CN110610957A - Display panel, preparation method of display panel and display device - Google Patents
Display panel, preparation method of display panel and display device Download PDFInfo
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- CN110610957A CN110610957A CN201910944347.4A CN201910944347A CN110610957A CN 110610957 A CN110610957 A CN 110610957A CN 201910944347 A CN201910944347 A CN 201910944347A CN 110610957 A CN110610957 A CN 110610957A
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 238000006243 chemical reaction Methods 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 20
- 238000002161 passivation Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000002096 quantum dot Substances 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 230000001788 irregular Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000605 extraction Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 239000003086 colorant Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a display panel, a preparation method of the display panel and a display device, and relates to the technical field of display. The display panel includes: a light emitting layer including a plurality of light emitting chips; a light conversion layer on the light emitting layer; the light conversion layer is internally provided with a plurality of channels, the light emitting chips are positioned below the channels, and the inner walls of the channels are curved inner walls; the surface of the inner wall of the channel is provided with a metal reflecting layer, and at least part of the channel is filled with a light conversion material. The display panel has the advantages of less optical crosstalk, high light collection rate and light extraction efficiency and good display effect.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
At present, there are two main methods for realizing the colorized display of the display panel: the red, green and blue three-primary-color light-emitting chips are all processed on the display panel, or the blue or ultraviolet single-color light-emitting chips are processed on the display panel and then are subjected to light conversion to generate light with three colors of red, green and blue. However, the display panel in the prior art has the problems of low color display light efficiency, optical crosstalk between the light emitting chips and the like.
Therefore, how to improve the display effect and the light emitting efficiency of the display panel is a technical problem to be urgently solved by those skilled in the art.
Disclosure of Invention
In view of the above, embodiments of the present disclosure are directed to a display panel, a method for manufacturing the display panel, and a display device, so as to solve the problems of low color display light efficiency and crosstalk between light emitting chips of the display panel in the prior art.
A first aspect of the present application provides a display panel, comprising: a light emitting layer including a plurality of light emitting chips; a light conversion layer on the light emitting layer; the light conversion layer is internally provided with a plurality of channels, the light emitting chips are positioned below the channels, and the inner walls of the channels are curved inner walls; the surface of the inner wall of the channel is provided with a metal reflecting layer, and at least part of the channel is filled with a light conversion material.
In an embodiment of the present application, in the display panel provided in the embodiment of the present invention, an area of the channel light exit is larger than an area of the channel light entrance.
In one embodiment of the application, the cross-sectional area of the channel in a direction parallel to the light-emitting layer increases first and then decreases in a direction away from the light-emitting layer.
In one embodiment of the present application, the inner wall of the channel is a regular or irregular curved surface, preferably a spherical surface.
In one embodiment of the present application, a passivation layer is disposed on a surface of the metal reflective layer and a surface of the light exit of the channel.
In one embodiment of the present application, the material of the metal reflective layer is metallic silver or aluminum.
In one embodiment of the present application, the light conversion material comprises a quantum dot material or a phosphor.
A second aspect of the present application provides a method for manufacturing a display panel, including: providing a bearing substrate, wherein a sacrificial layer is arranged on the bearing substrate; forming a plurality of channels above the sacrificial layer, wherein the inner walls of the channels are curved inner walls; forming a metal reflecting layer on the surface of the inner wall of the channel; filling at least part of the channel with a light conversion material; providing a driving back plate, wherein a plurality of light-emitting chips are arranged on the driving back plate; attaching one surface of the bearing substrate, which is provided with the channel, to one surface of the driving back plate, which is provided with a light-emitting chip, wherein the light-emitting chip is positioned below the channel; and removing the bearing substrate and the sacrificial layer.
In one embodiment of the present application, a passivation layer is formed on a surface of the metal reflective layer and a surface of the sacrificial layer corresponding to the channel.
A third aspect of the present application provides a display device comprising the display panel of any one of the first aspect or the display panel prepared by the method of any one of the second aspect.
