CN110620099B - Pin of intelligent power module, pin assembly, processing method and intelligent power module - Google Patents

Pin of intelligent power module, pin assembly, processing method and intelligent power module Download PDF

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Publication number
CN110620099B
CN110620099B CN201911005500.3A CN201911005500A CN110620099B CN 110620099 B CN110620099 B CN 110620099B CN 201911005500 A CN201911005500 A CN 201911005500A CN 110620099 B CN110620099 B CN 110620099B
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section
thickness
segment
pin
main body
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CN110620099A (en
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李媛媛
冯宇翔
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Midea Group Co Ltd
GD Midea Air Conditioning Equipment Co Ltd
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Midea Group Co Ltd
GD Midea Air Conditioning Equipment Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H01L21/4896—Mechanical treatment, e.g. cutting, bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The invention discloses a pin of an intelligent power module, a pin assembly, a processing method and the intelligent power module, wherein the pin comprises two bending parts, the two bending parts divide the pin into a first section, a middle section and a second section which are sequentially arranged along the length direction of the pin, the middle section is positioned between the two bending parts, the first section and the second section are respectively positioned at one side of the two bending parts far away from the middle section, and the thickness of the middle section is smaller than that of at least part of the first section and that of at least part of the second section. According to the pins of the intelligent power module, a large number of unit packages can be realized, the packaging efficiency is improved, and the feeding is convenient.

Description

Pin of intelligent power module, pin assembly, processing method and intelligent power module
Technical Field
The invention relates to the technical field of electronic devices, in particular to a pin of an intelligent power module, a pin assembly, a processing method and the intelligent power module.
Background
The intelligent power module is a power driving product combining power electronics and integrated circuit technology, can integrate a power switching device with a high-voltage driving circuit, and is provided with a fault detection circuit such as overvoltage, overcurrent and overheat. The intelligent power module can receive control signals of an MCU (micro control unit) on one hand, drive a subsequent circuit to work, and send state detection signals of the system back to the MCU on the other hand.
In the related art, pins in the intelligent power module can only adopt a small packaging mode with a small quantity, namely, the quantity of pins in unit packages is small, so that the packaging is complicated, meanwhile, in the processing process, the quantity of unit packages is limited, so that the feeding quantity is limited, and special operators are required to be arranged at a pin welding station for feeding.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the pin of the intelligent power module, which can realize unit package with a large number, improves the packaging efficiency and is convenient for feeding.
The invention also provides a pin assembly with the pin.
The invention also provides a processing method of the pin assembly.
The invention also provides an intelligent power module with the pin assembly.
According to the pin of the intelligent power module, the pin comprises two bending parts, the two bending parts divide the pin into a first section, a middle section and a second section which are sequentially arranged along the length direction of the pin, the middle section is positioned between the two bending parts, the first section and the second section are respectively positioned at one sides of the two bending parts, which are far away from the middle section, and the thickness of the middle section is smaller than that of at least part of the first section and that of at least part of the second section.
According to the pins of the intelligent power module, when a plurality of pins are stacked in the packaging process, the displacement of two adjacent pins in the length direction of the pins is reduced, so that the packaging occupied space of the plurality of pins is saved, the unit packaging of a plurality of pins is conveniently realized, the feeding quantity is not excessively limited, special operators are not required to be arranged at a pin welding station for feeding, and the labor cost is saved; meanwhile, under the condition that the displacement generated in the length direction of the pins after the plurality of pins are overlapped is 0, the packaging deformation of the pins is reduced, and the use reliability of the pins is guaranteed.
In some embodiments, the bending included angle between the middle section and the first section is alpha, 90 degrees < alpha < 180 degrees, the middle section is an equal-thickness section and has a thickness D, the first section comprises an equal-thickness first main body section, the thickness of the first main body section is D1, wherein D1 is greater than or equal to a first preset absolute value, and the first preset absolute value is an absolute value of a ratio of D to a cosine of the bending included angle alpha.
In some embodiments, the bending included angle between the middle section and the second section is beta, 90 ° < beta < 180 °, the middle section is an equal-thickness section and has a thickness D, the second section includes an equal-thickness second main body section, and the thickness of the second main body section is D2, where D2 is greater than or equal to a second preset absolute value, and the second preset absolute value is an absolute value of a ratio of D to a cosine of the bending included angle beta.
In some embodiments, the first segment is disposed parallel to the second segment, the first segment comprises a first body segment of equal thickness, the first body segment has a thickness D1, the second segment comprises a second body segment of equal thickness, the second body segment has a thickness D2, wherein d1=d2.
In some embodiments, at least one of the first and second segments includes a body segment of equal thickness and a connecting segment of equal thickness connected between the body segment and the intermediate segment, the connecting segment having a thickness less than the thickness of the body segment, and the intermediate segment also having a thickness less than the thickness of the body segment.
In some embodiments, the thickness of the connecting section is equal to the thickness of the intermediate section.
In some embodiments, the thickness-side surfaces of the connecting section are flush with the thickness-side surfaces of the intermediate section.
In some embodiments, the thickness-side surface of the body section is flush with the thickness-side surface of the connection section.
In some embodiments, the first segment includes the main body segment and the connection segment, the main body segment of the first segment is a first main body segment, the connection segment of the first segment is a first connection segment, the second segment also includes the main body segment and the connection segment, the main body segment of the second segment is a second main body segment, the connection segment of the second segment is a second connection segment, the thickness both sides of the pin are respectively a first side and a second side, the first main body segment and the first connection segment are in the first side parallel and level, and the second main body segment and the second connection segment are in the second side parallel and level.
According to a second aspect of the present invention, a pin assembly includes pins of the intelligent power module according to the first aspect of the present invention, wherein the pins are arranged in a plurality of spaced apart manner along a preset direction, the preset direction is perpendicular to a length direction of the pins and a thickness direction of the pins, and the pins are connected through connecting ribs.
