CN110610957A - Display panel, manufacturing method of display panel, and display device - Google Patents

Abstract

The present application provides a display panel, a method for preparing the display panel and a display device, which relate to the field of display technology. The display panel includes: a light-emitting layer, including a plurality of light-emitting chips; a light conversion layer, located on the light-emitting layer; wherein, a plurality of channels are arranged in the light conversion layer, and the light-emitting chips are located below the channels. The inner wall of the channel is a curved inner wall; the surface of the inner wall of the channel is provided with a metal reflection layer, and at least part of the channel is filled with light conversion materials. The display panel has the advantages of less light crosstalk, high light collection rate and light extraction efficiency, and good display effect.

Description

Display panel, manufacturing method of display panel, and display device

technical field

The present application relates to the field of display technology, and in particular to a display panel, a method for preparing the display panel, and a display device.

Background technique

At present, there are two main methods to realize the color display of the display panel: process red, green and blue three primary color light-emitting chips on the display panel, or process only blue or ultraviolet monochromatic light-emitting chips on the display panel Then the light is converted into red, green and blue light. However, the display panel in the prior art has problems such as low light efficiency of color display and light crosstalk between light emitting chips.

Based on this, how to improve the display effect and light extraction efficiency of the display panel is a technical problem to be solved urgently by those skilled in the art.

Contents of the invention

In view of this, the embodiments of the present application are dedicated to providing a display panel, a method for manufacturing the display panel, and a display device, so as to solve the problems of low light efficiency of the color display of the display panel and optical crosstalk between light-emitting chips in the prior art.

The first aspect of the present application provides a display panel, including: a light-emitting layer, including a plurality of light-emitting chips; a light conversion layer, located on the light-emitting layer; wherein, a plurality of channels are provided in the light-conversion layer, and the The light-emitting chip is located under the channel, and the inner wall of the channel is a curved inner wall; the inner wall of the channel is provided with a metal reflection layer, and at least part of the channel is filled with light conversion material.

In one embodiment of the present application, in the above-mentioned display panel provided by the embodiment of the present invention, the area of the light outlet of the channel is larger than the area of the light inlet of the channel.

In an embodiment of the present application, the cross-sectional area of the channel in a direction parallel to the light-emitting layer first increases and then decreases along a direction away from the light-emitting layer.

In one embodiment of the present application, the inner wall of the channel is a regular curved surface or an irregular curved surface, preferably a spherical surface.

In one embodiment of the present application, a passivation layer is provided on the surface of the metal reflective layer and the surface of the light outlet of the channel.

In one embodiment of the present application, the material of the metal reflective layer is metal silver or aluminum.

In one embodiment of the present application, the light conversion material includes quantum dot material or phosphor.

The second aspect of the present application provides a method for manufacturing a display panel, including: providing a carrier substrate, wherein a sacrificial layer is provided on the carrier substrate; multiple channels are formed above the sacrificial layer, and the inner walls of the channels are a curved inner wall; forming a metal reflective layer on the inner wall surface of the channel; filling at least part of the channel with a light conversion material; providing a driving backplane, wherein a plurality of light-emitting chips are arranged on the driving backplane; The side of the carrying substrate having the channel is bonded to the side of the driving backplane having the light-emitting chip, and the light-emitting chip is located under the channel; the carrying substrate and the sacrificial layer are removed.

In one embodiment of the present application, it further includes forming a passivation layer on the surface of the metal reflective layer and the surface of the sacrificial layer corresponding to the channel.

The third aspect of the present application provides a display device, including the display panel according to any one of the first aspect or the display panel prepared by any one of the methods in the second aspect.

The display device provided by the embodiment of the present invention includes the above-mentioned display panel, and therefore also has the same advantages as those of the above-mentioned display panel, which will not be repeated here.

In the embodiment of this application, by designing a channel with a metal reflective layer on the inner wall surface, and filling some channels with light conversion materials to form a light conversion layer, light reflection can be realized, and the propagation of lateral light and high-angle light can be changed. direction, which effectively solves the problems of low light efficiency of color display and light crosstalk between adjacent light-emitting chips in existing display panels.

Description of drawings

FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application.

FIG. 2 is a schematic structural diagram of a display panel according to another embodiment of the present application.

FIG. 3 is a schematic structural diagram of a display panel according to another embodiment of the present application.

FIG. 4 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present application.

FIG. 5 is a schematic structural view of a display panel in a process of laminating a light conversion structure according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a display device according to an embodiment of the present application.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some, not all, embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application. Where possible, the same or similar parts will be given the same reference numerals in the drawings.

