CN110587117A - Device and method for processing superhard brittle material - Google Patents
Device and method for processing superhard brittle material Download PDFInfo
- Publication number
- CN110587117A CN110587117A CN201910424105.2A CN201910424105A CN110587117A CN 110587117 A CN110587117 A CN 110587117A CN 201910424105 A CN201910424105 A CN 201910424105A CN 110587117 A CN110587117 A CN 110587117A
- Authority
- CN
- China
- Prior art keywords
- grinding fluid
- processing
- groove
- superhard
- brittle material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention belongs to the technical field of processing of superhard brittle materials, provides a processing device of superhard brittle materials, and also provides a processing method of superhard brittle materials. The invention has the beneficial effects that: the laser cutting is used for forming a smooth edge, the ultrasonic vibration cutting is combined for further processing redundant materials, the processing of the super-hard brittle material can be finished at high quality, the quality of the processed edge of the super-hard brittle material is effectively guaranteed, and the method is particularly suitable for processing deep holes and inner grooves of the super-hard brittle material.
Description
Technical Field
The invention relates to a processing device of a superhard brittle material, and also relates to a processing method of the superhard brittle material, belonging to the technical field of superhard brittle material processing.
Background
The existing superhard brittle material is mainly machined, the machining has high requirements on a cutter, the cutter is worn greatly and needs to be replaced frequently, the cost is increased, and the superhard brittle material has high hardness and high brittleness, so the machining is easy to damage the material, the defective rate is high, the quality of a machined edge is poor, and the precision is low.
At present, devices for processing the superhard brittle material by using laser and ultrasonic waves are available, but when an inner groove of the superhard brittle material is processed, the single laser and ultrasonic waves have certain defects, for example, the common method for processing the inner groove by using the laser is ablation layer by layer, materials melted by blowing with high-speed airflow leave a slot, but under the processing requirement of a certain depth of the inner groove or a deep hole, the edge quality of a processed part of a workpiece is easily poor; when ultrasonic oscillation abrasive impacts the surface layer to be impacted and removed when the inner groove is machined by ultrasonic waves, microscopic transverse cracks are easily formed at the edge, and the quality is damaged.
Disclosure of Invention
In order to overcome the defects, the invention provides a processing device of a superhard brittle material.
In order to overcome the defects, the invention provides a processing method of a superhard brittle material.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a processing device for a superhard brittle material comprises a laser cutting device, an ultrasonic processing device, a grinding fluid injection circulating device and a groove-shaped processing platform, wherein a workpiece to be processed is arranged in the groove-shaped processing platform, and the laser cutting device is used for carrying out laser processing on the workpiece to be processed along a preset track to form a cutting path; the grinding fluid injection circulating device is used for injecting grinding fluid into the groove-shaped processing platform and forming flowing circulation, and the ultrasonic processing device is used for further processing along the cutting path.
Preferably, cell type processing platform includes the workstation, the workstation is equipped with the baffle respectively all around, the baffle seals the workstation and forms the cell body of upper shed, cell type processing platform both sides are equipped with Y axle straight line module respectively, are equipped with an X axle straight line module between two Y axle straight line modules, be equipped with Z axle straight line module on the X axle straight line module, laser cutting device sets up on X axle straight line module, ultrasonic wave processingequipment sets up on Z axle straight line module.
Preferably, the grinding fluid injection circulating device is arranged on one side of the groove-shaped processing platform and comprises a grinding fluid storage tank, a grinding fluid filtering tank, a circulating pump and a connecting pipeline, the grinding fluid storage tank, the groove-shaped processing platform, the grinding fluid filtering tank and the circulating pump are connected through the connecting pipeline to form a circulating pipeline, and an electromagnetic switch valve is arranged on the connecting pipeline positioned at the liquid inlet of the groove-shaped processing platform; and the grinding fluid storage tank is higher than the upper end surface of the side plate of the groove-shaped processing platform.
A processing method of a superhard brittle material adopts the processing device of the superhard brittle material, and comprises the following specific steps:
firstly, fixing a workpiece to be processed on a groove-shaped working platform, and carrying out laser cutting on the workpiece by a laser cutting device along a preset track to form a cutting path;
step two, starting the grinding fluid injection circulating device, and injecting the grinding fluid into the groove-shaped processing platform; the grinding fluid submerges the workpiece to be processed;
and step three, the Z-axis linear module moves downwards to drive the ultrasonic processing device to move downwards, the ultrasonic processing device is started, and the cutter of the ultrasonic processing device vibrates the grinding fluid to process the workpiece to be processed along the cutting path.