According to the pin assembly, the pins are beneficial to realizing unit package with a larger number, so that the number of the pins for feeding is not limited greatly, special operators are not required to be arranged at a pin welding station for pin feeding, and the cost is saved.
In some embodiments, the length of the second section is greater than the length of the first section, the connecting rib is connected to the second sections of the pins, the connecting rib comprises a first connecting rib and a second connecting rib, the first connecting rib is connected to one end of the second section, which is close to the middle section, and the second connecting rib is connected to one end of the second section, which is far away from the middle section.
In some embodiments, the length of the second section is greater than that of the first section, the connecting rib is connected to the second sections of the pins, the connecting rib comprises a second connecting rib, the second connecting rib is connected to one end, far away from the middle section, of the second section, and a plurality of positioning holes are formed in the second connecting rib and are suitable for being matched with positioning pins of the packaging mold in a positioning mode.
A method for manufacturing a lead assembly according to a third aspect of the present invention, the lead assembly being according to the second aspect of the present invention, the method comprising the steps of: the sheet metal is thinned so that the sheet metal includes a thin plate portion and first and second thick plate portions that are located on both sides of the thin plate portion in a first direction, and both ends of the thin plate portion in the first direction are respectively bent.
According to the processing method of the pin assembly, the processing procedure is simple, and the pin assembly is favorable for adopting a plurality of unit packages.
In some embodiments, before the sheet metal is thinned or after the sheet metal is bent, the method further comprises the steps of: punching the metal plate to obtain the pin assembly.
The intelligent power module according to the fourth aspect of the present invention comprises the pin assembly according to the second aspect of the present invention.
According to the intelligent power module, the pin assembly is adopted, so that the use reliability is ensured.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a schematic diagram of pins of a smart power module according to one embodiment of the invention;
Fig. 2 is an enlarged view of a portion a circled in fig. 1;
FIG. 3 is another schematic view of the pin shown in FIG. 1;
FIG. 4 is an enlarged view of portion B of FIG. 3;
FIG. 5 is a further schematic view of the pin shown in FIG. 1;
FIG. 6 is an enlarged view of portion C of FIG. 5;
Fig. 7 is a schematic diagram of a package of pins and a package magazine according to one embodiment of the present invention;
FIG. 8 is an enlarged view of portion D of FIG. 7;
fig. 9 is a schematic diagram of a pin assembly according to one embodiment of the invention;
FIG. 10 is a flow chart of a method of manufacturing a pin assembly according to one embodiment of the present invention;
FIG. 11 is a flow chart of a method of manufacturing a pin assembly according to another embodiment of the present invention;
FIG. 12 is a schematic diagram of a smart power module according to one embodiment of the invention;
Fig. 13 is a schematic diagram of the package of the smart power module shown in fig. 12.
Reference numerals:
Intelligent power module 300, package 301,
A circuit board 201, a component 202,
Pin assembly 200, connecting ribs 101,
A first connecting rib 1011, a second connecting rib 1012, a positioning hole 1012a,
Pin 100, bending part 100a, main body section 100b, connecting section 100c,
A first side 10a, a second side 10b,
A first section 1, a first main body section 11, a first connecting section 12,
An intermediate section 2,
A second section 3, a second body section 31, a second connecting section 32.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
The following disclosure provides many different embodiments, or examples, for implementing different structures of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the applicability of other processes and/or the use of other materials.
The pin 100 of the smart power module 300 according to an embodiment of the present invention is described below with reference to the accompanying drawings.
As shown in fig. 1, 3 and 5, the pin 100 may include two bent portions 100a, the two bent portions 100a may be disposed at intervals along a length direction (e.g., OO' direction in fig. 1) of the pin 100, the two bent portions 100a divide the pin 100 into a first section 1, a middle section 2 and a second section 3 sequentially disposed along the length direction of the pin 100, that is, the two bent portions 100a divide the pin 100 into the first section 1, the middle section 2 and the second section 3, and the first section 1, the middle section 2 and the second section 3 are sequentially disposed along the length direction of the pin 100; wherein, the middle section 2 is located between two bending positions 100a, the two bending positions 100a are respectively disposed at two ends of the length of the middle section 2, the first section 1 and the second section 3 are respectively located at one side of the two bending positions 100a far away from the middle section 2, then one bending position 100a is located between the first section 1 and the middle section 2, and the other bending position 100a is located between the second section 3 and the middle section 2.
In connection with fig. 5 and 6, the formation of the "bent portion 100a" may be understood that the extending directions of the portions located at both sides of the bent portion 100a are not parallel; for example, the extending direction of the end of the first segment 1 adjacent to the corresponding bending position 100a is not parallel to the extending direction of the end of the middle segment 2 adjacent to the corresponding bending position 100a, and the extending direction of the end of the second segment 3 adjacent to the corresponding bending position 100a is not parallel to the extending direction of the end of the middle segment 2 adjacent to the corresponding bending position 100 a.
As shown in fig. 2, 4 and 6, the thickness of the intermediate section 2 is smaller than both the thickness of at least part of the first section 1 and the thickness of at least part of the second section 3, i.e. the thickness of the intermediate section 2 is smaller than the thickness of at least part of the first section 1 and the thickness of the intermediate section 2 is smaller than the thickness of at least part of the second section 3, such that the thickness of the intermediate section 2 is thinner relative to the thickness of at least part of the first section 1 and the thickness of the intermediate section 2 is thinner relative to the thickness of at least part of the second section 3; when the pins 100 are packaged, the pins 100 can be sequentially stacked along the thickness direction of the first section 1, and the arrangement of the middle section 2 meets the requirements, so that when the pins 100 are stacked, the displacement of two adjacent pins 100 in the length direction of the pins 100 is reduced, the occupation space of two adjacent pins 100 in the length direction of the pins 100 is avoided to be larger, the packaging occupation space of the pins 100 is saved, the unit packaging of a plurality of pins 100 is facilitated, the packaging quantity is reduced, and the packaging efficiency is improved; meanwhile, under the condition that the displacement generated in the length direction of the pins 100 after the plurality of pins 100 are overlapped is 0, the packaging deformation of the pins 100 is reduced, the pins 100 are prevented from being greatly deformed in the packaging process to influence the normal use of the pins 100, and the use reliability of the pins 100 is guaranteed conveniently.
