CN110609801A - Adapter plate and server system - Google Patents
Adapter plate and server system Download PDFInfo
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- CN110609801A CN110609801A CN201910733072.XA CN201910733072A CN110609801A CN 110609801 A CN110609801 A CN 110609801A CN 201910733072 A CN201910733072 A CN 201910733072A CN 110609801 A CN110609801 A CN 110609801A
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- fan
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- rack
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- 230000005477 standard model Effects 0.000 claims abstract description 31
- 238000006243 chemical reaction Methods 0.000 claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 230000001105 regulatory effect Effects 0.000 claims abstract description 7
- 230000001276 controlling effect Effects 0.000 claims abstract description 6
- 238000013461 design Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000011217 control strategy Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 241000522620 Scorpio Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000009490 scorpio Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0016—Inter-integrated circuit (I2C)
Abstract
The invention discloses a patch board which is used for connecting a Rack standard model mainboard to a frame of an open computing project OCP standard model; the keysets includes: the main control chip and the power supply conversion connecting plate; the main control chip is used for acquiring temperature and regulating and controlling the rotating speed of the fan according to a set heat dissipation strategy, wherein the fan is positioned in a node of an OCP standard machine type; and the power supply conversion connecting plate is used for connecting the power supply of the Rack standard type mainboard with the frame of the OCP standard type. Through the scheme of the invention, the adapter plate can assemble the Rack standard model mainboard to the frame of the OCP standard model.
Description
Technical Field
The invention relates to the field of servers, in particular to a patch panel and a server system.
Background
Currently, in the field of servers, domestic Rack type is dominated by Rack server architecture of the Scorpio standard, and foreign countries have established server architecture of the OCP (Open computer Project) standard. Both the Rack-standard server and the OCP-standard architecture server are Rack-mounted, but the biggest difference between the Rack-standard server and the OCP-standard architecture server is that the heat dissipation control mode is different. In the prior art, corresponding board cards are respectively designed for the two architectures.
In the field of servers, Rack type centralized heat dissipation strategies are adopted for servers in the Rack standard, fans are specially matched with racks to form fan walls, and heat dissipation regulation and control strategies are intensively performed according to the temperature of each node. The server of OCP standard dispels the heat for each node alone, and the fan is installed inside the node, and the regulation and control strategy is controlled by the interior controller of node.
Aiming at the problem that in the prior art, corresponding board cards are respectively designed for a Rack standard server and an OCP standard architecture server, a patch panel needs to be designed, and a Rack standard type mainboard is assembled to a Rack of an OCP standard type through the board cards.
Disclosure of Invention
In order to solve the technical problem, the invention provides an adapter board which can assemble a Rack standard type main board to a Rack of an OCP standard type.
In order to achieve the object of the present invention, the present invention provides an interposer,
the adapter plate is used for connecting the Rack standard model main board to a frame of an open computing project OCP standard model;
the keysets includes: the main control chip and the power supply conversion connecting plate;
the main control chip is used for acquiring temperature and regulating and controlling the rotating speed of the fan according to a set heat dissipation strategy, wherein the fan is positioned in a node of an OCP standard machine type;
and the power supply conversion connecting plate is used for connecting the power supply of the Rack standard type mainboard with the frame of the OCP standard type.
In an exemplary embodiment, the Rack standard model motherboard includes: a temperature sensor;
the temperature sensor is used for detecting the temperature and sending the detected temperature to the main control chip through an I2C bus.
In an exemplary embodiment, the obtaining the temperature and regulating and controlling the fan speed according to the set heat dissipation strategy includes:
and the main control chip is used for sending a driving signal to the corresponding fan in a Pulse Width Modulation (PWM) mode according to the received temperature so as to adjust the rotating speed of the fan according to the driving signal.
In an exemplary embodiment, the main control chip is further configured to determine a rotation speed of the fan according to a Tach signal received from the fan; wherein the Tach signal is returned after the fan adjusts the rotation speed.
In an exemplary embodiment, a network controller is further disposed in the main control chip;
and the network controller is used for connecting the patch panel to the switch through a network cable and connecting the patch panel to an external host through the switch.
In an exemplary embodiment, the network controller is configured to transmit node-related information including a Rack standard model motherboard to an external host.
