CN110600461A - Packaging structure and electronic equipment - Google Patents

Packaging structure and electronic equipment Download PDF

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Publication number
CN110600461A
CN110600461A CN201910825765.1A CN201910825765A CN110600461A CN 110600461 A CN110600461 A CN 110600461A CN 201910825765 A CN201910825765 A CN 201910825765A CN 110600461 A CN110600461 A CN 110600461A
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CN
China
Prior art keywords
substrate
layer
package
elevated
components
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Granted
Application number
CN201910825765.1A
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Chinese (zh)
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CN110600461B (en
Inventor
曲林
叶润清
马富强
陈道锋
孙亮权
龙浩晖
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Honor Device Co Ltd
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Huawei Technologies Co Ltd
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Priority to CN201910825765.1A priority Critical patent/CN110600461B/en
Publication of CN110600461A publication Critical patent/CN110600461A/en
Application granted granted Critical
Publication of CN110600461B publication Critical patent/CN110600461B/en
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The application provides a packaging structure and an electronic device comprising the same. The packaging structure comprises a first substrate, a first packaging layer, an additional layer and a connecting part. Because the additional layer with first encapsulation layer electricity is connected, and first base plate and additional layer all are equipped with external pin for intraformational components and parts of first encapsulation can carry out signal connection through first base plate or additional layer and external structure, and components and parts can follow promptly packaging structure's both sides communicate with external structure, thereby the size that has reduced first base plate is to the influence of the integrated quantity of components and parts in the packaging structure, easily realizes the design of multi-functional high complexity's packaging system, promotes electronic equipment's miniaturization and the promotion of function diversification.

Description

Packaging structure and electronic equipment
Technical Field
The present application relates to the field of electronic information technology, and in particular, to a package structure and an electronic device including the package structure.
Background
In a conventional package structure, there is only a single-layer substrate, and after a component is disposed on the substrate, the component is packaged, that is, a package layer is formed on one side of the single-layer substrate. In the package structure, a connection with an external structure or module is generally achieved through a substrate, so as to achieve communication between components in the package structure and the outside. However, as electronic devices are miniaturized and function diversification is promoted, the number of components in the package structure is increasing. Because the miniaturized demand of electronic equipment, the area size of base plate receives the restriction, and the components and parts in the packaging structure all need be connected with external pin on the base plate to make the components and parts in the packaging structure communicate with external structure. And because the area size of base plate receives the restriction, be used for the components and parts in the intercommunication packaging structure and the external pin quantity of external structure receive the restriction to the integrated quantity of the components and parts in the packaging structure has been restricted, the promotion that influences electronic equipment's miniaturization and function diversification.
Disclosure of Invention
The application provides a packaging structure, a packaging method and electronic equipment comprising the packaging structure, and aims to reduce the influence of the size of a substrate on the integrated quantity of components in the packaging structure and avoid influencing the miniaturization and function diversification of the electronic equipment.
In a first aspect, the present application provides a package structure. The packaging structure comprises a first substrate, a first packaging layer, an additional layer and a connecting part, wherein the first packaging layer is packaged on the first substrate, the additional layer is stacked on one side, away from the first substrate, of the first packaging layer and is electrically connected with the first packaging layer, and the additional layer is fixed with the first packaging layer through the connecting part. The first substrate and one side of the additional layer, which deviates from the first packaging layer, are provided with external pins, and the external pins are used for being electrically connected with an external structure.
In this application, the package structure includes the first substrate, a first encapsulation layer, an additional layer, and a connection portion. Because the additional layer with first encapsulation layer electricity is connected, just first base plate reaches the additional layer all is equipped with the external pin that can external structure carry out the electricity and connect, makes intraformational components and parts of first encapsulation can pass through first base plate and the additional layer carries out the electricity with external structure and connects, and components and parts can follow promptly packaging structure's both sides communicate with external structure to the size that has reduced the base plate is to the influence of the integrated quantity of components and parts in the packaging structure, easily realizes the design of multi-functional high complexity's packaging system, promotes electronic equipment's miniaturization and the promotion of function diversification. In addition, as the components can be selectively connected to the first substrate or the additional layer according to actual needs, routing of the components of the first packaging layer and external structure communication can be more convenient.
In addition, in the embodiment of the present application, since the additional layer is fixed to the first package layer through the connection portion, compared with a manner that the additional layer and the first substrate are directly fixed to each other through the first package layer in some embodiments, the additional layer and the first package layer in the embodiment of the present application are easier to detach, so that when a package structure with a new function is required, the additional layer connected to the first package layer can be easily replaced. Specifically, by replacing and connecting an additional layer having a new function to the first package layer, a package structure having a new function can be obtained. In the embodiment of the application, the additional layer is simply replaced to obtain the packaging structure with the required new function, the operation is simple, and the waste of the first substrate and the first packaging layer can be avoided.
In some embodiments, the additional layer includes a second substrate, and a side of the second substrate facing away from the first package layer is provided with the external pin. The components in the first packaging layer can be selectively and electrically connected with the first substrate or the second substrate, so that the first substrate or the second substrate is electrically connected with the outside, and the influence of the size of the first substrate on the number of the components packaged in the first packaging structure is reduced.
In some embodiments, the additional layer further comprises a second encapsulation layer, the second encapsulation layer is encapsulated on the second substrate, and the second encapsulation layer is located on a side of the second substrate close to the first encapsulation layer. Through encapsulating the second encapsulation layer on the second base plate, also can encapsulate different components and parts in the second encapsulation layer to make the additional layer can certain function, through will have the second encapsulation layer the additional layer is connected to on the first encapsulation layer, can increase packaging structure's function, thereby can expand packaging structure's function through simple operation, and can not increase packaging structure's area occupied. For example, in some embodiments, an audio processing chip is packaged in the first package layer, and at this time, the package structure including the first package layer has an audio processing function. The sensor processing chip is packaged in the second packaging layer, and when an additional layer comprising the second packaging layer is connected to the first packaging layer, the packaging structure can have a sensor signal processing function, namely, the function of the packaging structure is expanded. When the functions of the packaging structure need to be changed according to actual needs, the additional layers with different functions can be replaced, the operation is simple, and the waste of the first substrate and the first packaging layer can be avoided.
In some embodiments, the first package layer includes a package material layer, and a plurality of spaced-apart elevated pillars, a plurality of components, and at least one third substrate embedded in the package material layer, where the third substrate is connected to the first substrate through the elevated pillars, and the plurality of components are fixed on the first substrate or the third substrate.
In the embodiment of the application, connect third base plate and first base plate through the elevating post, it is higher than first base plate to make the third base plate through the elevating post, thereby make and have sufficient space between third base plate and the first base plate in packaging structure's thickness direction, with the convenience can set up components and parts in first base plate orientation first encapsulation layer's one side and the one side or the two sides homoenergetic of third base plate, realize that components and parts pile up the setting on packaging structure's thickness direction, with the density that improves the components and parts in the packaging structure. In addition, the size of the first substrate can be reduced, and the occupied area of the packaging structure is reduced. The thickness direction of the package structure is perpendicular to the first surface of the first substrate.
In some embodiments, the first package layer includes a package material layer, and a plurality of spaced-apart elevated pillars, a plurality of components, and a plurality of third substrates embedded in the package material layer, at least two of the third substrates partially overlap or completely overlap in an orthographic projection on the first substrate, the third substrates partially overlapping or completely overlapping in an orthographic projection on the first substrate are connected by the elevated pillars, and the plurality of components are fixed on the first substrate or the third substrate.
In an embodiment of the present application, the first package layer includes a plurality of third substrates, and orthographic projections of at least two of the third substrates on the first substrate partially overlap or completely overlap, that is, a part of the third substrates are stacked in a thickness direction of the package structure. And, the orthographic projection part on the first substrate overlaps or all overlaps pass through between the third base plate connect through the elevated column, pile up through the elevated column between the third base plate that sets up promptly in thickness direction and connect to make also can have sufficient space between the third base plate of piling up in thickness direction, so that the one side or the two sides of the third base plate of piling up in thickness direction all can set up components and parts, thereby can make components and parts further pile up in packaging structure's thickness direction, improve the density of components and parts in the packaging structure.
In some embodiments, both sides of the third substrate are connected with components, so that the space in the thickness direction of the package structure is utilized as much as possible, and the density of the components in the package structure is improved.
In some embodiments, the first package layer includes a package material layer, and a plurality of spaced-apart elevated pillars, a plurality of components, and a plurality of third substrates embedded in the package material layer, where the elevated pillars are fixed on the first substrate or the third substrate, and one end of each elevated pillar departing from the first substrate or the third substrate extends to a surface of the package material layer departing from the first substrate. In other words, one end of the elevated column is fixed on the first substrate or the third substrate, and the other end extends to the surface of the packaging material layer. And because the elevated column is a conductive structure, that is, the end face of the elevated column extending to the surface of the packaging material layer is a connection terminal for connecting the first packaging layer with other structures, and other structures are connected to the end face of the elevated column extending to the surface of the packaging material layer, so as to realize electrical connection with the first substrate, the third substrate in the first packaging layer and the component.
In some embodiments, the elevated column is also an insulating structure formed by insulating materials, and can only play a role of elevating, but can not realize an electric connection role.
In the embodiment of the present application, the elevated column may be of different types. Specifically, the elevated column may be a preformed columnar structure, and the elevated column is connected to the third substrate or the first substrate through solder or conductive adhesive; alternatively, the elevated pillar may be a conductive pillar located in a via hole in the first package layer, and the conductive pillar is in contact with the third substrate or the first substrate; alternatively, the elevated column may be integrally formed with the third substrate. When the elevated column is in a preformed columnar structure, the two ends of the elevated column are both provided with solder or conductive adhesive, and the elevated column is fixedly connected with the first substrate or the third substrate through the solder or the conductive adhesive. When the elevated column is a conductive column located in the via hole in the first packaging layer, the elevated column is in direct contact with the first substrate or the third substrate connected with the elevated column. Specifically, the elevated column of this type is formed in a specific manner: after the first packaging material layer is packaged, an opening extending to the substrate (which may be the first substrate or the third substrate) is formed on the formed first packaging layer, and then a metal material is filled in the opening by sputtering or other processes to form a conductive pillar, so that the conductive pillar is in contact with the substrate, and the conductive pillar is electrically connected with the substrate. Because the conductive columns are formed after the first packaging layer is provided with the holes, the conductive columns and the substrate do not need to be fixed through solder or viscose, namely, the elevated columns are directly contacted with the first substrate or the third substrate connected with the elevated columns. When the elevated column and the third substrate are integrally formed, one end of the elevated column and the third substrate are in an integral structure, and the other end of the elevated column is connected with solder or conductive adhesive, so that the elevated column and the third substrate are fixedly connected with the first substrate or other third substrates through the solder or the conductive adhesive.