The display device provided by the embodiment of the invention comprises the display panel, so that the display device also has the same advantages as those of the display panel, and the description is omitted.
In the embodiment of the application, the light conversion layer is formed by designing the channel with the metal reflection layer on the surface of the inner wall and respectively filling the light conversion materials in partial channels, so that light reflection can be realized, the propagation directions of transverse light and high-angle light are changed, and the problems of low light efficiency of color display and light crosstalk between adjacent light emitting chips in the conventional display panel are effectively solved.
Drawings
Fig. 1 is a schematic diagram of a display panel structure according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a display panel according to another embodiment of the present application.
Fig. 3 is a schematic structural diagram of a display panel according to another embodiment of the present application.
Fig. 4 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a display panel in a process of attaching a light conversion structure according to an embodiment of the present application.
Fig. 6 is a schematic structural diagram of a display device provided in an embodiment according to the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
At present, there are two main methods for realizing the color display of the display panel: the red, green and blue three-primary-color light-emitting chips are all processed on the display panel, or the blue or ultraviolet single-color light-emitting chips are processed on the display panel and then are subjected to light conversion to generate light with three colors of red, green and blue. However, the existing display panel has the defects of side wall light leakage and side wall light emission after light conversion, which causes the problems of low light efficiency of color display generation, light crosstalk among light emitting chips and the like, and the display effect is also affected accordingly. Accordingly, embodiments of the present application provide a display panel to solve the above problems.
Fig. 1 is a schematic diagram of a display panel structure according to an embodiment of the present application.
As shown in fig. 1, in one implementable embodiment, the display panel includes a driving backplane 1 having a light emitting layer 2, the light emitting layer 2 including a plurality of light emitting chips 3; the display panel further comprises a light conversion layer 8 positioned on the light emitting layer 2, the light conversion layer 8 having a plurality of channels 4 disposed therein; the light emitting chip 3 is disposed corresponding to the channel 4 and is located below the channel 4. The channel 4 is filled with a light conversion material 7, so that the conversion of the light color can be realized. The inner wall surface of passageway 4 is provided with metal reflection stratum 5, can realize the reflection to the light of incidenting to metal reflection stratum 5 surface, change the propagation direction of light, especially can change the propagation direction of horizontal (being on a parallel with the light-emitting layer direction) light and the light of high angle, can effectively avoid the light that sends in the light-emitting chip region to enter into adjacent light-emitting chip region, thereby effectively avoid producing the interference to adjacent light-emitting chip region, make the emission light upwards form the light-emitting simultaneously, promote luminous efficiency and screen body luminance.
In an alternative embodiment of the present application, the area of the light outlet of the channel 4 is larger than the area of the light inlet of the channel 4, as shown in fig. 2, that is, the channel 4 is generally wide at the top and narrow at the bottom in the direction away from the driving back plate 1, and at this time, the light outlet of the channel 4 can emit as much light generated by the light emitting chip 3 as possible, which helps to improve the light output rate of the display panel.
Further, the cross-sectional area of the channels 4 in a direction parallel to the light-emitting layer 2 increases first and then decreases in a direction away from the light-emitting layer. The area of the light exit opening of the channel 4 is now smaller than the cross-sectional area of the middle part of the channel 4 in a direction parallel to the light-emitting layer, but larger than the area of the light entrance opening of the channel 4, as shown in fig. 1. Because the design of passageway 4 such, the produced light of emitting chip 3 can carry out secondary reflection or multiple reflection at the inner wall surface of passageway 4, increases the exit angle between the emergent light of 4 light outlets of passageway and the luminescent layer horizontal plane to avoid producing the light of emergence between two adjacent emitting chips and produce the light and crosstalk the scheduling problem, make the emission light upwards form the light-emitting, promote luminous efficiency.