Wherein the thickness of the intermediate section 2 is smaller than the thickness of at least part of the first section 1, it is understood that the thickness of the intermediate section 2 is smaller than the thickness of the part of the first section 1, the thickness of the intermediate section 2 may be smaller than the thickness of any part of the first section 1, or the thickness of the intermediate section 2 is smaller than the thickness of the whole first section 1, the thickness of the intermediate section 2 may be smaller than the minimum value of the thickness of the whole first section 1 if the first section 1 is of a non-uniform thickness design; in other words, the thickness of the intermediate section 2 is smaller than the thickness of at least part of the first section 1, and it is also understood that the thickness of the intermediate section 2 may be smaller than the maximum value of the thickness of the entire first section 1, for example, the first section 1 is of non-uniform thickness design, a part of the thickness of the first section 1 is 0.3mm, and another part of the thickness of the second section 3 is 0.5mm, and the thickness of the intermediate section 2 may be smaller than 0.5 mm.
Also, the thickness of the intermediate section 2 is smaller than the thickness of at least part of the second section 3, it being understood that the thickness of the intermediate section 2 is smaller than the thickness of the part of the second section 3, where the thickness of the intermediate section 2 may be smaller than the thickness of any part of the second section 3, or the thickness of the intermediate section 2 is smaller than the thickness of the entire second section 3, where the thickness of the intermediate section 2 may be smaller than the minimum of the thickness of the entire second section 3 if the second section 3 is of non-uniform thickness design; in other words, the thickness of the intermediate section 2 is smaller than the thickness of at least part of the second section 3, it is also understood that the thickness of the intermediate section 2 may be smaller than the maximum value of the thickness of the entire second section 3, for example, the second section 3 is of non-uniform thickness design, a part of the thickness of the second section 3 is 0.4mm, and another part of the thickness of the second section 3 is 0.6mm, and the thickness of the intermediate section 2 may be smaller than 0.6 mm.
According to the pins 100 of the intelligent power module 300 provided by the embodiment of the invention, when a plurality of pins 100 are stacked in the packaging process, the displacement of two adjacent pins 100 in the length direction of the pins 100 is reduced, so that the packaging occupied space of the plurality of pins 100 is saved, unit packaging of a plurality of pins 100 is realized conveniently, a plurality of pins 100 can be contained in a packaging material box, the feeding quantity is not excessively limited, one-time large-scale feeding can be performed, the labor cost is greatly saved, the automation degree is improved, and the feeding is performed without arranging special operators at a pin welding station, so that the labor cost is saved; meanwhile, under the condition that the displacement generated in the length direction of the pins 100 after the plurality of pins 100 are overlapped is required to be 0, the packaging deformation of the pins 100 is reduced, and the use reliability of the pins 100 is guaranteed. .
In some embodiments, as shown in fig. 6, the bending included angle between the middle section 2 and the first section 1 is alpha, and alpha is an obtuse angle, that is, 90 ° < alpha < 180 °, so as to facilitate stacking packaging of the plurality of pins 100, and facilitate saving of occupied space when the plurality of pins 100 are packaged in units. The intermediate section 2 is an equal-thickness section and the thickness of the intermediate section 2 is D, the thickness of any position on the intermediate section 2 can be D, the first section 1 comprises a first main body section 11 with equal thickness, the thickness of the first main body section 11 is D1, and the thickness of any position on the first main body section 11 can be D1. Wherein D1 is not less than |D/cos alpha|. Therefore, when the pins 100 are stacked, the displacement of the first section 1 of the two adjacent pins 100 in the length direction of the pins 100 is 0, which is favorable for realizing the regular guarantee of the pins 100, saving the occupied space of unit package and further promoting the quantity of the pins 100 of the unit package.
It will be appreciated that when D1+|D/cos α|, the thickness D of the intermediate section 2 can be less than the thickness D1 of the first body section 11, but is not limited thereto; for example, if the first segment 1 further includes other portions (e.g., a first connecting segment 12 described later), the thickness of the intermediate segment 2 may be smaller than the thickness of the other portions of the first segment 1 other than the first main body segment 11, and the thickness D of the intermediate segment 2 may be smaller than, equal to, or greater than the thickness D1 of the first main body segment 11.
In connection with fig. 6-8, it can be understood that when d1= |d/cos α| is performed on the longitudinal section of the pin 100, Δxyz is performed, where the point X is located on the surface of one side of the thickness of the middle section 2, the points Y and Z are both located on the surface of the other side of the thickness of the middle section 2, XY is parallel to the thickness direction of the middle section 2, XZ is parallel to the thickness direction of the first main section 11, the angle ZYX is complementary to the bending angle α, i.e. the angle zyx+α=180°, and is equal to the thickness D of the middle section 2, so xz=xy/cos = |zyx, i.e. xz= |d/cos α| is equal to D1, i.e. the size of the middle section 2 in the thickness direction of the first section 1 is equal to the thickness of the first section 1, so that when a plurality of pins 100 are stacked, the first section 1 and the middle section 2 of two adjacent pins 100 can be in contact, i.e. the angle zyx+α=180°, and is equal to the thickness D, so that the xz=xy = is equal to the thickness D is equal to the thickness of the other pin 2.
