CN110620099A - Pin and pin assembly of intelligent power module, processing method and intelligent power module - Google Patents

Pin and pin assembly of intelligent power module, processing method and intelligent power module Download PDF

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Publication number
CN110620099A
CN110620099A CN201911005500.3A CN201911005500A CN110620099A CN 110620099 A CN110620099 A CN 110620099A CN 201911005500 A CN201911005500 A CN 201911005500A CN 110620099 A CN110620099 A CN 110620099A
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China
Prior art keywords
section
segment
thickness
pin
connection
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Granted
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CN201911005500.3A
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Chinese (zh)
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CN110620099B (en
Inventor
李媛媛
冯宇翔
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Midea Group Co Ltd
GD Midea Air Conditioning Equipment Co Ltd
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Midea Group Co Ltd
Guangdong Midea Refrigeration Equipment Co Ltd
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Priority to CN201911005500.3A priority Critical patent/CN110620099B/en
Publication of CN110620099A publication Critical patent/CN110620099A/en
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Publication of CN110620099B publication Critical patent/CN110620099B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H01L21/4896—Mechanical treatment, e.g. cutting, bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The invention discloses a pin and a pin assembly of an intelligent power module, a processing method of the pin and the intelligent power module. According to the pins of the intelligent power module, a large number of unit packages can be realized, the packaging efficiency is improved, and the loading is convenient.

Description

Pin and pin assembly of intelligent power module, processing method and intelligent power module
Technical Field
The invention relates to the technical field of electronic devices, in particular to a pin and a pin assembly of an intelligent power module, a processing method of the pin and the pin assembly, and the intelligent power module.
Background
The intelligent power module is a power driving product combining power electronics and integrated circuit technology, can integrate a power switch device and a high-voltage driving circuit together, and is provided with a fault detection circuit for overvoltage, overcurrent, overheat and the like. The intelligent power module can receive a control signal of the MCU (micro control unit) on one hand to drive a subsequent circuit to work, and send a state detection signal of the system back to the MCU on the other hand.
In the correlation technique, the pin in the intelligent power module can only adopt the little packing mode of less quantity, and the quantity of pin in the unit packing is less promptly for the packing is loaded down with trivial details, simultaneously in the course of working, because unit packing quantity receives the restriction, makes material loading quantity receive the restriction, need arrange special operating personnel at pin welding station and carry out the material loading.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the pin of the intelligent power module, and the pin can realize unit packaging with a large number, improves packaging efficiency and is convenient to feed.
The invention also provides a pin assembly with the pin.
The invention further provides a processing method of the pin assembly.
The invention also provides an intelligent power module with the pin assembly.
According to the pin of the intelligent power module in the first aspect of the invention, the pin comprises two bent parts, the two bent parts divide the pin into a first section, an intermediate section and a second section which are sequentially arranged along the length direction of the pin, the intermediate section is located between the two bent parts, the first section and the second section are respectively located on one sides of the two bent parts far away from the intermediate section, and the thickness of the intermediate section is smaller than at least part of the thickness of the first section and smaller than at least part of the thickness of the second section.
According to the pins of the intelligent power module, when a plurality of pins are overlapped in the packaging process, the displacement of two adjacent pins in the length direction of the pins is favorably reduced, so that the packaging occupied space of the pins is saved, the unit packaging of a large number of pins is facilitated, the feeding quantity is not limited too much, special operators are not required to be arranged at the pin welding station for feeding, and the labor cost is saved; meanwhile, under the condition that the displacement generated in the length direction of the pins is 0 after the plurality of pins are overlapped, the packaging deformation of the pins is favorably reduced, and the use reliability of the pins is conveniently ensured.
In some embodiments, a bending included angle between the middle section and the first section is α, 90 ° < α < 180 °, the middle section is an equal-thickness section and has a thickness D, the first section includes a first main body section having an equal thickness, the thickness of the first main body section is D1, wherein D1 is greater than or equal to a first preset absolute value, and the first preset absolute value is an absolute value of a ratio of D to a cosine of the bending included angle α.
In some embodiments, a bending included angle between the middle section and the second section is β, β is greater than 90 ° < β < 180 °, the middle section is a constant-thickness section and has a thickness D, the second section includes a second main body section having a constant thickness, the thickness of the second main body section is D2, wherein D2 is greater than or equal to a second preset absolute value, and the second preset absolute value is an absolute value of a ratio of D to a cosine of the bending included angle β.
In some embodiments, the first segment is disposed in parallel with the second segment, the first segment comprising a first body segment of uniform thickness D1, the second segment comprising a second body segment of uniform thickness D2, wherein D1 is D2.
In some embodiments, at least one of the first segment and the second segment comprises a body segment of uniform thickness and a connecting segment of uniform thickness connected between the body segment and the intermediate segment, the connecting segment having a thickness less than a thickness of the body segment and the intermediate segment also having a thickness less than a thickness of the body segment.
In some embodiments, the thickness of the connecting section is equal to the thickness of the intermediate section.
In some embodiments, the thickness side surfaces of the connecting section are flush with the thickness side surfaces of the middle section.
In some embodiments, a thickness-side surface of the main body segment is flush with a thickness-side surface of the connecting segment.
In some embodiments, the first segment includes the main body segment and the connection segment, the main body segment of the first segment is a first main body segment, the connection segment of the first segment is a first connection segment, the second segment also includes the main body segment and the connection segment, the main body segment of the second segment is a second main body segment, the connection segment of the second segment is a second connection segment, the two sides of the thickness of the pin are respectively a first side and a second side, the first main body segment is flush with the first connection segment on the first side, and the second main body segment is flush with the second connection segment on the second side.
The pin assembly according to a second aspect of the present invention includes the pins of the intelligent power module according to the first aspect of the present invention, the pins are arranged at intervals along a preset direction, the preset direction is perpendicular to the length direction of the pins and the thickness direction of the pins, and the pins are connected through a connecting rib.
