CN105977398A - Package cover plate and preparation method thereof, and display apparatus - Google Patents
Package cover plate and preparation method thereof, and display apparatus Download PDFInfo
- Publication number
- CN105977398A CN105977398A CN201610539595.7A CN201610539595A CN105977398A CN 105977398 A CN105977398 A CN 105977398A CN 201610539595 A CN201610539595 A CN 201610539595A CN 105977398 A CN105977398 A CN 105977398A
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- Prior art keywords
- cover plate
- layer
- encapsulation cover
- inorganic layer
- inorganic
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The embodiments of the invention provide a package cover plate and a preparation method thereof, and a display apparatus, are applied to manufacturing of a package cover plate and an OLED display apparatus, and relate to the technical field of display, for the purposes of increasing the folding angle of a package cover plate and improving the problem of easy fractures of inorganic layers during long-term use. The package cover plate comprises two first inorganic layers, and at least two organic layers and at least one second inorganic layer which are disposed between the two first inorganic layers, wherein the first inorganic layers, the organic layers and the second inorganic layer are in close contact and are alternatively arranged, and multiple grooves are arranged in upper surfaces, which are in contact with the second inorganic layer, of the organic layers; the grooves are arranged at intervals along the direction of a foldable edge of the package cover plate; and for any one organic layer and the second inorganic layer which is disposed above and is in contact with the corresponding organic layer, the thickness of the second inorganic layer is the same as the height of the grooves of the surfaces of the organic layer.
Description
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of encapsulation cover plate and preparation side thereof
Method, display device.
Background technology
Organic electroluminescent LED (Organic Light Emitting Diode is called for short OLED)
Display has frivolous, wide viewing angle, low in energy consumption, fast response time, can realize Flexible Displays
Advantage, therefore OLED display is widely applied in display field and lighting field.
The core component of OLED display is OLED, and it is as New Type Display Devices,
The advantage with high colour gamut, high-contrast.But the luminescent material in OLED and function
Material is more sensitive to water and oxygen, it is therefore desirable to provide a kind of encapsulation cover plate intercepting water oxygen, with
Form the protection to OLED.
Encapsulation cover plate of the prior art, as it is shown in figure 1, use inoranic membrane 01, have
The stepped construction that machine film 02, inoranic membrane 01 are alternately arranged.But, due to institute in this structure
There is inoranic membrane 01 to be smooth planar structure, and the toughness of inoranic membrane 01 is relative to organic membrane
01 is relatively low, when all inoranic membranes 01 are all smooth planar structure, can cause this structure
Encapsulation cover plate bending angle less.And during life-time service, it is susceptible to inoranic membrane
01 ruptures and causes the water oxygen barriers function of encapsulation cover plate to lose efficacy.
Summary of the invention
Embodiments of the invention provide a kind of encapsulation cover plate and preparation method thereof, display device, can
To increase the bending angle of encapsulation cover plate, and inorganic layer in life-time service can be improved easily break
The problem split.
For reaching above-mentioned purpose, embodiments of the invention adopt the following technical scheme that
First aspect, it is provided that a kind of encapsulation cover plate, including two-layer the first inorganic layer and be positioned at two
At least two-layer organic layer between layer the first inorganic layer and at least one of which the second inorganic layer, described the
One inorganic layer, described organic layer and described second inorganic layer are in close contact and alternately arranged, described
The upper surface that organic layer contacts with described second inorganic layer has multiple groove；Along described cap
The direction on the limit that plate is bent, described groove is intervally arranged；For arbitrary described organic layer and position
Side and described second inorganic layer of contact thereon, the thickness of described second inorganic layer has with described
The height of the groove on machine layer surface is identical.
Preferably, each limit of described encapsulation cover plate is the most bent, is positioned at described organic layer upper surface
Multiple grooves distribute as net shape.
Preferably, the limit parallel with first direction of described encapsulation cover plate is bent, described groove
Along the second direction vertical with first direction, extend to separately from a lateral edges of described encapsulation cover plate
Side.
Preferably, described groove is rectangular channel.
Preferably, along the bearing of trend of described groove, described groove be shaped as curve shape.
