CN104266092A - Waterproof LED lamp and manufacturing method thereof - Google Patents
Waterproof LED lamp and manufacturing method thereof Download PDFInfo
- Publication number
- CN104266092A CN104266092A CN201410452380.2A CN201410452380A CN104266092A CN 104266092 A CN104266092 A CN 104266092A CN 201410452380 A CN201410452380 A CN 201410452380A CN 104266092 A CN104266092 A CN 104266092A
- Authority
- CN
- China
- Prior art keywords
- led lamp
- bonnet
- lamp panel
- lampshade
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000003822 epoxy resin Substances 0.000 claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000741 silica gel Substances 0.000 claims abstract description 26
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 26
- 238000007711 solidification Methods 0.000 claims description 29
- 230000008023 solidification Effects 0.000 claims description 29
- 238000007789 sealing Methods 0.000 claims description 20
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 239000004568 cement Substances 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 239000003673 groundwater Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241001465754 Metazoa Species 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K63/00—Receptacles for live fish, e.g. aquaria; Terraria
- A01K63/06—Arrangements for heating or lighting in, or attached to, receptacles for live fish
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/30—Lighting for domestic or personal use
- F21W2131/308—Lighting for domestic or personal use for aquaria
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a waterproof LED lamp and a manufacturing method thereof. The waterproof LED lamp comprises a rear cover and a lamp cover, an LED lamp panel is installed in a space formed by the rear cover and the lamp cover, a drive circuit board connected with the LED lamp panel is installed in a space formed by the LED lamp panel and the rear cover, the drive circuit board is connected with a wire extending out of the rear cover, the space composed of the front face of the LED lamp panel and the lamp cover is filled with epoxy resin, and the space formed by the rear cover and the back face of the LED lamp panel is filled with conductive silica gel. Good radiation performance is achieved on the basis that light transmittance is guaranteed, the service life of the LED lamp is prolonged, and the LED lamp manufactured through the method is ideal in waterproof and radiating effect, high in reliability and capable of being used as an outdoor lamp, an aquarium lamp and the like.
Description
Technical field
The present invention relates to a kind of lighting, particularly a kind of water-proof LED lamp.
Background technology
LED for aquarium apparatus etc. needs good water resistance, current LED carrys out waterproof by the mode of filling epoxy resin in bonnet and lampshade, but due to a large amount of heats can be produced in LED work, the epoxy resin of filling is equivalent to one layer of heat preservation layer and LED lamp panel and drive circuit board is wrapped up, heat can not be distributed in time, can cause shorten the service life of LED.
In order to heat conductivility can be increased while playing sealing function, people first it is envisioned that adopt heat conductive silica gel to replace epoxy resin, if really waterproof and heat-conducting effect can be realized after changing epoxy resin into heat conductive silica gel, but realize heat conduction because heat conductive silica gel needs to add ceramic powder or metal dust etc., its light transmission is far away not as good as epoxy resin, obviously, adopt after heat conductive silica gel and realize drawback that heat conduction and waterproof bring and be not less than to sacrifice light transmittance the insulation drawback that epoxy resin brings, reality is also infeasible.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of heat radiation and the desirable water-proof LED lamp of waterproof effect and preparation method thereof.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of water-proof LED lamp, comprise bonnet and lampshade, in the space that described bonnet and lampshade are formed, LED lamp panel is installed, in the space that described LED lamp panel and described bonnet are formed, the drive circuit board be electrically connected with described LED lamp panel is installed, described drive circuit board is connected with the wire stretched out outside described bonnet, be filled with epoxy resin in the space that described LED lamp panel front and described lampshade are formed, in the space that described bonnet and the described LED lamp panel back side are formed, be filled with heat conductive silica gel.
Described bonnet is provided with the vacuum pipe joint and injected rubber hose joint that the space that forms with described LED lamp panel and described lampshade is communicated with.
Described bonnet is provided with wire inlet hole, is provided with sealing shroud in described wire inlet hole, and one end of described wire is welded with described drive circuit board through after described sealing shroud.
The rear side of described LED lamp panel is pasted with an annular ring, and described drive circuit board adopts heat conductive silica gel to be encapsulated in annular ring.
Described drive circuit board is provided with glue feeding opening.
The preparation method of above-mentioned water-proof LED lamp is as follows:
1, loaded by sealing shroud in wire inlet hole, then sealing shroud is passed in one end of wire, injection ring epoxy resins in bonnet, seals up the gap between wire sealing shroud, wire inlet hole, leaves standstill solidification 4-36 hour.
2, adopted by annular ring quick setting cement to be pasted onto the back side of LED lamp panel, drive circuit board is put into annular ring, then in annular ring, pours into heat conductive silica gel, leave standstill solidification 1-12 hour.