According to the pin assembly, the pins are adopted, so that the unit packaging with a large number of pins is facilitated, the number of the pins to be loaded is not greatly limited, and a special operator does not need to be arranged at the pin welding station to load the pins, so that the cost is saved.
In some embodiments, the length of the second section is greater than the length of the first section, the connection rib is connected at a plurality of the second sections of the pins, the connection rib comprises a first connection rib and a second connection rib, the first connection rib is connected at one end of the second section close to the middle section, and the second connection rib is connected at one end of the second section far away from the middle section.
In some embodiments, the length of the second section is greater than that of the first section, the connecting rib is connected to the second sections of the plurality of pins, the connecting rib includes a second connecting rib, the second connecting rib is connected to one end of the second section, which is far away from the middle section, and a plurality of positioning holes are formed in the second connecting rib, and the positioning holes are suitable for being in positioning fit with positioning pins of a packaging mold.
According to a third aspect of the present invention, there is provided a method for processing a lead frame assembly according to the second aspect of the present invention, the method comprising the steps of: a metal plate is thinned so as to include a thin plate portion and a first thick plate portion and a second thick plate portion which are located on both sides of the thin plate portion in a first direction, and both end portions of the thin plate portion in the first direction are bent.
According to the processing method of the pin assembly, the processing procedure is simple, and the pin assembly is favorably packaged by a large number of units.
In some embodiments, before the metal plate is thinned or after the thin plate portion is bent, the method further includes: and punching the metal plate to form the pin assembly.
A smart power module according to a fourth aspect of the invention comprises a pin assembly according to the above-mentioned second aspect of the invention.
According to the intelligent power module, the pin assembly is adopted, so that the use reliability is ensured.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a schematic diagram of a pin of a smart power module according to one embodiment of the invention;
FIG. 2 is an enlarged view of portion A circled in FIG. 1;
FIG. 3 is another schematic diagram of the pin shown in FIG. 1;
FIG. 4 is an enlarged view of portion B circled in FIG. 3;
FIG. 5 is yet another schematic illustration of the pin shown in FIG. 1;
FIG. 6 is an enlarged view of the circled portion C of FIG. 5;
fig. 7 is a schematic packaging diagram of a pin and packaging cartridge according to one embodiment of the invention;
FIG. 8 is an enlarged view of portion D circled in FIG. 7;
fig. 9 is a schematic diagram of a pin assembly according to one embodiment of the invention;
fig. 10 is a schematic flow chart diagram of a method of manufacturing a pin assembly according to one embodiment of the invention;
fig. 11 is a schematic flow chart diagram of a method of manufacturing a pin assembly according to another embodiment of the invention;
FIG. 12 is a schematic diagram of a smart power module, according to one embodiment of the invention;
fig. 13 is a schematic diagram of the package of the smart power module shown in fig. 12.
Reference numerals:
smart power module 300, package 301,
A circuit board 201, a component 202,
A pin component 200, a connecting rib 101,
A first connecting rib 1011, a second connecting rib 1012, a positioning hole 1012a,
A lead 100, a bend 100a, a main body section 100b, a connection section 100c,
A first side 10a, a second side 10b,
A first section 1, a first main body section 11, a first connecting section 12,
An intermediate section 2,
A second section 3, a second body section 31, a second connecting section 32.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the applicability of other processes and/or the use of other materials.
The pin 100 of the smart power module 300 according to an embodiment of the invention is described below with reference to the drawings.
As shown in fig. 1, 3 and 5, the lead 100 may include two bends 100a, the two bends 100a may be disposed at intervals along a length direction (e.g., an OO' direction in fig. 1) of the lead 100, the two bends 100a separate the lead 100 into a first section 1, an intermediate section 2 and a second section 3, which are sequentially disposed along the length direction of the lead 100, that is, the two bends 100a separate the lead 100 into the first section 1, the intermediate section 2 and the second section 3, and the first section 1, the intermediate section 2 and the second section 3 are sequentially disposed along the length direction of the lead 100; the middle section 2 is located between two bending parts 100a, the two bending parts 100a are respectively arranged at two ends of the length of the middle section 2, the first section 1 and the second section 3 are respectively located at one side of the two bending parts 100a far away from the middle section 2, one bending part 100a is located between the first section 1 and the middle section 2, and the other bending part 100a is located between the second section 3 and the middle section 2.
In conjunction with fig. 5 and 6, the formation of the "bend 100 a" may be understood that the extending directions of the portions at both sides of the bend 100a are not parallel; for example, the extending direction of the end of the first segment 1 adjacent to the corresponding bend 100a is not parallel to the extending direction of the end of the middle segment 2 adjacent to the corresponding bend 100a, and the extending direction of the end of the second segment 3 adjacent to the corresponding bend 100a is not parallel to the extending direction of the end of the middle segment 2 adjacent to the corresponding bend 100 a.
As shown in fig. 2, 4 and 6, the thickness of the intermediate section 2 is both less than the thickness of at least part of the first section 1 and less than the thickness of at least part of the second section 3, i.e. the thickness of the intermediate section 2 is less than the thickness of at least part of the first section 1 and the thickness of the intermediate section 2 is less than the thickness of at least part of the second section 3, so that the intermediate section 2 is thinner relative to at least part of the thickness of the first section 1 and the intermediate section 2 is thinner relative to at least part of the thickness of the second section 3; when the plurality of pins 100 are packaged, the plurality of pins 100 can be sequentially overlapped along the thickness direction of the first section 1, and the arrangement of the middle section 2 meets the requirements, so that when the plurality of pins 100 are overlapped, the displacement of two adjacent pins 100 in the length direction of the pins 100 is favorably reduced, and the large occupied space of two adjacent pins 100 in the length direction of the pins 100 is avoided, so that the packaging occupied space of the plurality of pins 100 is saved, the unit packaging of a large number of pins 100 is facilitated, the packaging quantity is reduced, and the packaging efficiency is improved; meanwhile, under the condition that the displacement generated in the length direction of the pin 100 after the plurality of pins 100 are stacked is 0, the packaging deformation of the pin 100 is favorably reduced, the normal use of the pin 100 is prevented from being influenced by the large deformation of the pin 100 in the packaging process, and the use reliability of the pin 100 is conveniently ensured.