With reference to fig. 6-8, it can be understood that when d1 > |d/cos α|, when the plurality of pins 100 are stacked, the first sections 1 of the two adjacent pins 100 correspondingly contact, and the middle sections 2 of the two adjacent pins 100 can be spaced apart, which is also beneficial to realizing balanced stress of the pins 100.
Alternatively, the bending angle α may be 135 °, but not limited thereto, and for example, the bending angle α may be 120 °, 140 °, or the like.
In some embodiments, as shown in fig. 6, the bending included angle between the middle section 2 and the second section 3 is beta, and beta is an obtuse angle, that is, 90 ° < beta < 180 °, so as to facilitate stacking packaging of the plurality of pins 100, and facilitate saving of occupied space when the plurality of pins 100 are packaged in units. The middle section 2 is an equal-thickness section, the thickness of the middle section 2 is D, the thickness of any position on the middle section 2 can be D, the second section 3 comprises a second main body section 31 with equal thickness, the thickness of the second main body section 31 is D2, and the thickness of any position on the second main body section 31 can be D2. Wherein D2 is not less than |D/cos beta|. Therefore, when the pins 100 are stacked, the displacement of the second section 3 of the two adjacent pins 100 in the length direction of the pins 100 is 0, which is favorable for realizing the regular guarantee of the pins 100, saving the occupied space of unit package and further promoting the quantity of the pins 100 of the unit package.
It will be appreciated that when d2+|d/cos β|, the thickness D of the intermediate section 2 may be less than the thickness D2 of the second body section 31, but is not limited thereto; for example, if the second section 3 further includes other portions (e.g., a second connecting section 32 described later), the thickness of the intermediate section 2 may be smaller than the thickness of the other portions of the second section 3 other than the second main body section 31, and the thickness D of the intermediate section 2 may be smaller than, equal to, or greater than the thickness D2 of the second main body section 31.
In connection with fig. 6-8, it can be understood that when d2= |d/cos β| is performed on the longitudinal section of the pin 100, where the point X is located on the surface of one side of the thickness of the middle section 2, the points Y and Z are both located on the surface of the other side of the thickness of the middle section 2, XY is parallel to the thickness direction of the middle section 2, XZ is parallel to the thickness direction of the second body section 31, the angle ZYX is complementary to the bending angle β, i.e. the angle zyx+β=180°, and is equal to the thickness D of the middle section 2, so xz=xy/cos = |zyx, i.e. xz= |d/cos β| is equal to D2, i.e. the dimension of the middle section 2 in the thickness direction of the second section 3 is equal to the thickness of the second section 3, so that when a plurality of pins 100 are stacked, the second section 3 and the middle section 2 of two adjacent pins 100 can be in contact with each other, i.e. the angle zyx+β=180 °, and thus the angle zyx=x/X, i.e. XZ = is equal to the thickness D2 of one of the other pins 100 and the other pin 100 is prevented from being deformed by the other pins.
With reference to fig. 6-8, it can be understood that when d2 > |d/cos β|, when the plurality of pins 100 are stacked, the second sections 3 of the two adjacent pins 100 correspondingly contact, and the middle sections 2 of the two adjacent pins 100 can be spaced apart, which is also beneficial to realizing balanced stress of the pins 100.
Alternatively, the bending angle β may be 135 °, but not limited thereto, and for example, the bending angle β may be 120 °, 140 °, or the like.
For example, in the examples of fig. 5 and 6, the bending angle between the middle section 2 and the first section 1 is α, the bending angle between the middle section 2 and the second section 3 is β, and α and β are both obtuse angles, that is, 90 ° < α < 180 °, 90 ° < β < 180 °, so as to facilitate stacking packaging of the plurality of pins 100, and further facilitate avoiding a larger displacement between two adjacent pins 100 in the length direction of the pins 100, so that the occupied space of two adjacent pins 100 in the length direction of the pins 100 is larger, and facilitate saving the occupied space when the plurality of pins 100 perform unit packaging. The middle section 2 is an equal-thickness section and the thickness of the middle section 2 is D, the first section 1 comprises an equal-thickness first main body section 11, the thickness of the first main body section 11 is D1, the second section 3 comprises an equal-thickness second main body section 31, and the thickness of the second main body section 31 is D2. Wherein D1 is not less than |D/cos alpha|, and D2 is not less than|D/cos beta|.
In some embodiments, as shown in fig. 6, the first section 1and the second section 3 are disposed in parallel, and then, in a longitudinal section of the pin 100, a thickness center line of the first section 1 may be parallel to a thickness center line of the second section 3, so that when the middle section 2 is formed as a straight section, a bending angle α between the middle section 2 and the first section 1 may be equal to a bending angle β between the middle section 2 and the second section 3; the first section 1 comprises a first main body section 11 with equal thickness, the thickness of the first main body section 11 is D1, the thickness of any position on the first main body section 11 can be D1, the second section 3 comprises a second main body section 31 with equal thickness, the thickness of the second main body section 31 is D2, and the thickness of any position on the second main body section 31 can be D2. Wherein d1=d2.
Therefore, the structure of the pin 100 is convenient to simplify, the processing procedure of the pin 100 is simplified, the processing efficiency is improved, and meanwhile, when a plurality of pins 100 are packaged, the first section 1 and the second section 3 of the two adjacent pins 100 are convenient to be respectively contacted and arranged, namely, the first section 1 of one of the two adjacent pins 100 is contacted with the first section 1 of the other pin, and the second section 3 of one of the two adjacent pins 100 is contacted with the second section 3 of the other pin, so that the stress between the two adjacent pins 100 is balanced, the pins 100 are prevented from generating larger packaging deformation, and the use reliability of the pins 100 is ensured. Therein, it will be appreciated that in some embodiments, the intermediate sections 2 of adjacent two pins 100 may be disposed in contact; in other embodiments, the intermediate sections 2 of adjacent two pins 100 may be spaced apart.