3, wire is welded with drive circuit board, then in bonnet, pour into heat conductive silica gel, and LED lamp panel is seated, adopt clamp, leave standstill solidification 4-12 hour.
4, connect the sidewall painting epoxy resin of lampshade side at bonnet, then lampshade is assembled on bonnet, lampshade and bonnet is formed and is tightly connected, leave standstill solidification 4-24 hour.
5, on vacuum pipe joint with injected rubber hose joint, vacuum tube and injected rubber hose is connected respectively, while vacuum tube vacuumizes, injected rubber hose injection ring epoxy resins, makes to fill full epoxy resin in lampshade, injected rubber hose and vacuum tube, then under 20-25 degree Celsius of environment, leaves standstill solidification 24-60 hour.
In described step, injected rubber hose and vacuum tube are transparent hose, after having poured into, cut off injected rubber hose and vacuum tube, make the two length be connected in respectively on vacuum pipe joint and injected rubber hose joint be 10-20cm.
The invention has the beneficial effects as follows: in the space that LED lamp panel front of the present invention and lampshade are formed, be filled with epoxy resin, heat conductive silica gel is filled with in the space that bonnet and the LED lamp panel back side are formed, product can be made to realize good heat radiation when ensureing light transmittance, improve the service life of product, the LED waterproof adopting method of the present invention to make and radiating effect ideal, reliability is high, can be used as outside light, the uses such as aquatic animals lamp.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is water-proof LED lamp exploded view of the present invention;
Fig. 2 is water-proof LED lamp sectional view of the present invention;
Fig. 3 is drive circuit board structural representation of the present invention.
Detailed description of the invention
Referring to figs. 1 through Fig. 3, a kind of water-proof LED lamp, comprise bonnet 1 and lampshade 5, in the space that described bonnet 1 and lampshade 5 are formed, LED lamp panel 4 is installed, be provided with the drive circuit board 2 be electrically connected with described LED lamp panel 4 in the space that described LED lamp panel 4 and described bonnet 1 are formed, described bonnet 1 is provided with the vacuum pipe joint 8 and injected rubber hose joint 9 that the space that forms with described LED lamp panel 4 and described LED lamp panel 4 is communicated with.
Described drive circuit board 2 is connected with the wire 10 stretched out outside described bonnet 1, specifically, described bonnet 1 is provided with wire inlet hole 6, in described wire inlet hole 6, sealing shroud 7 is installed, one end of described wire 10 is welded with described drive circuit board 2 through after described sealing shroud 7, and sealing shroud 7 is silica gel material, can gap tentatively between sealed guide inlet hole 6 and wire 10, when follow-up infusion epoxy resin, epoxy resin can not flow out from the gap between wire inlet hole 6 and wire 10.
The rear side of described LED lamp panel 4 is pasted with an annular ring 3, described drive circuit board 2 adopts heat conductive silica gel to be encapsulated in annular ring 3, described drive circuit board 2 is provided with glue feeding opening 13, when pouring into heat conductive silica gel, heat conductive silica gel can flow into below drive circuit board from glue feeding opening 13, make between LED lamp panel and drive circuit board can not spacing, be conducive to the conduction of heat.
Be filled with epoxy resin 12 in the space that described LED lamp panel 4 front and described lampshade 5 are formed, in the space that described bonnet 1 and LED lamp panel 4 back side are formed, be filled with heat conductive silica gel 11.Epoxy resin 12 seals, heat conductive silica gel 11 sealing and conductive force, making LED realize good heat radiation when ensureing light transmittance, can improve the service life of product.
The preparation method of above-mentioned water-proof LED lamp is as follows:
1, sealing shroud 7 is loaded in wire inlet hole 6, then sealing shroud 7 is passed in one end of wire 10, injection ring epoxy resins in bonnet, seal up the gap between wire 10 sealing shroud 7, wire inlet hole 6, solidification 4-36 hour is left standstill according to environment temperature and humidity, at room temperature 25-30 degree, humidity about 50% leaves standstill solidification 24 hours.The groundwater increment of epoxy resin is unsuitable too many, is advisable can seal up gap between wire 10, sealing shroud 7, wire inlet hole 6.
2, quick setting cement (as 502, happy safe 406 etc.) is adopted by annular ring 3 to be pasted onto the back side of LED lamp panel 4, drive circuit board 2 is put into annular ring 3, then in annular ring 3, heat conductive silica gel is poured into, solidification 1-12 hour is left standstill according to environment temperature and humidity, at room temperature 25-30 degree, humidity about 50% leaves standstill solidification 4 hours.The injection rate of heat conductive silica gel is advisable to fill full annular ring 3, reserve the welding position of drive circuit board welding lead.