Wherein the thickness of the middle section 2 is less than the thickness of at least part of the first section 1, it is understood that the thickness of the middle section 2 is less than the thickness of part of the first section 1, in which case the thickness of the middle section 2 may be less than the thickness of any part of the first section 1, or the thickness of the middle section 2 is less than the thickness of the entire first section 1, in which case the thickness of the middle section 2 may be less than the minimum of the thickness of the entire first section 1 if the first section 1 is of non-uniform thickness design; in other words, the thickness of the intermediate section 2 is less than the thickness of at least part of the first section 1, it is also understood that the thickness of the intermediate section 2 may be less than the maximum of the thickness of the entire first section 1, for example, if the first section 1 is of a non-uniform thickness design, a part of the first section 1 has a thickness of 0.3mm, and another part of the second section 3 has a thickness of 0.5mm, then the thickness of the intermediate section 2 may be less than 0.5 mm.
Likewise, the thickness of the intermediate section 2 is less than the thickness of at least part of the second section 3, it being understood that the thickness of the intermediate section 2 is less than the thickness of part of the second section 3, in which case the thickness of the intermediate section 2 may be less than the thickness of any part of the second section 3, or the thickness of the intermediate section 2 may be less than the thickness of the entire second section 3, in which case the thickness of the intermediate section 2 may be less than the minimum of the thickness of the entire second section 3 if the second section 3 is of a non-uniform thickness design; in other words, the thickness of the intermediate section 2 is less than the thickness of at least part of the second section 3, it being understood that the thickness of the intermediate section 2 may be less than the maximum of the thickness of the entire second section 3, for example, if the second section 3 is of a non-uniform thickness design, the thickness of a part of the second section 3 is 0.4mm, and the thickness of another part of the second section 3 is 0.6mm, then the thickness of the intermediate section 2 may be less than 0.6 mm.
According to the pins 100 of the intelligent power module 300, in the packaging process, when the plurality of pins 100 are overlapped, the displacement of two adjacent pins 100 in the length direction of the pins 100 is favorably reduced, so that the packaging occupied space of the plurality of pins 100 is saved, unit packaging of a larger number of pins 100 is facilitated, more pins 100 can be accommodated in a packaging box, the feeding quantity is not limited to be too large, one-time large-scale feeding can be performed, the labor cost is greatly saved, the automation degree is improved, special operators do not need to be arranged at the pin welding station for feeding, and the labor cost is saved; meanwhile, under the condition that the displacement generated in the length direction of the pin 100 after the plurality of pins 100 are stacked needs to be 0, the packaging deformation of the pin 100 is favorably reduced, and the use reliability of the pin 100 is conveniently ensured. .
In some embodiments, as shown in fig. 6, the bending included angle between the middle section 2 and the first section 1 is α, and α is formed as an obtuse angle, i.e. 90 ° < α < 180 °, so as to facilitate the stacked packaging of the plurality of pins 100, which is beneficial to saving the occupied space when the plurality of pins 100 are packaged in a unit. The middle section 2 is an equal-thickness section, and the thickness of the middle section 2 is D, the thickness of any position on the middle section 2 can be D, the first section 1 comprises the first main body section 11 with the equal thickness, the thickness of the first main body section 11 is D1, and the thickness of any position on the first main body section 11 can be D1. Wherein D1 is ≧ D/cos α |. Therefore, when the plurality of pins 100 are stacked, the displacement of the first section 1 of two adjacent pins 100 in the length direction of the pin 100 is 0, which is beneficial to realizing the regular guarantee of the pins 100, saving the occupied space of unit package and further improving the number of the pins 100 of the unit package.
It is understood that when D1 ≧ D/cos α ≧ the thickness D of intermediate section 2 can be less than the thickness D1 of first body section 11, but is not limited thereto; for example, if the first segment 1 further includes other portions (e.g., the first connecting segment 12 described later), the thickness of the intermediate segment 2 may be less than the thickness of the first segment 1 except for the first main segment 11, and the thickness D of the intermediate segment 2 may be less than, equal to, or greater than the thickness D1 of the first main segment 11.
With reference to fig. 6-8, it can be understood that when D1 is | D/cos α |, then Δ XYZ can be made on a longitudinal section of the lead 100, where point X is located on a surface on one side of the thickness of the intermediate segment 2, point Y and point Z are both located on a surface on the other side of the thickness of the intermediate segment 2, XY is parallel to the thickness direction of the intermediate segment 2, and XZ is parallel to the thickness direction of the first body segment 11, then ═ ZYX is complementary to the bending included angle α, i.e., ═ ZYX + α is 180 °, and XY is equal to the thickness D of the intermediate segment 2, so XZ is XY/cos ZYX, i.e., XZ | D/cos α |, then XZ is equal to D1, i.e., the dimension of the intermediate segment 2 in the thickness direction of the first segment 1 is equal to the thickness of the first segment 1, so that when a plurality of leads 100 are stacked, the first segment 1 and the intermediate segment 2 of two adjacent leads 100 can both contact, i.e., the first segment 1 of one of the two adjacent leads 100 contacts the other first segment 1 The middle section 2 of one of the two adjacent pins 100 is in contact with the middle section 2 of the other pin, so that the pins 100 are stressed evenly, and the pins 100 are prevented from generating redundant package deformation.
