CN110610957A - Display panel, manufacturing method of display panel, and display device - Google Patents

Display panel, manufacturing method of display panel, and display device Download PDF

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Publication number
CN110610957A
CN110610957A CN201910944347.4A CN201910944347A CN110610957A CN 110610957 A CN110610957 A CN 110610957A CN 201910944347 A CN201910944347 A CN 201910944347A CN 110610957 A CN110610957 A CN 110610957A
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light
channel
display panel
layer
emitting
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邢汝博
王涛
张志豪
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/856Arrangements for extracting light from the devices comprising reflective means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请提供了一种显示面板、显示面板的制备方法和显示装置,涉及显示技术领域。该显示面板包括:发光层,包括多个发光芯片;光转换层,位于所述发光层上;其中,所述光转换层中设置有多个通道,所述发光芯片位于所述通道下方,所述通道的内壁为曲面状内壁;所述通道内壁表面设置有金属反射层,至少部分所述通道中填充有光转换材料。该显示面板具有光串扰少、光收集率和出光效率高、显示效果好的优点。

The present application provides a display panel, a method for preparing the display panel and a display device, which relate to the field of display technology. The display panel includes: a light-emitting layer, including a plurality of light-emitting chips; a light conversion layer, located on the light-emitting layer; wherein, a plurality of channels are arranged in the light conversion layer, and the light-emitting chips are located below the channels. The inner wall of the channel is a curved inner wall; the surface of the inner wall of the channel is provided with a metal reflection layer, and at least part of the channel is filled with light conversion materials. The display panel has the advantages of less light crosstalk, high light collection rate and light extraction efficiency, and good display effect.

Description

显示面板、显示面板的制备方法和显示装置Display panel, manufacturing method of display panel, and display device

技术领域technical field

本申请涉及显示技术领域,尤其涉及一种显示面板、显示面板的制备方法和显示装置。The present application relates to the field of display technology, and in particular to a display panel, a method for preparing the display panel, and a display device.

背景技术Background technique

目前,实现显示面板的彩色化显示的主要方法有两种:将红、绿、蓝三基色发光芯片均加工到显示面板上,或只在显示面板上加工蓝色或紫外光的单色发光芯片后再进行光转换生成红、绿、蓝三种颜色的光。但现有技术中的显示面板存在彩色显示出光效率低和发光芯片间存在光串扰等问题。At present, there are two main methods to realize the color display of the display panel: process red, green and blue three primary color light-emitting chips on the display panel, or process only blue or ultraviolet monochromatic light-emitting chips on the display panel Then the light is converted into red, green and blue light. However, the display panel in the prior art has problems such as low light efficiency of color display and light crosstalk between light emitting chips.

基于此,如何提高显示面板的显示效果以及出光效率,是本领域技术人员亟待解决的技术问题。Based on this, how to improve the display effect and light extraction efficiency of the display panel is a technical problem to be solved urgently by those skilled in the art.

发明内容Contents of the invention

有鉴于此,本申请实施例致力于提供一种显示面板、显示面板的制备方法和显示装置,以解决现有技术中显示面板彩色显示出光效率低和发光芯片间存在光串扰的问题。In view of this, the embodiments of the present application are dedicated to providing a display panel, a method for manufacturing the display panel, and a display device, so as to solve the problems of low light efficiency of the color display of the display panel and optical crosstalk between light-emitting chips in the prior art.

本申请第一方面提供了一种显示面板,包括:发光层,包括多个发光芯片;光转换层,位于所述发光层上;其中,所述光转换层中设置有多个通道,所述发光芯片位于所述通道下方,所述通道的内壁为曲面状内壁;所述通道内壁表面设置有金属反射层,至少部分所述通道中填充有光转换材料。The first aspect of the present application provides a display panel, including: a light-emitting layer, including a plurality of light-emitting chips; a light conversion layer, located on the light-emitting layer; wherein, a plurality of channels are provided in the light-conversion layer, and the The light-emitting chip is located under the channel, and the inner wall of the channel is a curved inner wall; the inner wall of the channel is provided with a metal reflection layer, and at least part of the channel is filled with light conversion material.

