CN110630487A - Water pump all-in-one with heat dissipation protection - Google Patents
Water pump all-in-one with heat dissipation protection Download PDFInfo
- Publication number
- CN110630487A CN110630487A CN201910875282.2A CN201910875282A CN110630487A CN 110630487 A CN110630487 A CN 110630487A CN 201910875282 A CN201910875282 A CN 201910875282A CN 110630487 A CN110630487 A CN 110630487A
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- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- water pump
- glue
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
- F04B53/08—Cooling; Heating; Preventing freezing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Details Of Reciprocating Pumps (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
The invention discloses a water pump all-in-one machine with heat dissipation protection, which comprises a machine shell, a circuit board and a glue layer, wherein a containing cavity is formed in the machine shell, the circuit board is arranged in the containing cavity, a glue injection port is formed in the top of the machine shell and communicated with the containing cavity, glue is injected into the containing cavity through the glue injection port, so that the glue layer is formed in the containing cavity and covers the circuit board. Through encapsulating in the casing for the glue film covers the circuit board, thereby has effectively improved the radiating effect to the circuit board, simultaneously, has strengthened overall structure intensity, has improved antidetonation, protecting effect greatly, has improved the safety and stability nature of the water pump all-in-one that has the heat dissipation protection greatly.
Description
Technical Field
The invention relates to a water pump all-in-one machine with heat dissipation protection.
Background
The water pump all-in-one machine is a machine for conveying liquid or pressurizing liquid. It transfers the mechanical energy of prime mover or other external energy to liquid to increase the energy of liquid, mainly used to transfer liquid including water, oil, acid-base liquid, emulsion, suspoemulsion and liquid metal, etc., and also to transfer liquid, gas mixture and liquid containing suspended solid matter.
At present, the circuit board is all set up in the casing through the mounting screw, and it is poor to have antidetonation protective effect in the use, simultaneously, has arranged various components and parts on the circuit board, and calorific capacity is big, and the radiating effect is not good to lead to the working property straight line decline of circuit board, cause the burnout of circuit board even.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a water pump all-in-one machine with heat dissipation protection.
The invention is realized by the following technical scheme:
the utility model provides a water pump all-in-one with heat dissipation protection, its includes casing, circuit board and glue film, the chamber that holds has in the casing, the circuit board set up in hold the intracavity, the top of casing has the injecting glue mouth, the injecting glue mouth with it is linked together to hold the chamber, through the injecting glue mouth to hold the intracavity encapsulating, make it is formed with to hold the intracavity the glue film, the glue film covers the circuit board.
Furthermore, the circuit board is connected to the inner wall surface of the casing and divides the accommodating cavity into an upper cavity and a lower cavity, at least one through hole is formed in the circuit board, the through hole is communicated with the upper cavity and the lower cavity, the adhesive layer is filled in the lower cavity, and the adhesive layer is filled in a partial space at the bottom end of the upper cavity.
Furthermore, a plurality of heating elements are arranged on the circuit board, and the plurality of heating elements are all positioned in the adhesive layer.
Further, the water pump all-in-one machine with heat dissipation protection still includes the input/output integrated circuit board, the input/output integrated circuit board with the glue film interval set up in hold the intracavity, the input/output integrated circuit board connect in the internal face of casing, just the one end of input/output integrated circuit board with the circuit board electricity is connected, the other end of control integrated circuit board is used for being connected with the outside.
Furthermore, a capacitor is arranged on the top surface of the circuit board, and the adhesive layer covers part of the structure of the bottom end of the capacitor.
Further, the glue layer covers two thirds of the height of the capacitor.
Further, the water pump all-in-one machine with heat dissipation protection still includes the apron, the apron connect in the casing and be used for sealing the injecting glue mouth.
Further, the bottom surface of apron has the draw-in groove, the apron with the pressure is equipped with the sealing washer between the casing, the sealing washer card is located the draw-in groove, just the draw-in groove encircle in the injecting glue mouth.
The invention has the beneficial effects that: through encapsulating in the casing for the glue film covers the circuit board, thereby has effectively improved the radiating effect to the circuit board, simultaneously, has strengthened overall structure intensity, has improved antidetonation, protecting effect greatly, has improved the safety and stability nature of the water pump all-in-one that has the heat dissipation protection greatly.
Drawings
Fig. 1 is a schematic structural diagram of a water pump all-in-one machine with heat dissipation protection according to an embodiment of the invention.
Fig. 2 is a schematic diagram of an internal structure of the water pump all-in-one machine with heat dissipation protection according to the embodiment of the invention.
Description of reference numerals:
case 1
Through-hole 21
Heating element 3
Input/output board card 4
Capacitor 5
Cover plate 6
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments in which the invention may be practiced.