For example, in the example of fig. 6, the intermediate section 2, the first section 1 and the second section 3 are respectively formed as straight sections, the bending angle between the intermediate section 2 and the first section 1 is α, the bending angle between the intermediate section 2 and the second section 3 is β, α and β are both formed as obtuse angles, and α=β, that is, 90 ° < α=β < 180 °, the intermediate section 2 is an equal thickness section and the thickness of the intermediate section 2 is D, the first section 1 includes the equal thickness first body section 11, the thickness of the first body section 11 is D1, the second section 3 includes the equal thickness second body section 31, and the thickness of the second body section 31 is D2. Wherein d1=d2 is not less than |d/cos α|, and D < D1.
In some embodiments, as shown in fig. 2,4 and 6, at least one of the first section 1 and the second section 3 includes a body section 100b of equal thickness and a connecting section 100c of equal thickness, the connecting section 100c being connected between the body section 100b and the intermediate section 2, the connecting section 100c having a thickness less than the thickness of the body section 100b, the intermediate section 2 also having a thickness less than the thickness of the body section 100 b. Thus, the following may be included: 1. the first section 1 comprises a body section 100b of equal thickness and a connecting section 100c of equal thickness; 2. the second section 3 comprises a body section 100b of equal thickness and a connecting section 100c of equal thickness; 3. the first section 1 comprises a body section 100b of equal thickness and a connecting section 100c of equal thickness, and the second section 3 also comprises a body section 100b of equal thickness and a connecting section 100c of equal thickness.
Here, "the body section 100b having an equal thickness" may mean that the body section 100b itself has an equal thickness structure, and "the connecting section 100c having an equal thickness" may mean that the connecting section 100c itself has an equal thickness structure.
For example, when the first segment 1 includes the main body segment 100b with the same thickness and the connecting segment 100c with the same thickness, the connecting segment 100c is connected between the main body segment 100b and the middle segment 2, the thickness of the connecting segment 100c is smaller than that of the main body segment 100b, and the thickness of the middle segment 2 is also smaller than that of the main body segment 100b, so that in the processing process of the pin 100, the thinning process and the bending process can be performed first, so that the processing is facilitated, and meanwhile in the bending process, since the length of the thinned portion (which can correspond to the connecting segment 100c and the middle segment 2) is longer, the requirement of the folding accuracy can be reduced, so that the pin 100 can be bent.
When the second section 3 includes the main body section 100b with equal thickness and the connecting section 100c with equal thickness, the connecting section 100c is connected between the main body section 100b and the middle section 2, the thickness of the connecting section 100c is smaller than that of the main body section 100b, and the thickness of the middle section 2 is also smaller than that of the main body section 100b, so that in the processing process of the pin 100, thinning processing can be performed first and bending processing can be performed again, so that processing is convenient, and meanwhile in the bending process, because the length of the thinned portion (which can correspond to the connecting section 100c and the middle section 2) is longer, the requirement on the folding precision can be reduced, so that the pin 100 can be bent.
When the first segment 1 includes the equal-thickness main body segment 100b and the equal-thickness connecting segment 100c, and the second segment 3 includes the equal-thickness main body segment 100b and the equal-thickness connecting segment 100c, as shown in fig. 2, 4, and 6, the connecting segment 100c of the first segment 1 is connected between the main body segment 100b of the first segment 1 and the intermediate segment 2, the thickness of the connecting segment 100c of the first segment 1 is smaller than the thickness of the main body segment 100b of the first segment 1, the thickness of the intermediate segment 2 is also smaller than the thickness of the main body segment 100b of the first segment 1, and the connecting segment 100c of the second segment 3 is connected between the main body segment 100b of the second segment 3 and the intermediate segment 2, and the thickness of the connecting segment 100c of the second segment 3 is smaller than the thickness of the main body segment 100b of the second segment 3, and the thickness of the intermediate segment 2 is also smaller than the thickness of the main body segment 100b of the second segment 3. Therefore, in the processing process of the pin 100, thinning treatment and bending treatment can be performed first, and meanwhile, in the bending process, the length of the thinned part (which can correspond to the connecting section 100c of the first section 1, the connecting section 100c of the second section 3 and the middle section 2) is longer, so that the requirement on folding accuracy can be effectively reduced.
For example, as shown in fig. 6, the thickness of the connection section 100c is equal to the thickness of the intermediate section 2, so that the structure of the pin 100 is simplified, and further, the thinning process of the pin 100 during the processing is facilitated. For example, when the first segment 1 includes the body segment 100b and the connecting segment 100c of equal thickness, the thickness of the connecting segment 100c of the first segment 1 may be equal to the thickness of the intermediate segment 2; when the second section 3 includes the body section 100b of equal thickness and the connecting section 100c of equal thickness, the thickness of the connecting section 100c of the second section 3 may be equal to the thickness of the intermediate section 2; when the first segment 1 includes the equal-thickness main body segment 100b and the equal-thickness connecting segment 100c, and the second segment 3 includes the equal-thickness main body segment 100b and the equal-thickness connecting segment 100c, at least one of the connecting segment 100c of the first segment 1 and the connecting segment 100c of the second segment 3 is equal to the thickness of the intermediate segment 2.
Of course, the thickness of the connecting section 100c and the thickness of the middle section 2 may be unequal, which is beneficial to realizing the structural diversity design of the pin 100.
Optionally, in the examples of fig. 5 and 6, the two side surfaces of the thickness of the connection section 100c are flush with the two side surfaces of the thickness of the middle section 2, that is, in the thickness direction (for example, the PP' direction in fig. 5) of the pin 100, the two side surfaces of the thickness of the connection section 100c are flush with the two side surfaces of the thickness of the middle section 2, so that the one side surface of the thickness of the connection section 100c and the one side surface of the thickness of the middle section 2 may be in the same plane, and the other side surface of the thickness of the connection section 100c and the other side surface of the thickness of the middle section 2 may be in the same plane, thereby being beneficial to ensuring the connection reliability between the connection section 100c and the middle section 2, and further facilitating the thinning process of the pin 100 during the processing, and facilitating the simplification of the processing procedure.