在本申请的一个实施例中,在本发明实施例提供的上述显示面板中,所述通道出光口的面积大于所述通道进光口的面积。In one embodiment of the present application, in the above-mentioned display panel provided by the embodiment of the present invention, the area of the light outlet of the channel is larger than the area of the light inlet of the channel.

在本申请的一个实施例中,所述通道平行于所述发光层方向上的横截面积沿远离所述发光层的方向先增大后减小。In an embodiment of the present application, the cross-sectional area of the channel in a direction parallel to the light-emitting layer first increases and then decreases along a direction away from the light-emitting layer.

在本申请的一个实施例中,所述通道的内壁为规则曲面或不规则曲面,优选为球面。In one embodiment of the present application, the inner wall of the channel is a regular curved surface or an irregular curved surface, preferably a spherical surface.

在本申请的一个实施例中,在所述金属反射层的表面和与所述通道的出光口表面设置有钝化层。In one embodiment of the present application, a passivation layer is provided on the surface of the metal reflective layer and the surface of the light outlet of the channel.

在本申请的一个实施例中,所述金属反射层的材料为金属银或铝。In one embodiment of the present application, the material of the metal reflective layer is metal silver or aluminum.

在本申请的一个实施例中,所述光转换材料包括量子点材料或荧光粉。In one embodiment of the present application, the light conversion material includes quantum dot material or phosphor.

本申请第二方面提供了一种显示面板的制备方法,包括:提供承载基板,其中,所述承载基板上设有牺牲层;在所述牺牲层上方形成多个通道,所述通道的内壁为曲面状内壁;在所述通道内壁表面形成金属反射层;在至少部分所述通道中填充光转换材料;提供驱动背板,其中,所述驱动背板上设有多个发光芯片;将所述承载基板具有所述通道的一面与所述驱动背板上具有发光芯片的一面贴合,所述发光芯片位于所述通道下方;去除所述承载基板和所述牺牲层。The second aspect of the present application provides a method for manufacturing a display panel, including: providing a carrier substrate, wherein a sacrificial layer is provided on the carrier substrate; multiple channels are formed above the sacrificial layer, and the inner walls of the channels are a curved inner wall; forming a metal reflective layer on the inner wall surface of the channel; filling at least part of the channel with a light conversion material; providing a driving backplane, wherein a plurality of light-emitting chips are arranged on the driving backplane; The side of the carrying substrate having the channel is bonded to the side of the driving backplane having the light-emitting chip, and the light-emitting chip is located under the channel; the carrying substrate and the sacrificial layer are removed.

在本申请的一个实施例中,还包括,在所述金属反射层的表面和与所述通道对应的牺牲层表面形成钝化层。In one embodiment of the present application, it further includes forming a passivation layer on the surface of the metal reflective layer and the surface of the sacrificial layer corresponding to the channel.

本申请第三方面提供了一种显示装置,包括第一方面任一项所述的显示面板或第二方面任一项方法所制备的显示面板。The third aspect of the present application provides a display device, including the display panel according to any one of the first aspect or the display panel prepared by any one of the methods in the second aspect.

本发明实施例提供的显示装置包括上述显示面板,因此也具有与上述显示面板的优点相同的优点,在此不再赘述。The display device provided by the embodiment of the present invention includes the above-mentioned display panel, and therefore also has the same advantages as those of the above-mentioned display panel, which will not be repeated here.

在本申请的实施例中,通过设计内壁表面具有金属反射层的通道,并在部分通道中分别填充光转换材料构成光转换层,能够实现光线反射,改变横向的光线和高角度的光线的传播方向,有效解决了现有显示面板中彩色显示出光效率低和相邻发光芯片间存在光串扰的问题。In the embodiment of this application, by designing a channel with a metal reflective layer on the inner wall surface, and filling some channels with light conversion materials to form a light conversion layer, light reflection can be realized, and the propagation of lateral light and high-angle light can be changed. direction, which effectively solves the problems of low light efficiency of color display and light crosstalk between adjacent light-emitting chips in existing display panels.

附图说明Description of drawings

图1是根据本申请一个实施例的显示面板结构示意图。FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application.

图2是根据本申请另一个实施例的显示面板结构示意图。FIG. 2 is a schematic structural diagram of a display panel according to another embodiment of the present application.