As shown in fig. 1 and fig. 2, this embodiment discloses a water pump all-in-one with heat dissipation protection, and this water pump all-in-one with heat dissipation protection includes casing 1, circuit board 2 and glue film, has in casing 1 and holds the chamber, and circuit board 2 sets up in holding the intracavity, and casing 1's top has injecting glue mouth 11, and injecting glue mouth 11 with hold the chamber and be linked together, through injecting glue mouth 11 to holding the intracavity encapsulating for it is formed with the glue film to hold the intracavity, and the glue film covers circuit board 2.
Can glue at the intracavity that holds of casing 1 through injecting glue mouth 11 for glue will flow to holding the intracavity and flow into to circuit board 2 on, make glue will cover circuit board 2, form the glue film after glue solidifies, thereby realize that the glue film covers circuit board 2. The heat dissipation effect on the circuit board 2 can be effectively improved through the adhesive layer; meanwhile, the overall structural strength of the water pump all-in-one machine with heat dissipation protection is effectively enhanced, the anti-seismic and protection effects on the circuit board 2 are greatly improved, and the safety and stability of the water pump all-in-one machine with heat dissipation protection are greatly improved.
The circuit board 2 is connected to the inner wall surface of the casing 1 and separates the containing cavity to form an upper cavity 13 and a lower cavity 12, at least one through hole 21 is formed in the circuit board 2, the through hole 21 is communicated with the upper cavity 13 and the lower cavity 12, the glue layer is filled in the lower cavity 12, and the glue layer is filled in a partial space at the bottom end of the upper cavity 13. When carrying out the encapsulating to the intracavity that holds of casing 1 through injecting glue mouth 11, glue will flow to circuit board 2 on through upper chamber 13, through the through-hole 21 on the circuit board 2 for glue will flow into downwards in lower floor's chamber 12 and fill lower floor's chamber 12, fill after lower floor's chamber 12, circuit board 2 will be covered to the glue of excess, make the partial bottom space of upper chamber 13 also have glue, be formed with the glue film after solidifying. Wherein the circuit board 2 is arranged in the housing 1 closer to the bottom end of the receiving cavity.
The circuit board 2 is provided with a plurality of heating elements 3, and the plurality of heating elements 3 are all positioned in the adhesive layer. Cover the glue film on heating element 3 completely to effectively strengthen the radiating effect to heating element 3, improved the safety and stability of the water pump all-in-one that has the heat dissipation protection.
The water pump all-in-one machine with the heat dissipation protection function further comprises an input and output board card 4, the input and output board card 4 and the glue layer are arranged in the containing cavity at intervals, the input and output board card 4 is connected to the inner wall face of the shell 1, one end of the input and output board card 4 is electrically connected with the circuit board 2, and the other end of the control board card is used for being connected with the outside. The input and output board card 4 is used for being electrically connected with the outside, and the input and output board card 4 is installed and arranged in the accommodating cavity and closer to the top of the accommodating cavity, so that a gap is formed between the adhesive layer and the input and output board card 4 without connection, and the input and output board card 4 is favorable for overhauling, maintenance and replacement.
The top surface of the circuit board 2 is provided with a capacitor 5, and the glue layer covers part of the structure at the bottom end of the capacitor 5. When carrying out the encapsulating to holding the intracavity through injecting glue mouth 11, observe the encapsulating condition through injecting glue mouth 11 for the glue film need not cover condenser 5 completely, only need cover the partial structure of condenser 5's bottom can. Preferably, the glue layer covers two thirds of the height of the capacitor 5, and the glue layer only needs to cover about two thirds of the overall height of the capacitor 5.
The water pump all-in-one machine with the heat dissipation protection function further comprises a cover plate 6, and the cover plate 6 is connected to the machine shell 1 and used for sealing the glue injection port 11. Through injecting glue mouth 11 to holding after the intracavity encapsulating is accomplished, connect in casing 1 through apron 6 and realize the sealed of injecting glue mouth 11, guaranteed to hold the leakproofness of intracavity.
The bottom surface of the cover plate 6 is provided with a clamping groove, a sealing ring is arranged between the cover plate 6 and the casing 1 in a pressing mode, the sealing ring is clamped in the clamping groove, and the clamping groove surrounds the glue injection port 11. The sealing effect between the cover plate 6 and the machine shell 1 can be effectively enhanced through the sealing ring. Through setting up the draw-in groove in the bottom surface at apron 6 for the sealing washer will block when sealed supporting and establish in the draw-in groove, has effectively avoided the sealing washer to produce the phenomenon of skew dislocation at the in-process of sealed use, has improved the sealing stability of the water pump all-in-one that has the heat dissipation protection.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention, and it is therefore to be understood that the invention is not limited by the scope of the appended claims.
Claims (8)
1. The utility model provides a water pump all-in-one with heat dissipation protection, its characterized in that, it includes casing, circuit board and glue film, the chamber has to hold in the casing, the circuit board set up in hold the intracavity, the top of casing has the injecting glue mouth, the injecting glue mouth with it is linked together to hold the chamber, through the injecting glue mouth to hold the intracavity encapsulating, make it is formed with to hold the intracavity the glue film, the glue film covers the circuit board.