In another alternative embodiment of the present application, the inner wall of the channel 4 is shaped as a regular curve, as shown in fig. 1; meanwhile, the shape of the inner wall of the channel 4 can also be an irregular curved surface, as shown in fig. 3. Preferably, when the inner wall of the channel 4 is spherical, as shown in fig. 1, the channel 4 has a good reflection effect on the light generated by the light emitting chip 3, and the reflection path and angle of the light after one reflection can be corrected, so that the reflected light is concentrated right above the light emitting opening of the channel 4 as much as possible, thereby reducing the optical crosstalk between the adjacent light emitting chips to the greatest extent.
Furthermore, in the embodiment of the present invention, the inner wall of the channel 4 has no wrinkles, which can reduce the number of times of light reflection, ensure that light can be reflected to the light outlet, improve the intensity of the emergent light, and increase the light-emitting rate of the display panel.
In an optional embodiment of the present application, a metal reflective layer 5 is disposed on an inner wall surface of a channel 4, a thickness of a thinnest position of the metal reflective layer 5 on the inner wall surface of the channel 4 (a distance from a surface of the metal reflective layer 5 far away from the inner wall of the channel 4 to the inner wall of the channel 4 is the thickness of the metal reflective layer 5) is at least 20nm, a thickness of a thickest position of the metal reflective layer 5 is less than 300nm, when the thickness of the metal reflective layer 5 is less than 20nm, a light reflection effect of the metal reflective layer 5 on light is not very obvious, when the thickness of the metal reflective layer 5 is greater than 300nm, on one hand, an excessively thick metal reflective layer cannot improve the light reflection effect, and on the other hand, an excessively thick metal reflective layer occupies a space where light exits from the channel 4 in a. Therefore, the thickness of the metal reflective layer 5 needs to be controlled to be 20nm to 300 nm.
In an alternative embodiment of the present application, the metal reflective layer 5 may be made of metal silver or metal aluminum in an embodiment of the present invention, in order to better implement the reflective function. Of course, the constituent material of the metal reflective layer 5 of the present invention is not limited to metal silver or metal aluminum, and may be other metal materials with good reflective function, and therefore, the material of the metal reflective layer 5 is not particularly limited in the embodiments of the present application.
In an alternative embodiment of the present application, the passivation layer 6 is disposed on the surface of the metal reflective layer 5, the thickness of the thinnest position of the passivation layer 6 (the distance from the surface of the passivation layer 6 far from the inner wall of the channel 4 to the surface of the metal reflective layer 5 far from the channel 4 is the thickness of the passivation layer 6) is at least 20nm, and the thickness of the thickest position of the passivation layer 6 is less than 500nm, so as to ensure that light can be effectively reflected by the metal reflective layer 5, and simultaneously, the passivation layer serves to protect the metal reflective layer 5 and the light conversion material. In this embodiment, the material of the passivation layer 6 may be one or more of silicon oxide, silicon nitride, and aluminum oxide, or may be other materials with good insulation and light transmittance, on one hand, the passivation layer 6 is disposed to prevent the metal reflective layer 5 from forming a conductive path to short-circuit the light emitting chip 3, and on the other hand, the passivation layer 6 can isolate the attack of water and oxygen on the light conversion material and the metal reflective layer to prevent the oxidation of the metal reflective layer 5 and the light conversion material 7.
In an alternative embodiment of the present application, at least part of the channels 4 may be filled with a corresponding light converting material 7, such as a red light converting material, a green light converting material, a blue light converting material, etc. Preferably, the light conversion material 7 filled in the channel 4 may be a quantum dot material or a phosphor, so that a part of the channel 4 can perform color conversion of monochromatic light corresponding to one emission color, and finally the display panel can perform color display.
It can be known, take light-emitting chip 3 to be blue light-emitting chip as an example, fill light conversion material in partial passageway 4, for example fill red quantum dot material in partial passageway 4 in order to realize blue light to red light's conversion, fill green quantum dot material in partial passageway 4 in order to realize blue light to green light's conversion, fill transparent material in partial passageway 4, can carry out blue color display equally, realize color display on display panel finally.