At present, there are two main methods to realize the color display of the display panel: process red, green and blue three primary color light-emitting chips on the display panel, or only process blue or ultraviolet monochromatic light-emitting chips on the display panel. Then the light is converted into red, green and blue light. However, existing display panels have defects such as sidewall light leakage and sidewall light emission after light conversion, resulting in problems such as low light extraction efficiency and light crosstalk between light-emitting chips in color display, and the display effect is also affected. Based on this, embodiments of the present application provide a display panel to solve the above problems.

FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application.

As shown in Figure 1, in a realizable embodiment, the display panel includes a driving backplane 1 with a light emitting layer 2, and the light emitting layer 2 includes a plurality of light emitting chips 3; Layer 8 , a plurality of channels 4 are arranged in the light conversion layer 8 ; The channel 4 is filled with a light conversion material 7, which can realize the conversion of the light color. The inner wall surface of the channel 4 is provided with a metal reflective layer 5, which can reflect the light incident on the surface of the metal reflective layer 5, change the propagation direction of the light, especially can change the transverse (parallel to the direction of the light-emitting layer) light and high-angle The direction of light propagation can effectively prevent the light emitted in the light-emitting chip area from entering the adjacent light-emitting chip area, thereby effectively avoiding interference with the adjacent light-emitting chip area, and at the same time make the emitted light upward to form light, improving light output efficiency and screen brightness .

In an optional embodiment of the present application, the area of the light outlet of channel 4 is larger than the area of the light inlet of channel 4, as shown in FIG. The shape is wide and narrow, at this time, the light outlet of the channel 4 can emit as much light as possible from the light-emitting chip 3 , which helps to improve the light output rate of the display panel.

Further, the cross-sectional area of the channel 4 in the direction parallel to the light-emitting layer 2 first increases and then decreases along the direction away from the light-emitting layer. At this time, the area of the light outlet of channel 4 is smaller than the cross-sectional area of the middle part of channel 4 in the direction parallel to the light-emitting layer, but larger than the area of the light inlet of channel 4, as shown in FIG. 1 . Due to the design of the channel 4, the light generated by the light-emitting chip 3 will undergo secondary reflection or multiple reflections on the inner wall surface of the channel 4, increasing the exit angle between the outgoing light at the light outlet of the channel 4 and the horizontal plane of the light-emitting layer, thereby Avoiding problems such as optical crosstalk between the emitted light between two adjacent light-emitting chips, so that the emitted light is upward to form light, and the light output efficiency is improved.

In another optional embodiment of the present application, the shape of the inner wall of the channel 4 is a regular curved surface, as shown in FIG. 1 ; meanwhile, the shape of the inner wall of the channel 4 may also be an irregular curved surface, as shown in FIG. 3 . Preferably, when the shape of the inner wall of the channel 4 is a spherical surface, as shown in Figure 1, the channel 4 has a good reflection effect on the light generated by the light-emitting chip 3, and the reflection path and angle of the light after one reflection can be corrected , so that the reflected light is gathered as much as possible directly above the light emitting port of channel 4, thereby minimizing the optical crosstalk between adjacent light emitting chips.

Furthermore, in the embodiment of the present invention, there are no wrinkles on the inner wall of the channel 4, which can reduce the number of light reflections, ensure that the light can be reflected to the light outlet, increase the intensity of the emitted light, and increase the light output rate of the display panel.

In an optional embodiment of the present application, a metal reflective layer 5 is provided on the inner wall surface of the channel 4, and the thickness of the thinnest position of the metal reflective layer 5 on the inner wall surface of the channel 4 (the surface of the metal reflective layer 5 away from the inner wall of the channel 4 The distance to the inner wall of the channel 4 (the thickness of the metal reflective layer 5) is at least 20nm, and the thickness of the thickest position of the metal reflective layer 5 is less than 300nm. When the thickness of the metal reflective layer 5 is less than 20nm, the reflection of the metal reflective layer 5 to light The effect is not very obvious. When the thickness of the metal reflective layer 5 is greater than 300nm, on the one hand, an overly thick metal reflective layer cannot improve the light reflection effect; , but will affect the light extraction efficiency. Therefore, the thickness of the metal reflective layer 5 needs to be controlled at 20 nm or more and 300 nm or less.

In an optional embodiment of the present application, in order to better realize the reflective function, the metal reflective layer 5 may be made of metallic silver or metallic aluminum in the embodiment of the present disclosure. Certainly, the constituent material of metal reflective layer 5 of the present invention has multiple choices, is not limited to metal silver or metal aluminum, can also be other metal materials with good reflective function, therefore, the embodiment of the present application is for the material of metal reflective layer 5 The composition is not specifically limited.