With reference to fig. 6-8, it can be understood that when D1 > | D/cos α | is formed, when a plurality of leads 100 are stacked, the first segments 1 of two adjacent leads 100 are correspondingly contacted, and the middle segments 2 of two adjacent leads 100 can be spaced apart, which is also beneficial to achieve uniform stress of the leads 100.
Alternatively, the bending angle α may be 135 °, but is not limited thereto, and for example, the bending angle α may also be 120 °, or 140 °, and the like.
In some embodiments, as shown in fig. 6, the bending included angle between the middle section 2 and the second section 3 is β, and β is formed as an obtuse angle, i.e. 90 ° < β < 180 °, so as to facilitate the stacked packaging of the plurality of pins 100, which is beneficial to saving the occupied space when the plurality of pins 100 are packaged in units. The middle section 2 is an equal-thickness section, and the thickness of the middle section 2 is D, the thickness of any position on the middle section 2 can be D, the second section 3 comprises the equal-thickness second main body section 31, the thickness of the second main body section 31 is D2, and the thickness of any position on the second main body section 31 can be D2. Wherein D2 is ≧ D/cos β |. Therefore, when the plurality of pins 100 are stacked, the displacement of the second section 3 of two adjacent pins 100 in the length direction of the pin 100 is 0, which is beneficial to realizing the regular guarantee of the pins 100, saving the occupied space of unit package and further improving the number of the pins 100 of the unit package.
It is understood that when D2 ≧ D/cos β |, the thickness D of intermediate section 2 can be less than the thickness D2 of second body section 31, but is not limited thereto; for example, if the second segment 3 further includes other portions (e.g., a second connecting segment 32 described later), the thickness of the intermediate segment 2 may be less than the thickness of the second segment 3 other than the second body segment 31, in which case the thickness D of the intermediate segment 2 may be less than, equal to, or greater than the thickness D2 of the second body segment 31.
With reference to fig. 6-8, it can be understood that when D2 is | D/cos β |, then Δ XYZ can be made on a longitudinal section of the leads 100, where point X is located on the surface on one side of the thickness of the intermediate segment 2, point Y and point Z are both located on the surface on the other side of the thickness of the intermediate segment 2, XY is parallel to the thickness direction of the intermediate segment 2, and XZ is parallel to the thickness direction of the second body segment 31, then | ZYX is complementary to the bending included angle β, i.e., | ZYX + β ═ 180 °, and XY is equal to the thickness D of the intermediate segment 2, so XZ is XY/cos | Z, i.e., XZ | D/cos β |, then XZ is equal to D2, i.e., the dimension of the intermediate segment 2 in the thickness direction of the second segment 3 is equal to the thickness of the second segment 3, so that when a plurality of leads 100 are stacked, the second segment 3 and intermediate segment 2 of two adjacent leads 100 can both contact, i.e., one of the second segment 3 contacts the other of the second segment 3 contacts the second segment 3 The middle section 2 of one of the two adjacent pins 100 is in contact with the middle section 2 of the other pin, so that the pins 100 are stressed evenly, and the pins 100 are prevented from generating redundant package deformation.
With reference to fig. 6-8, it can be understood that when D2 > | D/cos β | is formed, when a plurality of leads 100 are stacked, the second segments 3 of two adjacent leads 100 are correspondingly contacted, and the middle segments 2 of two adjacent leads 100 can be spaced apart, which is also beneficial to achieve uniform stress of the leads 100.
Alternatively, the included angle β may be 135 °, but is not limited thereto, and for example, the included angle β may also be 120 °, or 140 °, and the like.
For example, in the example of fig. 5 and 6, the bending included angle between the middle section 2 and the first section 1 is α, the bending included angle between the middle section 2 and the second section 3 is β, and both α and β are formed as obtuse angles, that is, 90 ° < α < 180 °, 90 ° < β < 180 °, so as to facilitate the stacked packaging of the plurality of pins 100, which is beneficial to further avoid a large displacement between two adjacent pins 100 in the length direction of the pin 100, so that the occupied space of two adjacent pins 100 in the length direction of the pin 100 is large, and the occupied space of the plurality of pins 100 in unit packaging is saved. The intermediate section 2 is of constant thickness and the thickness of the intermediate section 2 is D, the first section 1 comprises a first body section 11 of constant thickness, the thickness of the first body section 11 is D1, the second section 3 comprises a second body section 31 of constant thickness, the thickness of the second body section 31 is D2. Wherein D1 is ≥ D/cos alpha |, D2 is ≥ D/cos beta |.
In some embodiments, as shown in fig. 6, the first section 1 and the second section 3 are arranged in parallel, and the thickness center line of the first section 1 may be parallel to the thickness center line of the second section 3 on the longitudinal section of the lead 100, so that when the middle section 2 is formed as a straight line section, the bending included angle α between the middle section 2 and the first section 1 may be equal to the bending included angle β between the middle section 2 and the second section 3; the first segment 1 comprises a first body segment 11 with equal thickness, the thickness of the first body segment 11 is D1, the thickness of the first body segment 11 at any position can be D1, the second segment 3 comprises a second body segment 31 with equal thickness, the thickness of the second body segment 31 is D2, and the thickness of the second body segment 31 at any position can be D2. Wherein D1 ═ D2.
From this, be convenient for simplify pin 100's structure, simplify pin 100's manufacturing procedure, promote machining efficiency, simultaneously when a plurality of pins 100 pack, be convenient for first section 1 and the second section 3 of two adjacent pins 100 contact respectively the setting, namely first section 1 and another first section 1 contact of one of them in two adjacent pins 100, second section 3 and another second section 3 contact of one of them in two adjacent pins 100, make the atress balanced between two adjacent pins 100, avoid pin 100 to produce great packing deformation, guarantee pin 100's use reliability. Wherein, it is understood that, in some embodiments, the middle sections 2 of two adjacent pins 100 can be disposed in contact; in other embodiments, the middle sections 2 of two adjacent leads 100 can be spaced apart.
