CN101096404A - Cashew phenol modified linetype phenolic resin and method for manufacturing composite laminated board - Google Patents
Cashew phenol modified linetype phenolic resin and method for manufacturing composite laminated board Download PDFInfo
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- CN101096404A CN101096404A CNA2007100152042A CN200710015204A CN101096404A CN 101096404 A CN101096404 A CN 101096404A CN A2007100152042 A CNA2007100152042 A CN A2007100152042A CN 200710015204 A CN200710015204 A CN 200710015204A CN 101096404 A CN101096404 A CN 101096404A
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Abstract
The invention relates to a cashew phenol modified linear formaldehyde-phenol resin and a method for manufacturing composite basal layer clamping plate in the roofing copper production method technique field. The material of the cashew phenol modified linear formaldehyde-phenol resin is cashew phenol, phenol, formaldehyde, acid catalyst and the solvent. The method comprises the following steps: 1, manufacturing the cashew phenol modified linear formaldehyde-phenol resin; 2, preparing resin adhesive by mixing the modified linear formaldehyde-phenol resin, epoxide resin, fire retardant and brightener; 3, dipping the wood-pulp paper with the resin adhesive; drying the paper base-material sheet; getting the paper base semi-solid sheet; formulating glass cloth base-material sheet, copper foil and the paper base semi-solid sheet together; heating; increasing the pressure; manufacturing the composite basal layer clamping plate. The cashew phenol modified linear formaldehyde-phenol resin is provided with the good fire-resisting property, the good punching property and the high planeness; and the wiring board is provided with the high fire-resisting property, which is fit for leadless reflow soldering.
Description
One, technical field
The present invention relates to a kind of cashew phenol modified lacquer resins and be used to make the method for compound base veneer sheet, belong to copper-clad plate production method technical field.
Two, background technology
Copper-clad laminate (is called for short copper-clad plate Copper C1ad Laminate, CCL) is the main raw of making printed circuit board (pcb).Therefore also be the indispensable base electronic material of any complete electronic set, parts.
Compound basic copper-clad plate has the favorable mechanical processibility, aspects such as its physical strength, dielectric properties, water-absorbent, anti-ion migration all are better than paper-based copper-coated board, and its fundamental characteristics is suitable with the fabricbase copper-clad plate, and cost is lower, in recent years, in the world the demand of compound basic copper-clad plate is being increased year by year.
The manufacturing processed of compound basic copper-clad plate is: be mixed with resin adhesive liquid with materials such as thermoset or novolac resin and Resins, epoxy, fire retardant, solvents, make the paper substrate prepreg with this glue dipping wood pulp paper drying, make the fabricbase prepreg with phenolic aldehyde epoxy or epoxy impregnation woven fiber glass.Again both are arranged in pairs or groups by a certain percentage, carry out heating and pressurizing with Copper Foil after compound and make compound base veneer sheet.
At present, along with light, thin, short and smallization of civil electronic apparatus, unleaded etc., performance requriements to compound matrix copper-clad laminate is more and more higher, used novolac resin in producing at present, its performance has been difficult to satisfy the demand of high performance copper clad laminate, the performance index requirement of electronics and IT products such as computer, industrial electric power supply, lighting installation to wiring board do not satisfied in the compound basic copper-clad plate of producing at aspects such as thermotolerance, planeness, punchings, be not suitable for unleaded Reflow Soldering etc. yet.
The employing novel material improves the performance of product, and is just very necessary.
Three, summary of the invention
The object of the present invention is to provide a kind of cashew phenol modified lacquer resins and be used to make the method for compound base veneer sheet, the copper coated foil plate of making, have advantages such as high heat resistance, planeness is good, punching is good, can be used for making used wiring board in the electronics and IT products such as computer, industrial electric power supply, lighting installation, simultaneously, the wiring board that is processed into has high heat resistance, goes for unleaded Reflow Soldering or makes spray sheet tin usefulness.