图3是根据本申请另一个实施例的显示面板结构示意图。FIG. 3 is a schematic structural diagram of a display panel according to another embodiment of the present application.

图4是根据本申请一个实施例的显示面板的制备方法的流程示意图。FIG. 4 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present application.

图5是根据本申请一个实施例的贴合光转换结构过程的显示面板的结构示意图。FIG. 5 is a schematic structural view of a display panel in a process of laminating a light conversion structure according to an embodiment of the present application.

图6是根据本申请一个实施例中提供的显示装置结构示意图。Fig. 6 is a schematic structural diagram of a display device according to an embodiment of the present application.

具体实施方式Detailed ways

下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。在可能的情况下,附图中相同或相似的部分将采用相同的附图标记。The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some, not all, embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application. Where possible, the same or similar parts will be given the same reference numerals in the drawings.

目前,实现显示面板彩色化显示的主要方法有两种:将红、绿、蓝三基色发光芯片均加工到显示面板上,或只在显示面板上加工蓝色或紫外光的单色发光芯片后再进行光转换生成红、绿、蓝三种颜色的光。然而现有的显示面板中存在侧壁漏光及光转换后侧壁发光的缺陷,导致彩色显示产生出光效率低和发光芯片间光串扰等问题,显示效果也因此受到影响。基于此,本申请的实施例提供了一种显示面板,用以解决上述问题。At present, there are two main methods to realize the color display of the display panel: process red, green and blue three primary color light-emitting chips on the display panel, or only process blue or ultraviolet monochromatic light-emitting chips on the display panel. Then the light is converted into red, green and blue light. However, existing display panels have defects such as sidewall light leakage and sidewall light emission after light conversion, resulting in problems such as low light extraction efficiency and light crosstalk between light-emitting chips in color display, and the display effect is also affected. Based on this, embodiments of the present application provide a display panel to solve the above problems.

图1是根据本申请一个实施例的显示面板结构示意图。FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present application.

如图1所示,在一个可实现的实施例中,显示面板包括具有发光层2的驱动背板1,发光层2包括多个发光芯片3;显示面板还包括位于发光层2上的光转换层8,光转换层8中设置有多个通道4;发光芯片3与通道4对应设置,并且位于通道4的下方。通道4中填充有光转换材料7,可以实现出光色彩的转换。通道4的内壁表面设置有金属反射层5,可以对入射至金属反射层5表面的光线实现反射,改变光线的传播方向,尤其是可以改变横向(平行于发光层方向)的光线和高角度的光线的传播方向,可以有效避免发光芯片区域内发出的光进入到相邻发光芯片区域,从而有效避免对相邻发光芯片区域产生干扰,同时使发射光向上形成出光,提升出光效率和屏体亮度。As shown in Figure 1, in a realizable embodiment, the display panel includes a driving backplane 1 with a light emitting layer 2, and the light emitting layer 2 includes a plurality of light emitting chips 3; Layer 8 , a plurality of channels 4 are arranged in the light conversion layer 8 ; The channel 4 is filled with a light conversion material 7, which can realize the conversion of the light color. The inner wall surface of the channel 4 is provided with a metal reflective layer 5, which can reflect the light incident on the surface of the metal reflective layer 5, change the propagation direction of the light, especially can change the transverse (parallel to the direction of the light-emitting layer) light and high-angle The direction of light propagation can effectively prevent the light emitted in the light-emitting chip area from entering the adjacent light-emitting chip area, thereby effectively avoiding interference with the adjacent light-emitting chip area, and at the same time make the emitted light upward to form light, improving light output efficiency and screen brightness .

在本申请一个可选的实施例中,通道4出光口的面积大于通道4进光口的面积,如图2所示,也就是说通道4沿远离驱动背板1的方向上总体上呈上宽下窄的形状,此时通道4出光口能够尽可能多地发射发光芯片3所产生的光,有助于提高显示面板的出光率。In an optional embodiment of the present application, the area of the light outlet of channel 4 is larger than the area of the light inlet of channel 4, as shown in FIG. The shape is wide and narrow, at this time, the light outlet of the channel 4 can emit as much light as possible from the light-emitting chip 3 , which helps to improve the light output rate of the display panel.