3, wire 10 is welded with drive circuit board 2, then in bonnet 1, heat conductive silica gel is poured into, and LED lamp panel 4 is seated, adopt fixture as clampings such as dovetail clips, solidification 4-12 hour is left standstill according to environment temperature and humidity, at room temperature 25-30 degree, humidity about 50% leaves standstill solidification 4 hours.Heat conductive silica gel will fill bonnet, makes LED lamp panel 4, drive circuit board fully contacts with silica gel, form good radiator.
4, the sidewall painting epoxy resin of lampshade 5 side is connected at bonnet 1, then lampshade 5 is assembled on bonnet 1, lampshade 5 and bonnet 1 is formed and is tightly connected, leave standstill solidification 4-24 hour according to environment temperature and humidity, at room temperature 25-30 degree, humidity about 50% leaves standstill solidification 8 hours.
5, on vacuum pipe joint 8 with injected rubber hose joint 9, vacuum tube and injected rubber hose is connected respectively, while vacuum tube vacuumizes, injected rubber hose injection ring epoxy resins, make in lampshade, injected rubber hose and vacuum tube, to fill full epoxy resin, then under 20-25 degree Celsius of environment, leave standstill solidification 24-60 hours according to ambient humidity, at room temperature 20-25 degree, humidity about 50% leaves standstill solidification 48 hours.
In the solidification of step 1 to step 4, special requirement be there is no to temperature and pressure etc.In steps of 5, because the groundwater increment of epoxy resin is large, and good light transmittance to be kept, if solidification temperature is too high while sealing, react more violent in solidification process, a large amount of heat can produce bubble, wire drawing, the disadvantageous factor of the outward appearances such as crackle in the process of release, if solidification temperature is too low, can extend the time of solidification, therefore, the present invention selects to leave standstill solidification under 20-25 degree Celsius of environment.
In steps of 5, injected rubber hose and vacuum tube are suitably transparent hose, can the perfusion situation of visual epoxy resin, after having poured into, cut off injected rubber hose and vacuum tube, the two length be connected in respectively on vacuum pipe joint 8 and injected rubber hose joint 9 is made to be 10-20cm, when standing solidification, temperature influence, epoxy resin smaller volume in lampshade, the epoxy resin of vacuum pipe joint 8 and injected rubber hose joint 9 can add in lampshade, makes not interspace and bubble in lampshade, after having solidified, cut off injected rubber hose and vacuum tube.
Epoxy resin is a kind of encapsulant conventional in current industry, there is after solidification good physics, chemical property, it has excellent adhesive strength to the surface of metal and nonmetallic materials, dielectric properties are good, set shrinkage factor is little, and hardness is high, and pliability is better, in the present embodiment, the 500AB-307 type epoxide-resin glue that Bole's high-strength composite material Co., Ltd produces is adopted.
Heat conductive silica gel is also guides thermalize compound conventional in current industry, there is good insulation, switching performance and pliability, in the present embodiment, adopt CS-9811G (A:B=1:1) the dual composition addition type flame-retarded heat-conducting organic silicon casting glue that apocalypse Science and Technology Ltd. of China of Shenzhen produces, component A is grey thick liquid, B component is white viscous liquid, and two components can be preserved for a long time before unmixed, have good insulating properties, elasticity, corrosion resistance and anti-flammability after solidification.
Claims (7)
1. a water-proof LED lamp, comprise bonnet (1) and lampshade (5), in the space that described bonnet (1) and lampshade (5) are formed, LED lamp panel (4) is installed, in the space that described LED lamp panel (4) and described bonnet (1) are formed, the drive circuit board (2) be electrically connected with described LED lamp panel (4) is installed, described drive circuit board (2) is connected with and stretches out described bonnet (1) wire outward (10), it is characterized in that being filled with epoxy resin (12) in the space that described LED lamp panel (4) front and described lampshade (5) are formed, heat conductive silica gel (11) is filled with in the space that described bonnet (1) and described LED lamp panel (4) back side are formed.
2. water-proof LED lamp according to claim 1, is characterized in that described bonnet (1) is provided with the vacuum pipe joint (8) and injected rubber hose joint (9) that the space that forms with described LED lamp panel (4) and described lampshade (5) is communicated with.
3. water-proof LED lamp according to claim 1, it is characterized in that described bonnet (1) is provided with wire inlet hole (6), be provided with sealing shroud (7) in described wire inlet hole (6), one end of described wire (10) is welded with described drive circuit board (2) afterwards through described sealing shroud (7).