The objective of the invention is to be achieved through the following technical solutions:
Cashew phenol modified lacquer resins, raw material are cashew phenol, phenol, formaldehyde, an acidic catalyst and solvent; The mass ratio of cashew phenol and phenol is between 1: 5 to 1: 4, cashew phenol and phenol and and formaldehyde mole ratio at (1.05-1.2): between 1;
Above-mentioned cashew phenol modified lacquer resins is used to make the method for compound base veneer sheet, and its special character is, may further comprise the steps:
(1), makes cashew phenol modified lacquer resins;
(2), mixed with above-mentioned modified linear phenol-aldehyde resin and Resins, epoxy, fire retardant by 7: 5: 3 mass ratio, be mixed with resin adhesive liquid;
(3), produce the paper substrate tablet with the resin adhesive liquid dipping wood pulp paper, the drying that make, promptly make the paper substrate prepreg, fold and fit over woven fiber glass base-material sheet, Copper Foil again, at temperature 170-180 ℃, unit pressure is compacting 80-100 minute under the 7-9mpa, heating, add and be pressed into compound base veneer sheet, also can not fold and join Copper Foil, make insulcrete.
In the preparation resin adhesive liquid, the cashew phenol modified lacquer resins of relative 100 weight parts is furnished with the 63-70 parts by weight of epoxy resin, the fire retardant of 38-42 weight part.
The preparation resin adhesive liquid in, the cashew phenol modified lacquer resins of relative 100 weight parts, can also join the 5-5.5 weight part whitening agent.
Fire retardant adopts tetrabromo-bisphenol and three oxidations, two magnesium;
Whitening agent adopts the electronic-grade titanium dioxide;
Make cashew phenol modified lacquer resins, be with cashew phenol, phenol, formaldehyde under an acidic catalyst effect, carry out polycondensation at 98-100 ℃, react and made in 2-3 hour, the ratio of cashew phenol and phenol is between 1: 5 to 1: 4, cashew phenol and phenol and and formaldehyde mole ratio at (1.05-1.2): between 1.
Selection of catalysts and consumption: can select an acidic catalysts such as hydrochloric acid, tosic acid, oxalic acid for use, consumption: for phenol and cashew phenol consumption and 0.5-1%; Selecting for use of solvent: various alcohols commonly used all can be made solvent, generally select methyl alcohol for use.
The present invention utilizes phenol and part cashew phenol to carry out polycondensation at acidic conditions and formaldehyde and forms, and mainly is to utilize the carbochain of 15 carbon on the cashew phenol to increase the snappiness of product; The present invention adopts cashew phenol modified lacquer resins to make copper coated foil plate, have performances such as excellent thermotolerance, punching, high-flatness, simultaneously, other performance of sheet material such as electrical property etc. all do not have to reduce, and can be used for making used wiring board in the electronics and IT products such as computer, industrial electric power supply, lighting installation; Simultaneously, the wiring board that is processed into this sheet material has high heat resistance, goes for unleaded Reflow Soldering or makes spray sheet tin usefulness.
Four, embodiment
Describe the present invention in detail with embodiment below, but these embodiment must not be interpreted as the limitation of the present invention that goes up in all senses.
Cashew phenol modified lacquer resins and be used to make the method for compound base veneer sheet, adopt cashew phenol and phenol, formaldehyde under an acidic catalyst effect, 98-100 ℃ of reaction 2-3 hour, make cashew phenol modified lacquer resins, with the mixed resin adhesive liquid of making of materials such as this resin and Resins, epoxy, fire retardant, again with this glue through gluing, make copper-clad plate.Catalyzer can be selected an acidic catalysts such as hydrochloric acid, tosic acid, oxalic acid for use, consumption be phenol and cashew phenol consumption and 0.5-1%; Solvent is selected methyl alcohol for use.