It is further preferred that described groove be shaped as waveform.
Preferably, described encapsulation cover plate is 5 layers or 7 Rotating fields.
Preferably, described encapsulation cover plate also includes being arranged on outside one layer of described first inorganic layer
Protective layer.
Second aspect, it is provided that a kind of display device, including be provided with OLED substrate,
And for encapsulating the encapsulation cover plate of described OLED, described encapsulation cover plate is first aspect
Described encapsulation cover plate.
The third aspect, it is provided that the preparation method of a kind of encapsulation cover plate, including forming two-layer the first nothing
Machine layer and at least two-layer organic layer between two-layer the first inorganic layer and at least one of which
Two inorganic layers, described first inorganic layer, described organic layer and described second inorganic layer are in close contact
And it is alternately arranged.
Wherein, described second inorganic layer forming described organic layer with being positioned above and contact,
Including: form organic film, processed by etching technics, form surface and there is multiple groove
Organic layer；Along the direction on the bent limit of described encapsulation cover plate, described groove is intervally arranged；?
The surface inorganic material of described organic layer, forms the second inorganic layer.
Embodiments of the invention provide a kind of encapsulation cover plate and preparation method thereof, display device, logical
Cross during forming encapsulation cover plate, arrange at organic layer upper surface multiple along encapsulation cover plate bendable
The groove that the direction on the limit of folding is intervally arranged, can form the second inorganic layer above this organic layer
Time, make the part corresponding with groove of the second inorganic layer be positioned at groove upper with this organic layer
Surface flushes, and the remainder (i.e. part between groove) making the second inorganic layer is relative
The upper surface of this organic layer is formed as protruding, and due to be no matter the second inorganic layer be positioned at groove
Interior part, or projection is all intervally arranged so that when there is bending in encapsulation cover plate,
Second inorganic layer tension Disjunct distribution, thus the second inorganic layer can be strengthened along cap
Toughness on the direction on the limit that plate is bent, so that the bent angle of encapsulation cover plate increases
Greatly, additionally, during this structure also can be improved in life-time service inorganic layer be easily broken off
Problem, extends the service life of encapsulation cover plate and can improve its mechanical performance.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below by right
In embodiment or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that,
Accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art
From the point of view of, on the premise of not paying creative work, it is also possible to obtain the attached of other according to these accompanying drawings
Figure.
The structural representation of a kind of encapsulation cover plate that Fig. 1 provides for prior art；
The schematic side view one of a kind of encapsulation cover plate that Fig. 2 provides for the embodiment of the present invention；
The schematic side view two of a kind of encapsulation cover plate that Fig. 3 provides for the embodiment of the present invention；
The schematic side view of a kind of organic layer that Fig. 4 provides for the embodiment of the present invention；
Fig. 5 be in Fig. 2 along A-A to generalized section one；
Fig. 6 be in Fig. 2 along A-A to generalized section two；
Fig. 7 be in Fig. 2 along B-B to generalized section；
The schematic side view three of a kind of encapsulation cover plate that Fig. 8 provides for the embodiment of the present invention；
The structural representation one of a kind of display device that Fig. 9 provides for the embodiment of the present invention；
The structural representation two of a kind of display device that Figure 10 provides for the embodiment of the present invention.
Reference
01-inoranic membrane；02-organic membrane；10-the first inorganic layer；20-organic layer；21-groove；
30-the second inorganic layer；40-protective layer；60-OLED device；70-encapsulation cover plate；80-optics
Glue.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is entered
Row clearly and completely describes, it is clear that described embodiment is only a part of embodiment of the present invention,
Rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having
Have and make the every other embodiment obtained under creative work premise, broadly fall into present invention protection
Scope.
The embodiment of the present invention provides a kind of encapsulation cover plate 70, as Fig. 2-4 shows, including two-layer first
Inorganic layer 10 and at least two-layer organic layer 20 He between two-layer the first inorganic layer 10
At least one of which the second inorganic layer 30, the first inorganic layer 10, organic layer 20 and the second inorganic layer
30 are in close contact and alternately arranged.Wherein, organic layer 20 contacts with the second inorganic layer 30
Upper surface has multiple groove 21；For arbitrary organic layer 20 be positioned above and contact
Second inorganic layer 30, the thickness of described second inorganic layer 30 and described organic layer 20 surface
The height of groove 21 is identical.