In an optional embodiment of the present application, the surface of the metal reflective layer 5 is provided with a passivation layer 6, and the thickness of the thinnest position of the passivation layer 6 (the surface of the passivation layer 6 away from the inner wall of the channel 4 to the surface of the metal reflective layer 5 away from The distance between the surface of the channel 4 (the thickness of the passivation layer 6) is at least 20nm, and the thickness of the thickest part of the passivation layer 6 is less than 500nm, so as to ensure that the light can be effectively reflected by the metal reflection layer 5, and at the same time protect the metal reflection Layer 5 and the role of the light conversion material. In this embodiment, the material of the passivation layer 6 can be composed of one or more of silicon oxide, silicon nitride, aluminum oxide, or other materials with good insulation and light transmittance. The arrangement of the layer 6 can prevent the metal reflective layer 5 from forming a conductive path and causing the light-emitting chip 3 to short circuit. Oxidation of material 7.

In an optional embodiment of the present application, at least part of the channels 4 may be filled with corresponding light conversion materials 7, such as red light conversion materials, green light conversion materials, blue light conversion materials and the like. Preferably, the light conversion material 7 filled in the channel 4 can be a quantum dot material, or a phosphor, so that part of the channel 4 can perform color conversion of monochromatic light corresponding to a luminous color, and finally enable the display panel to perform color conversion. show.

It can be seen that, taking the light-emitting chip 3 as a blue light-emitting chip as an example, some channels 4 are filled with light conversion materials, for example, some channels 4 are filled with red quantum dot materials to realize the conversion from blue light to red light, and some channels 4 are filled with The green quantum dot material is used to realize the conversion from blue light to green light, and a part of the channel 4 is filled with transparent material, which can also perform blue color display, and finally realize color display on the display panel.

In an optional embodiment of the present application, a color filter can also be arranged on the light conversion layer 8 to increase the color saturation of the outgoing light and filter out other non-red, green and blue colors of light, thereby improving the display effect of the panel .

The display panel provided according to the embodiment of the present application has been described above, and a method for manufacturing the aforementioned display panel provided according to the embodiment of the present application will be described below with reference to FIG. 4 and FIG. 5 .

FIG. 4 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present application. FIG. 5 is a schematic structural view of a display panel in a process of laminating a light conversion structure according to an embodiment of the present application.

As shown in FIG. 4 , the manufacturing method of the display panel may include the following steps.

Step 510: providing a carrier substrate, a sacrificial layer is provided on the carrier substrate, and a plurality of channels are formed above the sacrificial layer, and the inner walls of the channels are curved inner walls;

Step 520: forming a metal reflective layer on the inner wall surface of the channel;

Step 530: filling part of the channels with light conversion material;

Step 540: providing a driving backplane, on which a plurality of light-emitting chips are arranged;

Step 550: Attach the side of the carrier substrate with the channel to the side of the driving backplane with the light-emitting chip, and the light-emitting chip is located below the channel;

Step 560: removing the carrier substrate and the sacrificial layer to complete the preparation of the display panel.

It should be understood that in various embodiments of the present application, the serial numbers of the processes do not mean the order of execution, and the execution order of the processes should be determined by their functions and internal logic, rather than by the execution order of the embodiments of the present application. The implementation process constitutes no limitation. For example, step 540 may also be performed first and then other steps are performed.

In an optional embodiment of the present application, in step 510, negative photoresist is spin-coated on the surface of the sacrificial layer 10 on the carrier substrate 9, and the channel 4 is etched by photolithography to form the light conversion layer 8. The cross-sectional area of the channel 4 obtained in the direction parallel to the carrying substrate 9 first decreases and then increases along the direction away from the carrying substrate 9 . At this time, the area of the opening of the channel 4 away from the carrier substrate 9 is smaller than the cross-sectional area of the middle part of the channel 4 in the horizontal direction parallel to the carrier substrate 9, but larger than the area of the opening of the channel 4 near the carrier substrate, so that the carrier substrate with the channel 4 9 When bonding with the driving backplane 1, the side with the smaller opening of the channel 4 can be bonded with the driving backplane to form the light-incoming surface, and the side with the larger opening of the channel 4 becomes the light-emitting surface.

In an optional embodiment of the present application, step 520 further includes forming a passivation layer 6 on the surface of the metal reflective layer 5 and the surface of the sacrificial layer 10 corresponding to the channel 4 .

In another optional embodiment of the present application, in step 550, the carrier substrate 9 with the light conversion layer 8 is bonded to the driving backplane 1, and the side with the smaller opening diameter of the channel 4 is bonded to the driving backplane 1 with a light-emitting chip. 3, the side with the larger opening diameter of the channel 4 is used as the light-emitting surface, and the light-emitting chip 3 on the driving backplane 1 is located under the channel 4, which can increase the light-emitting area of the display panel and improve the light extraction rate, so that the display panel has excellent performance. Light effect.