Specific embodiment 1:
In 1000 milliliters of four-hole boiling flasks, drop into successively: phenol 210 grams, cashew phenol 90 grams, formaldehyde 198 grams, hydrochloric acid 2.1 grams.Be warmed up to 98-100 ℃ of boiling reaction 2-3 hour then, the time is to vacuum hydro-extraction, purifies to water, removes vacuum, adds methyl alcohol 230 gram dissolvings evenly, obtains the lacquer resins that amount of solid is 52-55%.Make resin adhesive liquid in proportion with Resins, epoxy, fire retardant, whitening agent again with this resin.Then with this glue dipping 130g/m
2Bleaching wood oar paper, drying obtains the paper substrate prepreg of certain solubility, gel content.6 paper substrate prepregs, 2 fabricbase prepregs, 1 adhesive coated foil are cooperated, and are that 175 ℃, unit pressure are compacting 90 minutes under the 8mpa in temperature, obtain the compound basic copper-clad plate of 1.6mm, as sample 1.Detect according to GB GB/T4723-1995 then.
Specific embodiment 2:
In 1000 milliliters four-hole boiling flask, drop into 240 gram phenol, 70 gram cashew phenols, formaldehyde 186 grams, hydrochloric acid 2.2 grams are operated according to the technology of embodiment 1, obtain sample 2.Detect by same standard.
Comparative example:
In 1000 milliliters four-hole boiling flask, drop into 300 gram phenol, 186 gram formaldehyde, 3.0 gram oxalic acid are operated according to the technology of embodiment 1, obtain in the comparative sample, detect by same standard.Every performance comparison of gained sample:
| Index name | Unit | Sample 1 | Sample 2 | Comparative Examples |
| Flexural strength | Mpa | Vertical: 171.1 | 165.8 | ?175.3 |
| Horizontal: 161.2 | 158.4 | ?167.5 | ||
| Verticality | mm | 1.6 | 1.5 | ?1.6 |
| Punching | 5-4-5 | 5-5-5 | ?5-4-4 | |
| Angularity | mm | A：1.0 E：2.5 | A：1.0 E：1.5 | ?A：2.5 ?E：4.5 |
| CTI | V | 350 | 350 | ?350 |
| Stripping strength | N/mm | 1.5 | 2.0 | ?2.0 |
| Unleaded backflow percent of pass | ％ | 98 | 100 | ?96 |
| Water-absorbent | Mg | 65.2 | 56.8 | ?66.5 |
| Water-intake rate | ％ | 18 | 17 | ?24 |
| Voltage breakdown | V | Vertical 45000 | Vertical 45000 | Vertical 45000 |
| Horizontal 45000 | Horizontal 45000 | Horizontal 45000 |
Can draw from above performance data analysis, have with the compound base veneer sheet of cashew phenol modified lacquer resins manufacturing that excellent flexibility, punching and planeness are good, water-intake rate is low, and can 100% satisfy unleaded Reflow Soldering requirement.
Claims (8)
1, cashew phenol modified lacquer resins is characterized in that: raw material is cashew phenol, phenol, formaldehyde, an acidic catalyst and solvent.
2, according to the described cashew phenol modified lacquer resins of claim 1, it is characterized in that: the mass ratio of cashew phenol and phenol is between 1: 5 to 1: 4, cashew phenol and phenol and and formaldehyde mole ratio at (1.05-1.2): between 1, solvent is a methyl alcohol.
3, claim 1 or 2 described cashew phenol modified lacquer resinss are used to make the method for compound base veneer sheet, it is characterized in that, may further comprise the steps:
(1), makes cashew phenol modified lacquer resins;
(2), mixed with above-mentioned modified linear phenol-aldehyde resin and Resins, epoxy, fire retardant by 7: 5: 3 mass ratio, be mixed with resin adhesive liquid;
(3), produce the paper substrate tablet with the resin adhesive liquid dipping wood pulp paper, the drying that make, promptly make the paper substrate prepreg, fold and fit over woven fiber glass base-material sheet, Copper Foil again, at temperature 170-180 ℃, unit pressure is compacting 80-100 minute under the 7-9mpa, heating, add and be pressed into compound base veneer sheet, perhaps foldedly join Copper Foil, make insulcrete.