进一步地,通道4在平行于发光层2方向上的截面面积沿远离发光层的方向上先增大后减小。此时通道4出光口的面积小于通道4中间部分在平行于发光层方向上的截面面积,但大于通道4进光口的面积,如图1所示。由于通道4如此的设计,发光芯片3所产生的光线会在通道4的内壁表面进行二次反射或多次反射,增大通道4出光口的出射光与发光层水平面之间的出射角,从而避免产生相邻两个发光芯片之间出射的光产生光串扰等问题,使发射光向上形成出光,提升出光效率。Further, the cross-sectional area of the channel 4 in the direction parallel to the light-emitting layer 2 first increases and then decreases along the direction away from the light-emitting layer. At this time, the area of the light outlet of channel 4 is smaller than the cross-sectional area of the middle part of channel 4 in the direction parallel to the light-emitting layer, but larger than the area of the light inlet of channel 4, as shown in FIG. 1 . Due to the design of the channel 4, the light generated by the light-emitting chip 3 will undergo secondary reflection or multiple reflections on the inner wall surface of the channel 4, increasing the exit angle between the outgoing light at the light outlet of the channel 4 and the horizontal plane of the light-emitting layer, thereby Avoiding problems such as optical crosstalk between the emitted light between two adjacent light-emitting chips, so that the emitted light is upward to form light, and the light output efficiency is improved.

在本申请另一个可选的实施例中,通道4的内壁形状为规则曲面,如图1所示;同时通道4的内壁形状也可以是不规则曲面,如图3所示。优选的,当通道4的内壁形状为球面时,如图1所示,此时通道4对发光芯片3所产生的光具有较好的反射作用,并且可以修正一次反射后光线的反射路径和角度,使反射光线尽可能地聚集于通道4发光口的正上方,从而能够最大程度地减少相邻发光芯片之间的光串扰。In another optional embodiment of the present application, the shape of the inner wall of the channel 4 is a regular curved surface, as shown in FIG. 1 ; meanwhile, the shape of the inner wall of the channel 4 may also be an irregular curved surface, as shown in FIG. 3 . Preferably, when the shape of the inner wall of the channel 4 is a spherical surface, as shown in Figure 1, the channel 4 has a good reflection effect on the light generated by the light-emitting chip 3, and the reflection path and angle of the light after one reflection can be corrected , so that the reflected light is gathered as much as possible directly above the light emitting port of channel 4, thereby minimizing the optical crosstalk between adjacent light emitting chips.

进一步地,在本发明的实施例中,通道4的内壁不存在褶皱,能够减少光线反射的次数,保证光线能够反射至出光口,提高出射光线的强度,增加显示面板的出光率。Furthermore, in the embodiment of the present invention, there are no wrinkles on the inner wall of the channel 4, which can reduce the number of light reflections, ensure that the light can be reflected to the light outlet, increase the intensity of the emitted light, and increase the light output rate of the display panel.

在本申请一个可选的实施例中,在通道4内壁表面设置有金属反射层5,通道4内壁表面上的金属反射层5的最薄位置的厚度(金属反射层5远离通道4内壁的表面到通道4内壁的距离为金属反射层5的厚度)至少为20nm,金属反射层5的最厚位置的厚度小于300nm,当金属反射层5的厚度小于20nm时,金属反射层5对光的反射作用并不是很明显,当金属反射层5的厚度大于300nm时,一方面过厚的金属反射层并不能提升光线的反射作用,另一方面过厚的金属反射层大量挤占了通道4出光的空间,反而会影响出光效率。因此金属反射层5的厚度需要控制在20nm以上300nm以下。In an optional embodiment of the present application, a metal reflective layer 5 is provided on the inner wall surface of the channel 4, and the thickness of the thinnest position of the metal reflective layer 5 on the inner wall surface of the channel 4 (the surface of the metal reflective layer 5 away from the inner wall of the channel 4 The distance to the inner wall of the channel 4 (the thickness of the metal reflective layer 5) is at least 20nm, and the thickness of the thickest position of the metal reflective layer 5 is less than 300nm. When the thickness of the metal reflective layer 5 is less than 20nm, the reflection of the metal reflective layer 5 to light The effect is not very obvious. When the thickness of the metal reflective layer 5 is greater than 300nm, on the one hand, an overly thick metal reflective layer cannot improve the light reflection effect; , but will affect the light extraction efficiency. Therefore, the thickness of the metal reflective layer 5 needs to be controlled at 20 nm or more and 300 nm or less.