In some embodiments, a plurality of the elevated columns are stacked in a thickness direction of the package structure, and the plurality of the elevated columns are different in type. When the length requirement of the elevated column is longer, namely the positions of the structures needing to be connected are far away from each other, the elevated column can be stacked, so that the manufacturing difficulty is reduced. For example, when it is required to form an elevated pillar extending from the first substrate to the surface of the first package layer, the height of the elevated pillar needs to be higher because the distance from the first substrate to the first package layer is longer. When the elevated column is the preformed conductive column, the elevated column is higher in height, so that the welding or bonding operation is inconvenient, the elevated column is not easy to keep stable relative to the first substrate, and the problem of open circuit is easy to occur. In some embodiments, two of the elevated pillars are stacked in the thickness direction of the package structure, that is, a shorter preformed conductive pillar is fixed on the first substrate, so that the preformed conductive pillar has a shorter size, and thus the conductive pillar can be fixed on the first substrate more easily and stably. And then, packaging the first substrate by using the first packaging material layer, opening a hole on the first packaging layer after packaging is finished, extending the opening to the conductive post, forming the conductive post in the opening, and finally stacking the two types of conductive posts so as to reduce the manufacturing difficulty and ensure the connection effect.
In some embodiments, the elevated column includes a column core and a cladding layer covering an outer circumferential surface of the column core, the cladding layer is made of a conductive material, and a roughness of an outer circumferential surface of the cladding layer is smaller than a roughness of an outer circumferential surface of the column core. In the embodiment of the application, the roughness of the outer peripheral surface of the coating layer is smaller than that of the outer peripheral surface of the column core, and the elevated column can have a good signal transmission effect due to the attachment effect of signals.
In some embodiments, the elevated column includes a column core and a cladding layer covering an outer circumferential surface of the column core, the column core is formed of a conductive material, and the cladding layer is formed of an insulating material. In the embodiment of the application, through the surface cladding insulating layer at the post core for can have better insulating effect between the adjacent elevated column, when making can guarantee that the signal of transmission can not produce the interference in the elevated column, make the distance of two elevated columns can be more nearly, thereby can increase the flexibility of walking the line in the packaging structure.
In some embodiments, the package structure further includes a plurality of protruding portions disposed on the third substrate at intervals, the protruding portions protrude from a surface of the third substrate, and an end surface of the protruding portion facing away from the third substrate is in contact with the first substrate or another third substrate opposite to the third substrate. In the embodiment of the present application, the third substrate is elevated relative to the first substrate or another third substrate by the protruding portion.
In some embodiments, the protruding portion is made of an insulating material, and a plurality of conductive pillars are embedded in the protruding portion, and the conductive pillars are electrically connected to the third substrate and the first substrate or another third substrate in contact with the protruding portion.
In some embodiments, the second substrate includes a substrate and a patch antenna disposed on the substrate, and the patch antenna is electrically connected to a part of the components in the first package layer through the substrate. In this embodiment, the second substrate is a patch antenna substrate, the substrate is a circuit board, and the patch antenna can be electrically connected with part of components in the first package layer through the substrate, so that the package structure can realize the transmission function of the radio frequency signal.
In some embodiments, components are embedded in the second substrate, the components in the second substrate are connected to the internal traces of the second substrate, and the components in the second substrate are electrically connected to the components in the first package layer. The second substrate is embedded with components, the components in the second substrate are connected with the components in the first packaging layer through the wiring in the second substrate, and the electrical connection between the components in the second substrate and the components 22 in the first packaging layer is realized. In this embodiment, through the embedded components and parts that establish at the second base plate to make full use of second base plate's inner space, thereby can reduce the quantity of the intraformational components and parts of first encapsulation, and then reduce packaging structure's volume, improve packaging structure's suitability.
In some embodiments, the connection portion is solder or conductive adhesive, the connection portion is located between the additional layer and the first package layer, and the additional layer and the first package layer are fixed and electrically connected through the connection portion. Compared with the mode that the first substrate is directly packaged with the additional layer through the first packaging layer, the mode that the additional layer is connected with the first packaging layer through the solder or the conductive adhesive can more conveniently separate the additional layer from the first packaging layer, so that the additional layer is convenient to replace.
In some embodiments, the connecting portion is a fixing cover, the additional layer is fixed on the fixing cover, the fixing cover includes a receiving cavity, and the additional layer, the first substrate and the first encapsulation layer are received in the receiving cavity; the fixing cover comprises a top wall and a peripheral wall arranged around the top wall, the top wall and the peripheral wall enclose the accommodating cavity, the top wall of the fixing cover is in contact with the additional layer, and the top wall of the fixing cover presses the additional layer onto the first packaging layer, so that the additional layer is fixed relative to the first packaging layer and keeps the additional layer electrically connected with the first packaging layer.
In some embodiments, the first package layer includes a first package material layer, and a plurality of components and conductive pillars embedded in the package material layer, where the plurality of components includes a plurality of passive devices, each of the passive devices includes a connection terminal, at least two of the plurality of passive devices are stacked in a thickness direction of the package structure, and the stacked passive devices are electrically connected to each other through the conductive pillars.
In this application embodiment, the components and parts in the first packaging layer directly pile up the setting on packaging structure's thickness direction to improve packaging structure's the density of components and parts, and reduce the size of first base plate, reduce packaging structure's area occupied. The components and parts of this embodiment are connected through leading electrical pillar electricity, compare in with components and parts direct stacking, through the pin direct contact of components and parts in order to realize the mode of electricity connection between the components and parts, the flexibility that can be more in the setting of the components and parts in the first encapsulation layer to can improve the density of the components and parts in the first encapsulation layer. Specifically, when components and parts are directly stacked, when the pins of the components and parts are directly contacted to realize the electric connection between the components and parts, the pins of the components and parts can be just contacted when the stacking is required to be ensured, and therefore, the size and the arrangement position of the components and parts need to meet certain requirements. When the components are connected through the conductive columns, the pins of the stacked components do not need to be in direct contact, so that the size and the arrangement position of the components are not strictly required, the flexibility of the arrangement of the components in the first packaging layer can be enhanced, and the density of the components in the first packaging layer is improved. In some embodiments, the conductive posts may also be curved conductive traces, so as to better connect the pins of the stacked components.
In a second aspect, the present application provides an electronic device, which includes a functional module and the package structure, wherein the functional module is electrically connected to the package structure.
In this application, because the size of packaging structure's base plate is less to the influence of the integrated quantity of components and parts in the packaging structure, easily realizes the design of multi-functional high complexity's packaging system to can promote electronic equipment's miniaturization and the promotion of function diversification. In addition, the packaging structure with the required new function can be obtained by simply replacing the additional layer, so that the functions of the electronic equipment can be conveniently replaced or expanded, and the diversification of the functions of the electronic equipment is further improved.
In some embodiments, the functional module includes one or more of an antenna module, a sensor module, an audio module, a camera module, a connector module, and a power module.
In a third aspect, the present application further provides a packaging method. The packaging method comprises the following steps:
forming a first packaging layer on a first substrate, wherein one surface of the first substrate is provided with an external pin, and the first packaging layer is formed on the surface of the first substrate deviating from the external pin; the method comprises the following steps that an additional layer is fixed with a first packaging layer through a connecting portion, so that the additional layer is fixed with the first packaging layer and electrically connected with the first packaging layer, wherein one side, deviating from the first packaging layer, of the additional layer is provided with an external pin, and the external pin is used for being electrically connected with an external structure.
In the embodiment of the application, the first package layer is formed on the first substrate, and the additional layer and the first package layer are fixed together and electrically connected through the connecting portion. Compared with a mode of directly packaging the first substrate and the additional layer together through the first packaging layer, the additional layer and the first packaging layer in the embodiment of the application are easier to detach, so that the additional layer connected to the first packaging layer can be easily replaced when a packaging structure with a new function is required.
In some embodiments, the forming a first encapsulation layer on a first substrate includes:
fixing a plurality of elevated columns on a first substrate provided with components, wherein the elevated columns are arranged at intervals; and fixing a third substrate provided with components on at least part of the plurality of elevated columns arranged on the first substrate.
In some embodiments, after the fixing the third substrate provided with the component on at least some of the plurality of elevated columns provided on the first substrate, the method further includes:
fixing a plurality of elevated columns on one surface of the third substrate, which is far away from the first substrate; and fixing the other third substrate provided with the component on an elevated column arranged on the third substrate.
In some embodiments, said securing the third substrate to the elevated column further comprises:
fixing a plurality of elevated columns on one surface of the third substrate, which is far away from the first substrate; form the packaging material layer on the first base plate, the packaging material layer deviates from the surface of first base plate with locate overhead column on the third base plate deviates from the one side parallel and level of third base plate, just overhead column on the third base plate deviates from the terminal surface of third base plate exposes packaging material layer.
In some embodiments of the present application, the elevated column and the third substrate are fixed on the first substrate, the component is fixedly connected on the third substrate and the first substrate, and then the packaging material layer is packaged, so as to obtain the first packaging layer.
In some embodiments, said fixing the third substrate to the elevated column further comprises:
forming a packaging material layer on the first substrate, wherein the packaging material layer covers the third substrate and the component;
forming an opening in the packaging material layer, the opening extending to the third substrate, the component, the first substrate or the elevated column, on a surface of the packaging material layer facing away from the first substrate;
and filling a conductive material in the open hole to form a conductive column, wherein one end of the conductive column is connected with the third substrate, the component or the first substrate, and the other end of the conductive column extends to the end face of the packaging material layer, deviates from the end face of the third substrate, is flush with the end face of the packaging material layer, and is exposed out of the packaging material layer.
In some embodiments, forming a first encapsulation layer on the first substrate comprises:
forming a packaging material layer on a first substrate provided with a component, wherein the packaging material layer covers the component on the first substrate, a groove is concavely formed in the direction of one surface of the packaging material layer, which is far away from the first substrate, towards the first substrate, and the bottom wall of the groove is spaced from the component on the first substrate;
an opening is formed in the bottom wall of the groove, and one end, far away from the groove, of the opening extends to the first substrate or a component arranged on the first substrate;
filling a conductive material in the opening to form a conductive column, so that the conductive column is electrically connected with the first substrate or a component on the first substrate;
arranging a component or a third substrate provided with a component in the groove, wherein the conductive column is electrically connected with the component or the third substrate in the groove;
and forming a sub-packaging material layer in the groove, wherein the sub-packaging material layer fills the groove, and the component in the groove is embedded in the sub-packaging material layer.
In some embodiments, when the third substrate provided with the component is disposed in the groove, before forming the sub-packaging material layer in the groove, the method includes:
fixing a prefabricated elevated column on the third substrate, wherein the elevated column is electrically connected with the third substrate; after the sub-packaging material layer is formed in the groove, the elevated column fixed on the third substrate is embedded in the sub-packaging material layer;
and grinding the first packaging layer deviated from the first surface to enable the end face, deviated from the third substrate, of the elevated column on the third substrate to be exposed out of the sub-packaging material layer and to be flush with one face, deviated from the first substrate, of the sub-packaging material layer.
Through be fixed with the third base plate of elevating post in the recess to make on the third base plate the elevating post deviates from the terminal surface of third base plate exposes sub-packaging material layer makes the additional layer pass through the elevating post exposes sub-packaging material layer's terminal surface and third base plate carry out the electricity and are connected, and then realize with the electricity of the intraformational components and parts of first encapsulation is connected.
In some embodiments, forming a sub-packaging material layer in the recess comprises:
arranging an opening in the sub-packaging material layer on the surface, which is far away from the first substrate, of the sub-packaging material layer, wherein the opening extends to the component in the groove or the third substrate in the groove;
and filling a conductive material in the opening to form a conductive column embedded in the opening, wherein the conductive column is electrically connected with the component in the groove or the third substrate in the groove.
In some embodiments, after the sub-package layer is packaged, an opening is formed in the packaged sub-package material layer, and the opening is filled with a conductive material to form the conductive pillar. When the additional layer is electrically connected with the first packaging layer, the additional layer can be electrically connected with the conductive posts, and therefore the electrical connection with the component in the first packaging layer is achieved.