The invention has the beneficial effects that: the laser cutting is used for forming a smooth edge, the ultrasonic vibration cutting is combined for further processing redundant materials, the processing of the super-hard brittle material can be finished at high quality, the quality of the processed edge of the super-hard brittle material is effectively guaranteed, and the method is particularly suitable for processing deep holes and inner grooves of the super-hard brittle material.
Drawings
FIG. 1 is a schematic structural diagram of a processing apparatus according to the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
As shown in fig. 1, the processing device for the superhard brittle material comprises a laser cutting device 1, an ultrasonic processing device 2, a grinding fluid injection circulating device and a groove-shaped processing platform 3, wherein a workpiece to be processed is arranged in the groove-shaped processing platform 3, and the laser cutting device 1 is used for performing laser processing on the workpiece to be processed along a preset track to form a cutting path; the grinding fluid injection circulating device is used for injecting grinding fluid into the groove-shaped processing platform 3 and forming flowing circulation, and the ultrasonic processing device 2 is used for further processing along the cutting path.
Cell type processing platform 3 includes workstation 301, workstation 301 is equipped with baffle 302 all around respectively, baffle 302 seals workstation 301 and forms the cell body of upper shed, 3 both sides of cell type processing platform are equipped with Y axle straight line module 4 respectively, are equipped with an X axle straight line module 5 between two Y axle straight line modules 4, be equipped with Z axle straight line module 6 on the X axle straight line module 5, laser cutting device 1 sets up on X axle straight line module 5, ultrasonic processing device 2 sets up on Z axle straight line module 6.
The grinding fluid injection circulating device is arranged on one side of the groove-shaped processing platform 3 and comprises a grinding fluid storage tank 7, a grinding fluid filtering tank 8, a circulating pump and a connecting pipeline 9, wherein the grinding fluid storage tank 7, the groove-shaped processing platform 3, the grinding fluid filtering tank 8 and the circulating pump are connected through the connecting pipeline 9 to form a circulating pipeline, the circulating pump is arranged in the grinding fluid filtering tank 8, and an electromagnetic switch valve is arranged on the connecting pipeline 9 positioned at a liquid inlet of the groove-shaped processing platform 3; and the grinding fluid storage tank 7 is higher than the upper end surface of the side plate of the groove-shaped processing platform 3.
In the embodiment, the structures of the laser cutting device 1, the ultrasonic processing device 2 and the XYZ axis linear module (4, 5, 6) are the prior art, and the detailed structures of the embodiment and the description of the drawings are not described in detail. In this embodiment, the workpiece to be processed is a ceramic wafer, and it can be understood that the superhard brittle material used instead of the processed workpiece may also be glass, a gemstone, a crystalline silicon wafer, or other materials.
Example 2
The present embodiment provides a method for processing a superhard brittle material, which uses the processing apparatus for a superhard brittle material shown in fig. 1 or embodiment 1, and specifically includes the following steps:
firstly, fixing a workpiece to be processed on a groove-shaped working platform 3, and carrying out laser cutting on the workpiece by a laser cutting device 1 along a preset track to form a cutting path;
step two, starting the grinding fluid injection circulating device, and injecting the grinding fluid into the groove-shaped processing platform 3; the grinding fluid submerges the workpiece to be processed;
and step three, the Z-axis linear module 6 descends to drive the ultrasonic processing device 2 to descend, the ultrasonic processing device 2 is started, and the cutter of the ultrasonic processing device 2 vibrates the grinding fluid to process the workpiece to be processed along the cutting path.
The method provided by the embodiment is mainly used for processing the inner groove or the deep hole, and due to the structure of the inner groove or the deep hole, the laser cutting device is independently adopted, so that although the working efficiency is high and the processing speed is high, the melted materials cannot be blown away from the slot by high-pressure gas easily, a wider slot, obvious roughness, an increased heat influence area and poor edge quality can be generated. The method combining laser cutting and ultrasonic processing is innovatively adopted in the embodiment, so that the processing speed of the superhard brittle material can be effectively improved, and the edge quality of the workpiece to be processed can be effectively guaranteed.