在本申请一个可选的实施例中,为了更好的实现反射功能,在本发明实施例中金属反射层5可以由金属银或者金属铝构成。当然,本发明金属反射层5的构成材料有多种选择,不限于金属银或者金属铝,还可以是其他具有良好反射功能的金属材料,因此,本申请的实施例对于金属反射层5的材料构成不做具体限定。In an optional embodiment of the present application, in order to better realize the reflective function, the metal reflective layer 5 may be made of metallic silver or metallic aluminum in the embodiment of the present disclosure. Certainly, the constituent material of metal reflective layer 5 of the present invention has multiple choices, is not limited to metal silver or metal aluminum, can also be other metal materials with good reflective function, therefore, the embodiment of the present application is for the material of metal reflective layer 5 The composition is not specifically limited.

在本申请一个可选的实施例中,金属反射层5表面设置有钝化层6,钝化层6的最薄位置的厚度(钝化层6远离通道4内壁的表面到金属反射层5远离通道4表面的距离为钝化层6的厚度)至少为20nm,钝化层6的最厚位置的厚度小于500nm,以保证光能够有效地被金属反射层5反射出去,同时起到保护金属反射层5和光转换材料的作用。在本实施例中,钝化层6的材料可以是氧化硅、氮化硅、氧化铝一种或者多种构成,还可以是其他具备良好的绝缘性与透光性的材料,一方面钝化层6的设置可以防止金属反射层5形成导电通路导致发光芯片3短路,另一方面,钝化层6能够隔绝水氧对光转换材料以及金属反射层的侵袭,防止金属反射层5与光转换材料7的氧化。In an optional embodiment of the present application, the surface of the metal reflective layer 5 is provided with a passivation layer 6, and the thickness of the thinnest position of the passivation layer 6 (the surface of the passivation layer 6 away from the inner wall of the channel 4 to the surface of the metal reflective layer 5 away from The distance between the surface of the channel 4 (the thickness of the passivation layer 6) is at least 20nm, and the thickness of the thickest part of the passivation layer 6 is less than 500nm, so as to ensure that the light can be effectively reflected by the metal reflection layer 5, and at the same time protect the metal reflection Layer 5 and the role of the light conversion material. In this embodiment, the material of the passivation layer 6 can be composed of one or more of silicon oxide, silicon nitride, aluminum oxide, or other materials with good insulation and light transmittance. The arrangement of the layer 6 can prevent the metal reflective layer 5 from forming a conductive path and causing the light-emitting chip 3 to short circuit. Oxidation of material 7.

在本申请一个可选的实施例中,至少部分通道4可以填充对应的光转换材料7,比如红色光转换材料、绿色光转换材料、蓝色光转换材料等。优选地,通道4中所填充的光转换材料7可以是量子点材料,也可以是荧光粉,使得部分通道4可以对应一种发光颜色进行单色光的色彩转换,最终使得显示面板能够进行彩色显示。In an optional embodiment of the present application, at least part of the channels 4 may be filled with corresponding light conversion materials 7, such as red light conversion materials, green light conversion materials, blue light conversion materials and the like. Preferably, the light conversion material 7 filled in the channel 4 can be a quantum dot material, or a phosphor, so that part of the channel 4 can perform color conversion of monochromatic light corresponding to a luminous color, and finally enable the display panel to perform color conversion. show.

可知的,以发光芯片3为蓝色发光芯片为例,部分通道4中填充光转换材料,比如在部分通道4中填充红色量子点材料以实现蓝光到红光的转换,在部分通道4中填充绿色量子点材料以实现蓝光到绿光的转换,在部分通道4填充透明材料,同样可以能够进行蓝色的彩色显示,最终在显示面板上实现彩色显示。It can be seen that, taking the light-emitting chip 3 as a blue light-emitting chip as an example, some channels 4 are filled with light conversion materials, for example, some channels 4 are filled with red quantum dot materials to realize the conversion from blue light to red light, and some channels 4 are filled with The green quantum dot material is used to realize the conversion from blue light to green light, and a part of the channel 4 is filled with transparent material, which can also perform blue color display, and finally realize color display on the display panel.