Drawings
To more clearly illustrate the structural features and effects of the present application, a detailed description is given below in conjunction with the accompanying drawings and specific embodiments.
Fig. 1 is a schematic diagram illustrating an internal structure of an electronic device according to some embodiments of the present application;
fig. 2 is a schematic structural diagram of a package structure according to some embodiments of the present application;
FIG. 2a is a schematic structural diagram of a package structure according to another embodiment of the present application;
FIG. 3 is a schematic structural diagram of a package structure according to other embodiments of the present application;
FIG. 4 is a schematic front view of a third substrate according to some embodiments of the present application;
FIG. 5 is a schematic side view of a third substrate according to some embodiments of the present application;
FIG. 6 is a schematic structural view of an elevated column of some embodiments of the present application;
FIG. 7 is a schematic structural diagram of a package structure according to another embodiment of the present application;
FIG. 8 is a schematic structural diagram of a package structure according to another embodiment of the present application;
fig. 9 is a schematic structural diagram of a package structure according to another embodiment of the present application;
FIG. 10 is a schematic structural diagram of a package structure according to another embodiment of the present application;
fig. 11 is a schematic structural diagram of a package structure according to another embodiment of the present application;
fig. 12 is a schematic structural diagram of a package structure according to another embodiment of the present application;
fig. 13 is a schematic structural diagram of a package structure according to another embodiment of the present application;
FIG. 14 is a flow chart of a packaging method according to some embodiments of the present application;
FIG. 15 is a flow chart illustrating a method of forming a first encapsulation layer in an encapsulation method according to some embodiments of the present application;
FIG. 16 is a flowchart illustrating a method of forming a first encapsulation layer in an encapsulation method according to further embodiments of the present application;
FIG. 17 is a flowchart illustrating a method of forming a first encapsulation layer in an encapsulation method according to further embodiments of the present application;
fig. 18 is a flowchart illustrating a method for forming a first encapsulation layer in an encapsulation method according to another embodiment of the present application.
Detailed Description
Technical solutions in some embodiments of the present application will be described below with reference to the drawings in some embodiments of the present application.
The application relates to a packaging structure, a packaging method and an electronic device comprising the packaging structure. The electronic device can be a mobile phone, a tablet computer or a router. The packaging structure can integrate the active device and/or the passive device in a package. The active device may be one or more of active devices such as a processor and a memory, and the passive device may be one or more of passive devices such as a capacitor element, an inductor element and a resistor element. In some embodiments of the present application, the package structure is electrically connected to the functional module of the electronic device, so that the functional module of the electronic device is controlled to operate through the cooperation of the active element and the passive element inside the package structure.
For example, referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 1000 according to some embodiments of the present application. The electronic device 1000 is a mobile phone. The functional modules of the mobile phone include a package structure 100, an antenna module 200, an audio module 300, a sensor module 400, a camera module 500, a connector module 600 and a power module 700, wherein the package structure 100 is electrically connected with other functional modules of the mobile phone (including the antenna module 200, the audio module 300, the sensor module 400, the camera module 500, the connector module 600 and the power module 700), so that the functional modules are controlled to work through communication between components (including active devices such as a processor and a memory and passive devices such as a capacitor element, an inductor element and a resistor element) in the package structure 100. It is understood that in some other embodiments of the present application, the electronic device may be other devices including other types of functional modules, and the functional modules are electrically connected to a package structure in the electronic device to realize functions of the electronic device. In some embodiments, the electronic device 1000 further includes a motherboard, and the package structure 100, a part of or all of the functional modules are disposed on the motherboard. The mainboard is Printed Circuit Board (PCB), and the circuit connection packaging structure through the mainboard with locate each functional module on the mainboard, realize packaging structure 100 and locate the mainboard on each functional module between the electricity be connected.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a package structure 100 according to some embodiments of the present application. The package structure 100 includes a first substrate 10, a first package layer 20, an additional layer 30 and a connection portion 40. The first encapsulation layer 20 is encapsulated on the first substrate 10. The additional layer 30 is stacked on a side of the first encapsulation layer 20 away from the first substrate 10 and electrically connected to the first encapsulation layer 20, and the additional layer 30 is fixed to the first encapsulation layer 20 through a connection portion 40.
The first substrate 10 is a general wiring board. The circuit board may be a Printed Circuit Board (PCB). The first substrate 10 includes a first surface 11 facing the first encapsulation layer 20 and a second surface 12 opposite to the first surface 11, and a component 22 is disposed on the first surface 11 and/or the second surface 12 of the first substrate 10. The component 22 is mounted on the first substrate 10 by means of a die bonding or the like. The component 22 is disposed on the first surface 11 and/or the second surface 12 of the first substrate 10, which means that the component 22 may be disposed on the first surface 11, the second surface 12, or both the first surface 11 and the second surface 12. In the embodiment shown in fig. 2, the component 22 is provided on the first surface 11. It is understood that in some embodiments, the component 22 may also be disposed on the second surface 12. For example, in the embodiment shown in fig. 2a, the first surface 11 and the second surface 12 of the first substrate 10 are both provided with components 22. In some embodiments of the present application, the second surface 12 has a plurality of external pins 121, and the external pins 121 are connected to traces in the first substrate 10, so that the package structure 100 is connected to external structures (such as the component 22, the substrate, and the functional module outside the package structure 100) outside the package structure 100 through the external pins 121. In the embodiment shown in fig. 2, the external leads 121 on the second surface 12 are solder balls. It is understood that the external connection pin 121 may also be in other forms such as a metal dome, a bonding wire, etc. It is required that the arrangement position, the number, the type of the component 22 and the position and the number of the external pins 121 in the embodiment shown in fig. 2 are schematic, and the arrangement position, the number, the type of the component 22 and the position and the number of the external pins 121 are not specifically limited in this application.
The first encapsulation layer 20 is encapsulated on the first surface 11 of the first substrate 10. The first package layer 10 includes a package material layer 21 and a plurality of components 22 embedded in the package material layer 21. In the embodiment of the present application, since the first encapsulation layer 20 covers the first surface 11 of the first substrate 10, the component 22 disposed on the first surface 11 is also a part of the first encapsulation layer 20, that is, a part of the plurality of components 22 in the first encapsulation layer 20 is the component 22 connected to the first substrate 10. The plurality of components 22 may be active devices such as a processor and a memory, or passive devices such as a capacitor element, an inductor element, and a resistor element; alternatively, the component 22 may be partially an active device and partially a passive device.
The first encapsulation layer 20 further includes a plurality of elevated pillars 24 and one or more third substrates 23 disposed on a side of the first substrate 10 facing the first encapsulation layer 20. Some of the components 22 in the plurality of components 22 in the first encapsulation layer 20 are provided on the third substrate 23. Specifically, the component 22 may be disposed on a surface of the third substrate 23 facing the first substrate 10, or may be disposed on a surface of the third substrate 23 facing away from the first substrate 10, that is, the component 22 may be disposed on one surface or two opposite surfaces of the third substrate 23.
In some embodiments, the third substrate 23 is electrically connected to the first substrate 10, such that the components 22 disposed on the third substrate 23 are indirectly electrically connected to the first substrate 10. In some embodiments of the present application, at least one third substrate 23 is connected to the first substrate 10 by an elevated column 24, and the elevated column 24 connecting the first substrate 10 and the third substrate 23 is connected between the first substrate 10 and the third substrate 23. The third substrate 23 and the first substrate 10 are connected by the raising column 23, that is, the third substrate 23 is raised above the first substrate 10 by the raising column 24, so that a sufficient space is provided between the third substrate 23 and the first substrate 10 in the thickness direction of the package structure 100, the components 22 can be conveniently arranged on one surface of the first substrate 10 facing the first package layer 20 and one surface or two surfaces of the third substrate 23, and the components 22 are stacked in the thickness direction of the package structure 100, so as to improve the density of the components 22 in the package structure 100. In addition, the size of the first substrate 10 can be reduced, and the footprint of the package structure 100 can be reduced. The thickness direction of the package structure 100 refers to a direction perpendicular to the first surface 11 of the first substrate 10.
In some embodiments, the orthographic projection of at least two third substrates 23 of the plurality of third substrates 23 on the first substrate 10 are overlapped. The overlapping in the present application may be partial overlapping or complete overlapping. I.e., portions of the third substrate 23 are stacked in the thickness direction of the package structure 100. Wherein, an elevated column 24 is connected between two adjacent third substrates 23 with partially or completely overlapped orthographic projections on the first substrate 10, that is, the third substrates 23 stacked in the thickness direction are connected by the elevated column 24. In the embodiment of the present application, the elevated column 24 is connected between the third substrates 23 stacked in the thickness direction, so that a sufficient space can be provided between the third substrates 23 stacked in the thickness direction, and one or both sides of the third substrates 23 stacked in the thickness direction can be conveniently provided with the component 22, so that the component 22 can be further stacked in the thickness direction of the package structure 100, and the density of the component 22 in the package structure 100 is improved.
In some embodiments, orthographic projections of portions of third substrate 23 on first substrate 10 do not coincide, i.e., portions of third substrate 23 correspond to different regions of first substrate 10. In the embodiment shown in fig. 2, some of the third substrates 23 are elevated above the first substrate 10 by the elevating posts 24, and some of the third substrates 23 are elevated above other third substrates 23 by the elevating posts 24, so that there is enough space between the third substrates 23 and the first substrate 10 or between the third substrates 23 stacked in the thickness direction of the package structure 100, so as to facilitate the arrangement of the components 22 on one side of the first substrate 10 facing the first package layer 20 and on one side or both sides of the third substrates 23, thereby realizing the stacking arrangement of the components 22 in the thickness direction of the package structure 100, so as to improve the density of the components 22 in the package structure 100, and reduce the size of the first substrate 10 and the occupied area of the package structure 100.
The elevated column 24 may be a conductive structure or a non-conductive structure. When the elevated column 24 is a conductive structure, the elevated column 24 may be made of a conductive metal such as copper and aluminum, or a conductive material such as conductive ceramic. At this time, the elevated column 24 can function as an elevated structure or as a structure for electrically connecting the substrates (the first substrate 10 and the third substrate 23) connected to both ends of the elevated column 24, or as both an elevated structure and a substrate connected to both ends of the elevated column 24; when the elevated column 24 is a non-conductive structure, the elevated column 24 may be formed of an insulating material such as resin, rubber, or the like. At this time, the raising column 24 can only play a role of raising. Therefore, in some embodiments of the present application, the elevated pillars 24 at different positions can be selected to be conductive pillars or non-conductive pillars according to actual needs.
In some embodiments of the present application, the type of elevated pillars 24 includes a pre-formed pillar structure or a conductive pillar located within the via 211 in the first package layer 20, i.e., the elevated pillars 24 may be pre-formed pillar structures or conductive pillars located within the via 211 in the first package layer 20. The via 211 in the first package layer 20 of the present application is similar to a metalized hole in a printed circuit board, and is formed by forming a via 211 on the first package layer 20, plating a layer of conductive material (e.g., metal material such as aluminum, copper, silver, etc.) on a hole wall, or depositing a conductive material in the via 211, so as to form a conductive pillar. The via holes 211 formed in the first package layer 20 may be through holes penetrating through the first package layer 20 according to actual needs, or may be buried closed holes embedded in the first package layer 20, or open holes extending from one surface of the first package layer 20 to the inside of the first package layer 20. It is understood that the elevated column 24 may be a cylindrical structure or a tubular structure.