For example, in the example of fig. 6, the intermediate section 2, the first section 1, and the second section 3 are respectively formed as straight line segments, the bending angle between the intermediate section 2 and the first section 1 is α, the bending angle between the intermediate section 2 and the second section 3 is β, each of α and β is formed as an obtuse angle, α ═ β, i.e., 90 ° < α ≦ β ≦ 180 °, the intermediate section 2 is an equal-thickness section, and the thickness of the intermediate section 2 is D, the first section 1 includes the first main body section 11 having an equal thickness, the thickness of the first main body section 11 is D1, the second section 3 includes the second main body section 31 having an equal thickness, and the thickness of the second main body section 31 is D2. Wherein D1 ≧ D2 ≧ D/cos α |, and D < D1.
In some embodiments, as shown in fig. 2, 4 and 6, at least one of the first segment 1 and the second segment 3 includes a main segment 100b of equal thickness and a connecting segment 100c of equal thickness, the connecting segment 100c being connected between the main segment 100b and the intermediate segment 2, the connecting segment 100c having a thickness less than that of the main segment 100b, and the intermediate segment 2 having a thickness less than that of the main segment 100 b. Thus, the following cases may be included: 1. the first segment 1 comprises a main body segment 100b of equal thickness and a connecting segment 100c of equal thickness; 2. the second section 3 comprises a main body section 100b of equal thickness and a connecting section 100c of equal thickness; 3. the first section 1 comprises a body section 100b of equal thickness and a connecting section 100c of equal thickness, and the second section 3 also comprises a body section 100b of equal thickness and a connecting section 100c of equal thickness.
Where "body segment 100b of equal thickness" may mean that body segment 100b itself is of equal thickness construction, and "connecting segment 100c of equal thickness" may mean that connecting segment 100c itself is of equal thickness construction.
For example, when the first segment 1 includes the main body segment 100b and the connecting segment 100c, which are equal in thickness, the connecting segment 100c is connected between the main body segment 100b and the middle segment 2, the thickness of the connecting segment 100c is smaller than that of the main body segment 100b, and the thickness of the middle segment 2 is also smaller than that of the main body segment 100b, so that during the processing of the pin 100, the thinning processing and then the bending processing can be performed to facilitate the processing, and during the bending, since the length of the thinned portion (which can correspond to the connecting segment 100c and the middle segment 2) is longer, the requirement for bending precision can be reduced to facilitate the bending of the pin 100.
When the second segment 3 includes the main body segment 100b and the connecting segment 100c, the connecting segment 100c is connected between the main body segment 100b and the middle segment 2, the thickness of the connecting segment 100c is smaller than that of the main body segment 100b, and the thickness of the middle segment 2 is also smaller than that of the main body segment 100b, so that in the processing of the pin 100, the thinning processing and then the bending processing can be performed first to facilitate the processing, and meanwhile, in the bending process, because the length of the thinned part (which can correspond to the connecting segment 100c and the middle segment 2) is longer, the requirement on the bending precision can be reduced to facilitate the bending of the pin 100.
When the first section 1 includes the body section 100b and the connecting section 100c of the same thickness and the second section 3 includes the body section 100b and the connecting section 100c of the same thickness, as shown in fig. 2, 4 and 6, the connecting section 100c of the first section 1 is connected between the body section 100b and the intermediate section 2 of the first section 1, the connecting section 100c of the first section 1 has a thickness smaller than that of the body section 100b of the first section 1, the intermediate section 2 also has a thickness smaller than that of the body section 100b of the first section 1, and the connecting section 100c of the second section 3 is connected between the body section 100b and the intermediate section 2 of the second section 3, the connecting section 100c of the second section 3 has a thickness smaller than that of the body section 100b of the second section 3, and the intermediate section 2 also has a thickness smaller than that of the body section 100b of the second section 3. Therefore, in the processing process of the pin 100, the thinning processing and the bending processing can be performed at first, and meanwhile, in the bending process, the lengths of the thinned parts (which can correspond to the connecting section 100c of the first section 1, the connecting section 100c of the second section 3 and the middle section 2) are longer, so that the requirement on the bending precision can be effectively reduced.
For example, as shown in fig. 6, the thickness of connecting section 100c is equal to the thickness of intermediate section 2, which facilitates simplifying the structure of pin 100 and further facilitates the thinning process of pin 100 during the manufacturing process. For example, when the first segment 1 includes the body segment 100b and the connection segment 100c of the same thickness, the thickness of the connection segment 100c of the first segment 1 may be the same as the thickness of the middle segment 2; when the second section 3 includes the main section 100b and the connecting section 100c of the same thickness, the thickness of the connecting section 100c of the second section 3 may be the same as that of the intermediate section 2; when the first section 1 includes the body section 100b and the connecting section 100c of the same thickness and the second section 3 includes the body section 100b and the connecting section 100c of the same thickness, at least one of the connecting section 100c of the first section 1 and the connecting section 100c of the second section 3 is equal to the thickness of the intermediate section 2.
Of course, the thickness of the connecting section 100c and the thickness of the middle section 2 may not be equal, which is beneficial to realizing the structural diversity design of the pin 100.
Alternatively, in the example of fig. 5 and 6, the two thickness side surfaces of the connection section 100c are flush with the two thickness side surfaces of the intermediate section 2, that is, the two thickness side surfaces of the connection section 100c are flush with the two thickness side surfaces of the intermediate section 2 in the thickness direction of the pin 100 (for example, the PP' direction in fig. 5), respectively, so that the one thickness side surface of the connection section 100c and the one thickness side surface of the intermediate section 2 may be located on the same plane, and the other thickness side surface of the connection section 100c and the other thickness side surface of the intermediate section 2 may be located on the same plane, thereby being beneficial to ensuring the reliability of the connection between the connection section 100c and the intermediate section 2, and further facilitating the thinning process of the pin 100 during the processing process, and facilitating the simplification of the processing procedure.