在本申请一个可选的实施例中,还可以在光转换层8上设置彩色滤光片,提高出射光线的色彩饱和度,滤除其他非红绿蓝颜色的光,从而提高面板的显示效果。In an optional embodiment of the present application, a color filter can also be arranged on the light conversion layer 8 to increase the color saturation of the outgoing light and filter out other non-red, green and blue colors of light, thereby improving the display effect of the panel .

上面描述了根据本申请实施例提供的显示面板,下面结合图4和图5描述一种根据本申请实施例提供的前述显示面板的制备方法。The display panel provided according to the embodiment of the present application has been described above, and a method for manufacturing the aforementioned display panel provided according to the embodiment of the present application will be described below with reference to FIG. 4 and FIG. 5 .

图4是根据本申请一个实施例的显示面板的制备方法的流程示意图。图5是根据本申请一个实施例的贴合光转换结构过程的显示面板的结构示意图。FIG. 4 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present application. FIG. 5 is a schematic structural view of a display panel in a process of laminating a light conversion structure according to an embodiment of the present application.

如图4所示,该显示面板的制备方法可以包括如下步骤。As shown in FIG. 4 , the manufacturing method of the display panel may include the following steps.

步骤510:提供承载基板,承载基板上设有牺牲层,在牺牲层上方形成多个通道,通道的内壁为曲面状内壁;Step 510: providing a carrier substrate, a sacrificial layer is provided on the carrier substrate, and a plurality of channels are formed above the sacrificial layer, and the inner walls of the channels are curved inner walls;

步骤520:在通道内壁表面形成金属反射层;Step 520: forming a metal reflective layer on the inner wall surface of the channel;

步骤530:在部分通道中填充光转换材料;Step 530: filling part of the channels with light conversion material;

步骤540:提供驱动背板,在驱动背板上设有多个发光芯片;Step 540: providing a driving backplane, on which a plurality of light-emitting chips are arranged;

步骤550:将承载基板具有通道的一面与驱动背板上具有发光芯片的一面贴合,发光芯片位于所述通道下方;Step 550: Attach the side of the carrier substrate with the channel to the side of the driving backplane with the light-emitting chip, and the light-emitting chip is located below the channel;

步骤560:去除承载基板和牺牲层,完成显示面板的制备。Step 560: removing the carrier substrate and the sacrificial layer to complete the preparation of the display panel.

应当理解,在本申请的各种实施例中,各过程的序号的大小并不意味着执行顺序的先后,各过程的执行顺序应以其功能和内在逻辑确定,而不应对本申请实施例的实施过程构成任何限定。比如也可以先执行步骤540再执行其他步骤。It should be understood that in various embodiments of the present application, the serial numbers of the processes do not mean the order of execution, and the execution order of the processes should be determined by their functions and internal logic, rather than by the execution order of the embodiments of the present application. The implementation process constitutes no limitation. For example, step 540 may also be performed first and then other steps are performed.

在本申请一个可选的实施例中,步骤510在承载基板9上的牺牲层10表面旋涂负性光刻胶,通过光刻的方式刻蚀出通道4,形成光转换层8,光刻所得到的通道4在平行于承载基板9方向上的截面面积沿远离承载基板9的方向上先减小后增大。此时通道4远离承载基板9处开口的面积小于通道4中间部分在平行于承载基板9水平方向上的截面面积,但大于通道4靠近承载基板处开口的面积,从而在具有通道4的承载基板9与驱动背板1贴合时,通道4开口较小的一面能够与驱动背板贴合成为进光面,通道4开口较大的一面成为出光面。In an optional embodiment of the present application, in step 510, negative photoresist is spin-coated on the surface of the sacrificial layer 10 on the carrier substrate 9, and the channel 4 is etched by photolithography to form the light conversion layer 8. The cross-sectional area of the channel 4 obtained in the direction parallel to the carrying substrate 9 first decreases and then increases along the direction away from the carrying substrate 9 . At this time, the area of the opening of the channel 4 away from the carrier substrate 9 is smaller than the cross-sectional area of the middle part of the channel 4 in the horizontal direction parallel to the carrier substrate 9, but larger than the area of the opening of the channel 4 near the carrier substrate, so that the carrier substrate with the channel 4 9 When bonding with the driving backplane 1, the side with the smaller opening of the channel 4 can be bonded with the driving backplane to form the light-incoming surface, and the side with the larger opening of the channel 4 becomes the light-emitting surface.