The preformed columnar structure means that the elevated column 24 is a prefabricated columnar conductive or non-conductive structure, and when the prefabricated elevated column 24 is fixed to the substrate (including the first substrate 10 and the third substrate 23) through processes such as welding or gluing, that is, when the prefabricated elevated column 24 is connected to the substrate, two ends of the elevated column 23 are in contact with the solder or the glue, so that the elevated column 23 is fixedly connected to the substrate through the solder or the glue. In some embodiments, the third substrate 23 and the elevated column 24 connected thereto may be obtained by an integral molding manner such as injection molding, that is, the third substrate 23 and the elevated column 24 connected thereto form an integral structure, so that it is not necessary to connect the third substrate 23 and the elevated column 24 by solder or glue layer, and further impedance of signals transmitted between the third substrate 23 and the elevated column 24 is reduced, thereby obtaining a better signal transmission effect, and further improving stability of a product using the package structure due to reduction of times of soldering. When the elevated column 24 is a conductive structure, the adhesive is a conductive adhesive.
The conductive pillars located in the via holes 211 of the first package layer 20 are formed by forming the via holes 211 extending to the substrate on the first package layer 20 after the first package layer 20 is formed, and then filling a metal material in the via holes 211 by sputtering or the like to form the conductive pillars, so that the conductive pillars are in contact with the substrate, i.e., the conductive pillars can be electrically connected to the substrate. Since the conductive posts are formed after the via holes 211 are formed on the first package layer 20, the conductive posts and the substrate do not need to be fixed by solder or adhesive. In the present embodiment, the elevated column 24 may be a solid column structure, or may be a hollow tubular structure. For example, a metal material is sputtered on the inner wall of the via hole 211, so that the metal material does not completely fill the open hole, thereby forming a tubular conductive pillar, and the raised pillar 24 is a hollow tubular structure.
In some embodiments, when two substrates are connected by the pre-formed elevated columns 24, the elevated columns 24 between the two substrates are multiple to stably support the substrates by the multiple elevated columns 24. It will be appreciated that the plurality of elevated columns 24 may be located at any position on the base plate as desired. And, a plurality of elevated pillars 24 are disposed at intervals, so that a subsequent encapsulation process can be smoothly performed, and an encapsulation material layer 21 having a uniform thickness can be formed at each position on the first substrate 10.
In some embodiments of the present application, the side of the first encapsulation layer 20 facing the additional layer 30 has connection points 241, and the side of the additional layer 30 facing the first encapsulation layer 20 has connection terminals. In some embodiments, the connection point 241 of the first packaging layer 20 is an end surface of the elevated column 24 exposed out of the first packaging layer 20. The connection point 241 of the first package layer 20 is opposite to the connection terminal of the additional layer 30, and when the additional layer 30 is connected to the first package layer 20 through the connection portion 40, the connection terminal and the connection point 241 can be electrically connected or directly contacted through the connection portion 40, so that the first package layer 20 and the additional layer 30 are electrically connected, and the component 22 in the first package layer 20 and the first substrate 10 can be electrically connected to the additional layer 30. The additional layer 30 is fixed to the first package layer 20 through the connection portion 40, and compared with a method of directly packaging the first substrate 10 and the additional layer 30 together through the first package layer 20, due to the existence of the connection portion 40, the additional layer 30 can be more conveniently assembled and disassembled with the first package layer 20. In some embodiments of the present application, the additional layer 30 may be various, and may include, for example, a second substrate, a second encapsulation layer, or a second substrate and a second encapsulation layer stacked on the second substrate. The second substrate can be a common circuit board, and can also be a circuit board with special functions such as a patch antenna substrate and the like; the second packaging layer may be a packaging structure in which components are packaged. Since the additional layer 30 can be easily detached from the first package layer 20, different types of additional layers 30 can be easily replaced on the first package layer 20, and different functions of the package structure 100 can be extended as required.
In some embodiments of the present application, one side of the first substrate 10 and the additional layer 30 departing from the first package layer 20 is provided with an external pin, so that the component 22 in the first package layer 20 can be connected with an external structure through the external pin of the first substrate 10 and the additional layer 30, so that the component 22 can be communicated with the external structure from two sides (the first substrate 10 side and the additional layer 30 side) of the package structure 100, thereby reducing the influence of the size of the substrate on the integrated number of the component 22 in the package structure 100, and easily realizing the design of a multifunctional high-complexity package system. Moreover, since the component 22 can be connected to the first substrate 10 or the additional layer 30 according to actual needs, routing of the component 30 communicating with the outside can be more convenient.
The structure of the package structure 100 of some embodiments of the present application shown in fig. 2 and 3 is illustrated in detail below, taking the first package layer 20 of the package structure 100 shown in fig. 2 and 3 as an example.
In the embodiment shown in fig. 2, five third substrates 23 are disposed in the first encapsulating layer 20, wherein the five third substrates 23 are a third substrate 23A, a third substrate 23B, a third substrate 23C, a third substrate 23D and a third substrate 23E, respectively. Orthographic projections of the third substrate 23B and the third substrate 23C on the first substrate 10 are overlapped, orthographic projections of the third substrate 23D and the third substrate 23E on the first substrate 10 are overlapped, and the third substrate 23A, the third substrate 23B and the third substrate 23D correspond to different positions of the first substrate 10, respectively. In the embodiment shown in fig. 2, the elevated pillars 24 connecting the substrates include pre-formed elevated pillars 24A, and conductive pillars 24B located in the vias 211 in the first encapsulation layer 20, and elevated pillars 24C integrally formed with the third substrate 23. In other words, the elevated pillars 24A are pre-formed pillar structures, and the elevated pillars 24B are conductive pillars located in the vias 211 in the first package layer 20. The third substrate 23A, the third substrate 23B, and the third substrate 23D are connected to the first substrate 10 through the preformed elevated column 24A, so that the third substrate 23A, the third substrate 23B, and the third substrate 23D are elevated relative to the first substrate 10 through the elevated column 24A, and sufficient space is provided between the third substrate 23A, the third substrate 23B, and the third substrate 23D and the first substrate 10, so that the components 22 can be stacked in the space between the third substrate 23A, the third substrate 23B, and the third substrate 23D and the first substrate 10, and thus the components 22 are stacked in the thickness direction of the package structure 100, the density of the components 22 in the package structure 100 is increased, and the occupied area of the package structure 100 is reduced. Since the orthographic projections of the third substrates 23B and 23C on the first substrate 10 are overlapped and the orthographic projections of the third substrates 23D and 23E on the first substrate 10 are overlapped, the third substrates 23B and 23C are connected by the pre-formed elevated columns 24A, and the third substrates 23D and 23E are connected by the pre-formed elevated columns 24A, so that the third substrate 23C is elevated relative to the third substrate 23B, and the third substrate 23E is elevated relative to the third substrate 23D, so that the components 22 can be disposed on both sides of the third substrate 23B facing the third substrate 23C and on both sides of the third substrate 23D facing the surface of the third substrate 23E and 23F, thereby achieving the stacked arrangement of the components 22 in the thickness direction of the package structure 100 to increase the density of the components 22 in the package structure 100, and reduces the footprint of the package structure 100. In this embodiment, the third substrate 23D and the elevated column 24A connected between the third substrate 23D and the first substrate 10 are integrated.
In the embodiment shown in fig. 2, an elevated pillar 24B is further disposed in the first encapsulation layer 20, and the elevated pillar 24B extends from a surface of the first encapsulation layer 20 away from the first substrate 10 to the first substrate 10 or the third substrate, or extends to an elevated pillar 24A fixed on the first substrate 10 and the third substrate. The elevated pillars 24B are formed by forming openings on a surface of the first encapsulation layer 20 away from the first substrate 10, where the openings extend to the first substrate 10 and the third substrate or are fixed on the elevated pillars 24A on the first substrate 10 or the third substrate. And filling a conductive material into the opening to obtain an elevated column 24B, so that one end surface of the elevated column 24B is in contact with the first substrate 10 or the third substrate, and the other end surface is located on the surface of the first packaging layer 20 deviating from the first substrate 10, thereby transmitting the signal transmitted on the first substrate 10 or the third substrate to the surface of the first packaging layer 20 through the elevated column 24B.
In this embodiment, the connection portion 40 is located between the first package layer 20 and the additional layer 30 to connect and fix the first package layer 20 and the additional layer 30. The end surface of the elevated column 24B on the surface of the first encapsulation layer 20 facing away from the first substrate 10 is the connection point 241 of the first encapsulation layer 20 in this embodiment. The additional layer 30 is provided with connection terminals. In this embodiment, the additional layer 30 is a circuit board, and the connection terminals on the additional layer 30 are pads of the second substrate. When the additional layer 30 and the first package layer 20 are fixed by the connection portion 40, the connection point 241 of the first package layer 20 and the connection terminal on the additional layer 30 are electrically connected by the connection portion 40, so as to realize the electrical connection between the additional layer 30 and the first package layer 20, and thus realize the communication between the component 22 in the first package layer 20 and the additional layer 30.
In the embodiment shown in fig. 3, the plurality of third substrates 23 includes a third substrate 23F, a third substrate 23G and a third substrate 23H. The third substrate 23F, the third substrate 23G, and the third substrate 23H correspond to different positions of the first substrate 10, that is, orthographic projections of the third substrate 23F, the third substrate 23G, and the third substrate 23H on the first substrate 10 do not overlap. The third substrate 23F and the third substrate 23H are elevated above the first substrate 10 by the elevating posts 24B. In this embodiment, the elevated pillars 24B are all conductive structures, so that the third substrate 23F and the third substrate 23H are electrically connected to the first substrate 10 through the elevated pillars 24B. In the embodiment of the present application, one end of each of the elevated pillars 24B is connected to the third substrate 23F and the third substrate 23H, and the other end is connected to the component 22 disposed on the first substrate 10, so that the elevated pillars 24B are electrically connected to the first substrate 10 through the component 22 on the first substrate 10. The surfaces of the third substrate 23F and the third substrate 23G departing from the first substrate 10 and the first substrate 10 are both provided with an elevated column 24A, and one end of the elevated column 24A far away from the first substrate 10 extends to the surface of the first encapsulation layer 20 departing from the first substrate 10. The end surface of the elevated column 24A facing away from the first substrate 10 is the connection point 241 of the first encapsulation layer 20 in this embodiment.
