CN110572943B - Circuit board drilling backing plate - Google Patents
Circuit board drilling backing plate Download PDFInfo
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- CN110572943B CN110572943B CN201910861198.5A CN201910861198A CN110572943B CN 110572943 B CN110572943 B CN 110572943B CN 201910861198 A CN201910861198 A CN 201910861198A CN 110572943 B CN110572943 B CN 110572943B
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- circuit board
- heat dissipation
- plate body
- base plate
- parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L97/00—Compositions of lignin-containing materials
- C08L97/02—Lignocellulosic material, e.g. wood, straw or bagasse
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
The invention provides a circuit board drilling base plate which comprises a base plate body, wherein the base plate body is made of thermoplastic materials and wood fiber materials through hot processing; the heat dissipation plate is a graphene plate, and the heat dissipation plate is abutted to one surface of the base plate body; wherein the thermoplastic material accounts for 30-80 parts; 30-50 parts of wood fiber material. The backing plate body is made of thermoplastic materials and wood fiber materials through hot processing, the backing plate body can be broken and then subjected to repeated hot processing to obtain a new backing plate body, and the backing plate body materials and the heat dissipation plate can be recycled, so that the energy is saved, and the environment is protected.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a drilling base plate of a circuit board.
Background
Printed circuit boards (PCBs for short) are substrates for assembling electronic components, and their main functions are to connect various electronic components to form predetermined circuits, to relay transmission, and to serve as key electronic interconnections of electronic products. The interconnection of such electronic components requires drilling holes in the printed wiring board to complete the attachment and connection of the electronic components.
When the circuit board is drilled, the drill bit has poor toughness and large brittleness due to the very high rotating speed, and is very expensive. In order to reduce the abrasion and the breakage of the drill bit, improve the drilling precision, prevent the surface of the circuit board from being scratched, avoid the hole from generating burrs and other reasons, when the circuit board is drilled, a base plate is placed above the circuit board, and a base plate is placed below the circuit board.
The backing plate for drilling the traditional circuit board comprises a phenolic paper backing plate, a resin aluminum backing plate, an aluminum foil backing plate, a paper phenol plate and the like. The existing base plate can be directly recycled except for an aluminum foil, and the recycling difficulty of other base plates is very high, because no matter paper or wood fiber base plate materials are added with phenolic resin, urea-formaldehyde resin and the like as binders, the phenolic resin, the urea-formaldehyde resin and the like are all thermosetting materials and are difficult to recycle, and the base plate has low direct recycling value and can only be used as a lining material in a case. Therefore, in the circuit board drilling industry for decades, the backing plate is a consumable material which is not regarded as important because the backing plate has low economic value and lower recycling value. The backing plate for drilling the circuit board causes huge waste to the society and pollutes the environment because the backing plate can only be used once and is difficult to recover.
Disclosure of Invention
In order to solve the problems, the invention provides a circuit board drilling base plate, the base plate body is made of thermoplastic materials and wood fiber materials through hot processing, the used base plate body can be broken and then subjected to repeated hot processing to obtain a new base plate body, and the base plate body materials and a heat dissipation plate can be recycled, so that the base plate is energy-saving and environment-friendly.
In order to achieve the above purpose, the invention adopts a technical scheme that:
a circuit board drilling pad comprising: the base plate body comprises a thermoplastic material and a wood fiber material which are manufactured through hot processing; the heat dissipation plate is a graphene plate, and the heat dissipation plate is abutted to one surface of the base plate body; wherein the thermoplastic material accounts for 30-80 parts; 30-50 parts of wood fiber material.
Further, the lubricant is also included, and the lubricant is 2-10 parts.
Further, the thermoplastic material is PVC or PP and PE mixture; the wood fiber can be at least one of wood chips, rice hulls, straws and bamboo fibers; the lubricant is graphene.
Furthermore, the heat dissipation plate is provided with a plurality of first heat dissipation holes.
Further, the backing plate body is provided with a heat dissipation plate accommodating groove and a circuit board accommodating groove which are respectively positioned on two sides of the backing plate body.
Furthermore, a plurality of second heat dissipation holes are formed in the side walls of the heat dissipation plate accommodating groove and the circuit board accommodating groove.
Further, the height of the cooling plate accommodating groove is equal to the thickness of the cooling plate.
Further, the base plate body is further provided with at least three positioning holes.
Further, the height of the heat dissipation plate accommodating groove and the height of the circuit board accommodating groove are 1-2mm, the thickness of the base plate body is 1-5mm, and the thickness of the heat dissipation plate is 1-3 mm.