In some embodiments, as shown in fig. 6, the surface of the thickness side of the main body section 100b is flush with the surface of the thickness side of the connecting section 100c, so that in the processing of the pin 100, thinning processing may be performed on the thickness side of the first section 1 and/or the thickness side of the second section 3, and thinning processing may not be performed on both sides of the thickness of the pin 100, which simplifies the processing procedure of the pin 100.
For example, when the first segment 1 includes the main body segment 100b and the connecting segment 100c having the same thickness, the thickness side surface of the main body segment 100b is flush with the thickness side surface of the connecting segment 100c, the thickness side surface of the main body segment 100b and the thickness side surface of the connecting segment 100c may be smoothly transited, for example, the thickness side surface of the first segment 1 may be formed in a planar structure; when the second section 3 includes the body section 100b and the connecting section 100c of the same thickness, the thickness side surface of the body section 100b is flush with the thickness side surface of the connecting section 100c, the thickness side surface of the body section 100b and the thickness side surface of the connecting section 100c may be smoothly transited, for example, the thickness side surface of the second section 3 may be formed in a planar structure; when the first section 1 includes the body section 100b and the connecting section 100c of the same thickness and the second section 3 includes the body section 100b and the connecting section 100c of the same thickness, the thickness side surface of the body section 100b of the first section 1 is flush with the thickness side surface of the connecting section 100c of the first section 1 and the thickness side surface of the body section 100b of the second section 3 is flush with the thickness side surface of the connecting section 100c of the second section 3.
Of course, the thickness-side surface of the main body segment 100b and the thickness-side surface of the connecting segment 100c may also be disposed non-flush.
As shown in fig. 2, 4 and 6, the first segment 1 includes a main body segment 100b and a connecting segment 100c, the main body segment 100b of the first segment 1 is a first main body segment 11, the connecting segment 100c of the first segment 1 is a first connecting segment 12, the second segment 3 also includes a main body segment 100b and a connecting segment 100c, the main body segment 100b of the second segment 3 is a second main body segment 31, the connecting segment 100c of the second segment 3 is a second connecting segment 32, two sides of the thickness of the pin 100 are a first side 10a and a second side 10b, respectively, the first main body segment 11 is flush with the first connecting segment 12 on the first side 10a, and the second main body segment 31 is flush with the second connecting segment 32 on the second side 10 b.
For example, in the example of fig. 5 and 6, the two sides of the thickness of the lead 100 are the upper side and the lower side, respectively, the first body segment 11 is flush with the first connection segment 12 on the upper side, the thickness lower side surface of the first connection segment 12 is located above the thickness lower side surface of the first body segment 11, the second body segment 31 is flush with the second connection segment 32 on the lower side, and the thickness upper side surface of the second connection segment 32 is located below the thickness upper side surface of the second body segment 31. Therefore, in the processing process, the thinning treatment for forming the first connecting section 12 and the thinning treatment for forming the second connecting section 32 can be respectively carried out on two sides of the thickness of the pin 100, which is beneficial to ensuring the structural strength and the structural stability of the pin 100.
Of course, it is also possible that the first body section 11 is flush with the first connection section 12 at the first side 10a and the second body section 31 is flush with the second connection section 32 at the first side 10 a; alternatively, the first body section 11 is flush with the first connection section 12 at the second side 10b, and the second body section 31 is flush with the second connection section 32 at the second side 10 b.
A pin assembly 200 according to an embodiment of the second aspect of the invention is described below with reference to the drawings.
As shown in fig. 9, the lead assembly 200 may include a plurality of leads 100, the leads 100 may be disposed at intervals along a predetermined direction (for example, a QQ' direction in fig. 9), and the predetermined direction is perpendicular to a length direction of the leads 100 and a thickness direction of the leads 100. The pin 100 is the pin 100 of the smart power module 300 according to the above-mentioned first aspect of the present invention.
As shown in fig. 9, the plurality of leads 100 are connected by the connecting rib 101 so that the plurality of leads 100 can be formed as a single body to facilitate the movement, packaging, installation, etc. of the entire lead assembly 200.
According to the pin assembly 200 of the embodiment of the invention, the pins 100 are adopted, so that a large number of unit packages can be realized, the feeding quantity of the pins 100 is not limited greatly, and a special operator is not required to be arranged at a pin welding station for feeding the pins, so that the cost is saved.
In some embodiments, as shown in fig. 9 and 12, the length of the second segment 3 is greater than the length of the first segment 1, and when the pin assembly 200 is incorporated into the smart power module 300, the first segment 1 of the pin 100 can be connected to the circuit substrate of the smart power module 300, and the second segment 3 of the pin 100 can be connected to other electrical components, such as an MCU, or a motor, or a compressor, etc., to facilitate connection of the pin 100.
Second section 3 at a plurality of pins 100 is connected to splice bar 101, and splice bar 101 includes first splice bar 1011 and second splice bar 1012, the one end that is close to interlude 2 at second section 3 is connected to first splice bar 1011, the one end of keeping away from interlude 2 at second section 3 is connected to second splice bar 1012, then first splice bar 1011 and second splice bar 1012 can all follow preset direction extension, and the length direction interval that second section 3 can be followed to first splice bar 1011 and second splice bar 1012 sets up, a plurality of pins 100 link to each other through first splice bar 1011, and a plurality of pins 100 link to each other through second splice bar 1012. Therefore, the structural stability of the pin assembly 200 is improved, and the packaging, installation and the like of the pin assembly 200 are facilitated.