In some embodiments, a plurality of the elevated columns 24 are stacked in the thickness direction of the package structure 100. When the structures to be connected are located far apart, a plurality of elevated columns 24 can be stacked, thereby reducing the manufacturing difficulty. Wherein, the type of the plurality of the elevated columns 24 arranged in a stack may be the same or different. In the package structure 100 of the embodiment shown in fig. 2, when it is necessary to form an elevated pillar extending from the first substrate 10 to the surface of the first package layer 20, the elevated pillar electrically connects the first substrate 10 and the additional layer 30 stacked on the first package layer 20. Since the distance from the first substrate 10 to the first encapsulation layer 20 is relatively long, the height of the elevated column 24 needs to be relatively high. When the elevated column 24 is a preformed conductive column, the elevated column 24 is high, so that the soldering or bonding operation is inconvenient, and the stability of the elevated column 24 relative to the first substrate 10 is not easy to maintain, and the problem of disconnection is easy to occur. Therefore, in this embodiment, a mode that two elevated columns 24 are stacked in the thickness direction of the package structure is adopted to reduce the manufacturing difficulty and ensure the connection effect. Wherein one of the two elevated columns 24 is an elevated column 24A and the other is an elevated column 24B. One end of the elevated column 24A is fixed on the first substrate 10, one end of the elevated column 24B is connected to the elevated column 24A, and the other end extends to the surface of the first package layer 20 departing from the first substrate 10. Specifically, the short elevated column 24A is fixed on the first substrate 10, and the elevated column 24A can be fixed on the first substrate 10 simply and stably due to the short dimension of the elevated column 24A. Then, the first package layer 20 is packaged on the first substrate 10, after the packaging is completed, the via hole 211 is formed in the first package layer 20, the via hole 211 extends to the elevated column 24A, the elevated column 24B is formed in the via hole 211, and finally, the two types of elevated columns (the elevated column 24A and the elevated column 24B) are stacked.
Referring to fig. 4 and 5, fig. 4 and 5 are schematic structural diagrams of a third substrate 23 according to other embodiments of the present application, which are observed from different angles. In some embodiments, the package structure 100 further includes a plurality of protrusions 232 disposed on the third substrate 23 at intervals, and the protrusions 232 protrude from the surface of the third substrate 23. The third substrate 23 includes a first surface 23a and a second surface 23b opposite to the first surface 23 a. The protrusions 232 may protrude from the first surface 23a and/or the second surface 23 b. In the present embodiment, the protrusion 232 protrudes from the first surface 23 a. The end face of the protruding portion 232 departing from the third substrate 23 contacts the first substrate 10, so that the third substrate 23 is spaced apart from the first substrate 10 by the protruding portion 232, and a sufficient space can be reserved between the first substrate 10 and the third substrate 23 to accommodate one or two layers of components 22, thereby realizing that the components 22 are stacked in the thickness direction of the package structure 100, so as to improve the density of the components 22 in the package structure 100, and reduce the occupied area of the package structure 100. Alternatively, in some embodiments, an end surface of the protruding portion 232 facing away from the third substrate 23 is in contact with another third substrate 23 opposite to the third substrate 23, so that there is enough space between the two third substrates 23 to accommodate one or two layers of components 22, that is, the components 22 can be disposed on both sides of the two third substrates 23, thereby further increasing the density of the components 22 in the package structure 100.
In the third substrate 23 of the embodiment shown in fig. 4 and 5, the third substrate 23 is provided with a plurality of protrusions 232 arranged at intervals, and the protrusions 232 are of an insulating structure and may be made of an insulating material such as rubber or resin. In some embodiments, the protruding portion 232 and the third substrate 23 may be a unitary structure, i.e., the protruding portion 232 is integrally formed during the process of forming the third substrate 23.
In some embodiments, the conductive pillars 26 may be embedded in the protruding portion 232, so as to realize the electrical connection between the third substrate 23 and other substrates in contact with the protruding portion 232. The plurality of conductive posts 26 are embedded in the protruding portion 232, one end of each conductive post 26 is communicated with the trace in the third substrate 23, and the other end of each conductive post 26 is exposed out of the protruding portion 232, when the third substrate 23 is stacked with other substrates, the protruding portion 232 can elevate the third substrate 23, that is, one surface of the protruding portion 232 departing from the third substrate 23 is supported on the first substrate 10 or another third substrate 23. The conductive posts 26 in the protruding portion 232 can directly contact with the pads of other substrates connected through the third substrate 23 or contact with the elevated posts fixed on other pads to electrically connect the third substrate 23 with other substrates.
In some embodiments, the conductive pillar 26 may be formed by providing a through hole on the second surface 23b toward the protruding portion 232, and making the through hole penetrate through the protruding portion 232 to a surface of the third substrate 23 away from the protruding portion 232. The conductive posts 26 are formed within the via by filling the via or plating the inner walls of the via with a conductive material. The two ends of the conductive pillar 26 are respectively located on the first surface 23a and the surface of the protruding portion 232 away from the first surface 23 a. When the third substrate 23 is connected to another substrate, the convex portion 232 of the third substrate 23 is laid on the substrate connected thereto. For example, when the third substrate 23 is connected to the first substrate 10, one surface of the protruding portion 232 away from the first surface 23a is fixed on the first substrate 10, and the conductive posts 26 in the protruding portion 232 are connected to the pads on the first substrate 10, so that the third substrate 23 is electrically connected to the first substrate 10. In this embodiment, the third substrate 23 is elevated above the first substrate 10 by the protruding portion 232, so that there is a sufficient space between the first substrate 10 and the third substrate 23, and the components 22 can be disposed on both the first substrate 10 and the third substrate 23, thereby realizing stacking of the components 22 in the thickness direction of the package structure, and improving the density of the components 22 in the package structure.
Referring to fig. 6, fig. 6 is a schematic structural view of an elevated column 24 according to some embodiments of the present application. In these embodiments, the elevated column 24 includes a column core 241 and a coating layer 242 coated on the outer peripheral surface of the column core 241. Here, the outer peripheral surface of the column core 241 refers to the other surfaces of the column core 241 except for the two opposite end surfaces.
In some embodiments, cladding layer 242 is formed of a conductive material and core 241 may be made of a conductive or non-conductive material. The roughness of the outer peripheral surface of the cladding layer 242 is smaller than that of the outer peripheral surface of the column core 241, so that the elevated column 24 has a good signal transmission effect due to the signal attachment effect. The outer peripheral surface of the coating layer 242 is a surface of the coating layer 242 facing away from the outer peripheral surface of the column core 241. In some embodiments of the present application, the coating layer 242 is a plating layer that is plated on the outer circumferential surface of the core pillar 241 by electroplating, evaporation, or the like, and covers the outer circumferential surface of the core pillar 241, and the plating layer is a conductive material layer, such as a silver layer, an aluminum layer, or the like. The plating layer formed by plating, vapor deposition, or the like generally has high surface smoothness.
In some embodiments, the elevated column 24 includes a column core 241 made of a conductive material, and a cladding 242 on the outer surface of the column core 241 is an insulating layer. Through the surface cladding insulating layer at post core 241 for have better insulating effect between the adjacent elevated column 24, make the signal that can guarantee to transmit in the elevated column 24 can not produce the interference in, make the distance of two elevated column 24 can be more closely, thereby can increase the flexibility of walking the line in packaging structure 100.
In some embodiments of the present application, the surface of the third substrate 23 is provided with pads, and the pads are connected with the traces of the third substrate 23. When the elevated column 24 is disposed on the third substrate 23, the elevated column 24 is connected to the pad of the third substrate 23, so that the elevated column 24 can be electrically connected to the component 22 on the third substrate 23 through the trace in the third substrate 23, and the elevated column 24 and the third substrate 23 can be more easily connected to each other. For example, in some embodiments, the elevated pillars 24 may be simply fixed to the pads of the third substrate 23 by soldering or pasting. In some embodiments, the pads are disposed on two opposite sides of the third substrate 23, and the pads on two opposite sides are connected to the traces in the third substrate 23, so that the elevated pillars 24 can be easily fixed on the two sides of the third substrate 23, and the third substrate 23 on the two sides of the third substrate 23 is electrically connected to the elevated pillars 24.
In some embodiments of the present application, the additional layer 30 includes a second substrate and/or a second encapsulation layer. In other words, in some embodiments, the additional layer 30 comprises a second substrate; in some embodiments, the additional layer 30 comprises a second encapsulation layer; in some embodiments, the additional layer 30 includes a second substrate and a second encapsulation layer, which is laminated on the second substrate. The second substrate may be various circuit boards. The second encapsulation layer is of a similar encapsulation structure as the first encapsulation layer 20, i.e. the second encapsulation layer also comprises a layer of encapsulation material and a component 22 embedded within the layer of encapsulation material. In some embodiments, a third substrate 23 and an elevated pillar 24 may also be disposed in the second encapsulation layer. And, the one side that additional layer 30 deviates from first base plate 10 still is equipped with external pin, external pin is used for being connected with the outside external structure electricity of packaging structure 100, thereby also can communicate the signal in packaging structure 100 with the external world through additional layer 30, need not make components and parts 22 in packaging structure 100 all be connected with first base plate 10, avoid the restriction of the size of first base plate 10 to components and parts 22's in packaging structure 100 integrated quantity, and make the interior more convenient of walking of packaging structure 100.
Referring to fig. 2, in the embodiment shown in fig. 2, the additional layer 30 only includes a second substrate, and the second substrate is a common printed circuit board similar to the first substrate 10, and is used for mounting the components 22, realizing the connection between the components 22, and electrically connecting with the external components of the package structure 100. And, the one side that the second base plate deviates from first base plate 10 is equipped with external pin 33, make components and parts 22 in the first encapsulation layer 20 not only can carry out signal intercommunication through external pin 121 on first base plate 10 with external structure, can also carry out signal intercommunication through external pin and external structure of second base plate, make components and parts 22 can communicate with external structure from the both sides (first base plate 10 side and additional layer 30 side) of packaging structure 100, thereby the influence of the size of base plate to the integrated quantity of components and parts 22 in packaging structure 100 has been reduced, easily realize the design of multi-functional high complexity's packaging system. In this embodiment, the external leads 33 are solder balls. It is understood that in other embodiments of the present application, the external connection pin 33 may also be a spring, a gold finger, a bonding pad, or other external connection structures. In this embodiment, the connection terminals of the additional layer 30 are pads of the additional layer 30 opposite to the connection points 241 of the first package layer 20 (i.e., the end surfaces of the elevated columns 24 exposed out of the first package layer 20).
It is understood that in some embodiments, the second substrate may be other types of circuit boards. Fig. 7 is a schematic diagram of a package structure according to another embodiment of the present application. In the embodiment shown in fig. 7, the additional layer 30 only includes the second substrate, and the second substrate is a patch antenna substrate, that is, the second substrate includes a substrate 31 and a patch antenna 32 disposed on the substrate 31. The substrate is a circuit board, and the patch antenna 32 is electrically connected to a part of the components 22 in the first package layer 20 through the substrate, so that the package structure 100 can implement a transmission function of a radio frequency signal. Fig. 8 is a schematic diagram of a package structure according to other embodiments of the present application. In the embodiment shown in fig. 8, the component 22 is embedded in the second substrate, and the component 22 is connected to the traces in the second substrate, so that the electrical connection between the component 22 and the component 22 is realized through the connection between the traces in the second substrate and the component 22 in the first package layer 20. In this embodiment, the components 22 are embedded in the second substrate, so as to fully utilize the internal space of the second substrate, thereby reducing the number of the components 22 in the first encapsulation layer 20, and further reducing the volume of the encapsulation structure 100. Alternatively, the components 22 embedded in the second substrate may be used to enrich the composition of the components 22 in the package structure 100, so as to expand the functions of the package structure 100.
In some embodiments of the present application, the additional layer 30 includes a second substrate and a second encapsulation layer disposed on the second substrate.
Referring to fig. 9, in the embodiment shown in fig. 9, the additional layer 30 includes a second substrate 30a and a second encapsulation layer 30b disposed on the second substrate 30 a. The second substrate 30a is the same circuit board as the first substrate 10; the second encapsulation layer 30b is a similar encapsulation structure as the first encapsulation layer 20. In other words, the second encapsulation layer 30b includes the second encapsulation material layer 34, the component 22 embedded in the second encapsulation material layer 34, the third substrate 23, and the elevated column 24, the component 22 is disposed on the second substrate 30a and/or on the third substrate 23 in the second encapsulation material layer 34, the second substrate 30b and the third substrate 23 in the second encapsulation material layer 34 can be supported by the elevated column 24, and the plurality of third substrates 23 in the second encapsulation material layer 34 can also be supported by the elevated column 24. In the present embodiment, the connection terminal of the additional layer 30 is the end surface 242 of the second package layer 30b exposed from the elevated column 24 in the second package layer 30 b. The connection portion 40 is located between the additional layer 30 and the first packaging layer 20, and when the additional layer 30 is electrically connected to the first packaging layer 20 through the connection portion 40, the second packaging layer 30b of the additional layer 30 is disposed toward the first packaging layer 20. In some embodiments, the type of the component 22 packaged in the second packaging layer 30b is different from the type of the component 22 packaged in the first packaging layer 20, that is, the function that the component 22 in the additional layer 30 can realize is different from the function that the component 22 in the first packaging layer 20 can realize, so that when the additional layer 30 is fixed to the first packaging layer 20 through the connecting portion 40, compared with the manner that the additional layer 30 and the first substrate 10 are directly packaged and fixed by the first packaging layer 20 in some embodiments, the additional layer 30 and the first packaging layer 20 in the embodiments of the present application are easier to detach, so that when a packaging structure with a new function needs to be obtained, the additional layer 30 connected to the first packaging layer 20 can be easily replaced. Specifically, by replacing and connecting the additional layer 30 having the new function to the first package layer 20, the package structure 100 having the new function can be obtained. In the embodiment of the present invention, the package structure 100 having the new function can be obtained by simply replacing the additional layer 30, the operation is simple, and waste of the first substrate 10 and the first package layer 20 can be avoided. In this embodiment, the side of deviating from the second encapsulation layer 30b on the second substrate 30a still is equipped with external pin 33, to realize the electric connection of package structure 100 and the outside external structure of package structure 100 through external pin 33 on the second substrate 30b, thereby make the components and parts 22 in the package structure 100 all can be connected with the outside structure of package structure 100 through first substrate 10 or second substrate 30a, need not make the components and parts 22 in the package structure 100 all be connected with first substrate 10, avoid the restriction of the size of first substrate 10 to the integrated quantity of components and parts 22 in the package structure 100, and make the interior wiring of package structure 100 more convenient.
Referring to fig. 10, the additional layer 30 in the embodiment shown in fig. 10 also includes a second substrate 30a and a second encapsulation layer 30b disposed on the second substrate 30 a. The second substrate 30a may be a circuit board having any structure. The second encapsulation layer 30b includes a second encapsulation material layer 34 and the component 22 embedded within the second encapsulation material layer 33. The component 22 is electrically connected to the second substrate 30a, so that a signal of the component 22 can be transmitted to the second substrate 30 a. In this embodiment, when the additional layer 30 is electrically connected to the first package layer 20 through the connection portion 40, the second substrate 30a of the additional layer 30 is disposed toward the first package layer 20. In this embodiment, the connection portion 40 is located between the second substrate 30a and the first package layer 20, so as to connect and fix the second substrate 30a and the additional layer 40 through the connection portion 40. In this embodiment, the connection terminals of the additional layer 30 are pads on the second substrate 30 a. In the embodiment of the present application, the additional layer 30 including the second encapsulation layer 30b is stacked on the first encapsulation layer 20, so that the types and the number of the components 22 in the package structure 100 can be increased, and the functions of the package structure 100 are enriched.
In this application, the additional layer 30 is connected to the first package layer 20 through the connection portion 40, and the connection portion 40 may be a fixing structure such as solder, glue, screw, buckle, and fixing cover. For example, in the embodiment shown in fig. 2, the connection portion 40 is solder between the first package layer 20 and the additional layer 30. In the embodiment shown in fig. 2, the connection 40 is connected to the first package layer 20 by solder. The solder is located between the connection terminals of the additional layer 30 and the connection points 241 of the first package layer 20, thereby electrically connecting the additional layer 30 and the first package layer 20. Compared with the package structure 100 obtained by directly packaging the additional layer 30 and the first substrate 10 together through the first package layer 20 in some embodiments, the package structure 100 obtained by fixedly connecting the additional layer 30 and the first package layer 20 through the connection portion 40 in the present application can be more easily disassembled from the first package layer 20 compared with the prior art in which the additional layer 30 and the first package layer 20 are directly packaged and connected through the first package layer 20, so that when the package structure 100 with a new function needs to be obtained, the additional layer 30 connected to the first package layer 20 can be easily replaced to obtain the desired package structure 100 with a new function. In the embodiment of the present invention, the package structure 100 having the new function can be obtained by simply replacing the additional layer 30, the operation is simple, and waste of the first substrate 10 and the first package layer 20 can be avoided.
Referring to fig. 10, fig. 10 is a schematic structural diagram illustrating a package structure 100 according to another embodiment of the present application. In the embodiment shown in fig. 10, the connection terminals of the additional layer 30 are pads on the second substrate 30a facing away from the second package layer 30b, and the connection portion 40 is located between the additional layer 30 and the first package layer 20. In the present embodiment, the connection portion 40 is solder. A plurality of spaced apart solder joints formed by solder are connected between the additional layer 30 and the first package layer 20 to provide a secure connection between the additional layer 30 and the first package layer 20. And, at least a portion of the solder joint is located between the connection terminal of the additional layer 30 and a connection point 241 of an encapsulation layer 20, thereby achieving the electrical connection between the first encapsulation layer 20 and the additional layer 30. In the present embodiment, the connection terminals of the additional layer 30 are electrically connected to the connection points 241 of the first package layer 20 by soldering, and the additional layer 30 and the first package layer 20 can be fixed to each other. In some embodiments, the solder between the additional layer 30 and the first package layer 20 may be located only between the connection terminals of the additional layer 30 and the connection points 241 of the first package layer 20. It is understood that, in some embodiments, the solder between the additional layer 30 and the first package layer 20 may be located at other positions than the connection point 241 between the connection terminal of the additional layer 30 and the first package layer 20, so as to provide a better fixing effect between the additional layer 30 and the first package layer 20, and avoid the damage that may be caused by the deformation of the additional layer 30 toward the first package layer 20 when the package structure 100 is subjected to a force in the thickness direction. In some embodiments, the end surface of the portion of the elevated pillar 24 in the second encapsulation layer 30b exposes the second encapsulation layer 30b, and the end surface of the portion of the elevated pillar 24 exposing the second encapsulation layer 30b is electrically connected to the external structure of the package structure 100. In other words, in the present embodiment, the end surface of the elevated pillar 24 exposed out of the second package layer 30b is an external pin of the additional layer 30.
In some embodiments, after the additional layer 30 and the first package layer 20 are fixed by solder, a gap exists between the additional layer 30 and the first package layer 20, and a gap between the additional layer 30 and the first package layer 20 generated by the solder fixation is filled with a package material again for secondary packaging to seal the gap between the additional layer 30 and the first package layer 20, so as to avoid possible damage caused by deformation of the additional layer 30 toward the first package layer 20 when the package structure 100 is subjected to an acting force in a thickness direction, and to enable a better fixing and connecting effect between the second substrate and the first package layer 20.
Referring to fig. 11, fig. 11 is a schematic view of a package structure 100 according to another embodiment of the present application. The embodiment shown in fig. 11 differs from the embodiment shown in fig. 10 in that: the connecting portion 40 is a conductive adhesive, which is coated on the surface of the first package layer 20 facing the second substrate 30a to fix the second substrate 30a and the first package layer 20. Also, since the conductive paste is conductive, the connection terminal and the connection point 241 can be electrically connected by the conductive paste. It is understood that, in some embodiments, the conductive paste can be disposed at the connection terminal position in a dispensing manner, and when the second substrate 30a is stacked on the first encapsulation layer 20, the connection terminal and the connection point 241 can be fixed by the conductive paste and can be electrically connected by the conductive paste.
Referring to fig. 12, fig. 12 is a schematic view of a package structure 100 according to another embodiment of the present application. The connecting portion 40 is a fixing cover, and the fixing cover includes a receiving cavity 41, and the additional layer 30, the first substrate 10, and the first package layer 20 are received in the receiving cavity 41. The fixing cover includes a top wall 411 and a peripheral wall 412 surrounding the top wall 411, the top wall 411 and the peripheral wall 412 enclose a containing cavity 41, the top wall 411 of the fixing cover contacts the additional layer 30, and the top wall 411 of the fixing cover presses the additional layer 30 onto the first packaging layer 20. Since the connection points of the first encapsulation layer 20 are disposed opposite to the connection terminals of the additional layer 30, the connection terminals of the additional layer 30 are in contact with the connection points of the first encapsulation layer 20 when the additional layer 30 is pressed against the first encapsulation layer 20. Specifically, in some embodiments of the present disclosure, the first substrate 10, the first encapsulation layer 20, and the additional layer 30 are sequentially stacked on a fixing plate 60 (e.g., a motherboard in a mobile phone), the fixing cover is disposed on the first substrate 10, the first encapsulation layer 20, and the additional layer 30, and the first substrate 10, the first encapsulation layer 20, and the additional layer 30 are all accommodated in the fixing cover, and an edge of the fixing cover is fixed on the fixing plate 60 by screws, adhesives, or fasteners, so as to press the additional layer 30 onto the first encapsulation layer 20. In some embodiments, the fixing cover may be fixed to the first packaging layer 20 by a snap or a screw, so as to fix the first packaging layer 20 and the additional layer 30. In some embodiments, the connection terminal of the additional layer 30 is a spring, and when the fixing cover is fixed on the first packaging layer 20, the spring is pressed against the connection point 241, so as to achieve a better electrical connection effect between the additional layer 30 and the first packaging layer 20. In this embodiment, the additional layer 30 is fixed to the first package layer 20 by fixing the additional layer 30 in the fixing cover and then fixing the fixing cover to the first package layer 20. Because the additional layer 30 is fixed in the fixing cover, when the additional layer 30 is a substrate with a relatively thin thickness, the additional layer 30 can be prevented from deforming due to the interaction force between the elastic sheet and the connecting point 241 due to the protection of the fixing cover on the additional layer 30, and the substrate is prevented from being damaged.
Referring to fig. 13, fig. 13 is a schematic structural diagram of a first substrate 10 and a first encapsulation layer 20 according to another embodiment of the present application. The embodiment shown in fig. 13 differs from the other embodiments of the present application in that the third substrate 23 is not provided in the first encapsulating layer 20 of the present embodiment, and the components 22 are stacked in the thickness direction of the first encapsulating layer 20. In some embodiments, all of the components 22 stacked in the thickness direction of the first package layer 20 are passive components 22, and the passive components 22 are connected by the conductive pillars 25 provided in the via holes 211. In this embodiment, the conductive pillars 25 disposed in the vias 211 have the same structure as the elevated pillars 24B in the embodiment shown in fig. 2. In some embodiments, the conductive pillars 25 may be shorter than the elevated pillars 24B and may have a length less than the thickness of the component 22, since the conductive pillars 25 only need to be electrically connected and do not need to be elevated. Compared with the way of directly stacking the components 22 and directly contacting the pins of the components 22 to achieve the electrical connection between the components 22, the pins of the components 22 need to be properly contacted to achieve the electrical connection between the components 22 during stacking, so that the size and the arrangement position of the components 22 need to meet certain requirements. In this embodiment, since the components 22 are connected by the conductive posts 25, there is no need to directly contact the pins of the stacked components 22, and there is no strict requirement on the size and the installation position of the components 22, so that the flexibility of the installation of the components 22 in the first package layer 20 can be enhanced, and the density of the components 22 in the first package layer 20 can be increased. In some embodiments, the conductive posts 25 may also be curved conductive traces that better connect the leads of the stacked components 22.