In some embodiments, as shown in fig. 6, the surface on the thickness side of the main body section 100b is flush with the surface on the thickness side of the connecting section 100c, so that during the processing of the pin 100, the thinning treatment may be performed on the thickness side of the first section 1 and/or the thickness side of the second section 3, and the thinning treatment may not be performed on the two thickness sides of the pin 100, thereby simplifying the processing procedure of the pin 100.
For example, when the first segment 1 includes the equal-thickness main body segment 100b and the equal-thickness connection segment 100c, the thickness-side surface of the main body segment 100b is flush with the thickness-side surface of the connection segment 100c, the thickness-side surface of the main body segment 100b and the thickness-side surface of the connection segment 100c may smoothly transition, for example, the thickness-side surface of the first segment 1 may be formed in a planar structure; when the second segment 3 includes the equal-thickness main body segment 100b and the equal-thickness connection segment 100c, the thickness-side surface of the main body segment 100b is flush with the thickness-side surface of the connection segment 100c, the thickness-side surface of the main body segment 100b and the thickness-side surface of the connection segment 100c may smoothly transition, for example, the thickness-side surface of the second segment 3 may be formed in a planar structure; when the first segment 1 includes the equal-thickness main body segment 100b and the equal-thickness connecting segment 100c, and the second segment 3 includes the equal-thickness main body segment 100b and the equal-thickness connecting segment 100c, the thickness-side surface of the main body segment 100b of the first segment 1 is flush with the thickness-side surface of the connecting segment 100c of the first segment 1, and the thickness-side surface of the main body segment 100b of the second segment 3 is flush with the thickness-side surface of the connecting segment 100c of the second segment 3.
Of course, the thickness side surface of the main body section 100b and the thickness side surface of the connecting section 100c may also be disposed non-flush.
As shown in fig. 2, 4 and 6, the first segment 1 includes a main body segment 100b and a connection segment 100c, the main body segment 100b of the first segment 1 is a first main body segment 11, the connection segment 100c of the first segment 1 is a first connection segment 12, the second segment 3 also includes a main body segment 100b and a connection segment 100c, the main body segment 100b of the second segment 3 is a second main body segment 31, the connection segment 100c of the second segment 3 is a second connection segment 32, two sides of the thickness of the pin 100 are a first side 10a and a second side 10b, respectively, the first main body segment 11 is flush with the first connection segment 12 at the first side 10a, and the second main body segment 31 is flush with the second connection segment 32 at the second side 10 b.
For example, in the examples of fig. 5 and 6, the thickness of the lead 100 is respectively on both sides of the upper side and the lower side, the first body section 11 is flush with the first connection section 12 on the upper side, the lower surface of the thickness of the first connection section 12 is located above the lower surface of the thickness of the first body section 11, the second body section 31 is flush with the second connection section 32 on the lower side, and the upper surface of the thickness of the second connection section 32 is located below the upper surface of the thickness of the second body section 31. Thus, during the processing, the thinning process for forming the first connection section 12 and the thinning process for forming the second connection section 32 can be performed on both sides of the thickness of the lead 100, which is beneficial to ensuring the structural strength and structural stability of the lead 100.
Of course, it is also possible that the first body section 11 is flush with the first connection section 12 at the first side 10a and the second body section 31 is flush with the second connection section 32 at the first side 10 a; or the first body section 11 is flush with the first connection section 12 on the second side 10b and the second body section 31 is flush with the second connection section 32 on the second side 10 b.
A pin assembly 200 according to an embodiment of the second aspect of the present invention is described below with reference to the accompanying drawings.
As shown in fig. 9, the lead assembly 200 may include a plurality of leads 100, and the plurality of leads 100 may be arranged at intervals along a predetermined direction (e.g., QQ' direction in fig. 9) perpendicular to a length direction of the leads 100 and a thickness direction of the leads 100. The pin 100 is the pin 100 of the intelligent power module 300 according to the first embodiment of the present invention.
As shown in fig. 9, a plurality of pins 100 are connected by connection ribs 101 so that the plurality of pins 100 can be formed as one body, facilitating the movement, packaging, installation, etc. of the entire pin assembly 200.
According to the pin assembly 200 provided by the embodiment of the invention, the above-mentioned pins 100 are adopted, so that a larger number of unit packages can be realized, the number of the pins 100 to be fed is not limited greatly, and special operators are not required to be arranged at a pin welding station for pin feeding, so that the cost is saved.
In some embodiments, as shown in fig. 9 and 12, the length of the second section 3 is greater than the length of the first section 1, and when the pin assembly 200 is referenced to the smart power module 300, the first section 1 of the pin 100 may be connected to a circuit substrate of the smart power module 300, and the second section 3 of the pin 100 may be connected to other electrical components, such as an MCU, or a motor, or a compressor, etc., to facilitate connection of the pin 100.
The connecting rib 101 is connected to the second section 3 of the plurality of pins 100, the connecting rib 101 comprises a first connecting rib 1011 and a second connecting rib 1012, the first connecting rib 1011 is connected to one end, close to the middle section 2, of the second section 3, the second connecting rib 1012 is connected to one end, far away from the middle section 2, of the second section 3, then the first connecting rib 1011 and the second connecting rib 1012 can both extend along the preset direction, the first connecting rib 1011 and the second connecting rib 1012 can be arranged at intervals along the length direction of the second section 3, the plurality of pins 100 are connected through the first connecting rib 1011, and the plurality of pins 100 are connected through the second connecting rib 1012. Thus, the structural stability of the pin assembly 200 is facilitated to be improved, and the packaging, the installation and the like of the pin assembly 200 are facilitated.
