..
The embodiment of the present invention is shaped to curve by the way that groove 21 is extended along on direction, can increase cap
Plate 70 while toughness, can reduce the requirement to manufacture craft along its overbending direction.
Based on above-mentioned, in order that encapsulation cover plate 70 is lightening, it is currently preferred, as shown in Fig. 2 the encapsulation cover plate 70
For 5 Rotating fields, or, as shown in figure 3, the encapsulation cover plate 70 is 7 Rotating fields.
Based on above-mentioned, it is preferred that as shown in figure 8, the encapsulation cover plate 70 also includes being arranged on one layer of first inorganic layer 10
The protective layer 40 in outside.
Wherein, the material of protective layer 40 for example can be hard organic material or rigidity inorganic material；The thickness of protective layer 40
Degree for example can be 500~5000nm.
The embodiment of the present invention can be prevented by setting the higher protective layer 40 of hardness in the outside of the first inorganic layer 10
When the encapsulation cover plate 70 is applied to display device, the first inorganic layer 10 is located at the surface of display device and the first inorganic layer occurs
10 are scratched, the problem of so as to influence the water oxygen barriers function of encapsulation cover plate 70.
The embodiment of the present invention provides a kind of display device, as shown in Figure 9 and Figure 10, including is provided with the base of OLED 60
Plate and the above-mentioned encapsulation cover plate 70 for encapsulating OLED 60.
Above-mentioned display device can be specifically OLED display, can be display, TV, mobile phone, tablet personal computer etc.
Product or part with any display function.
It should be noted that first, not to the fitting between encapsulation cover plate 70 and the substrate 50 for being provided with OLED 60
Mode is defined, for example, as shown in figure 9, to encapsulation cover plate 70 and can be provided with OLED 60 by optical cement 80
Substrate is bonded, to realize the encapsulation to OLED 60 on substrate 50；Can also be as shown in Figure 10, it is directly inorganic by first
Layer 10, which is deposited on, to be provided with the substrate of OLED 60, to realize the encapsulation to OLED 60.
Second, when encapsulation cover plate 70 includes protective layer 40, due in two layers of first inorganic layers 10 of encapsulation cover plate 70, its
In one layer be proximate to OLED 60 and set, and the first inorganic layer 10 close to OLED 60 is not in asking of being scratched
Topic, therefore, protective layer 40 should be arranged far from the outside of the first inorganic layer 10 of OLED 60.
The embodiment of the present invention provides a kind of display device, during the encapsulation cover plate 70 in forming display device, leads to
Cross the groove 21, Ke Yi for setting the direction on multiple sides bent along encapsulation cover plate 70 to be intervally arranged in the upper surface of organic layer 20
When the top of organic layer 20 forms the second inorganic layer 30, the part corresponding with groove 21 of the second inorganic layer 30 is set to be located at groove 21
It is interior and with the upper surface flush of the organic layer 20, and make the remainder (portion i.e. between groove 21 of the second inorganic layer 30
Point) upper surface of the relative organic layer 20 is formed as raised, and because either the second inorganic layer 30 is in groove 21
Part, or projection are all intervally arranged so that when encapsulation cover plate is bent, between the pulling force that the second inorganic layer 30 is subject to
Disconnected distribution, thus toughness of second inorganic layer 30 on the direction along the bent side of encapsulation cover plate 70 can be strengthened, so that
The bent angle increase of encapsulation cover plate 70, in addition, inorganic layer is easy during this structure can also improve in long-term use
The problem of fracture, extend the service life of encapsulation cover plate 70 and its mechanical performance can be improved.
The embodiment of the present invention also provides a kind of preparation method of encapsulation cover plate 70, including formed two layers of first inorganic layers 10 with
And at least two layers of organic layer 20 between two layers of first inorganic layers 10 and at least one layer of second inorganic layer 30, the first inorganic layer
10th, the inorganic layer 30 of organic layer 20 and second is in close contact and is alternately arranged.