The technical solution of the present invention is not limited to the limitations of the above specific embodiments, and all technical modifications made according to the technical solution of the present invention fall within the protection scope of the present invention.
Claims (4)
1. The processing device of the superhard brittle material is characterized in that: the device comprises a laser cutting device, an ultrasonic processing device, a grinding fluid injection circulating device and a groove-shaped processing platform, wherein a workpiece to be processed is arranged in the groove-shaped processing platform, and the laser cutting device is used for carrying out laser processing on the workpiece to be processed along a preset track to form a cutting path; the grinding fluid injection circulating device is used for injecting grinding fluid into the groove-shaped processing platform and forming flowing circulation, and the ultrasonic processing device is used for processing along the cutting path.
2. A processing apparatus for superhard brittle material as claimed in claim 1, characterized in that: cell type processing platform includes the workstation, the workstation is equipped with the baffle respectively all around, the baffle seals the workstation and forms upper shed's cell body, cell type processing platform both sides are equipped with Y axle straight line module respectively, are equipped with an X axle straight line module between two Y axle straight line modules, be equipped with Z axle straight line module on the X axle straight line module, laser cutting device sets up on X axle straight line module, ultrasonic wave processingequipment sets up on Z axle straight line module.
3. A processing apparatus for superhard brittle material as claimed in claim 2, characterized in that: the grinding fluid injection circulating device is arranged on one side of the groove-shaped processing platform and comprises a grinding fluid storage tank, a grinding fluid filtering tank, a circulating pump and a connecting pipeline, the grinding fluid storage tank, the groove-shaped processing platform, the grinding fluid filtering tank and the circulating pump are connected through the connecting pipeline to form a circulating pipeline, and an electromagnetic switch valve is arranged on the connecting pipeline positioned at the liquid inlet of the groove-shaped processing platform; and the grinding fluid storage tank is higher than the upper end surface of the side plate of the groove-shaped processing platform.
4. A method for processing a superhard brittle material by using the superhard brittle material processing device according to any one of claims 1 to 3, characterized in that: the method comprises the following steps:
firstly, fixing a workpiece to be processed on a groove-shaped working platform, and carrying out laser cutting on the workpiece by a laser cutting device along a preset track to form a cutting path;
step two, starting the grinding fluid injection circulating device, and injecting the grinding fluid into the groove-shaped processing platform; the grinding fluid submerges the workpiece to be processed;
and step three, the Z-axis linear module moves downwards to drive the ultrasonic processing device to move downwards, the ultrasonic processing device is started, and the cutter of the ultrasonic processing device vibrates the grinding fluid to process the workpiece to be processed along the cutting path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910424105.2A CN110587117B (en) | 2019-05-21 | 2019-05-21 | Device and method for processing superhard brittle material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910424105.2A CN110587117B (en) | 2019-05-21 | 2019-05-21 | Device and method for processing superhard brittle material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110587117A true CN110587117A (en) | 2019-12-20 |
| CN110587117B CN110587117B (en) | 2021-10-15 |
Family
ID=68852560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910424105.2A Active CN110587117B (en) | 2019-05-21 | 2019-05-21 | Device and method for processing superhard brittle material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110587117B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102092931A (en) * | 2010-11-26 | 2011-06-15 | 华中科技大学 | Method and device for preparing microchannel in glass material |
| CN203212456U (en) * | 2013-03-27 | 2013-09-25 | 深圳市远洋翔瑞机械股份有限公司 | Novel laser drilling equipment |
| CN103341692A (en) * | 2013-06-26 | 2013-10-09 | 京东方科技集团股份有限公司 | Method for cutting irregular figure substrate and display device |