It should be noted that first, the number of plies of all layers constituting encapsulation cover plate 70 is not entered
Row limits, and the most described encapsulation cover plate 70 can be 5 Rotating fields, 7 Rotating fields, 9 Rotating fields
On odd-level structure.
Wherein, due to the first inorganic layer 10, organic layer 20 and the second inorganic layer 30 alternately row
Arrange, and ground floor and last layer are the first inorganic layer 10, therefore, with the first inorganic layer
10 contact necessarily organic layer 20, the second inorganic layer 30 be then positioned at two-layer organic layer 20 it
Between.
Second, as it is known by the man skilled in the art that the thickness of organic layer 20 is more than inorganic layer
Thickness, therefore, on the one hand, the height for the groove 21 of organic layer 20 upper surface can basis
Depending on being formed at the thickness of the second inorganic layer 30 above this organic layer 20, when forming the second nothing
During machine layer 30, as long as making the part that the second inorganic layer 30 is corresponding with groove 21 be fully located at recessed
In groove 21, and with the upper surface flush being not provided with groove 21 of described organic layer 20.
On the other hand, due to not corresponding with groove 21 part of the second inorganic layer 30, then phase
The upper surface of described organic layer 20 is formed projection, thus is formed above the second inorganic layer 30
During organic film, the organic film that thickness is thicker can make its upper surface planarize, on this basis,
Even if follow-up needs etch formation groove 21 on this organic film, it is possible to ensure that institute is fluted
The consistency of thickness of 21.
Wherein, the thickness of the first inorganic layer 10 and the second inorganic layer 30 can be such as
100～1000nm.The thickness of organic layer 20 can be such as 2～10 μm.
Additionally, the material of the first inorganic layer 10 and the second inorganic layer 30 such as can be selected from oxidation
One or more in aluminum, zinc oxide, titanium oxide, silicon dioxide, silicon nitride and zirconium oxide
Combination.The material of organic layer 20 such as can be selected from polyvinyl alcohol, urethane acrylate gathers
The combination of one or more in compound, polyimide resin.
3rd, " upper surface " that the embodiment of the present invention is mentioned, is the first nothing formed at first
For machine layer 10 is reference.Additionally, it is to be formed that the embodiment of the present invention mentions " top "
For sequencing during encapsulation cover plate 70, for any two-layer, the one of rear formation
Layer, then be located at the top of a layer be initially formed.
4th, as a example by encapsulation cover plate 70 is as rectangle, if the horizontal direction of encapsulation cover plate 70
Limit is bent, then the horizontally spaced arrangement of groove 21.Now encapsulation cover plate 70 can left and right
Bend.
If the limit of the vertical direction of encapsulation cover plate 70 is bent, then groove 21 vertically between
Every arrangement.Now encapsulation cover plate 70 can front and back bend.
If the limit of the horizontal direction of encapsulation cover plate 70 and vertical direction can bend, then groove simultaneously
21 are all intervally arranged with vertical direction in the horizontal direction.Now encapsulation cover plate 70 can left and right, front
Rear bend.
The embodiment of the present invention provides a kind of encapsulation cover plate 70, by forming encapsulation cover plate 70 mistake
Cheng Zhong, arranges the direction on multiple limit bent along encapsulation cover plate 70 at organic layer 20 upper surface
The groove 21 being intervally arranged, when can form the second inorganic layer 30 above this organic layer 20,
The part corresponding with groove 21 making the second inorganic layer 30 is positioned at groove 21 organic with this
The upper surface flush of layer 20, and make the remainder of the second inorganic layer 30 (i.e. be positioned at groove
Part between 21) upper surface of this organic layer 20 relatively is formed as protruding, and due to no matter
It is the part being positioned at groove 21 of the second inorganic layer 30, or projection is all intervally arranged,
Make when encapsulation cover plate occurs bending, the second inorganic layer 30 tension Disjunct distribution,
Thus tough on the direction on the limit bent along encapsulation cover plate 70 of the second inorganic layer 30 can be strengthened
Property, so that the bent angle of encapsulation cover plate 70 increases, additionally, this structure also may be used
The problem that during improving in life-time service, inorganic layer is easily broken off, extends encapsulation cover plate 70
Service life and its mechanical performance can be improved.