Compared with the prior art, the technical scheme of the invention has the following advantages: according to the circuit board drilling base plate, the base plate body is made of thermoplastic plastics and wood fibers through hot processing, the material components are simple, after the base plate body is used, the base plate body can be broken and then subjected to hot processing again, necessary thermoplastic materials are added, and then the drilling base plate is made again. The backing plate body has low requirement on wood fiber in a formula system, can adopt waste materials in wood processing production, rice hulls and the like, has good dimensional stability, and does not have the problems of cracks, warping and the like.
Drawings
The technical solution and the advantages of the present invention will be apparent from the following detailed description of the embodiments of the present invention with reference to the accompanying drawings.
FIG. 1 is a front view of a shim plate body according to an embodiment of the present invention;
fig. 2 is a front view of a heat dissipation plate according to an embodiment of the present invention;
fig. 3 is a cross-sectional view of a circuit board pad body according to an embodiment of the invention.
The parts in the figure are numbered as follows:
a backing plate body 1, a heat radiation plate containing groove 11, a circuit board containing groove 12, a second heat radiation hole 13,
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present embodiment, a circuit board drilling pad is provided. As shown in fig. 1 and 2, a circuit board drilling pad includes a pad body 1 and a heat dissipation plate 2.
The base plate body 1 is made of thermoplastic materials, wood fiber materials and lubricants through hot processing. 30-80 parts of thermoplastic material, 30-50 parts of wood fiber material and 2-10 parts of lubricant. The thermoplastic material is PVC or PP and PE mixture; the wood fiber can be at least one of wood chips, rice hulls, straws and bamboo fibers; the lubricant is graphene, so that the circuit board can be smoothly drilled in the drilling process.
The thermoplastic material is a thermoplastic organism, can be one or more of PP, PE, PS and PVC, and the PVC or the mixture of PP and PE is preferred in the patent. The plastic-wood composite material is a new type composite material, and is characterized by that it utilizes thermoplastic plastics and plant fibre to make them pass through the processes of die pressing and injection moulding to produce section bar or plate material.
The preparation process of the backing plate body 1 of the embodiment is as follows: (1) mixing the raw materials, and weighing the thermoplastic material, the wood fiber and the lubricant in proportion to obtain a mixture. (2) And (3) extrusion molding, namely placing the mixture in a bin of a double-screw extruder, setting the extrusion temperature to be 200 plus 260 ℃, rapidly heating and stirring the mixture by the extruder, extruding the mixture into a die, and cooling and molding the mixture to obtain a body blank. (3) And post-processing, cutting off and polishing the feed inlet of the body blank smoothly, and drilling a positioning hole to obtain the base plate body 1.
The base plate body 1 is provided with at least three positioning holes which are located at the edge of the base plate body 1 and used for fixing the circuit board drilling base plate on the operation table top of the drilling equipment. The backing plate body 1 is further provided with a heat dissipation plate accommodating groove 11 and a circuit board accommodating groove 12 which are respectively positioned on two sides of the backing plate body 1. The heat sink accommodating groove 11 is used to fix the heat sink 2. The height of the cooling plate accommodating groove 12 is equal to the thickness of the cooling plate 2, so that the cooling plate 2 and the base plate body 1 can be conveniently combined together to be fixed on the machine table. The circuit board accommodating groove 12 is used for fixing a circuit board with a drilled hole, and the problems of hole deviation, error and the like caused by circuit board movement in the circuit board drilling process are solved. The side walls of the heat dissipation plate accommodating groove 11 and the circuit board accommodating groove 12 are provided with a plurality of second heat dissipation holes 13, so that the heat dissipation performance is further improved.
When the circuit board drilling pad plate is installed, the heat dissipation plate accommodating groove 11 faces downwards, and the heat dissipation plate 2 is accommodated in the heat dissipation plate accommodating groove 11. One side of the heat dissipation plate 2 is attached to and abutted against the lower surface of the base plate body 1, the other side of the heat dissipation plate 2 is abutted against the operation table surface of the drilling equipment, and four side walls of the heat dissipation plate 2 are abutted against four inner side walls of the heat dissipation plate accommodating groove 11. One side of the circuit board to be drilled faces the drill bit upwards, the other side of the circuit board to be drilled abuts against the inside of the circuit board accommodating groove 12, and the four side walls of the circuit board to be drilled are abutted and fixed with the inner side wall of the circuit board accommodating groove 12, so that the problems of drilling deviation and the like caused by movement of the circuit board to be drilled in the drilling process are prevented.