In an optional embodiment of the present application, the filling method adopted in step 540 may be methods such as inkjet printing, aerosol printing, electrostatic printing, screen printing, gravure printing, etc., through the above filling methods, at least part of the channels 4 are respectively The light conversion material 7 is filled, such as red light conversion material, green light conversion material, blue light conversion material, etc. The filled light conversion material 7 may be a quantum dot material or phosphor powder.

It should be noted that, in some embodiments of the present invention, the existence of the sacrificial layer 10 is essential. On the one hand, the existence of the sacrificial layer 10 can more easily peel off and remove the carrier substrate 9 in the process of processing the light conversion layer pattern, thereby realizing thinner and thinner screen processing, especially the potential for processing flexible screens; on the other hand, the sacrificial layer 10 The existence of can effectively reduce the stress produced on the metal reflective layer 5, the passivation layer 6 and the light conversion material 7 and other film layers when removing the carrier substrate 9, thereby avoiding the stress generated during the removal of the carrier substrate 9 on the metal reflective layer 5, Film layers such as the passivation layer 6 and the photo-converting material 7 cause damage.

FIG. 5 is a structural schematic diagram of the bonding of the driving backplane 1 with monochromatic light-emitting chips and the carrier substrate 9 with the light conversion layer 8 . The lamination of the carrier substrate 9 with the light conversion layer 8 and the monochromatic light-emitting driving backplane 1 is realized by means of alignment and pressing equipment, and no heat treatment process is required to realize the carrier substrate 9 with the light conversion layer 8 and the monochromatic light emission. Alignment and bonding of the illuminated drive backplane 1.

Further, in order to ensure that the light conversion layer 8 and the display screen can be closely bonded, an adhesive is applied on the edge where the drive backplane 1 and the light conversion layer 8 are bonded. Adhesive is applied to the bonded parts of the light-emitting chips 2 .

For the technical details of the above-mentioned manufacturing method of the display panel, reference may be made to the embodiments of the display panel, and in order to avoid repeated description, details are not repeated here.

Based on the same inventive concept, an embodiment of the present invention further provides a display device, as shown in FIG. 6 , which may include: the above-mentioned display panel provided by the embodiment of the present invention.

Specifically, the display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and the like. The other essential components of the display device should be understood by those of ordinary skill in the art, and will not be repeated here, nor should they be regarded as limitations on the present invention.

The above is only a preferred embodiment of the application, and is not intended to limit the application. Any modifications, equivalent replacements, etc. made within the spirit and principles of the application should be included in the protection scope of the application within.

Claims (10)

1. A display panel, comprising:

a light emitting layer including a plurality of light emitting chips;

a light conversion layer on the light emitting layer; wherein,

the light conversion layer is provided with a plurality of channels, the light emitting chips are positioned below the channels, and the inner walls of the channels are curved inner walls;

the surface of the inner wall of the channel is provided with a metal reflecting layer, and at least part of the channel is filled with a light conversion material.

2. The display panel according to claim 1, wherein the area of the channel light outlet is larger than the area of the channel light inlet.

3. The display panel according to claim 2, wherein a cross-sectional area of the channel in a direction parallel to the light-emitting layer increases first and then decreases in a direction away from the light-emitting layer.

4. A display panel as claimed in claim 3 characterized in that the inner wall of the channel is a regular or irregular surface, preferably a spherical surface.

5. The display panel according to claim 1, wherein a passivation layer is disposed on a surface of the metal reflective layer and a surface of the light exit opening of the channel.

6. The display panel according to claim 1, wherein the material of the metal reflective layer is silver or aluminum.

7. The display panel of claim 1, wherein the light conversion material comprises a quantum dot material or a phosphor.

8. A method for manufacturing a display panel, comprising:

providing a bearing substrate, wherein a sacrificial layer is arranged on the bearing substrate;

forming a plurality of channels above the sacrificial layer, wherein the inner walls of the channels are curved inner walls;

forming a metal reflecting layer on the surface of the inner wall of the channel;

filling at least part of the channel with a light conversion material;

providing a driving back plate, wherein a plurality of light-emitting chips are arranged on the driving back plate;

attaching one surface of the bearing substrate, which is provided with the channel, to one surface of the driving back plate, which is provided with a light-emitting chip, wherein the light-emitting chip is positioned below the channel;

and removing the bearing substrate and the sacrificial layer.

9. The method according to claim 8, further comprising forming a passivation layer on a surface of the metal reflective layer and a surface of the sacrificial layer corresponding to the channel.

10. A display device comprising the display panel according to any one of claims 1 to 7 or the display panel produced by the method according to any one of claims 8 to 9.