It should be noted that the above only shows a few embodiments of the package structure 100 of the present application. It will be apparent to those skilled in the art that various modifications and enhancements can be made without departing from the principles of the application, and such modifications and enhancements are intended to be included within the scope of the application. For example, in some embodiments, the package structures 100 of different embodiments of the present application may be combined together to form a new package structure 100. For example, in some embodiments, the first encapsulation layer 20 includes a first block and a second block connected to the first block, the structure of the first encapsulation layer 20 corresponding to the first block is the same as the structure of the first encapsulation layer 20 in the embodiment shown in fig. 2, and the structure of the first encapsulation layer 20 corresponding to the second block is the same as the structure of the first encapsulation layer 20 in the embodiment shown in fig. 13.
In the present application, the elevation between the first substrate 10 and the third substrate 23 and/or between the third substrate 23 and the other third substrate 23 in the package structure 100 is realized through the elevation column 24, so that a larger space is provided between the first substrate 10 and the third substrate 23 and/or between the third substrate 23 and the other third substrate 23, one or more layers of stacked components 22 can be disposed, and thus the stacking of the components 22 in the thickness direction of the package structure 100 is realized, so that under the condition that the area of the first substrate 10 of the package structure 100 is not changed, more components 22 can be packaged in the package structure 100, the density of the components in the package structure 100 can be higher, the design of a multifunctional and highly complex package system is easy to realize, and the miniaturization and the improvement of the function diversification of the electronic device are promoted. Furthermore, in the embodiment of the present application, the two sides (the first substrate 10 side and the additional layer 30 side) of the package structure 100 are both provided with external pins, so that the components 22 in the package structure 100 can communicate with the external structure through the first substrate 10 or the additional layer 30, thereby avoiding the limitation of the number of external pins on the first substrate 10 and limiting the integration number of the components 22 in the package structure 100, and thus the design of the package system 100 with multiple functions and high complexity can be more easily implemented, and the miniaturization and function diversification of the electronic device can be promoted. Moreover, since the component 22 can be connected to the first substrate 10 or the additional layer 30 according to actual needs, routing of the component 22 and external structure communication can be more convenient. In the embodiment of the present application, the additional layer 30 and the first package layer 20 are fixed and electrically connected through the connection portion 30, and compared to a manner that the additional layer 30 and the first substrate 10 are directly packaged together through the first package layer 20 to obtain the package structure 100, the additional layer 30 can be more easily detached from the first package layer 20, so that the additional layer 30 in the package structure 100 can be more easily replaced, and the diversification of the functions of the package structure 100 is further improved. And according to actual needs, the additional layer 30 in the package structure 100 is replaced to obtain the required package structure 100 without being manufactured again, so that resources can be more fully utilized, and waste is avoided.
Referring to fig. 14, the present application further provides a packaging method for obtaining the package structure 100 according to some embodiments described above. Specifically, the packaging method comprises the following steps:
step 110, forming a first package layer 20 on the first substrate 10, wherein one surface of the first substrate 10 is provided with an external pin, and the first package layer 20 is formed on a surface of the first substrate 10 away from the external pin. In some embodiments, the first encapsulation layer 20 has a connection point 241 formed on a side facing away from the first substrate 10.
In some embodiments of the present application, external pins are preset on the first substrate 10. It is understood that, in some embodiments, there are no external connection pins preset on the first substrate 10, and therefore, before step 110, the method further includes the following steps: external connection pins are formed on the first substrate 10. In some embodiments, the external leads are solder balls disposed on the first substrate 10 by a bonding process. It is understood that in some embodiments, the formation of the external connection pins on the first substrate 10 may also be performed after the step 110.
The specific implementation of step 110 is different in order to form the package structure 100 of the different embodiments described above. For example, referring to fig. 15, a manner of forming the first package layer 20 of the package structure 100 shown in fig. 2 includes:
step 201: a plurality of elevated columns 24 are fixed to the first substrate 10 on which the component 22 is provided, and the elevated columns 24 are provided at intervals. The elevated pillars 24 are pre-fabricated columnar structures, and the manner of fixing the elevated pillars 24 to the first substrate 10 provided with the component 22 may be soldering or bonding with conductive adhesive. In some embodiments, a plurality of pads are disposed on the first substrate 10, and the elevated column 24 is fixed at a position of the pad, so that the elevated column 24 is connected to a trace on the first substrate 10, and the elevated column 24 can be electrically connected to the component 22 fixed on the first substrate 10. The heights of the plurality of elevated columns can be the same or different.
In some embodiments, the first substrate 10 has the desired components 22 already mounted thereon. When the required components 22 are not fixed on the first substrate 10, before or after step 201, the method further includes the steps of: the components 22 are provided on the first substrate 10, and the components 22 include active devices and passive devices. Specifically, when the active device includes various functional chips, the passive device includes a capacitive element, an inductive element, a resistive element, or the like. The component 22 can be formed on the first substrate 10 by means of a patch or a bonding, and is connected to the traces on the first substrate 10.
Step 202: a third substrate 23 provided with a component 22 is fixed to at least some of the plurality of elevated columns 24 provided on the first substrate 10.
The third substrate 23 is fixed to the elevated column 24 by soldering, conductive adhesive fixing, or the like. In some embodiments, pads are disposed on two sides of the third substrate 23, and the elevated pillars 24 are fixed on the pads, so that the elevated pillars 24 can be connected to traces in the third substrate 23, and thus the elevated pillars 24 can be electrically connected to the components 22 fixed on the third substrate 23, so as to implement signal communication between the third substrate 23 and the components on the first substrate 10 through the elevated pillars 24. Further, by raising the third substrate 23 by the raising posts 24 provided on the first substrate 10, a sufficient space is provided between the first substrate 10 and the third substrate 23, and the components 22 can be provided on both the surface of the first substrate 10 facing the third substrate 23 and the surface of the third substrate 23 facing the first substrate 10, thereby increasing the density of the components 22 in the thickness direction of the package structure 100.
In some embodiments, the third substrate 23 has the desired components 22 already mounted thereon. When the required components 22 are not fixed on the third substrate 23, before or after step 202, the method further includes the steps of: the component 22 is provided on the third substrate 23. The component 22 may be provided on one surface of the third substrate 23 or on both surfaces opposite to the one surface.
In some embodiments, step 202 is followed by:
step 203: a plurality of elevated columns 24 are fixed to the third substrate 23 on the side thereof facing away from the first substrate 10. The elevated columns 24 are pre-fabricated columnar structures, and the manner of fixing the plurality of elevated columns 24 on the third substrate 10 may be welding or bonding through conductive adhesive. In some embodiments, the elevated columns 24 are fixed at the positions of the pads of the third substrate 23, such that the elevated columns 24 are connected with the traces on the first substrate 10, so that the elevated columns 24 can be electrically connected with the components 22 fixed on the third substrate 23. The heights of the plurality of elevated columns can be the same or different.
Step 204: an encapsulation material layer 21 is formed on the first substrate 10. In some embodiments of the present application, the encapsulation material layer 21 is formed on the first substrate 10 by injection molding. Specifically, the structure obtained in step 203 is placed in a mold, and a packaging material is filled into the mold, so that the packaging material flows in the mold until the mold is filled, and the packaging material is cured and demolded to obtain the packaging material layer 21. Wherein, the surface of the packaging material layer 21 departing from the first substrate 10 is flush with the surface of the elevated column 24 arranged on the third substrate 23 departing from the third substrate 23, and the end surface of the elevated column 24 on the third substrate 23 departing from the third substrate 23 is exposed out of the packaging material layer 21; the end surface of the elevated column on the third substrate 23 exposed out of the encapsulating material layer 21 is a connection point 241 of the first encapsulating layer 20.
In some embodiments, when the third substrate 23 stacked on the first substrate 10 is multiple, and orthographic projections of the multiple third substrates 23 on the first substrate 10 coincide, after step 203 and before step 204, the method further includes:
step 205: a plurality of elevated columns are fixed to the third substrate 23 on the side thereof facing away from the first substrate 10. For example, a plurality of elevated columns 24 are provided on the third base plate 23B in fig. 2.
Step 206: the other third substrate 23 provided with the component 22 is fixed to an elevating column provided on the third substrate 23. For example, in the embodiment of fig. 2, a third substrate 23C provided with a component 22 is fixed to an elevated column 24 provided on a third substrate 23B. In these embodiments, the third substrate 23 in step 205 "fixing the plurality of elevated columns on the side of the third substrate 23 facing away from the first substrate 10" refers to the third substrate 23 farthest from the first substrate 10. For example, in the embodiment shown in fig. 2, the third substrate 23 in step 250 is referred to as a third substrate 23C.
It is understood that in some embodiments, the above steps 205 to 206 may be repeated when another third substrate 23 is elevated above another third substrate 23 in the step 208.
Referring to fig. 16, in some other embodiments of the present application, step 203 and step 204 may be replaced by:
step 210: an encapsulating material layer 21 is formed on the first substrate 10, and the encapsulating material layer 21 covers a third substrate 23 that is elevated above the first substrate 10 and a component 22 provided on the first substrate 10 or the third substrate 23.
Step 211: openings are formed into the first encapsulation layer 20 from the surface of the encapsulation material layer 21 facing away from the first substrate 10, which openings extend to the third substrate 23, the component 22 or the first substrate 10. Alternatively, in some embodiments, the holes formed in the first encapsulation layer 20 extend to the elevated pillars 24 fixed to the third substrate 23 or the first substrate 10. The hole forming method on the first encapsulation layer 20 may be a laser drilling method or an etching drilling method.
Step 212: the openings formed in the first package layer 20 are filled with a conductive material to form conductive pillars. The conductive posts are the elevated posts 24B in the embodiment shown in fig. 2. One end of each conductive column is connected to the third substrate 23, the component 22 and the first substrate 10 or fixed to the elevated column on the first substrate 10 and the third substrate 23, the end face of the other end is flush with the end face of the packaging material layer away from the third substrate 23, and the end face of each conductive column, which is flush with the end face of the packaging material layer away from the third substrate 23, is a connection point 241 of the first packaging layer 20.
Referring to fig. 17, in some embodiments, when it is required to form the first encapsulation layer 20 of the embodiment shown in fig. 3 or fig. 13, the forming manner of forming the first encapsulation layer 20 on the first substrate 10 may include:
step 301: forming a packaging material layer 21 on the first substrate 10 provided with the component 22, wherein the packaging material layer 21 covers the component 22 on the first substrate 10, a groove 27 is concavely provided on a surface of the packaging material layer 21 departing from the first substrate 10 in a direction towards the first substrate 10, and a bottom wall of the groove 27 is spaced from the component 22 on the first substrate 10.
In some embodiments, the layer of encapsulating material 21 is formed by compression molding. Specifically, a cavity of the mold for forming the packaging material layer 21 is provided with a protrusion, so that a groove 27 is formed on the packaging material layer 21. It is understood that in some embodiments, the surface of the encapsulation material layer 21 formed by compression molding is flat, that is, the encapsulation material layer 21 does not have the groove 27, and it is necessary to form a groove from the surface of the encapsulation material layer 21 facing away from the first substrate 10 into the first encapsulation layer 20 after forming the encapsulation material layer 21.