Preferably, groove 21 size of organic layer 20 upper surface is identical and uniformly arranges.
Preferably, the thickness of two-layer the first inorganic layer 10 can be identical；When the second inorganic layer 30
When having multilamellar, the thickness of the second inorganic layer 30 is identical.First inorganic layer 10 and the second inorganic layer
The thickness of 30 may be the same or different.
Preferably, each limit of encapsulation cover plate 70 is the most bent, is positioned at organic layer 20 upper surface
Multiple grooves 21 distribute as net shape.
That is, along Fig. 2, AA is to cutting open, as it is shown in figure 5, being positioned at of the second inorganic layer 30
Part in groove 21 distributes as net shape.
Concrete, with reference to shown in Fig. 5, if two that encapsulation cover plate 70 is parallel with first direction
Limit can bend, and two limits parallel with second direction can also bend, then, and and position
Multiple grooves 21 in organic layer 20 upper surface set with second direction, all interval in the first direction
Put, so that multiple grooves 21 of organic layer 20 upper surface distribute as net shape.Wherein,
One direction can be horizontal direction, and second direction can be vertical direction.
The embodiment of the present invention is by being set to latticed by multiple grooves 21 on organic layer 20 surface
Distribution so that make the second inorganic layer 30 be positioned at groove 21 on the direction on any bent limit
In part be intervally arranged, part between groove 21 (i.e. protruding) is also intervally arranged,
Thus enhance tough on the direction along each bending edge of encapsulation cover plate 70 of the second inorganic layer 30
Property, and then the encapsulation cover plate 70 bent angle on each overbending direction is increased.
It is further preferred that groove 21 is equivalently-sized with protruding.
Preferably, the limit parallel with first direction of encapsulation cover plate 70 is bent, groove 21
Along the second direction vertical with first direction, extend from a lateral edges of described encapsulation cover plate 70
To opposite side.
That is, along Fig. 2, AA is to cutting open, as shown in Figure 6, and being positioned at of the second inorganic layer 30
Part in groove 21 extends to opposite side from a lateral edges of encapsulation cover plate 70.
Concrete, with reference to shown in Fig. 6, if encapsulation cover plate 70 limit parallel with first direction can
To bend, then, it is positioned at the groove 21 of organic layer 20 upper surface to be spaced in the first direction and set
Put, and be bar shaped, and each groove 21 is along the second direction vertical with first direction, from
One lateral edges of described encapsulation cover plate 70 extends to opposite side.
Wherein, first direction can be horizontal direction or vertical direction.
The embodiment of the present invention by being set to bar shaped by groove 21, and edge is vertical with first direction
Second direction, groove 21 extends to opposite side from a lateral edges of described encapsulation cover plate 70,
When can make limit parallel with first direction in encapsulation cover plate 70 that bending occurs, increase encapsulation cover plate
70 toughness along its overbending direction.
Preferably, described groove 21 is rectangular channel.
The embodiment of the present invention is by being set to rectangular channel by groove 21 so that be positioned at groove 21
The second interior inorganic layer 30 and the second inorganic layer 30 between groove 21 can have one
While be contact and the second inorganic layer 30 in groove 21 and between groove 21
Second inorganic layer 30 shape is equal so that more uniform along rectangular channel diagonally adjacent stress ratio,
Thus the second organic layer 30 can be strengthened in the toughness diagonally adjacent along rectangular channel.
Preferably, as it is shown in fig. 7, along the bearing of trend of groove 21, being shaped as of groove 21
Curve shape.Can be such as arc, S-shaped, waveform etc..
The embodiment of the present invention is shaped to song by being extended along by groove 21 on direction
Line, can increase encapsulation cover plate 70 along its overbending direction while toughness, and it is right to reduce
The requirement of processing technology.