In an exemplary embodiment, the network controller, the network physical PHY chip and the network connector RJ45 form a network system.
In an exemplary embodiment, the network physical PHY chip is configured to connect to a master control chip via an RGMII bus protocol;
and the network connector RJ45 is used for connecting the network physical PHY chip with an external switch through a medium related interface MDI.
In an exemplary embodiment, the power conversion connection board is further configured to convert a voltage, and supply the converted voltage to a fan and related equipment on the adapter board;
wherein the associated device comprises: master control chips and other IC devices.
In order to solve the above problem, the present invention also provides a server system, including: the system comprises a Rack standard model main board, an open computing project OCP standard model Rack and the adapter board in any one of the embodiments.
Compared with the prior art, the invention provides and discloses a patch panel, which is used for connecting a Rack standard model mainboard to a frame of an open computing project OCP standard model; the keysets includes: the main control chip and the power supply conversion connecting plate; the main control chip is used for acquiring temperature and regulating and controlling the rotating speed of the fan according to a set heat dissipation strategy, wherein the fan is positioned in a node of an OCP standard machine type; and the power supply conversion connecting plate is used for connecting the power supply of the Rack standard type mainboard with the frame of the OCP standard type. Through the scheme of the invention, the adapter plate can assemble the Rack standard model mainboard to the frame of the OCP standard model.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.
FIG. 1 is a schematic diagram illustrating the structural design and connection of an adapter plate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a fan heat dissipation design of an interposer according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a network system design of a patch panel according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a power conversion connection board design of an interposer according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
The steps illustrated in the flow charts of the figures may be performed in a computer system such as a set of computer-executable instructions. Also, while a logical order is shown in the flow diagrams, in some cases, the steps shown or described may be performed in an order different than here.
Example one
Fig. 1 is a schematic diagram of the patch panel architecture design connection according to an embodiment of the present invention, according to which,
the adapter plate is used for connecting the Rack standard model main board to a frame of an open computing project OCP standard model;
the keysets includes: the main control chip and the power supply conversion connecting plate;
the main control chip is used for acquiring temperature and regulating and controlling the rotating speed of the fan according to a set heat dissipation strategy, wherein the fan is positioned in a node of an OCP standard machine type;
and the power supply conversion connecting plate is used for connecting the power supply of the Rack standard type mainboard with the frame of the OCP standard type.
In this embodiment, the core board, i.e., the motherboard, may be a motherboard of a Rack standard model.
The main board is internally provided with an I2C connector, the I2C connector connects the main board with a main control chip through an I2C cable, and the main control chip may be an MCU (Micro Controller Unit) or a BMC (baseboard management Controller).
The main control chip controls the rotating speed of the fan through signal transmission.
The mainboard is also internally provided with a Power connector which is connected with a Power connector through a P12V _ AUX cable, the Power connector is connected with a Power Bus Bar connector through a P12V _ AUX cable, and the Power Bus Bar connector performs voltage conversion through a voltage converter so as to supply Power to the PHY, the main control chip and the fan.
In an exemplary embodiment, the Rack standard model motherboard includes: a temperature sensor;
the temperature sensor is used for detecting the temperature and sending the detected temperature to the main control chip through an I2C bus.
In an exemplary embodiment, the main control chip is configured to obtain a temperature and regulate and control a rotation speed of a fan according to a set heat dissipation policy, and includes:
and the main control chip is used for sending a driving signal to the corresponding fan in a Pulse Width Modulation (PWM) mode according to the received temperature so as to adjust the rotating speed of the fan according to the driving signal. And the fan is positioned in a node of an OCP standard model.
In an exemplary embodiment, the main control chip is further configured to determine a rotation speed of the fan according to a Tach signal received from the fan; wherein the Tach signal is returned after the fan adjusts the rotation speed.
An exemplary embodiment is shown in fig. 2, a main control chip in an adapter board regulates and controls the rotation speed of a fan through a set heat dissipation strategy so as to meet the heat dissipation strategy of a rack of an OCP standard model; the specific implementation can be as follows:
the MCU or BMC in the adapter plate can acquire temperature and regulate and control the rotating speed of the fan according to a set heat dissipation strategy so as to perform a heat dissipation function.