Step 302: an opening is formed in the bottom wall of the groove 27, and one end of the opening, which is far away from the groove 27, extends to the first substrate 10 or the component 22 arranged on the first substrate 10.
Step 303: the openings are filled with a conductive material to form conductive pillars, so that the conductive pillars are electrically connected to the first substrate or the component 22 on the first substrate 10. For the embodiment shown in fig. 3, the conductive pillar formed by filling the conductive material in the opening is the elevated pillar 24B shown in fig. 3; for the embodiment shown in fig. 13, the conductive pillar formed by filling the conductive material in the opening is the conductive pillar 25.
Step 304: the component 22 or the third substrate 23 provided with the component 22 is provided in the groove 27, and the conductive column is electrically connected to the component 22 or the third substrate 23 in the groove. For example, in the embodiment shown in fig. 13, a third substrate 23 provided with a component 22 is provided in the recess. In the embodiment shown in fig. 3, the component 22 is disposed directly within the recess 27.
In some embodiments, the third substrate 23 has the desired components 22 already mounted thereon. When the required component 22 is not fixed on the third substrate 23, before or after step 304, the method further includes the steps of: the component 22 is provided on the third substrate 23. The component 22 is disposed on a surface of the third substrate 23 facing away from the first substrate 10.
Step 305: a layer of sub-encapsulation material 28 is formed within the recess 27, the layer of sub-encapsulation material 28 filling the recess 27, and the component 22 within the recess 27 being embedded within the layer of sub-encapsulation material 28.
In some embodiments, after step 304 and before step 305, the component 22 or the third substrate 23 disposed in the groove 27 is fixed in the groove 27 by bonding or the like, so as to ensure that the component 22 or the third substrate 23 located in the groove 27 does not move during the subsequent process of forming the sub-packaging material layer 28 in the groove 27, so as to ensure that the conductive posts can be electrically connected with the component 22 or the third substrate 23 in the groove 27.
In some embodiments, after step 304 and before step 305, further comprising step 306: a preformed elevated column 24 is fixed on the third substrate 23, and one end of the elevated column 24 is fixed on the third substrate 23, and the other end extends to the surface of the packaging material layer 21 away from the first substrate 10. After the sub-packaging material layer 28 is formed in the groove 27, the side of the raised post 24 facing away from the first substrate 10 is just coplanar with the side of the sub-packaging material layer 28 facing away from the first substrate 10, and the sub-packaging material layer 28 is exposed. At this time, the elevated column 24 provided on the third substrate 23 serves as a connection point 241 of the first package layer 20. It is understood that in some embodiments, before or after step 301, pre-formed elevated pillars 24 are disposed on the first substrate 10, and after the encapsulation material layer 21 is formed on the first substrate 10, the end surfaces of the elevated pillars 24 disposed on the first substrate 10 facing away from the first substrate 10 are coplanar with the surface of the encapsulation material layer 21 facing away from the first substrate 10. In this case, the end surface of the elevated column 24 provided on the first substrate 10, which end surface is away from the first substrate 10, is also a connection point 241 of the first encapsulation layer 20.
Referring to fig. 18, in some other embodiments of the present application, there may be no step "fixing the preformed elevated column 24 on the third substrate 23" or "disposing the preformed elevated column 24 on the first substrate 10", and the step 305 may further include:
step 307: an opening is provided in the layer of sub-packaging material 28 on the side of the layer of sub-packaging material 28 facing away from the first substrate 10, which opening extends to the component 22 in the recess 27 or to the third substrate 23 in the recess 27.
Step 308: and filling the opening with a conductive material to form a conductive pillar embedded in the opening, wherein the conductive pillar is electrically connected to the component 22 in the groove 27 or the third substrate 23 in the groove 27, and an end surface of the conductive pillar coplanar with the sub-packaging material layer 28 is a connection point 241 of the first packaging layer 20.
After the first substrate 10 and the first encapsulation layer 20 of the package structure 100 are formed through the above steps, the method further includes step 120: the additional layer 30 and the first encapsulation layer 20 are fixed by the connection portion 40, so that the additional layer 30 and the first encapsulation layer 20 are fixed and electrically connected. Wherein, one side of the additional layer 30 departing from the first package layer 20 is provided with an external pin, and the external pin is used for electrically connecting with an external structure. The side of the additional layer 30 facing the first encapsulation layer 20 is provided with connection terminals, and the connection terminals of the additional layer 30 are in contact and signal communication with the connection points 241.
When the additional layer 30 only has a second substrate, the second substrate can be directly fixed to the additional layer 30 by the connection portion 40. In some embodiments, when the additional layer 30 includes a second substrate and a second encapsulation layer, the second encapsulation layer needs to be formed on the second substrate first, wherein a method for forming the second encapsulation layer on the second substrate is the same as a method for forming the first encapsulation layer 20 on the first substrate 10, and details thereof are not repeated herein.
The connection portion 40 may be solder, conductive adhesive, or a fixing cover. When the connection portion 40 is made of solder, that is, a solder joint is formed at the position of the connection point 241 of the first package layer 20, the additional layer 30 is disposed on the surface of the first package layer 20 away from the first substrate 10, and the connection terminal of the additional layer 30 is in contact with the solder joint, so that the connection point 241 of the first package layer 20 is connected to the connection terminal of the additional layer 30. It will be appreciated that in some embodiments, solder joints may be disposed at other positions of the first encapsulation layer 20 away from the first substrate 10 to provide better connection between the first encapsulation layer 20 and the additional layer 30. When the connecting portion 40 is a conductive adhesive, the conductive adhesive is coated on a surface of the first package layer 20 away from the first substrate 10, and the additional layer 30 is disposed on the first package layer 20 and fixed to the first package layer 20 through the conductive adhesive. Moreover, since the conductive adhesive is conductive, the connection terminals of the additional layer 30 and the connection points 241 can be fixed by the connection portions 40, so that the first package layer 20 and the additional layer 30 are fixed and electrically connected.
In the embodiment of the application, the packaging structure with high density of components can be obtained through a simple packaging method, the number of components in the packaging structure can be increased, the design of a multifunctional high-complexity packaging system is easy to realize, and the miniaturization and the improvement of function diversification of electronic equipment are promoted.
In the above, it should be noted that the preferred embodiments of the present application are described by way of example only, and it should be understood that various modifications and improvements can be made by those skilled in the art without departing from the principle of the present application, and such modifications and improvements are also considered to be within the scope of the present application.

Claims (18)

1. A packaging structure is characterized by comprising a first substrate, a first packaging layer, an additional layer and a connecting part, wherein the first packaging layer is packaged on the first substrate, the additional layer is stacked on one side, away from the first substrate, of the first packaging layer and is electrically connected with the first packaging layer, and the additional layer is fixed with the first packaging layer through the connecting part;
the first substrate and one side of the additional layer, which deviates from the first packaging layer, are provided with external pins, and the external pins are used for being electrically connected with an external structure.
2. The package structure of claim 1, wherein the additional layer comprises a second substrate, and a side of the second substrate facing away from the first package layer is provided with the external leads.
3. The package structure of claim 2, wherein the additional layer further comprises a second encapsulation layer, the second encapsulation layer being encapsulated on the second substrate, and the second encapsulation layer being located on a side of the second substrate adjacent to the first encapsulation layer.
4. The package structure of claim 1, wherein the first package layer comprises a package material layer, and a plurality of spaced-apart raised pillars, a plurality of components, and at least one third substrate embedded in the package material layer, the third substrate is connected to the first substrate via the raised pillars, and the plurality of components are fixed on the first substrate or the third substrate.
5. The package structure according to claim 1, wherein the first package layer includes a package material layer, and a plurality of spaced-apart elevated pillars, a plurality of components and a plurality of third substrates embedded in the package material layer, at least two of the third substrates partially or completely overlap each other in an orthographic projection of the first substrate, the partially or completely overlapping third substrates in the orthographic projection of the first substrate are connected by the elevated pillars, and the plurality of components are fixed on the first substrate or the third substrate.
6. The package structure of claim 1, wherein the first package layer comprises a package material layer and a plurality of spaced-apart elevated pillars, a plurality of components, and a plurality of third substrates embedded in the package material layer, the elevated pillars are fixed on the first substrate or the third substrate, and ends of the elevated pillars facing away from the first substrate or the third substrate extend to a surface of the package material layer facing away from the first substrate; the elevated column is of a conductive structure.
7. The package structure according to any one of claims 4 to 6, wherein the elevated column is a pre-formed pillar structure, and the elevated column is connected to the third substrate or the first substrate by solder or conductive adhesive;
or the elevated column is a conductive column located in a via hole in the first package layer, and the conductive column is in contact with the third substrate or the first substrate;
alternatively, the elevated column and the third substrate are integrally formed.
8. The package structure of claim 7, wherein the plurality of elevated columns are stacked in a thickness direction of the package structure, and the plurality of elevated columns are different in type from each other.
9. The package structure according to any one of claims 4 to 8, wherein the elevated column includes a column core and a coating layer covering an outer circumferential surface of the column core, the coating layer is made of a conductive material, and a roughness of an outer circumferential surface of the coating layer is smaller than a roughness of an outer circumferential surface of the column core.
10. The package structure according to any one of claims 4 to 8, wherein the elevated column includes a column core and a cladding layer that is coated on an outer circumferential surface of the column core, the column core is formed using a conductive material, and the cladding layer is formed using an insulating material.
11. The package structure according to any one of claims 4 to 6, further comprising a plurality of protrusions spaced apart from the third substrate, wherein the protrusions protrude from a surface of the third substrate, and an end surface of the protrusion facing away from the third substrate is in contact with the first substrate; or the end face of the boss departing from the third substrate is in contact with the other third substrate opposite to the third substrate.
12. The package structure of claim 11, wherein the bump is formed of an insulating material, and a plurality of conductive pillars are embedded in the bump, and the conductive pillars are electrically connected to the third substrate and the first substrate or another third substrate in contact with the bump.
13. The package structure of claim 2, wherein the second substrate comprises a substrate and a patch antenna disposed on the substrate, and the patch antenna is electrically connected to a portion of the components in the first package layer through the substrate.
14. The package structure of claim 2, wherein components are embedded in the second substrate, the components in the second substrate are connected to internal traces of the second substrate, and the components in the second substrate are electrically connected to the components in the first encapsulation layer.
15. The package structure of claim 1, wherein the connection portion is solder or conductive adhesive, the connection portion is located between the additional layer and the first package layer, and the additional layer and the first package layer are fixed and electrically connected by the connection portion.
16. The package structure according to claim 1, wherein the first package layer includes a first package material layer, and a plurality of components and conductive pillars embedded in the package material layer, the plurality of components includes a plurality of passive devices, each of the passive devices includes a connection terminal, at least two of the plurality of passive devices are stacked in a thickness direction of the package structure, and the stacked layers of the passive devices are electrically connected through the conductive pillars.
17. An electronic device, characterized in that the electronic device comprises a functional module and a package structure according to any of claims 1-16, the functional module being electrically connected to the package structure.
18. The electronic device of claim 17, wherein the functional module comprises one or more of an antenna module, a sensor module, an audio module, a camera module, a connector module, and a power module.
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