在本申请一个可选的实施例中,步骤520还包括,在金属反射层5的表面和与通道4对应的牺牲层10表面形成钝化层6。In an optional embodiment of the present application, step 520 further includes forming a passivation layer 6 on the surface of the metal reflective layer 5 and the surface of the sacrificial layer 10 corresponding to the channel 4 .

在本申请另一个可选的实施例中,步骤550对具备光转换层8的承载基板9与驱动背板1进行贴合,通道4开口直径小的一面贴合在驱动背板1具有发光芯片3的一面,通道4开口直径大的一面作为发光面,且驱动背板1上的发光芯片3位于通道4下方,能够增大显示面板的发光面积,提高出光率,从而使得显示面板具有优异的出光效果。In another optional embodiment of the present application, in step 550, the carrier substrate 9 with the light conversion layer 8 is bonded to the driving backplane 1, and the side with the smaller opening diameter of the channel 4 is bonded to the driving backplane 1 with a light-emitting chip. 3, the side with the larger opening diameter of the channel 4 is used as the light-emitting surface, and the light-emitting chip 3 on the driving backplane 1 is located under the channel 4, which can increase the light-emitting area of the display panel and improve the light extraction rate, so that the display panel has excellent performance. Light effect.

在本申请一个可选的实施例中,步骤540采取的填充方法可以是喷墨打印、气溶胶打印、静电打印、丝网印刷、凹版印刷等方法,通过以上填充方法向至少部分通道4中分别填充光转换材料7,比如红色光转换材料、绿色光转换材料、蓝色光转换材料等,所填充的光转换材料7可以是量子点材料,也可以是荧光粉。In an optional embodiment of the present application, the filling method adopted in step 540 may be methods such as inkjet printing, aerosol printing, electrostatic printing, screen printing, gravure printing, etc., through the above filling methods, at least part of the channels 4 are respectively The light conversion material 7 is filled, such as red light conversion material, green light conversion material, blue light conversion material, etc. The filled light conversion material 7 may be a quantum dot material or phosphor powder.

需要说明的是,在本发明的一些实施例中,牺牲层10的存在是必不可少的。一方面,牺牲层10的存在能够更容易地将加工光转换层图形过程中的承载基板9剥离去除,从而实现更轻薄的屏体加工,尤其有潜力加工柔性屏;另一方面,牺牲层10的存在能够有效地减少去除承载基板9时对金属反射层5、钝化层6以及光转换材料7等膜层产生的应力,从而避免承载基板9去除过程中产生的应力对金属反射层5、钝化层6以及光转换材料7等膜层造成损伤。It should be noted that, in some embodiments of the present invention, the existence of the sacrificial layer 10 is essential. On the one hand, the existence of the sacrificial layer 10 can more easily peel off and remove the carrier substrate 9 in the process of processing the light conversion layer pattern, thereby realizing thinner and thinner screen processing, especially the potential for processing flexible screens; on the other hand, the sacrificial layer 10 The existence of can effectively reduce the stress produced on the metal reflective layer 5, the passivation layer 6 and the light conversion material 7 and other film layers when removing the carrier substrate 9, thereby avoiding the stress generated during the removal of the carrier substrate 9 on the metal reflective layer 5, Film layers such as the passivation layer 6 and the photo-converting material 7 cause damage.

图5为具有单色发光芯片的驱动背板1与具有光转换层8的承载基板9贴合后的结构示意图。所述具有光转换层8的承载基板9和单色发光的驱动背板1的贴合借助对准、压合设备实现,无需进行热处理工艺,实现具有光转换层8的承载基板9和单色发光的驱动背板1的对准贴合。FIG. 5 is a structural schematic diagram of the bonding of the driving backplane 1 with monochromatic light-emitting chips and the carrier substrate 9 with the light conversion layer 8 . The lamination of the carrier substrate 9 with the light conversion layer 8 and the monochromatic light-emitting driving backplane 1 is realized by means of alignment and pressing equipment, and no heat treatment process is required to realize the carrier substrate 9 with the light conversion layer 8 and the monochromatic light emission. Alignment and bonding of the illuminated drive backplane 1.