4, be used to make the method for compound base veneer sheet according to the described cashew phenol modified lacquer resins of claim 3, it is characterized in that: in the preparation resin adhesive liquid, the cashew phenol modified lacquer resins of relative 100 weight parts, is furnished with the 63-70 parts by weight of epoxy resin, the fire retardant of 38-42 weight part.
5, be used to make the method for compound base veneer sheet according to claim 3 or 4 described cashew phenol modified lacquer resinss, it is characterized in that: in the preparation resin adhesive liquid, the cashew phenol modified lacquer resins of relative 100 weight parts can also be joined the whitening agent of 5-5.5 weight part.
6, be used to make the method for compound base veneer sheet according to the described cashew phenol modified lacquer resins of claim 5, it is characterized in that: fire retardant adopts tetrabromo-bisphenol and three oxidations, two magnesium; Whitening agent adopts the electronic-grade titanium dioxide.
7, be used to make the method for compound base veneer sheet according to the described cashew phenol modified lacquer resins of claim 3, it is characterized in that: make cashew phenol modified lacquer resins, be with cashew phenol, phenol, formaldehyde under an acidic catalyst effect, carry out polycondensation at 98-100 ℃, react and made in 2-3 hour.
8, be used to make the method for compound base veneer sheet according to the described cashew phenol modified lacquer resins of claim 7, it is characterized in that: an acidic catalyst is selected hydrochloric acid or tosic acid or oxalic acid for use, consumption be phenol and cashew phenol consumption and 0.5-1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100152042A CN100543055C (en) | 2007-06-20 | 2007-06-20 | Cashew phenol modified lacquer resins is used to make the method for compound base veneer sheet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100152042A CN100543055C (en) | 2007-06-20 | 2007-06-20 | Cashew phenol modified lacquer resins is used to make the method for compound base veneer sheet |
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| Publication Number | Publication Date |
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| CN101096404A true CN101096404A (en) | 2008-01-02 |
| CN100543055C CN100543055C (en) | 2009-09-23 |
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| CNB2007100152042A Expired - Fee Related CN100543055C (en) | 2007-06-20 | 2007-06-20 | Cashew phenol modified lacquer resins is used to make the method for compound base veneer sheet |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408673A (en) * | 2011-11-14 | 2012-04-11 | 山东金宝电子股份有限公司 | Epoxidized soybean oil modified phenolic resin and method for producing non-fire-retardant paper based copper clad laminate by using same |
| CN102582183A (en) * | 2011-12-29 | 2012-07-18 | 铜陵浩荣电子科技有限公司 | Preparation method of halogen-free flame-retardant paper-based copper-clad plate |
| CN117362560A (en) * | 2023-12-04 | 2024-01-09 | 山东永创材料科技有限公司 | Modified phenolic resin and preparation method thereof |
-
2007
- 2007-06-20 CN CNB2007100152042A patent/CN100543055C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408673A (en) * | 2011-11-14 | 2012-04-11 | 山东金宝电子股份有限公司 | Epoxidized soybean oil modified phenolic resin and method for producing non-fire-retardant paper based copper clad laminate by using same |
| CN102582183A (en) * | 2011-12-29 | 2012-07-18 | 铜陵浩荣电子科技有限公司 | Preparation method of halogen-free flame-retardant paper-based copper-clad plate |
| CN102582183B (en) * | 2011-12-29 | 2014-11-05 | 铜陵浩荣电子科技有限公司 | Preparation method of halogen-free flame-retardant paper-based copper-clad plate |
| CN117362560A (en) * | 2023-12-04 | 2024-01-09 | 山东永创材料科技有限公司 | Modified phenolic resin and preparation method thereof |
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| CN100543055C (en) | 2009-09-23 |
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Assignee: Shandong golden capital electronic materials Limited by Share Ltd Assignor: Shandong Jinbao Electronic Co., Ltd. Contract record no.: 2010370000244 Denomination of invention: and method for manufacturing composite laminated board using cashew phenol modified linetype phenolic resin Granted publication date: 20090923 License type: Exclusive License Open date: 20080102 Record date: 20100514 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090923 Termination date: 20120620 |