Alternatively, the connecting rib 101 may be integrally formed with the plurality of pins 100, and the pin assembly 200 may be formed as a single piece, so as to improve the processing efficiency and realize mass production.
In some embodiments, as shown in fig. 9, the length of the second section 3 is greater than that of the first section 1, the connection rib 101 is connected to the second section 3 of the plurality of pins 100, the connection rib 101 includes a second connection rib 1012, the plurality of pins 100 can be connected by the second connection rib 1012, the second connection rib 1012 can extend along a preset direction, the second connection rib 1012 is connected to an end of the second section 3 away from the middle section 2, a plurality of positioning holes 1012a are formed on the second connection rib 1012, the positioning holes 1012a are suitable for being in positioning fit with positioning pins of a packaging mold, so that when the pin assembly 200 is applied to the smart power module 300, the positioning holes 1012a can be in positioning fit with the positioning pins of the packaging module in a packaging process of the smart power module 300, positioning of the smart power module 300 is facilitated, and packaging efficiency is improved.
The positioning holes 1012a may be formed as through holes, and the positioning holes 1012a may penetrate the second connecting ribs 1012 in the thickness direction of the second connecting ribs 1012.
A method of manufacturing the pin assembly 200 according to the embodiment of the third aspect of the present invention is described below with reference to the drawings.
As shown in fig. 10 and 11, the lead assembly 200 is the lead assembly 200 according to the second aspect of the present invention, and the method for processing the lead assembly 200 may include the following steps: the metal plate is thinned so that the metal plate includes a thin plate portion and a first thick plate portion and a second thick plate portion located on both sides of the thin plate portion in the first direction, and both end portions of the thin plate portion in the first direction are bent.
For example, after the metal plate is subjected to the thinning process, the metal plate may include a thin plate portion, a first thick plate portion, and a second thick plate portion, the first thick plate portion and the second thick plate portion may be located on both sides of the thin plate portion in the first direction, and both end portions of the thin plate portion in the first direction may be bent. The thin plate part may at least correspond to the middle section 2 of the pin assembly 100 after being processed, the first thick plate part may correspond to at least part of the first section 1 of the pin assembly 100 after being processed, the second thick plate part may correspond to at least part of the second section 3 of the pin assembly 100 after being processed, and the two end parts of the thin plate part may respectively correspond to two bending parts 100a of the pin assembly after being processed, wherein the first direction may be a length direction of the pin 100 after the pin assembly 200 is processed.
According to the processing method of the pin assembly 200 provided by the embodiment of the invention, the processing procedure is simple, the production cost is low, the operation is convenient, and the pin assembly 200 can be conveniently packaged by a large number of units.
For example, when the thin plate portion corresponds to middle section 2 after pin assembly 100 is machined, the first thick plate portion can correspond to first section 1 after pin assembly 100 is machined, and the second thick plate portion can correspond to second section 3 after pin assembly 100 is machined. When at least one of the first segment 1 and the second segment 3 includes the main segment 100b and the connecting segment 100c having the same thickness, the thin plate portion corresponds to the middle segment 2 and the connecting segment 100c after the processing of the pin assembly 100 is completed, and at this time, if the first segment 1 includes the main segment 100b and the connecting segment 100c, the first thick plate portion may correspond to the main segment 100b of the first segment 1 after the processing of the pin assembly 100 is completed, and the second thick plate portion may correspond to the second segment 3 after the processing of the pin assembly 100 is completed; if the second section 3 includes the body section 100b and the connection section 100c, the second thick plate portion may correspond to the body section 100b of the second section 3 after the processing of the pin assembly 100 is completed, and the first thick plate portion may correspond to the first section 1 after the processing of the pin assembly 100 is completed; if the first segment 1 includes a main segment 100b and a connecting segment 100c, and the second segment 3 includes a main segment 100b and a connecting segment 100c, the thin plate portion corresponds to the middle segment 2 of the first segment 1 after the machining of the pin assembly 100, the connecting segment 100c of the first segment 1, and the connecting segment 100c of the second segment 3, the first thick plate portion may correspond to the main segment 100b of the first segment 1 after the machining of the pin assembly 100, and the second thick plate portion may correspond to the main segment 100b of the second segment 3 after the machining of the pin assembly 100.
Optionally, the thinning treatment may be performed by using a corrosive solution such as acid to perform a corrosion treatment; but is not limited thereto.
Optionally, when the two end portions of the thin plate portion are bent, a stamping manner may be adopted, so that the bending included angle may be a sinking angle formed by stamping; but is not limited thereto.
Alternatively, the metal plate may be a copper plate (or become a copper strip), which is typically between 200 μm and 1000 μm thick.
As shown in fig. 10 and 11, the method for processing the lead assembly 200 further includes the following steps before the metal plate is thinned or after the thin plate portion is bent: the metal plate is punched out of the pin assembly 200.
For example, in the example of fig. 10, after bending the thin plate portion, the metal plate is punched out of the pin assembly 200, that is, the processing method of the pin assembly 200 may include the steps of: the metal plate is thinned so that the metal plate includes a thin plate portion and a first thick plate portion and a second thick plate portion located on both sides of the thin plate portion in the first direction, both end portions of the thin plate portion in the first direction are bent, respectively, and then the metal plate is punched out to form the lead assembly 200. At this time, "punching out the lead frame assembly 200 from the metal plate" may be understood as punching out the metal plate after the thinning process and the bending process to punch out the lead frame assembly 200.