4. water-proof LED lamp according to claim 1, is characterized in that the rear side of described LED lamp panel (4) is pasted with an annular ring (3), and described drive circuit board (2) adopts heat conductive silica gel to be encapsulated in annular ring (3).
5. water-proof LED lamp according to claim 1, is characterized in that described drive circuit board (2) is provided with glue feeding opening (13).
6. a preparation method for water-proof LED lamp as described in claim as arbitrary in claim 1 to 5, is characterized in that its making step is as follows:
(1), sealing shroud (7) is loaded in wire inlet hole (6), then sealing shroud (7) is passed in one end of wire (10), injection ring epoxy resins in bonnet, seals up the gap between wire (10) sealing shroud (7), wire inlet hole (6), leaves standstill solidification 4-36 hour;
(2), by annular ring (3) adopt quick setting cement to be pasted onto the back side of LED lamp panel (4), drive circuit board (2) is put into annular ring (3), then in annular ring (3), pour into heat conductive silica gel, leave standstill solidification 1-12 hour;
(3), by wire (10) weld with drive circuit board (2), then in bonnet (1), pour into heat conductive silica gel, and LED lamp panel (4) is seated, adopt clamp, leave standstill solidification 4-12 hour;
(4), at the sidewall of bonnet (1) connection lampshade (5) side be coated with epoxy resin, then lampshade (5) be assembled on bonnet (1), lampshade (5) and bonnet (1) are formed and is tightly connected, leave standstill solidification 4-24 hour;
(5), on vacuum pipe joint (8) with injected rubber hose joint (9), vacuum tube and injected rubber hose is connected respectively, while vacuum tube vacuumizes, injected rubber hose injection ring epoxy resins, make in lampshade, injected rubber hose and vacuum tube, to fill full epoxy resin, then under 20-25 degree Celsius of environment, leave standstill solidification 24-60 hour.
7. the preparation method of water-proof LED lamp according to claim 6, it is characterized in that in described step (5), injected rubber hose and vacuum tube are transparent hose, after having poured into, cut off injected rubber hose and vacuum tube, make the two length be connected in respectively on vacuum pipe joint (8) and injected rubber hose joint (9) be 10-20cm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410452380.2A CN104266092B (en) | 2014-09-05 | 2014-09-05 | A kind of water-proof LED lamp and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410452380.2A CN104266092B (en) | 2014-09-05 | 2014-09-05 | A kind of water-proof LED lamp and preparation method thereof |
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CN104266092A true CN104266092A (en) | 2015-01-07 |
CN104266092B CN104266092B (en) | 2016-05-25 |
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CN201410452380.2A Expired - Fee Related CN104266092B (en) | 2014-09-05 | 2014-09-05 | A kind of water-proof LED lamp and preparation method thereof |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107205367A (en) * | 2015-02-12 | 2017-09-26 | 飞利浦灯具控股公司 | Aquarium illuminating |
CN108662483A (en) * | 2017-03-31 | 2018-10-16 | 马少峰 | The sealed lamp or electrical structure of a kind of resistance to hyperbar or hydraulic pressure |
CN110630487A (en) * | 2019-09-17 | 2019-12-31 | 科比传动技术(上海)有限公司 | Water pump all-in-one with heat dissipation protection |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101187463A (en) * | 2007-12-27 | 2008-05-28 | 深圳帝光电子有限公司 | LED light source module with heat guiding system and radiation system |
CN201141580Y (en) * | 2008-01-10 | 2008-10-29 | 雅辉产品有限公司 | Epoxy resin LED water-proof lamp |
CN204187313U (en) * | 2014-09-05 | 2015-03-04 | 中山市晔汇电子有限公司 | A kind of water-proof LED lamp |
-
2014
- 2014-09-05 CN CN201410452380.2A patent/CN104266092B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101187463A (en) * | 2007-12-27 | 2008-05-28 | 深圳帝光电子有限公司 | LED light source module with heat guiding system and radiation system |
CN201141580Y (en) * | 2008-01-10 | 2008-10-29 | 雅辉产品有限公司 | Epoxy resin LED water-proof lamp |
CN204187313U (en) * | 2014-09-05 | 2015-03-04 | 中山市晔汇电子有限公司 | A kind of water-proof LED lamp |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107205367A (en) * | 2015-02-12 | 2017-09-26 | 飞利浦灯具控股公司 | Aquarium illuminating |
CN108662483A (en) * | 2017-03-31 | 2018-10-16 | 马少峰 | The sealed lamp or electrical structure of a kind of resistance to hyperbar or hydraulic pressure |
CN110630487A (en) * | 2019-09-17 | 2019-12-31 | 科比传动技术(上海)有限公司 | Water pump all-in-one with heat dissipation protection |
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CN104266092B (en) | 2016-05-25 |
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