In an optional embodiment of the present application, a color filter may be further disposed on the light conversion layer 8 to improve the color saturation of the emergent light, and filter out other non-red, green, and blue colors of light, so as to improve the display effect of the panel.
The display panel provided according to the embodiment of the present application is described above, and a method for manufacturing the foregoing display panel provided according to the embodiment of the present application is described below with reference to fig. 4 and 5.
Fig. 4 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application. Fig. 5 is a schematic structural diagram of a display panel in a process of attaching a light conversion structure according to an embodiment of the present application.
As shown in fig. 4, the method of manufacturing the display panel may include the following steps.
Step 510: providing a bearing substrate, wherein a sacrificial layer is arranged on the bearing substrate, a plurality of channels are formed above the sacrificial layer, and the inner walls of the channels are curved inner walls;
step 520: forming a metal reflecting layer on the surface of the inner wall of the channel;
step 530: filling a light conversion material in part of the channel;
step 540: providing a driving back plate, wherein a plurality of light-emitting chips are arranged on the driving back plate;
step 550: attaching one surface of the bearing substrate, which is provided with a channel, to one surface of the driving back plate, which is provided with a light-emitting chip, wherein the light-emitting chip is positioned below the channel;
step 560: and removing the bearing substrate and the sacrificial layer to finish the preparation of the display panel.
It should be understood that, in the various embodiments of the present application, the size of the serial number of each process does not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. For example, step 540 may be performed before other steps are performed.
In an alternative embodiment of the present application, step 510 spin-coats a negative photoresist on the surface of the sacrificial layer 10 on the carrier substrate 9, and the channel 4 is etched by photolithography to form the light conversion layer 8, wherein the cross-sectional area of the channel 4 obtained by photolithography first decreases and then increases in the direction away from the carrier substrate 9 in the direction parallel to the carrier substrate 9. At this time, the area of the opening of the channel 4 far from the carrier substrate 9 is smaller than the cross-sectional area of the middle part of the channel 4 in the horizontal direction parallel to the carrier substrate 9, but is larger than the area of the opening of the channel 4 near the carrier substrate, so that when the carrier substrate 9 with the channel 4 is attached to the driving back plate 1, the side with the smaller opening of the channel 4 can be attached to the driving back plate to form a light inlet side, and the side with the larger opening of the channel 4 forms a light outlet side.
In an alternative embodiment of the present application, step 520 further includes forming a passivation layer 6 on the surface of the metal reflective layer 5 and the surface of the sacrificial layer 10 corresponding to the via 4.
In another optional embodiment of the present application, in step 550, the carrier substrate 9 with the light conversion layer 8 is attached to the driving backplane 1, one side of the channel 4 with a small opening diameter is attached to one side of the driving backplane 1 with the light emitting chips 3, one side of the channel 4 with a large opening diameter is used as a light emitting surface, and the light emitting chips 3 on the driving backplane 1 are located below the channel 4, so that the light emitting area of the display panel can be increased, the light extraction rate is improved, and the display panel has an excellent light extraction effect.
In an alternative embodiment of the present application, the filling method adopted in step 540 may be inkjet printing, aerosol printing, electrostatic printing, screen printing, gravure printing, etc., by which the light conversion material 7, such as red light conversion material, green light conversion material, blue light conversion material, etc., is respectively filled into at least part of the channels 4, and the filled light conversion material 7 may be quantum dot material, or may be phosphor.
It is noted that in some embodiments of the invention, the presence of the sacrificial layer 10 is essential. On one hand, the existence of the sacrificial layer 10 can more easily strip and remove the bearing substrate 9 in the process of processing the light conversion layer graph, so that the lighter and thinner screen body processing is realized, and the flexible screen is especially potential to be processed; on the other hand, the existence of the sacrificial layer 10 can effectively reduce the stress generated to the metal reflective layer 5, the passivation layer 6, the light conversion material 7 and other film layers when the carrier substrate 9 is removed, so that the damage of the stress generated in the carrier substrate 9 removing process to the metal reflective layer 5, the passivation layer 6, the light conversion material 7 and other film layers is avoided.