Based on above-mentioned, in order to make encapsulation cover plate 70 lightening, currently preferred, such as Fig. 2
Shown in, described encapsulation cover plate 70 is 5 Rotating fields, or, as it is shown on figure 3, described encapsulation
Cover plate 70 is 7 Rotating fields.
Based on above-mentioned, it is preferred that as shown in Figure 8, described encapsulation cover plate 70 also includes arranging
Protective layer 40 outside one layer of first inorganic layer 10.
Wherein, the material of protective layer 40 can be such as hard organic material or the inorganic material of rigidity
Material；The thickness of protective layer 40 can be such as 500～5000nm.
The embodiment of the present invention is by arranging, in the outside of the first inorganic layer 10, the protection that hardness is higher
Layer 40, is possible to prevent when described encapsulation cover plate 70 is applied to display device, the first inorganic layer
10 surfaces being positioned at display device and occur the first inorganic layer 10 to be scratched, thus affect encapsulation
The problem of the water oxygen barriers function of cover plate 70.
The embodiment of the present invention provides a kind of display device, as shown in Figure 9 and Figure 10, including setting
It is equipped with the substrate of OLED 60 and for encapsulating the above-mentioned envelope of OLED 60
Capping plate 70.
Above-mentioned display device can be specifically OLED display, can be display, electricity
Depending on, mobile phone, panel computer etc. there are product or the parts of any display function.
It should be noted that first, not to encapsulation cover plate 70 be provided with OLED 60
Substrate 50 between laminating type be defined, such as, as it is shown in figure 9, can pass through
Encapsulation cover plate 70 and the substrate being provided with OLED 60 are fitted by optical cement 80,
To realize the encapsulation of OLED 60 on substrate 50；Can also as shown in Figure 10, directly
Connect and the first inorganic layer 10 is deposited on the substrate being provided with OLED 60, right to realize
The encapsulation of OLED 60.
Second, when encapsulation cover plate 70 includes protective layer 40, due to the two of encapsulation cover plate 70
In layer the first inorganic layer 10, wherein one layer is proximate to OLED 60 and arranges, and close
First inorganic layer 10 of OLED 60 does not haves the problem scratched, therefore, protection
Layer 40 should be arranged far from the outside of the first inorganic layer 10 of OLED 60.
The embodiment of the present invention provides a kind of display device, the encapsulation cover plate in forming display device
During 70, multiple along encapsulation cover plate 70 bendable by arranging at organic layer 20 upper surface
The groove 21 that the direction on the limit of folding is intervally arranged, can form second above this organic layer 20
During inorganic layer 30, the part corresponding with groove 21 of the second inorganic layer 30 is made to be positioned at groove 21
In and with the upper surface flush of this organic layer 20, and make the remainder of the second inorganic layer 30 (i.e.
Part between groove 21) upper surface of this organic layer 20 relatively is formed as protruding, and
Owing to being no matter the part being positioned at groove 21 of the second inorganic layer 30, or between projection is all
Every arrangement so that when encapsulation cover plate occurs bending, the second inorganic layer 30 tension
Disjunct distribution, thus the second inorganic layer 30 can be strengthened on the limit bent along encapsulation cover plate 70
Toughness on direction, so that the bent angle of encapsulation cover plate 70 increases, additionally, this
Plant the problem that during structure also can be improved in life-time service, inorganic layer is easily broken off, extend envelope
Service life of capping plate 70 and its mechanical performance can be improved.
The embodiment of the present invention also provides for the preparation method of a kind of encapsulation cover plate 70, including forming two
Layer the first inorganic layer 10 and at least two-layer organic layer between two-layer the first inorganic layer 10
20 and at least one of which the second inorganic layer 30, the first inorganic layer 10, organic layer 20 and the second nothing
Machine layer 30 is in close contact and alternately arranged.
Wherein, organic layer 20 and the second inorganic layer 30 being positioned above and contact, tool are formed
Body includes:
Form organic film, processed by etching technics, form surface and there is multiple groove 21
Organic layer 20；Along the direction on the bent limit of encapsulation cover plate 70, groove 21 is intervally arranged.
At the surface inorganic material of organic layer 20, form the second inorganic layer 30, described
The thickness of two inorganic layers 30 is identical with the height of the groove 21 on described organic layer 20 surface.