Alternatively, the connection rib 101 may be integrally formed with the plurality of pins 100, and then the pin assembly 200 may be formed as an integral piece, so as to improve the processing efficiency and realize mass production.
In some embodiments, as shown in fig. 9, the length of the second section 3 is greater than that of the first section 1, the connection rib 101 is connected to the second section 3 of the plurality of pins 100, and the connection rib 101 includes a second connection rib 1012, the plurality of pins 100 may be connected through the second connection rib 1012, the second connection rib 1012 may extend along a preset direction, the second connection rib 1012 is connected to one end of the second section 3 far away from the middle section 2, and a plurality of positioning holes 1012a are formed in the second connection rib 1012, and the positioning holes 1012a are suitable for positioning and matching with positioning pins of a packaging mold, so that when the pin assembly 200 is applied to the intelligent power module 300, the positioning holes 1012a may be positioned and matched with positioning pins of the packaging module in the packaging process of the intelligent power module 300, thereby facilitating positioning of the intelligent power module 300 and improving packaging efficiency.
Wherein, the positioning hole 1012a may be formed as a through hole, and the positioning hole 1012a may penetrate the second connection rib 1012 in the thickness direction of the second connection rib 1012.
A method of processing the pin assembly 200 according to an embodiment of the third aspect of the present invention is described below with reference to the accompanying drawings.
As shown in fig. 10 and 11, the lead assembly 200 is the lead assembly 200 according to the second aspect of the present invention, and the method for manufacturing the lead assembly 200 may include the steps of: the sheet metal is thinned so that the sheet metal includes a thin plate portion and first and second thick plate portions located on both sides of the thin plate portion in the first direction, and both ends of the thin plate portion in the first direction are respectively bent.
For example, after the metal plate is thinned, the metal plate may include a thin plate portion, a first thick plate portion, and a second thick plate portion, which may be located on both sides of the thin plate portion in the first direction, and both ends of the thin plate portion in the first direction may be bent, respectively. The thin plate portion may correspond to at least the middle section 2 after the processing of the lead assembly 100 is completed, the first thick plate portion may correspond to at least a portion of the first section 1 after the processing of the lead assembly 100 is completed, the second thick plate portion may correspond to at least a portion of the second section 3 after the processing of the lead assembly 100 is completed, and two bent portions 100a after bending both end portions of the thin plate portion may respectively correspond to the two bent portions after the processing of the lead assembly is completed, wherein the first direction may be a length direction of the lead 100 after the processing of the lead assembly 200 is completed.
According to the processing method of the pin assembly 200, the processing procedure is simple, the production cost is low, the operation is convenient, and the pin assembly 200 is favorable for adopting a plurality of unit packages.
For example, when the thin plate portion corresponds to the intermediate section 2 after the machining of the pin assembly 100 is completed, the first thick plate portion may correspond to the first section 1 after the machining of the pin assembly 100 is completed, and the second thick plate portion may correspond to the second section 3 after the machining of the pin assembly 100 is completed. When at least one of the first and second sections 1 and 3 includes the body section 100b and the connection section 100c having the same thickness, the thin plate portion corresponds to the intermediate section 2 and the connection section 100c after the completion of the processing of the lead assembly 100, and at this time, if the first section 1 includes the body section 100b and the connection section 100c, the first thick plate portion may correspond to the body section 100b of the first section 1 after the completion of the processing of the lead assembly 100, and the second thick plate portion may correspond to the second section 3 after the completion of the processing of the lead assembly 100; if the second section 3 includes a body section 100b and a connection section 100c, the second thick plate portion may correspond to the body section 100b of the second section 3 after the machining of the pin assembly 100 is completed, and the first thick plate portion may correspond to the first section 1 after the machining of the pin assembly 100 is completed; if the first segment 1 includes a body segment 100b and a connection segment 100c, and the second segment 3 includes a body segment 100b and a connection segment 100c, the thin plate portion corresponds to the intermediate segment 2 after the completion of the processing of the lead assembly 100, the connection segment 100c of the first segment 1, and the connection segment 100c of the second segment 3, the first thick plate portion may correspond to the body segment 100b of the first segment 1 after the completion of the processing of the lead assembly 100, and the second thick plate portion may correspond to the body segment 100b of the second segment 3 after the completion of the processing of the lead assembly 100.
Optionally, the thinning treatment can adopt an acid and other corrosive solutions for corrosion treatment to realize thinning; but is not limited thereto.
Optionally, when the two end parts of the thin plate part are bent, a stamping mode can be adopted, so that a bending included angle can be a sinking angle formed by stamping; but is not limited thereto.
Alternatively, the metal plate may be a copper plate (or copper strip), the thickness of which is typically between 200 μm and 1000 μm.
As shown in fig. 10 and 11, the processing method of the lead assembly 200 further includes the steps of: the metal plate is die cut to form the pin assembly 200.
For example, in the example of fig. 10, after bending the thin plate portion, the pin assembly 200 is punched out of the metal plate, that is, the processing method of the pin assembly 200 may include the steps of: the metal plate is subjected to a thinning process such that the metal plate includes a thin plate portion and first and second thick plate portions respectively located on both sides of the thin plate portion in the first direction, both ends of the thin plate portion in the first direction are respectively bent, and then the metal plate is die-cut to form the lead assembly 200. At this time, "punching out the metal plate to punch out the pin assembly 200" may be understood as punching out the metal plate subjected to the thinning process and the bending process to punch out the pin assembly 200.
For another example, in the example of fig. 11, prior to the thinning of the metal plate, the pin assembly 200 is die cut from the metal plate, i.e., the method of processing the pin assembly 200 may include the steps of: the lead assembly 200 is punched out of a metal plate, and then the metal plate is subjected to a thinning process such that the metal plate includes a thin plate portion and first and second thick plate portions respectively located on both sides of the thin plate portion in the first direction, and both ends of the thin plate portion in the first direction are respectively bent. At this time, the "punching out the metal plate of the lead assembly 200" punches out the outer contour of the lead assembly 200 in the thickness direction from the prepared metal plate, and the punched structure is not the finished lead assembly 200, but the lead assembly 200 can be formed by the subsequent thinning process and bending process.