The side walls of the heat dissipation plate accommodating groove 11 and the circuit board accommodating groove 12 are provided with a plurality of second heat dissipation holes 13. The height of the heat dissipation plate receiving groove 12 is equal to the thickness of the heat dissipation plate 2. The height of the heat dissipation plate accommodating groove 11 and the height of the circuit board 12 accommodating groove are 1-2mm, the thickness of the backing plate body 1 is 1-5mm, and the thickness of the heat dissipation plate is 1-3 mm.
The heat dissipation plate 2 is provided with a plurality of first heat dissipation holes 21 on the heat dissipation plate 2. The heat dissipation plate is made of graphene, the graphene material has good heat conduction performance, and the phenomenon that drilling quality and efficiency are affected due to the fact that a large amount of heat is generated by the rapid movement of a drill bit in the circuit board drilling process can be avoided. The heat dissipation plate and the base plate body are formed in a split mode, so that the utilization rate of the heat dissipation plate can be improved, and the requirements of energy conservation, environmental protection and reutilization can be met. The heat dissipation plate is provided with a first heat dissipation hole, so that the heat dissipation performance is further improved.
Example 1
Mixing and placing 25 parts of PP, 25 parts of PE, 48 parts of sawdust and 2 parts of graphene in a bin of a double-screw extruder, setting the extrusion temperature to be 200 ℃, uniformly mixing the raw materials in the double-screw extruder, extruding the mixture into a die for molding, and post-processing to obtain the backing plate body 1.
Example 2
Mixing and placing 30 parts of PP, 30 parts of PE, 30 parts of sawdust and 10 parts of graphene in a bin of a double-screw extruder, setting the extrusion temperature to be 220 ℃, uniformly mixing the raw materials in the double-screw extruder, extruding the mixture into a die for molding, and post-processing to obtain the backing plate body 1.
Example 3
Mixing and placing 22 parts of PP, 20 parts of PE, 50 parts of sawdust and 8 parts of graphene in a bin of a double-screw extruder, setting the extrusion temperature to be 230 ℃, uniformly mixing the raw materials in the double-screw extruder, extruding the mixture into a die for molding, and post-processing to obtain the backing plate body 1.
Example 4
Mixing 60 parts of PVC, 30 parts of sawdust and 10 parts of graphene, placing the mixture in a bin of a double-screw extruder, setting the extrusion temperature to 240 ℃, uniformly mixing the raw materials in the double-screw extruder, extruding the mixture into a die for molding, and post-processing to obtain the backing plate body 1.
Example 5
50 parts of PVC and 50 parts of the crushed material of the waste base plate body are mixed and placed in a bin of a double-screw extruder, the extrusion temperature is set to be 250 ℃, the raw materials are uniformly mixed in the double-screw extruder, extruded into a die for molding, and the base plate body 1 is obtained after post-processing.
Example 6
30 parts of PVC and 70 parts of the crushed material of the waste base plate body are mixed and placed in a bin of a double-screw extruder, the extrusion temperature is set to be 260 ℃, the raw materials are uniformly mixed in the double-screw extruder, the mixture is extruded into a die to be molded, and the base plate body 1 is obtained through post-processing.
The above description is only an exemplary embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures or equivalent processes that are transformed by the content of the present specification and the attached drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A circuit board drilling backing plate, comprising:
the base plate body comprises a thermoplastic material and a wood fiber material which are manufactured through hot processing; and
the heat dissipation plate is a graphene plate and abuts against one surface of the base plate body;
wherein the thermoplastic material accounts for 30-80 parts; 30-50 parts of wood fiber material;
the backing plate body is provided with a heat dissipation plate accommodating groove and a circuit board accommodating groove which are respectively positioned on two sides of the backing plate body.
2. The circuit board drilling pad of claim 1, wherein the pad body further comprises 2-10 parts of a lubricant.
3. The circuit board drilling liner plate according to claim 2, wherein the thermoplastic material is any two of PVC, PP and PE; the wood fiber is at least one of wood chips, rice hulls, straws and bamboo fibers; the lubricant is graphene.
4. A circuit board drilling pad as claimed in claim 3, wherein the heat dissipation plate has a plurality of first heat dissipation holes.
5. The circuit board drilling pad as claimed in claim 1, wherein the heat sink receiving groove and the side wall of the circuit board receiving groove are provided with a plurality of second heat dissipating holes.
6. A circuit board drilling pad as claimed in claim 5, wherein the height of the heat sink receiving groove is equal to the thickness of the heat sink.