Wherein, inorganic material can pass through PECVD (Plasma Enhanced
Chemical Vapor Deposition, plasma enhanced chemical vapor deposition method),
CVD (Chemical Vapor Deposition, chemical vapour deposition technique) etc. realizes.
The modes such as organic film can pass through deposition, evaporation are formed.
The embodiment of the present invention also provides for the preparation method of a kind of display device, as it is shown in figure 9, bag
Include and above-mentioned encapsulation cover plate 70 and the substrate being formed with OLED 60 are passed through optical cement 80
Laminating, to be packaged OLED 60.
The embodiment of the present invention also provides for the preparation method of a kind of display device, as shown in Figure 10,
Directly by the preparation side of above-mentioned encapsulation cover plate 70 on the substrate being formed with OLED 60
Method preparation forms encapsulation cover plate 70, to be packaged OLED 60.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is also
Being not limited to this, any those familiar with the art is at the technology model that the invention discloses
In enclosing, change can be readily occurred in or replace, all should contain within protection scope of the present invention.
Therefore, protection scope of the present invention should be as the criterion with described scope of the claims.
Claims (10)
1. an encapsulation cover plate, including two-layer the first inorganic layer and be positioned at two-layer the first inorganic layer
Between at least two-layer organic layer and at least one of which the second inorganic layer, described first inorganic layer, institute
State organic layer and described second inorganic layer be in close contact and alternately arranged, it is characterised in that
The upper surface that described organic layer contacts with described second inorganic layer has multiple groove；Along institute
Stating the direction on the bent limit of encapsulation cover plate, described groove is intervally arranged；
For arbitrary described organic layer and described second inorganic layer being positioned above and contact, institute
The thickness stating the second inorganic layer is identical with the height of the groove of described organic surface.
Encapsulation cover plate the most according to claim 1, it is characterised in that described encapsulation cover plate
Each limit the most bent, the multiple grooves being positioned at described organic layer upper surface distribute as net shape.
Encapsulation cover plate the most according to claim 1, it is characterised in that described encapsulation cover plate
The limit parallel with first direction bent, described groove is along the second party vertical with first direction
To, extend to opposite side from a lateral edges of described encapsulation cover plate.
4. according to the encapsulation cover plate described in Claims 2 or 3, it is characterised in that described groove
For rectangular channel.
Encapsulation cover plate the most according to claim 3, it is characterised in that along described groove
Bearing of trend, described groove be shaped as curve shape.
Encapsulation cover plate the most according to claim 5, it is characterised in that the shape of described groove
Shape is waveform.
Encapsulation cover plate the most according to claim 1, it is characterised in that described encapsulation cover plate
It is 5 layers or 7 Rotating fields.
Encapsulation cover plate the most according to claim 1, it is characterised in that described encapsulation cover plate
Also include being arranged on the protective layer outside one layer of described first inorganic layer.
9. a display device, including being provided with the substrate of OLED and for encapsulating
The encapsulation cover plate of described OLED, it is characterised in that described encapsulation cover plate is claim
Encapsulation cover plate described in any one of 1-8.
10. a preparation method for encapsulation cover plate, including forming two-layer the first inorganic layer and position
At least two-layer organic layer between two-layer the first inorganic layer and at least one of which the second inorganic layer, institute
State the first inorganic layer, described organic layer and described second inorganic layer to be in close contact and alternately arranged,
It is characterized in that, described second inorganic layer forming described organic layer with being positioned above and contact,
Including:
Form organic film, processed by etching technics, form surface and there is having of multiple groove
Machine layer；Along the direction on the bent limit of described encapsulation cover plate, described groove is intervally arranged；
At the surface inorganic material of described organic layer, form the second inorganic layer.
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| CN201610539595.7A CN105977398B (en) | 2016-07-08 | 2016-07-08 | A kind of encapsulation cover plate and preparation method thereof, display device |
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| CN201610539595.7A CN105977398B (en) | 2016-07-08 | 2016-07-08 | A kind of encapsulation cover plate and preparation method thereof, display device |
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| CN105977398B CN105977398B (en) | 2018-01-12 |
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