The main control chip performs data transmission through an I2C bus and a core board card (a motherboard may be a motherboard of a Rack standard type), detects the temperature of each device through a built-in temperature sensor in the core board card, where each device may be the temperature of a Central Processing Unit (CPU), the temperature of a hard disk, or the like, and transmits the obtained temperature of each device to the main control chip through an I2C bus. After the main control chip obtains the temperature, the rotating speed of the fan is controlled in a PWM mode, wherein the fan is located in a node of an OCP standard machine type. And after the rotating speed of the fan is adjusted, returning a Tach signal to the main control chip, and determining the current rotating speed of the fan by the main control chip according to the Tach signal received from the fan. The master control chip of the adapter board can use BMC, and the type of the BMC can be ASD 1250. For example: taking the CPU as an example, the preset policy may be:
when the device temperature is <40, the PWM is set to 50 (50%);
when the device temperature > is 40, the PWM is adjusted to 75 (75%);
when the device temperature > 60, the PWM is adjusted to 100 (100%), i.e., full speed.
When the CPU temperature is detected to be 80 degrees, the PWM is adjusted to be 100 (100%), and the fan is controlled to be at full speed.
In an exemplary embodiment, a network controller is further disposed in the main control chip;
and the network controller is used for connecting the patch panel to the switch through a network cable and connecting the patch panel to an external host through the switch.
In an exemplary embodiment, the network controller is configured to transmit node-related information including a Rack standard model motherboard to an external host.
In an exemplary embodiment, the network controller, the network physical PHY chip and the network connector RJ45 form a network system.
In an exemplary embodiment, the network physical PHY chip is configured to connect to a master control chip via an RGMII bus protocol;
and the network connector RJ45 is used for connecting the network physical PHY chip with an external switch through a medium related interface MDI.
Fig. 3 is a schematic diagram of a network system design of a patch panel according to an exemplary embodiment of the present invention, and as shown in fig. 3, the network system of the patch panel is composed of a network controller, a network physical PHY chip, and a network connector RJ 45.
When the master control chip adopts the ASD1250 model of BMC, a NIC network controller is integrated in the BMC of the ASD1250 model.
The NIC (network controller) in the main control chip is connected to the network physical PHY chip via the RGMII bus protocol, the network physical PHY chip is connected to the network connector RJ45 via the medium dependent interface MDI, and the network connector RJ45 is connected to the external switch, and is connected to the external host via the external switch.
Through the network system, the patch panel is connected to the switch through the network cable, and is connected to the external host through the switch, and the external host can acquire the node related information through the network system.
In an exemplary embodiment, the power conversion connection board is further configured to convert a voltage, and supply the converted voltage to a fan and related equipment on the adapter board; wherein the associated device comprises: master control chips and other IC devices.
Fig. 4 is a schematic diagram of a Power conversion connection board design of an interposer according to an exemplary embodiment of the invention, and as shown in fig. 4, a Power connector is further disposed in the motherboard, and the Power connector is connected to a Power connector through a P12V _ AUX cable, the Power connector is connected to a Power Bus Bar connector through a P12V _ AUX cable, and the Power Bus Bar connector performs voltage conversion through a voltage converter to supply Power to a network physical PHY chip, a main control chip, and a fan.
And connecting the mainboard with a power supply of the Rack standard type mainboard and a Rack power interface of the OCP standard type through the power supply conversion connecting plate. The interface mode of the power interface of the Rack standard type mainboard is different from that of the Rack power interface of the OCP standard type, the Rack power interface of the OCP standard type mainboard is a copper sheet, the power interface of the Rack standard type mainboard is a multi-pin power connector, the connector is generally 24 pins, and the power connector with the multi-pin power interface of the Rack standard type mainboard is connected with the copper sheet interface of the Rack power supply of the OCP standard type through the power conversion connecting plate.
This power conversion connecting plate carries out voltage conversion, supplies power to each equipment on the adapter plate, for example: the power supply required for the IC used on the conversion board, for example: the voltages applied by different network physical PHY chips are different, some need 1.2V, some need 1.8V, and voltage conversion power supply is carried out according to the voltage needed by the selected IC chip.