Fig. 5 is a schematic structural view of the driving backplane 1 with the monochromatic light emitting chips bonded to the carrier substrate 9 with the light conversion layer 8. The bearing substrate 9 with the light conversion layer 8 and the monochromatic light-emitting driving back plate 1 are attached by means of alignment and pressing equipment, and the bearing substrate 9 with the light conversion layer 8 and the monochromatic light-emitting driving back plate 1 are attached in an aligned mode without a heat treatment process.
Further, in order to ensure that the light conversion layer 8 can be closely attached to the display screen, an adhesive is coated on the edge where the driving back plate 1 is attached to the light conversion layer 8, and in order to avoid affecting the light emitting effect, the adhesive is not coated on the position where the channel 4 is attached to the light emitting chip 2 of the display screen.
For the technical details of the preparation method of the display panel, reference may be made to the embodiments of the display panel, and details are not repeated herein to avoid repeated descriptions.
Based on the same inventive concept, an embodiment of the present invention further provides a display device, as shown in fig. 6, which may include: the display panel provided by the embodiment of the invention.
Specifically, the display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. Other essential components of the display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the invention.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modifications, equivalents and the like that are within the spirit and principle of the present application should be included in the scope of the present application.
Claims (10)
1. A display panel, comprising:
a light emitting layer including a plurality of light emitting chips;
a light conversion layer on the light emitting layer; wherein,
the light conversion layer is provided with a plurality of channels, the light emitting chips are positioned below the channels, and the inner walls of the channels are curved inner walls;
the surface of the inner wall of the channel is provided with a metal reflecting layer, and at least part of the channel is filled with a light conversion material.
2. The display panel according to claim 1, wherein the area of the channel light outlet is larger than the area of the channel light inlet.
3. The display panel according to claim 2, wherein a cross-sectional area of the channel in a direction parallel to the light-emitting layer increases first and then decreases in a direction away from the light-emitting layer.
4. A display panel as claimed in claim 3 characterized in that the inner wall of the channel is a regular or irregular surface, preferably a spherical surface.
5. The display panel according to claim 1, wherein a passivation layer is disposed on a surface of the metal reflective layer and a surface of the light exit opening of the channel.
6. The display panel according to claim 1, wherein the material of the metal reflective layer is silver or aluminum.
7. The display panel of claim 1, wherein the light conversion material comprises a quantum dot material or a phosphor.
8. A method for manufacturing a display panel, comprising:
providing a bearing substrate, wherein a sacrificial layer is arranged on the bearing substrate;
forming a plurality of channels above the sacrificial layer, wherein the inner walls of the channels are curved inner walls;
forming a metal reflecting layer on the surface of the inner wall of the channel;
filling at least part of the channel with a light conversion material;
providing a driving back plate, wherein a plurality of light-emitting chips are arranged on the driving back plate;
attaching one surface of the bearing substrate, which is provided with the channel, to one surface of the driving back plate, which is provided with a light-emitting chip, wherein the light-emitting chip is positioned below the channel;
and removing the bearing substrate and the sacrificial layer.
9. The method according to claim 8, further comprising forming a passivation layer on a surface of the metal reflective layer and a surface of the sacrificial layer corresponding to the channel.
10. A display device comprising the display panel according to any one of claims 1 to 7 or the display panel produced by the method according to any one of claims 8 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910944347.4A CN110610957A (en) | 2019-09-30 | 2019-09-30 | Display panel, preparation method of display panel and display device |
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| CN201910944347.4A CN110610957A (en) | 2019-09-30 | 2019-09-30 | Display panel, preparation method of display panel and display device |
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| CN201910944347.4A Pending CN110610957A (en) | 2019-09-30 | 2019-09-30 | Display panel, preparation method of display panel and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116646441A (en) * | 2023-06-16 | 2023-08-25 | 盐城鸿石智能科技有限公司 | Micro display chip and preparation method thereof |
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