The smart power module 300 according to the fourth aspect of the present invention includes the pin assembly 200, and the pin assembly 200 is the pin assembly 200 according to the above-described second aspect of the present invention.
For example, in the examples of fig. 12 and 13, the smart power module 300 may further include a circuit substrate 201 and components 202, the components 202 may be disposed on the circuit substrate 201, the corresponding components 202 may be connected by metal wires, and the pin assembly 200 may be connected to the circuit substrate 201. The components 202 may include power devices and control devices, among other things.
When the intelligent power module 300 needs to be packaged, the intelligent power module can be packaged by a packaging mold, such as injection molding packaging; the packaged intelligent power module 300 may be mostly located in a package 301, such as a thermoplastic resin, for example, the circuit substrate 201, the component 202, the metal wires, etc. are sealed in the package 301, and a part of the pins 100 is sealed in the package 301, and another part extends out of the package 301 to be connected with other components.
According to the intelligent power module 300 provided by the embodiment of the invention, the pin assembly 200 is adopted, so that the use reliability is ensured, the packaging defect of the intelligent power module 300 is removed, and the packaging yield is improved.
Other configurations and operations of the intelligent power module 300 according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "length", "thickness", "upper", "lower", "vertical", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims (13)

1. The pin of the intelligent power module is characterized by comprising two bending parts, wherein the two bending parts divide the pin into a first section, a middle section and a second section which are sequentially arranged along the length direction of the pin, the middle section is positioned between the two bending parts, the first section and the second section are respectively positioned at one sides of the two bending parts far away from the middle section, and the thickness of the middle section is smaller than that of at least part of the first section and that of at least part of the second section;
The bending included angle between the middle section and the first section is alpha, 90 degrees is less than alpha and less than 180 degrees, the middle section is an equal-thickness section and has a thickness D, the first section comprises an equal-thickness first main body section, the thickness of the first main body section is D1, wherein D1 is equal to a first preset absolute value, and the first preset absolute value is the absolute value of the ratio of D to the cosine of the bending included angle alpha;
the included angle of bending between the middle section and the second section is beta, 90 degrees is less than beta and less than 180 degrees, the middle section is a constant-thickness section and has a thickness D, the second section comprises a second main body section with constant thickness, the thickness of the second main body section is D2, wherein D2 is equal to a second preset absolute value, and the second preset absolute value is the absolute value of the ratio of D to the cosine of the included angle beta of bending.
2. The pin of claim 1, wherein the first segment is disposed parallel to the second segment, the first segment comprises a first body segment of equal thickness, the first body segment has a thickness D1, the second segment comprises a second body segment of equal thickness, the second body segment has a thickness D2, wherein d1=d2.
3. The pin of claim 1, wherein at least one of the first section and the second section comprises a body section of equal thickness and a connecting section of equal thickness, the connecting section being connected between the body section and the intermediate section, the connecting section having a thickness less than the thickness of the body section, the intermediate section also having a thickness less than the thickness of the body section.
4. A pin of a smart power module as claimed in claim 3, wherein the thickness of the connection section is equal to the thickness of the intermediate section.
5.The pin of claim 4, wherein the thickness-side surfaces of the connection section are flush with the thickness-side surfaces of the middle section.
6. A pin for a smart power module as claimed in claim 3, wherein the thickness side surface of the main body section is flush with the thickness side surface of the connection section.
7. The pin of claim 3, wherein the first segment comprises the main body segment and the connection segment, the main body segment of the first segment is a first main body segment, the connection segment of the first segment is a first connection segment, the second segment also comprises the main body segment and the connection segment, the main body segment of the second segment is a second main body segment, the connection segment of the second segment is a second connection segment, the two sides of the thickness of the pin are a first side and a second side respectively, the first main body segment is flush with the first connection segment on the first side, and the second main body segment is flush with the second connection segment on the second side.
8. A pin assembly comprising the intelligent power module according to any one of claims 1 to 7, wherein the pins are arranged in a plurality of spaced apart manner along a predetermined direction, the predetermined direction is perpendicular to a length direction of the pins and a thickness direction of the pins, and the pins are connected by connecting ribs.
9. The pin assembly of claim 8 wherein said second section has a length greater than a length of said first section, said connector bars being connected to said second sections of a plurality of said pins, said connector bars including a first connector bar connected to an end of said second section adjacent said intermediate section and a second connector bar connected to an end of said second section remote from said intermediate section.
10. The pin assembly of claim 8, wherein the length of the second section is greater than the length of the first section, the connecting rib is connected to the second sections of the plurality of pins, and the connecting rib comprises a second connecting rib connected to one end of the second section far from the middle section, and a plurality of positioning holes are formed in the second connecting rib and are suitable for being matched with positioning pins of the packaging mold in a positioning mode.
11. A method of manufacturing a pin assembly according to claim 9 or 10, comprising the steps of:
The sheet metal is thinned so that the sheet metal includes a thin plate portion and first and second thick plate portions that are located on both sides of the thin plate portion in a first direction, and both ends of the thin plate portion in the first direction are respectively bent.
12. The method of manufacturing a lead assembly according to claim 11, wherein before the sheet metal is thinned or after the sheet metal is bent, further comprising the steps of:
Punching the metal plate to obtain the pin assembly.
13. A smart power module comprising a pin assembly according to claim 9 or 10.
CN201911005500.3A 2019-10-22 2019-10-22 Pin of intelligent power module, pin assembly, processing method and intelligent power module Active CN110620099B (en)

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