进一步地,为了保证光转换层8与显示屏能够紧密贴合,在驱动背板1与光转换层8贴合的边缘涂布粘合剂,为了不影响的发光效果,不在通道4与显示屏的发光芯片2贴合处涂布粘合剂。Further, in order to ensure that the light conversion layer 8 and the display screen can be closely bonded, an adhesive is applied on the edge where the drive backplane 1 and the light conversion layer 8 are bonded. Adhesive is applied to the bonded parts of the light-emitting chips 2 .

上述显示面板的制备方法的技术细节可参考显示面板部分的实施例,为了避免重复叙述,这里不再赘述。For the technical details of the above-mentioned manufacturing method of the display panel, reference may be made to the embodiments of the display panel, and in order to avoid repeated description, details are not repeated here.

基于同一发明构思,本发明实施例还提供了一种显示装置,如图6所示,可以包括:如本发明实施例提供的上述显示面板。Based on the same inventive concept, an embodiment of the present invention further provides a display device, as shown in FIG. 6 , which may include: the above-mentioned display panel provided by the embodiment of the present invention.

具体地,该显示装置可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的,在此不做赘述,也不应作为对本发明的限制。Specifically, the display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and the like. The other essential components of the display device should be understood by those of ordinary skill in the art, and will not be repeated here, nor should they be regarded as limitations on the present invention.

以上所述仅为本申请的较佳实施例而已,并不用以限制本申请,凡在本申请的精神和原则之内,所作的任何修改、等同替换等,均应包含在本申请的保护范围之内。The above is only a preferred embodiment of the application, and is not intended to limit the application. Any modifications, equivalent replacements, etc. made within the spirit and principles of the application should be included in the protection scope of the application within.

Claims (10)

1. A display panel, comprising:
a light emitting layer including a plurality of light emitting chips;
a light conversion layer on the light emitting layer; wherein,
the light conversion layer is provided with a plurality of channels, the light emitting chips are positioned below the channels, and the inner walls of the channels are curved inner walls;
the surface of the inner wall of the channel is provided with a metal reflecting layer, and at least part of the channel is filled with a light conversion material.
2. The display panel according to claim 1, wherein the area of the channel light outlet is larger than the area of the channel light inlet.
3. The display panel according to claim 2, wherein a cross-sectional area of the channel in a direction parallel to the light-emitting layer increases first and then decreases in a direction away from the light-emitting layer.
4. A display panel as claimed in claim 3 characterized in that the inner wall of the channel is a regular or irregular surface, preferably a spherical surface.
5. The display panel according to claim 1, wherein a passivation layer is disposed on a surface of the metal reflective layer and a surface of the light exit opening of the channel.
6. The display panel according to claim 1, wherein the material of the metal reflective layer is silver or aluminum.
7. The display panel of claim 1, wherein the light conversion material comprises a quantum dot material or a phosphor.
8. A method for manufacturing a display panel, comprising:
providing a bearing substrate, wherein a sacrificial layer is arranged on the bearing substrate;
forming a plurality of channels above the sacrificial layer, wherein the inner walls of the channels are curved inner walls;
forming a metal reflecting layer on the surface of the inner wall of the channel;
filling at least part of the channel with a light conversion material;
providing a driving back plate, wherein a plurality of light-emitting chips are arranged on the driving back plate;
attaching one surface of the bearing substrate, which is provided with the channel, to one surface of the driving back plate, which is provided with a light-emitting chip, wherein the light-emitting chip is positioned below the channel;
and removing the bearing substrate and the sacrificial layer.
9. The method according to claim 8, further comprising forming a passivation layer on a surface of the metal reflective layer and a surface of the sacrificial layer corresponding to the channel.
10. A display device comprising the display panel according to any one of claims 1 to 7 or the display panel produced by the method according to any one of claims 8 to 9.
CN201910944347.4A 2019-09-30 2019-09-30 Display panel, manufacturing method of display panel, and display device Pending CN110610957A (en)

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Application publication date: 20191224