For another example, in the example of fig. 11, before the metal plate is thinned, the metal plate is punched to form the pin assembly 200, that is, the processing method of the pin assembly 200 may include the following steps: the lead frame 200 is punched out of a metal plate, and then the metal plate is subjected to a thinning process so that the metal plate includes a thin plate portion and a first thick plate portion and a second thick plate portion located on both sides of the thin plate portion in a first direction, and both end portions of the thin plate portion in the first direction are bent, respectively. At this time, "punching out the metal plate into the pin assembly 200" punches out the outer contour of the pin assembly 200 from the prepared metal plate in the thickness direction, and the punched-out structure is not the finished pin assembly 200, but may be formed by the subsequent thinning process and bending process to form the pin assembly 200.
The smart power module 300 according to the fourth aspect of the present invention includes the pin assembly 200, and the pin assembly 200 is the pin assembly 200 according to the second aspect of the present invention.
For example, in the example of fig. 12 and 13, the smart power module 300 may further include a circuit substrate 201 and components 202, the components 202 may be disposed on the circuit substrate 201, the corresponding components 202 may be connected by metal wires, and the pin assembly 200 may be connected to the circuit substrate 201. The components 202 may include power devices and control devices, among others.
When the intelligent power module 300 needs to be packaged, the intelligent power module can be packaged through a packaging mold, for example, injection molding packaging; the packaged smart power module 300 may be mostly located in a package 301 such as a thermoplastic resin, for example, the circuit substrate 201, the component 202, and the metal wires are all sealed to the package 301, and a portion of the leads 100 is sealed to the package 301, and another portion of the leads extends out of the package 301 to be connected to other components.
According to the intelligent power module 300 of the embodiment of the invention, by adopting the pin assembly 200, the use reliability is ensured, the packaging defects of the intelligent power module 300 are removed, and the packaging yield is improved.
Other constructions and operations of the smart power module 300 according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "length", "thickness", "upper", "lower", "vertical", "horizontal", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (15)

1. The utility model provides an intelligent power module's pin, its characterized in that, the pin includes two departments of buckling, two the department of buckling will the pin is separated for following the length direction of pin sets gradually first section, interlude and second section, the interlude is located two between the department of buckling, first section with the second section is located two respectively the department of buckling is kept away from one side of interlude, the thickness of interlude both is less than the at least partial thickness of first section, is less than again the at least partial thickness of second section.
2. The pin of claim 1, wherein a bending angle between the middle section and the first section is α, 90 ° < α < 180 °, the middle section is a constant thickness section and has a thickness D, the first section comprises a first body section having a constant thickness D1, wherein D1 is greater than or equal to a first predetermined absolute value, and the first predetermined absolute value is an absolute value of a ratio of D to a cosine of the bending angle α.
3. The pin of claim 1, wherein a bending included angle between the middle section and the second section is β, 90 ° < β < 180 °, the middle section is a constant thickness section and has a thickness D, the second section comprises a second main body section having a constant thickness D2, wherein D2 is greater than or equal to a second predetermined absolute value, and the second predetermined absolute value is an absolute value of a ratio of D to a cosine of the bending included angle β.
4. The pin of a smart power module according to claim 1, wherein the first segment is disposed in parallel with the second segment, the first segment comprises a first body segment of uniform thickness, the first body segment has a thickness of D1, the second segment comprises a second body segment of uniform thickness, the second body segment has a thickness of D2, wherein D1 ═ D2.
5. The pin of the smart power module of claim 1, wherein at least one of the first segment and the second segment comprises a body segment of uniform thickness and a connection segment of uniform thickness, the connection segment being connected between the body segment and the intermediate segment, the connection segment having a thickness less than a thickness of the body segment, the intermediate segment also having a thickness less than a thickness of the body segment.
6. The pin for a smart power module of claim 5, wherein the thickness of the connecting segment is equal to the thickness of the middle segment.
7. The smart power module pin according to claim 6, wherein thickness side surfaces of the connection section are flush with thickness side surfaces of the middle section.
8. The pin of a smart power module according to claim 5, wherein a thickness-side surface of the main body section is flush with a thickness-side surface of the connection section.
9. The pin of claim 5, wherein the first segment comprises the body segment and the connection segment, the body segment of the first segment is a first body segment, the connection segment of the first segment is a first connection segment, the second segment also comprises the body segment and the connection segment, the body segment of the second segment is a second body segment, the connection segment of the second segment is a second connection segment, two sides of the thickness of the pin are respectively a first side and a second side, the first body segment is flush with the first connection segment at the first side, and the second body segment is flush with the second connection segment at the second side.
10. A pin assembly, comprising the pins of the smart power module according to any one of claims 1-9, wherein the pins are arranged at intervals along a predetermined direction, the predetermined direction is perpendicular to the length direction of the pins and the thickness direction of the pins, and the pins are connected through a connecting rib.
11. The pin assembly according to claim 10, wherein the second section has a length greater than the first section, the connection rib is connected to the second sections of the plurality of pins, the connection rib includes a first connection rib and a second connection rib, the first connection rib is connected to an end of the second section near the middle section, and the second connection rib is connected to an end of the second section far from the middle section.
12. The pin assembly according to claim 10, wherein the second section has a length greater than that of the first section, the connection rib is connected to the second sections of the plurality of pins, the connection rib includes a second connection rib, the second connection rib is connected to an end of the second section away from the middle section, and a plurality of positioning holes are formed in the second connection rib, and the positioning holes are adapted to be positioned and engaged with positioning pins of a packaging mold.
13. A method of manufacturing a pin assembly according to claim 11 or 12, the method comprising the steps of:
a metal plate is thinned so as to include a thin plate portion and a first thick plate portion and a second thick plate portion which are located on both sides of the thin plate portion in a first direction, and both end portions of the thin plate portion in the first direction are bent.
14. The method for processing a lead assembly according to claim 13, further comprising, before the step of thinning the metal plate or after the step of bending the thin plate portion, the steps of:
and punching the metal plate to form the pin assembly.
15. A smart power module comprising a pin assembly according to claim 11 or 12.
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