The application realizes a patch panel, the design is simple, the cost is low, the patch panel can be freely matched, the hardware architecture can be conveniently built, the compatibility is strong, common reference is provided for the subsequent projects of the same platform, the commonality is strong, and the development times of subsequent board cards are reduced.
In a second embodiment, a server system includes: the system comprises a Rack standard model main board, an open computing project OCP standard model Rack and a patch panel in any one of the above embodiments.
In the server system provided in this embodiment, the Rack standard model main board can be applied to the Rack of the open computing project OCP standard model through the adapter board. According to the server system, a mainboard does not need to be designed separately for different machine types, so that development resources are saved, product forms are enriched, and design benefits are maximized.
It will be understood by those of ordinary skill in the art that all or some of the steps of the methods, systems, functional modules/units in the devices disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. In a hardware implementation, the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed by several physical components in cooperation. Some or all of the components may be implemented as software executed by a processor, such as a digital signal processor or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art.
Claims (10)
1. An adapter plate is characterized in that a plurality of adapter plates are arranged in the shell,
the adapter plate is used for connecting the Rack standard model main board to a frame of an open computing project OCP standard model;
the keysets includes: the main control chip and the power supply conversion connecting plate;
the main control chip is used for acquiring temperature and regulating and controlling the rotating speed of the fan according to a set heat dissipation strategy, wherein the fan is positioned in a node of an OCP standard machine type;
and the power supply conversion connecting plate is used for connecting the power supply of the Rack standard type mainboard with the frame of the OCP standard type.
2. The interposer as recited in claim 1,
the Rack standard model mainboard comprises: a temperature sensor;
the temperature sensor is used for detecting the temperature and sending the detected temperature to the main control chip through an I2C bus.
3. The interposer as recited in claim 2, wherein said obtaining temperature and regulating fan speed according to a set heat dissipation strategy comprises:
and the main control chip is used for sending a driving signal to the corresponding fan in a Pulse Width Modulation (PWM) mode according to the received temperature so as to adjust the rotating speed of the fan according to the driving signal.
4. The interposer as recited in claim 3, wherein:
the main control chip is also used for determining the rotating speed of the fan according to the Tach signal received from the fan; wherein the Tach signal is returned after the fan adjusts the rotation speed.
5. The patch panel according to claim 1, wherein a network controller is further disposed in the main control chip;
and the network controller is used for connecting the patch panel to the switch through a network cable and connecting the patch panel to an external host through the switch.
6. The interposer as recited in claim 5,
and the network controller is used for transmitting the node related information comprising the Rack standard model mainboard to an external host.
7. The interposer as recited in claim 5,
the network controller, the network physical PHY chip and the network connector RJ45 form a network system.
8. The interposer as recited in claim 7,
the network physical PHY chip is used for connecting the main control chip through an RGMII bus protocol;
and the network connector RJ45 is used for connecting the network physical PHY chip with an external switch through a medium related interface MDI.
9. The interposer as recited in claim 8,
the power supply conversion connecting plate is also used for converting voltage and supplying the converted voltage to the fan and related equipment on the adapter plate;
wherein the associated device comprises: master control chips and other IC devices.
10. A server system, comprising: a Rack standard model motherboard, an open computing project OCP standard model Rack, and a patch panel as claimed in any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910733072.XA CN110609801A (en) | 2019-08-09 | 2019-08-09 | Adapter plate and server system |
| PCT/CN2019/121107 WO2021027183A1 (en) | 2019-08-09 | 2019-11-27 | Adapter board and server system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910733072.XA CN110609801A (en) | 2019-08-09 | 2019-08-09 | Adapter plate and server system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110609801A true CN110609801A (en) | 2019-12-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910733072.XA Pending CN110609801A (en) | 2019-08-09 | 2019-08-09 | Adapter plate and server system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110609801A (en) |
| WO (1) | WO2021027183A1 (en) |
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| TWI817714B (en) * | 2022-09-13 | 2023-10-01 | 英業達股份有限公司 | Server, adapter card and control method thereof |
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Also Published As
| Publication number | Publication date |
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| WO2021027183A1 (en) | 2021-02-18 |
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Application publication date: 20191224 |
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