2. The all-in-one water pump machine with heat dissipation protection as claimed in claim 1, wherein the circuit board is connected to an inner wall surface of the casing and divides the accommodating cavity into an upper cavity and a lower cavity, the circuit board is provided with at least one through hole, the through hole is communicated with the upper cavity and the lower cavity, the adhesive layer is filled in the lower cavity, and the adhesive layer is filled in a partial space at the bottom end of the upper cavity.
3. The all-in-one machine of the water pump with the heat dissipation protection function as claimed in claim 1, wherein a plurality of heating elements are arranged on the circuit board, and the plurality of heating elements are all located in the adhesive layer.
4. The all-in-one water pump machine with heat dissipation protection of claim 1, characterized in that, the all-in-one water pump machine with heat dissipation protection further comprises an input/output board card, the input/output board card and the glue layer are arranged in the accommodating cavity at intervals, the input/output board card is connected to the inner wall surface of the casing, one end of the input/output board card is electrically connected with the circuit board, and the other end of the control board card is used for being connected with the outside.
5. The all-in-one machine with the function of heat dissipation and protection for the water pump as claimed in claim 1, wherein a capacitor is arranged on the top surface of the circuit board, and the adhesive layer covers a partial structure of the bottom end of the capacitor.
6. The all-in-one pump with heat dissipation protection as defined in claim 5, wherein the glue layer covers two thirds of the height of the capacitor.
7. The all-in-one water pump machine with heat dissipation protection as defined in claim 1, further comprising a cover plate, wherein the cover plate is connected to the casing and used for sealing the glue injection port.
8. The all-in-one water pump machine with heat dissipation protection as claimed in claim 7, wherein a clamping groove is formed in the bottom surface of the cover plate, a sealing ring is pressed between the cover plate and the casing, the sealing ring is clamped in the clamping groove, and the clamping groove surrounds the glue injection port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910875282.2A CN110630487A (en) | 2019-09-17 | 2019-09-17 | Water pump all-in-one with heat dissipation protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910875282.2A CN110630487A (en) | 2019-09-17 | 2019-09-17 | Water pump all-in-one with heat dissipation protection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110630487A true CN110630487A (en) | 2019-12-31 |
Family
ID=68972686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910875282.2A Withdrawn CN110630487A (en) | 2019-09-17 | 2019-09-17 | Water pump all-in-one with heat dissipation protection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110630487A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201636617U (en) * | 2010-03-27 | 2010-11-17 | 浙江恒泰电工有限公司 | LED (Light-Emitting Diode) underground lamp |
| TW201306673A (en) * | 2011-07-20 | 2013-02-01 | Silitek Electronic Guangzhou | Circuit board device and manufacturing method thereof and power supply having the circuit board device |
| CN204003495U (en) * | 2014-06-17 | 2014-12-10 | 艾美特电器（深圳）有限公司 | A kind of water pump |
| CN104266092A (en) * | 2014-09-05 | 2015-01-07 | 中山市晔汇电子有限公司 | Waterproof LED lamp and manufacturing method thereof |
| CN205847813U (en) * | 2016-06-07 | 2016-12-28 | 石家庄赛纳电子科技有限公司 | A kind of radiator structure of power amplifier |
| CN109888984A (en) * | 2019-04-10 | 2019-06-14 | 广东骏驰科技股份有限公司 | A kind of water pump controller |
| CN209053796U (en) * | 2018-10-17 | 2019-07-02 | 上海济鼎实业有限公司 | New-energy automobile electronic water pump heat radiating type rear cover |
-
2019
- 2019-09-17 CN CN201910875282.2A patent/CN110630487A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201636617U (en) * | 2010-03-27 | 2010-11-17 | 浙江恒泰电工有限公司 | LED (Light-Emitting Diode) underground lamp |
| TW201306673A (en) * | 2011-07-20 | 2013-02-01 | Silitek Electronic Guangzhou | Circuit board device and manufacturing method thereof and power supply having the circuit board device |
| CN204003495U (en) * | 2014-06-17 | 2014-12-10 | 艾美特电器（深圳）有限公司 | A kind of water pump |
| CN104266092A (en) * | 2014-09-05 | 2015-01-07 | 中山市晔汇电子有限公司 | Waterproof LED lamp and manufacturing method thereof |
| CN205847813U (en) * | 2016-06-07 | 2016-12-28 | 石家庄赛纳电子科技有限公司 | A kind of radiator structure of power amplifier |
| CN209053796U (en) * | 2018-10-17 | 2019-07-02 | 上海济鼎实业有限公司 | New-energy automobile electronic water pump heat radiating type rear cover |
| CN109888984A (en) * | 2019-04-10 | 2019-06-14 | 广东骏驰科技股份有限公司 | A kind of water pump controller |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20191231 |
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| WW01 | Invention patent application withdrawn after publication |