7. A circuit board drilling pad according to claim 6, wherein the pad body further comprises at least three positioning holes.
8. The circuit board drilling pad of claim 7, wherein the height of the heat dissipation plate accommodating groove and the circuit board accommodating groove is 1-2mm, the thickness of the pad body is 1-5mm, and the thickness of the heat dissipation plate is 1-2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910861198.5A CN110572943B (en) | 2019-09-12 | 2019-09-12 | Circuit board drilling backing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910861198.5A CN110572943B (en) | 2019-09-12 | 2019-09-12 | Circuit board drilling backing plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110572943A CN110572943A (en) | 2019-12-13 |
| CN110572943B true CN110572943B (en) | 2021-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910861198.5A Active CN110572943B (en) | 2019-09-12 | 2019-09-12 | Circuit board drilling backing plate |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112454958A (en) * | 2020-12-14 | 2021-03-09 | 深圳市瀚鼎电路电子有限公司 | Multilayer PCB laminated cover plate and preparation method thereof |
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| KR100638857B1 (en) * | 2004-12-27 | 2006-10-26 | 주식회사 보원케미칼 | A back up board for manufacturing a printed circuit board |
| KR20110018407A (en) * | 2011-02-07 | 2011-02-23 | 전두표 | A backup board for manufacturing holes of a printed circuit board |
| CN103586923A (en) * | 2013-11-26 | 2014-02-19 | 苏州思诺林电子有限公司 | Base plate for drilling of circuit board |
| CN103642149A (en) * | 2013-11-07 | 2014-03-19 | 陈元文 | Technologies for manufacturing and recovering recoverable circuit board boring backing plate |
| CN103889162A (en) * | 2008-10-17 | 2014-06-25 | 林克治 | Method for surface mounting of elements and devices on flexible printed circuit, system and magnetic fixture |
| CN204104219U (en) * | 2014-09-30 | 2015-01-14 | 何龙 | PCB boring high accuracy cooling backing plate |
| CN204291600U (en) * | 2014-12-03 | 2015-04-22 | 杨淑静 | Boring assistant board |
| CN206713169U (en) * | 2017-04-18 | 2017-12-05 | 湖北吉象人造林制品有限公司 | A kind of minute surface superelevation hard electron circuit backing plate |
| CN108676352A (en) * | 2018-05-29 | 2018-10-19 | 深圳市柳鑫实业股份有限公司 | A kind of printed circuit board drilling backing plate and preparation method thereof |
| CN109379853A (en) * | 2018-10-11 | 2019-02-22 | 深圳市山本光电股份有限公司 | A kind of FPC carrier |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203086862U (en) * | 2012-12-29 | 2013-07-24 | 北京德天泉机电设备有限公司 | Bottom support tooling used for printing of microphone PCB |
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2019
- 2019-09-12 CN CN201910861198.5A patent/CN110572943B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100638857B1 (en) * | 2004-12-27 | 2006-10-26 | 주식회사 보원케미칼 | A back up board for manufacturing a printed circuit board |
| CN103889162A (en) * | 2008-10-17 | 2014-06-25 | 林克治 | Method for surface mounting of elements and devices on flexible printed circuit, system and magnetic fixture |
| KR20110018407A (en) * | 2011-02-07 | 2011-02-23 | 전두표 | A backup board for manufacturing holes of a printed circuit board |
| CN103642149A (en) * | 2013-11-07 | 2014-03-19 | 陈元文 | Technologies for manufacturing and recovering recoverable circuit board boring backing plate |
| CN103586923A (en) * | 2013-11-26 | 2014-02-19 | 苏州思诺林电子有限公司 | Base plate for drilling of circuit board |
| CN204104219U (en) * | 2014-09-30 | 2015-01-14 | 何龙 | PCB boring high accuracy cooling backing plate |
| CN204291600U (en) * | 2014-12-03 | 2015-04-22 | 杨淑静 | Boring assistant board |
| CN206713169U (en) * | 2017-04-18 | 2017-12-05 | 湖北吉象人造林制品有限公司 | A kind of minute surface superelevation hard electron circuit backing plate |
| CN108676352A (en) * | 2018-05-29 | 2018-10-19 | 深圳市柳鑫实业股份有限公司 | A kind of printed circuit board drilling backing plate and preparation method thereof |
| CN109379853A (en) * | 2018-10-11 | 2019-02-22 | 深圳市山本光电股份有限公司 | A kind of FPC carrier |
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| CN110572943A (en) | 2019-12-13 |
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