Wherein, organic layer 20 and the second inorganic layer 30 for being positioned above and contacting are formed, is specifically included：
Organic film is formed, is handled by etching technics, forming surface has the organic layer 20 of multiple grooves 21；Along encapsulation
The direction on the bent side of cover plate 70, groove 21 are intervally arranged.
In the surface inorganic material of organic layer 20, the second inorganic layer 30, the thickness of second inorganic layer 30 are formed
It is identical with the height of the groove 21 on the surface of organic layer 20.
Wherein, inorganic material can pass through PECVD (Plasma Enhanced Chemical Vapor
Deposition, plasma enhanced chemical vapor deposition method), CVD (Chemical Vapor Deposition, chemical gaseous phase
Sedimentation) etc. realize.
Organic film can be formed by the mode such as deposition, evaporation.
The embodiment of the present invention also provides a kind of preparation method of display device, as shown in figure 9, including by above-mentioned encapsulation cover plate
70 are bonded with the substrate formed with OLED 60 by optical cement 80, to be packaged to OLED 60.
The embodiment of the present invention also provides a kind of preparation method of display device, as shown in Figure 10, formed with OLED
Directly prepare to form encapsulation cover plate 70 by the preparation method of above-mentioned encapsulation cover plate 70 on 60 substrate, to enter OLED 60
Row encapsulation.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (7)
1. a kind of encapsulation cover plate, including two layers of first inorganic layers and at least two layers between two layers of first inorganic layers it is organic
Layer and at least one layer of second inorganic layer, first inorganic layer, the organic layer and second inorganic layer are in close contact and handed over
For arrangement, it is characterised in that
The upper surface that the organic layer contacts with second inorganic layer has multiple grooves；It is bent along the encapsulation cover plate
The direction on side, the groove are intervally arranged；
For any organic layer and second inorganic layer for being positioned above and contacting, the thickness of second inorganic layer
It is identical with the height of the groove of the organic surface；
The side parallel with first direction of the encapsulation cover plate is bent, the groove edge second party vertical with first direction
To extending to opposite side from a lateral edges of the encapsulation cover plate；
Along the bearing of trend of the groove, the groove is shaped as curve shape.
2. encapsulation cover plate according to claim 1, it is characterised in that along the bearing of trend of the groove, the groove
It is shaped as waveform.
3. encapsulation cover plate according to claim 1, it is characterised in that the groove is rectangular channel.
4. encapsulation cover plate according to claim 1, it is characterised in that the encapsulation cover plate is 5 layers or 7 Rotating fields.
5. encapsulation cover plate according to claim 1, it is characterised in that the encapsulation cover plate also includes being arranged on described in one layer
Protective layer on the outside of first inorganic layer.
6. a kind of display device, including it is provided with the substrate of OLED and the cap for encapsulating the OLED
Plate, it is characterised in that the encapsulation cover plate is the encapsulation cover plate described in claim any one of 1-5.
7. a kind of preparation method of encapsulation cover plate, including form two layers of first inorganic layers and between two layers of first inorganic layers
At least two layers organic layer and at least one layer of second inorganic layer, first inorganic layer, the organic layer and described second inorganic
Layer is in close contact and is alternately arranged, it is characterised in that forms the organic layer and second nothing for being positioned above and contacting
Machine layer, including：
Organic film is formed, is handled by etching technics, forming surface has the organic layer of multiple grooves；Along the encapsulation cover plate
The direction on bent side, the groove are intervally arranged；
In the surface inorganic material of the organic layer, form the second inorganic layer, the thickness of second inorganic layer with it is described
The height of the groove of organic surface is identical；
The side parallel with first direction of the encapsulation cover plate is bent, the groove edge second party vertical with first direction
To extending to opposite side from a lateral edges of the encapsulation cover plate；
Along the bearing of trend of the groove, the groove is shaped as curve shape.
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| CN201610539595.7A CN105977398B (en) | 2016-07-08 | 2016-07-08 | A kind of encapsulation cover plate and preparation method thereof, display device |
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| CN201610539595.7A CN105977398B (en) | 2016-07-08 | 2016-07-08 | A kind of encapsulation cover plate and preparation method thereof, display device |
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