| US20150060402A1 (en) * | 2013-08-29 | 2015-03-05 | Corning Incorporated | Methods for forming vias in glass substrates |
| CN104923917A (en) * | 2014-03-17 | 2015-09-23 | 株式会社迪思科 | Plate-shaped object processing method |
| CN107540232A (en) * | 2016-06-23 | 2018-01-05 | 奥特司科技株式会社 | The processing method of glass |
| CN109175896A (en) * | 2018-09-12 | 2019-01-11 | 广东正业科技股份有限公司 | A kind of supersonic making method and system of hard brittle material |
| CN109623504A (en) * | 2018-11-22 | 2019-04-16 | 中国人民解放军火箭军工程大学 | A kind of Machining System and method of supersonic vibration assistant grinding and magnetic force polishing |
-
2019
- 2019-05-21 CN CN201910424105.2A patent/CN110587117B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102092931A (en) * | 2010-11-26 | 2011-06-15 | 华中科技大学 | Method and device for preparing microchannel in glass material |
| CN203212456U (en) * | 2013-03-27 | 2013-09-25 | 深圳市远洋翔瑞机械股份有限公司 | Novel laser drilling equipment |
| CN103341692A (en) * | 2013-06-26 | 2013-10-09 | 京东方科技集团股份有限公司 | Method for cutting irregular figure substrate and display device |
| US20150060402A1 (en) * | 2013-08-29 | 2015-03-05 | Corning Incorporated | Methods for forming vias in glass substrates |
| CN104923917A (en) * | 2014-03-17 | 2015-09-23 | 株式会社迪思科 | Plate-shaped object processing method |
| CN107540232A (en) * | 2016-06-23 | 2018-01-05 | 奥特司科技株式会社 | The processing method of glass |
| CN109175896A (en) * | 2018-09-12 | 2019-01-11 | 广东正业科技股份有限公司 | A kind of supersonic making method and system of hard brittle material |
| CN109623504A (en) * | 2018-11-22 | 2019-04-16 | 中国人民解放军火箭军工程大学 | A kind of Machining System and method of supersonic vibration assistant grinding and magnetic force polishing |
Non-Patent Citations (1)
| Title |
|---|
| 汤漾平: "《机械制造装备技术》", 31 March 2015, 华中科技大学出版社 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110587117B (en) | 2021-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101259776B1 (en) | air dust collector | |
| CN110746104B (en) | Cutting and splitting method and system for laser precision processing glass | |
| TW201026619A (en) | Method of cutting mother glass substrate for display panel and substrate of brittle material, and method of manufacturing display | |
| CN113333967A (en) | Splitting method and splitting device for laser cutting of glass | |
| CN103358028A (en) | Method and system for scribing brittle ultrathin piece by water jet and laser | |
| CN105669014B (en) | It is a kind of to use laser grooving and scribing glass processing method | |
| CN102335789A (en) | Device and method for removing re-melting layers on inner walls of air film holes of blades | |
| CN211111717U (en) | Cutting and splitting system for laser precision processing glass | |
| CN110480188A (en) | A kind of processing method of nano twin crystal micro cutter of diamond rapid shaping | |
| JP2010142891A (en) | Substrate table and laser processing apparatus using the same | |
| CN110587117B (en) | Device and method for processing superhard brittle material | |
| CN103753018A (en) | Rotary tower type batch laser shock welding device under vacuum environment | |
| CN109048088B (en) | Method and device for processing micropores by combining long-pulse laser and plasma jet | |
| CN104625266A (en) | Electrolysis-mechanical micro cutting machining system of fretsaw winding electrode | |
| CN114939741B (en) | Ultrasonic jet assisted femtosecond laser rotary-cut composite machining equipment and method for turbine blade air film cooling hole | |
| CN115007958B (en) | Electrode system of liquid-guided laser-electrolytic combined machining tool and milling method | |
| CN114505905A (en) | Ultrasonic wave cut-off knife and 3D printing preparation method and repairing method thereof | |
| CN206622758U (en) | A kind of laser cutting machine | |
| CN113070740B (en) | Efficient processing method of thin-wall alumina ceramic structural part and negative pressure clamp | |
| CN112296408B (en) | Processing equipment and processing method for surface heat dissipation structure of laminated AlN substrate | |
| CN107030394A (en) | A kind of laser cutting machine | |
| CN102082206B (en) | Special scribing and cutting worktable for solar cell chip | |
| CN110549250A (en) | Wafer manufacturing tool and use method thereof | |
| CN114653677B (en) | Ultrasonic-assisted laser-induced cavitation bubble automatic cleaning device | |
| CN210650917U (en) | Air supply device for micro-drilling processing of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |